阅读说明：本技术 一种镭射切割台板结构 (Radium-shine cutting bed plate structure ) 是由 温质康 庄丹丹 乔小平 苏智昱 于 2021-09-01 设计创作，主要内容包括：本发明公开一种镭射切割台板结构,包括台板,所述台板的上表面设有机载体薄膜,有机载体薄膜内部分散有具有吸水和散射效果的颗粒；所述有机载体薄膜的上表面从下至上依序设有第一全反射膜和第二全反射膜,第一全反射膜和第二全反射膜组成叠层的全反射薄膜结构。本发明的切割台板结构可将从工件上透射到台板的激光进行反射到工件的背面的切割处,该反射后的能量激光使工件切割处背面融化并形成裂缝,该发明有利于提高切割效率,减少镭射切割次数,充分利于激光能量有利于延长激光器寿命,减少成本输出。(The invention discloses a laser cutting table plate structure which comprises a table plate, wherein an organic carrier film is arranged on the upper surface of the table plate, and particles with water absorption and scattering effects are dispersed in the organic carrier film; the upper surface of the organic carrier film is sequentially provided with a first total reflection film and a second total reflection film from bottom to top, and the first total reflection film and the second total reflection film form a laminated total reflection film structure. The cutting table plate structure can reflect the laser transmitted to the table plate from the workpiece to the cutting position on the back of the workpiece, and the reflected energy laser melts the back of the cutting position of the workpiece and forms a crack.)

1. The utility model provides a radium-shine cutting bed plate structure, includes the platen, its characterized in that: an organic carrier film is arranged on the upper surface of the bedplate, and particles with water absorption and scattering effects are dispersed in the organic carrier film; the upper surface of the organic carrier film is sequentially provided with a first total reflection film and a second total reflection film from bottom to top, and the first total reflection film and the second total reflection film form a laminated total reflection film structure.

2. The laser cutting template structure of claim 1, wherein: the organic carrier film is formed by ink-jet printing or coating with a coating machine.

3. The laser cutting template structure of claim 1, wherein: the organic carrier film comprises polyimide, ethylene terephthalate or polybutylene terephthalate.

4. The laser cutting template structure of claim 1, wherein: the thickness range of the organic carrier film is 4um-6 um.

5. The laser cutting template structure of claim 1, wherein: the component of the particle is TiO2, and the particle size of the particle is 50nm-200 nm.

6. The laser cutting template structure of claim 1, wherein: the film material of the first reflecting film and the second reflecting film is SiN_x、SiO₂、MgF₂Or Al₂O₃And the reflectivity of the first reflecting film is greater than that of the second reflecting film.

7. The laser cutting template structure of claim 1, wherein: the first reflecting film and the second reflecting film are formed by chemical vapor deposition.

Technical Field

The invention relates to the field of laser cutting machines, in particular to a laser cutting table plate structure.

Background

The manufacturing process of the Organic Light Emitting Diode (abbreviated as OELD) display panel comprises a process of cutting and edging, a laser cutting machine is adopted to cut circuits inside the OLED panel, and in the manufacturing process of the small-sized panel, large-sized glass needs to be cut into small units so as to facilitate the continuation of the subsequent process flow, the manufacturing process of the circuit board is complex and fine, so that the panel is cut by adopting laser, the cutting precision is high, the cutting and burning influence is small, and the improvement of the yield of products is facilitated

The laser cutting machine is also called a laser cutting machine, and focuses laser emitted from a laser into a laser beam with high power density through an optical path system. Irradiating the surface of the workpiece by laser beams to enable the irradiated area on the surface of the workpiece to reach a melting point or a boiling point, and causing the area to form a thermal gradient and mechanical deformation so as to enable the surface of the workpiece to form cracks and break the cut workpiece;

in the laser cutting process, a laser is required to gather laser into high-power and high-energy light waves to be concentrated on a workpiece, the energy of the laser gathered by the laser is attenuated along with the prolonging of the service time of the laser, the workpiece can be broken off only by increasing the cutting times, the prepared Q-time is prolonged, the laser is replaced periodically, and the maintenance cost is increased; and with the increase of the requirements of the workpiece cutting process, a high-specification laser is often required to gather and generate high-energy output laser.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides a laser cutting table plate structure which can fully utilize laser which is not refracted and absorbed by a cut workpiece, improve the laser energy utilization rate of a laser, prolong the service life of the laser, reduce the cost output, improve the cutting efficiency and reduce the laser cutting times.

In order to achieve the purpose, the invention adopts the following technical scheme:

a laser cutting table plate structure comprises a table plate, wherein an organic carrier film is arranged on the upper surface of the table plate, and particles with water absorption and scattering effects are dispersed in the organic carrier film; the upper surface of the organic carrier film is sequentially provided with a first total reflection film and a second total reflection film from bottom to top, and the first total reflection film and the second total reflection film form a laminated total reflection film structure.

Further, the organic carrier film is formed by ink-jet printing or coating with a coating machine.

Further, the organic carrier film comprises polyimide, ethylene terephthalate or polybutylene terephthalate.

Further, the thickness range of the organic carrier film is 4um-6 um.

Further, the component of the particles is TiO2, and the particle size of the particles is 50nm-200 nm.

Further, the film material of the first reflective film and the second reflective film is SiN_x、SiO₂、MgF₂Or Al₂O₃And the reflectivity of the first reflecting film is greater than that of the second reflecting film.

Furthermore, the first reflecting film and the second reflecting film are formed by chemical vapor deposition.

By adopting the technical scheme, the invention has the following beneficial technical effects: the cutting table plate structure can reflect the laser transmitted to the table plate from the workpiece to the cutting position on the back of the workpiece, and the reflected energy laser melts the back of the cutting position of the workpiece and forms a crack.

Drawings

The invention is described in further detail below with reference to the accompanying drawings and the detailed description;

fig. 1 is a schematic cross-sectional view of a laser cutting table structure according to the present invention.

Detailed Description

As shown in fig. 1, the laser cutting table plate structure of the present invention comprises a table plate 1, wherein an organic carrier film 3 is disposed on the upper surface of the table plate 1, and particles 2 having water absorption and scattering effects are dispersed in the organic carrier film 3; the upper surface of the organic carrier film 3 is sequentially provided with a first total reflection film 4 and a second total reflection film 5 from bottom to top, and the first total reflection film 4 and the second total reflection film 5 form a laminated total reflection film structure.

Coating an organic carrier film 3 on the platen by IJP (ink jet printing)/Coater, wherein the organic carrier film 3 contains the particles 2, and the composition of the organic carrier film is not limited to Polyimide (PI), polyethylene terephthalate (PET) or polybutylene terephthalate (PBT), preferably Polyimide (PI) with the thickness ranging from 4um to 6um, preferably 5 um; the particles 2 have a water-absorbing and scattering effect on light, and the material thereof is not limited to TiO₂The particle size is not limited to 50nm-200nm, preferably 100nm, and then a first total reflection film 4 and a first total reflection film 5 are deposited by a PECVD (chemical vapor deposition) machine, the first total reflection film 4 and the first total reflection film 5 form a laminated total reflection film structure, wherein the film material of the first total reflection film 4 and the first total reflection film 5 is not limited to SiN_x，SiO₂，MgF₂，Al₂O₃The film has high equal reflectivity and large extinction coefficient.

The first reflection film 4 and the first reflection film 5 constitute a total reflection film, wherein the first reflection film 4 has a reflectance larger than that of the second reflection film 5, and when the light beams are reflected on the upper and lower surfaces of the film according to the total reflection principle, since the same light from both the reflected light beams has coherence, and when the light paths are overlapped with each other, the light is intensified after the interference when the optical path difference is even multiple of one-half wavelength, and the light is likely to be totally reflected from a dense medium (medium having a large refractive index) to a sparse medium (medium having a small refractive index) because the glass component is SiO₂，SiO₂The refractive index of (1.3-1.4) is low, and it is difficult to find a transparent film with a lower refractive index, so that light is refracted from glass to the first reflective film 4, and to make the refracted light totally reflect, the two reflective films 5 are designed to be optically thinner, that is, the reflectivity of the first reflective film 4 is greater than that of the first reflective film 5, and the first reflective film 4 is preferably made of SiN_x，SiN_xHas a refractive index of 2.3, and the second reflective film 5 is preferably made of SiO₂，SiO₂Has a refractive index of 1.3 to 1.4, refractsThe light is totally reflected at the interface of the first reflecting film 4 and the first totally reflecting film 5, the totally reflected light is collected to the cutting position of the workpiece and is heated and burnt to crack the cutting position of the workpiece, so that the waste of laser energy is reduced, the cutting efficiency is improved, the cutting times of the workpiece are reduced, and the laser is burnt to crack the back of the cutting position of the workpiece, so that the two sides of the workpiece are evenly burnt to crack, and the risk of breaking the workpiece off is reduced; the light which is not totally reflected by the total reflection film is completely absorbed by the particles 2, and the light is prevented from being reflected back to the light emitting area of the device, so that the service life and the display effect of the device in the light emitting area are influenced.

While the invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, which are illustrative and not restrictive, and that those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.