阅读说明：本技术 一种深镀能力好的电镀锡溶液及其电镀方法 (A kind of the solution of electrotinning and its electro-plating method that covering power is good ) 是由 王冬生 于 2019-09-29 设计创作，主要内容包括：本发明公开了一种深镀能力好的电镀锡溶液,其特征在于,由以下原料配制而成：甲基磺酸亚锡100ml/L～300ml/L、甲基磺酸70wt％75ml/L～150ml/L、异丙醇10g/L～30g/L、十二烷基硫酸钠1g/L～10g/L、对甲氧基苯酚0.5g/L～3g/L、槲皮素0.02g/L～0.05g/L、6-苯基-2-硫脲嘧啶0.1g/L～0.2g/L、苹果酸0.2g/L～0.5g/L。本发明的有益效果是,大大提高了电镀液的深镀能力,非常适合于长管形状工件的施镀,解决了现有技术中长期存在的难以解决的技术问题。(The invention discloses a kind of good the solution of electrotinning of covering power, it is characterized in that, being formulated by following raw material: stannous methanesulfonate 100ml/L~300ml/L, methane sulfonic acid 70wt%75ml/L~150ml/L, isopropanol 10g/L~30g/L, lauryl sodium sulfate 1g/L~10g/L, p methoxy phenol 0.5g/L~3g/L, Quercetin 0.02g/L~0.05g/L, 6- phenyl -2- deracil 0.1g/L~0.2g/L, malic acid 0.2g/L~0.5g/L.The invention has the advantages that substantially increasing the covering power of electroplate liquid, it is very suitable for the plating of long tube shape workpiece, solves long-standing insoluble technical problem in the prior art.)

1. a kind of good the solution of electrotinning of covering power, which is characterized in that be formulated by following raw material: stannous methanesulfonate 100ml/L~300ml/L, methane sulfonic acid 70wt%75ml/L~150ml/L, isopropanol 10g/L~30g/L, dodecyl sulphur Sour sodium 1g/L~10g/L, p methoxy phenol 0.5g/L~3g/L, Quercetin 0.02g/L~0.05g/L, 6- phenyl -2- thiocarbamide Pyrimidine 0.1g/L~0.2g/L, malic acid 0.2g/L~0.5g/L.

2. a kind of good the solution of electrotinning of covering power according to claim 1, which is characterized in that prepared by following raw material It forms: stannous methanesulfonate 200ml/L, methane sulfonic acid 70wt%100ml/L, isopropanol 20g/L, lauryl sodium sulfate 5g/ L, p methoxy phenol 2g/L, Quercetin 0.03g/L, 6- phenyl -2- deracil 0.1g/L, malic acid 0.3g/L.

3. a kind of good the solution of electrotinning of covering power according to claim 1 or 2, which is characterized in that preparation method packet Include following steps:

1/2 deionized water is added in clean beaker；

Methane sulfonic acid 70wt% is measured with graduated cylinder, is placed in a beaker, stirs evenly；

Stannous methanesulfonate is measured with graduated cylinder, is placed in a beaker, stirs evenly；

Successively add isopropanol, lauryl sodium sulfate, p methoxy phenol, Quercetin, 6- phenyl -2- deracil and apple Acid stirs evenly；

Deionized water constant volume is added, that is, prepares and completes.

Technical field

The present invention relates to electroplating technology more particularly to a kind of covering power good the solution of electrotinning and its plating side Method.

Background technique

Due to emphasizing that light, thin, short, the small HDI epoch have become the mainstream of PCB industry.In electroplating process, deep blind hole and The requirement standard of high aspect ratio the electroplates in hole, preferable coating quality and plate face uniformity etc. all becomes important now and closes The influence of key, wherein a key index of the covering power as plating, particularly important for the production of circuit board.Covering power Also it is covering power, the currently used method in China is tubular inner hole method.This method is to take that a root hole diameter is 10mm, length is The copper tube of 100mm, as in the rectangle test flume equipped with plating solution to be measured, allow in pore both ends and slot two sections anode apart 50mm was powered after plating a period of time, after taking-up is cleaned up and dried, after splitting along central axes, in measurement coating plating inlet pipe Depth, the covering power of plating solution is evaluated with the ratio of the length of interior wall coating and caliber.In the prior art, pass through heating Method will bring risk to promote covering power for the organic additive in electroplate liquid, and the excessively high organic additive of temperature has divided Solution, leads to plate face quality problem, and production capacity can directly be reduced by reducing current density then, cause production capacity low, the wasting of resources.

Currently, the technical solution of some electroplate liquids has been disclosed in the prior art, such as publication No. is CN 105648483 The Chinese patent application of A discloses a kind of high speed tin plating solution and preparation method thereof, be added in clean beaker 1/2 go from Sub- water；The desired amount of methane sulfonic acid is measured with graduated cylinder, is placed in a beaker, stirs evenly；The desired amount of methyl sulphur is measured with graduated cylinder Sour stannous, is placed in a beaker, and stirs evenly；Additive is added by 60-100ml/L in stannous methanesulfonate solution, stirring is equal It is even；Deionized water constant volume is added, i.e. configuration is completed.The invention obtains uniform color, crystal grain in wider current density range Consistent coating, the effective formation for controlling tin palpus, ensure that the anti-tarnishing ability of coating and excellent solderability, guarantee can To improve current density to greatest extent, anti-tarnishing ability and solderability ensure that, while having given up the use of defoaming agent, make It is lower to be mingled with organic impurities in coating.Although the electroplate liquid has the above advantages, its covering power is not good enough, in practical plating In, which but and is not suitable for the simple shape workpiece of long tubing, so that the inside coating of long tube workpiece can not Reach requirement, causes the Corrosion Potential of serious quality problems and inner wall of long pipe.Therefore, a kind of covering power is developed more preferably The solution of electrotinning becomes a kind of urgent need.

Summary of the invention

In view of the deficienciess of the prior art, that the object of the present invention is to provide a kind of covering powers is good, is suitble to elongated tubular work The solution of electrotinning and its electro-plating method of part.

To achieve the goals above the present invention adopts the following technical scheme:

A kind of the solution of electrotinning that covering power is good, which is characterized in that be formulated by following raw material: stannous methanesulfonate 100ml/L~300ml/L, methane sulfonic acid 70wt%75ml/L~150ml/L, isopropanol 10g/L~30g/L, dodecyl sulphur Sour sodium 1g/L~10g/L, p methoxy phenol 0.5g/L~3g/L, Quercetin 0.02g/L~0.05g/L, 6- phenyl -2- thiocarbamide Pyrimidine 0.1g/L~0.2g/L, malic acid 0.2g/L~0.5g/L.

Preferably, the good the solution of electrotinning of a kind of covering power is formulated: stannous methanesulfonate by following raw material 200ml/L, methane sulfonic acid 70wt%100ml/L, isopropanol 20g/L, lauryl sodium sulfate 5g/L, p methoxy phenol 2g/ L, Quercetin 0.03g/L, 6- phenyl -2- deracil 0.1g/L, malic acid 0.3g/L.

A kind of preparation method of the good the solution of electrotinning of covering power of the present invention, comprising the following steps:

1/2 deionized water is added in clean beaker；

Methane sulfonic acid 70wt% is measured with graduated cylinder, is placed in a beaker, stirs evenly；

Stannous methanesulfonate is measured with graduated cylinder, is placed in a beaker, stirs evenly；

Successively add isopropanol, lauryl sodium sulfate, p methoxy phenol, Quercetin, 6- phenyl -2- deracil and apple Acid stirs evenly；

Deionized water constant volume is added, that is, prepares and completes.

The electro-plating method of the solution of electrotinning of the present invention: pure tin plate is put into electroplate liquid as anode, by workpiece according to routine It is put into after treatment before plating in electroplate liquid of the present invention as cathode, control current density is 1-5A/dm², 20-40 DEG C of bath temperature, The technological parameter of electroplating time 10-30min carries out plating.

The invention has the advantages that substantially increasing the covering power of electroplate liquid, it is very suitable for long tube shape workpiece Plating, solve long-standing insoluble technical problem in the prior art.

Specific embodiment

The present invention is further described below by embodiment.