阅读说明：本技术 包含流平剂的锡合金电镀组合物 (Tin alloy electroplating compositions containing leveling agents ) 是由 A·弗鲁格尔 J-P·B·林德纳 M·阿诺德 于 2018-05-28 设计创作，主要内容包括：本发明涉及包含锡离子,任选地选自银、铜、铟和铋离子的其他合金金属离子以及至少一种包含含有式L1的结构单元的线性或支化聚咪唑<Image he="67" wi="71" file="DDA0002292867210000012.GIF" imgContent="drawing" imgFormat="GIF" orientation="portrait" inline="no"></Image>化合物的添加剂的含水组合物在沉积含锡或锡合金层中的用途,以及在基板上沉积锡合金层的方法。<Image he="347" wi="560" file="DDA0002292867210000011.GIF" imgContent="drawing" imgFormat="GIF" orientation="portrait" inline="no"></Image>(The invention relates to other alloy metal ions comprising tin ions, optionally selected from silver, copper, indium and bismuth ions, and at least one linear or branched polyimidazole comprising a structural unit containing the formula L1 The use of an aqueous composition of an additive to a compound for depositing a tin-or tin-alloy-containing layer, and a method for depositing a tin-alloy layer on a substrate.)