阅读说明：本技术 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法 (method for processing, in particular for dividing, a substrate by means of laser-induced deep etching ) 是由 R.奥斯索尔特 N.安布罗修斯 D.邓克尔 A.施努尔 于 2018-04-06 设计创作，主要内容包括：本发明涉及一种借助激光诱导的深度蚀刻来加工基板的方法,其中,激光束沿加工线运动,并且将各个脉冲以空间上的激光脉冲间距(d)引导到基板上。接下来通过蚀刻以蚀刻速率(R)和蚀刻时长(t)在1>d/(R*t)>10<Sup>-5</Sup>的条件下实施各向异性的材料剥除。(The invention relates to a method for processing a substrate by means of laser-induced deep etching, wherein a laser beam is moved along a processing line and individual pulses are directed onto the substrate with a spatial laser pulse spacing (d). An anisotropic material stripping is then carried out by etching at an etching rate (R) and an etching duration (t) under conditions of 1> d/(R x t) > 10-5.)