Piezoelectric module, electronic device, and piezoelectric module assembly process

文档序号：194132 发布日期：2021-11-02 浏览：57次中文

阅读说明：本技术 压电模组、电子设备和压电模组组装工艺 (Piezoelectric module, electronic device, and piezoelectric module assembly process ) 是由陈静颜嘉甫于 2020-04-30 设计创作，主要内容包括：本公开是关于一种压电模组、电子设备和压电模组组装工艺,属于压电模组技术领域。该压电模组具有体积小、易加工的特性,适应于批量生产。该压电模组包括：至少两个压电组件,正极电路板,和负极电路板；压电组件包括：主体部和连接部,连接部自主体部的设定边缘凸出；主体部和连接部的第一面为正极,主体部和连接部的第二面为负极,第一面和第二面相对。至少两个压电组件的主体部层叠设置,至少两个压电组件的连接部沿边缘交错分布,且连接部第一面的朝向相同。正极电路板与连接部第一面相连,负极电路板与连接部第二面相连。(The disclosure relates to a piezoelectric module, electronic equipment and a piezoelectric module assembling process, and belongs to the technical field of piezoelectric modules. The piezoelectric module has the characteristics of small volume and easiness in processing, and is suitable for batch production. This piezoelectric module includes: at least two piezoelectric components, a positive circuit board, and a negative circuit board; the piezoelectric assembly includes: the connecting part protrudes from the set edge of the main body part; the first surfaces of the main body part and the connecting part are positive electrodes, the second surfaces of the main body part and the connecting part are negative electrodes, and the first surfaces and the second surfaces are opposite. The main body parts of the at least two piezoelectric components are stacked, the connecting parts of the at least two piezoelectric components are distributed along the edge in a staggered mode, and the orientation of the first surfaces of the connecting parts is the same. The positive circuit board is connected with the first surface of the connecting part, and the negative circuit board is connected with the second surface of the connecting part.)

1. A piezoelectric module, comprising: at least two piezoelectric components, a positive circuit board, and a negative circuit board;

the piezoelectric assembly includes: the connecting part protrudes from a set edge of the main body part;

the main body part and the first surface of the connecting part are positive electrodes, the main body part and the second surface of the connecting part are negative electrodes, and the first surface is opposite to the second surface;

the main body parts of the at least two piezoelectric components are arranged in a stacked mode, the connecting parts of the at least two piezoelectric components are distributed along the edge in a staggered mode, and the first surfaces of the connecting parts face in the same direction;

the positive circuit board is connected with the first surface of the connecting part, and the negative circuit board is connected with the second surface of the connecting part.

2. The piezoelectric module of claim 1, wherein the connecting portion comprises:

the first surface of the bearing section is the anode, and the second surface of the bearing section is the cathode; and

a bending section connected to the bearing section, wherein a bending direction of the bending section is configured as: the bearing sections of at least two piezoelectric components are close to each other in the thickness direction of the connecting part.

3. The piezoelectric module of claim 2, wherein in any two of the piezoelectric assemblies, the distance between the first faces of the carrier sections is less than or equal to a set threshold.

4. The piezoelectric module of claim 2, wherein the at least two piezoelectric elements comprise: a first piezoelectric component and a second piezoelectric component;

the bending section of the first piezoelectric assembly comprises a first bending section, the bearing section of the first piezoelectric assembly comprises a first bearing section, and the first bending section and the first bearing section are sequentially connected from the set edge;

the bending section of the second piezoelectric assembly comprises a second bending section, the bearing section of the second piezoelectric assembly comprises a second bearing section, and the second bending section and the second bearing section are sequentially connected from the set edge;

the bending directions of the first bending section and the second bending section are opposite, so that the distance between the first surfaces of the first bearing section and the second bearing section is smaller than or equal to a set threshold value.

5. The piezoelectric module of claim 4, wherein the first carrier segment and the second carrier segment connect the positive circuit board and the negative circuit board; or

The first bearing section and the second bearing section are connected with one of the positive circuit board and the negative circuit board.

6. The piezoelectric module according to claim 5, wherein the bending section of the first piezoelectric element comprises a third bending section, the bearing section of the first piezoelectric element further comprises a third bearing section, and the third bending section and the third bearing section are sequentially connected from the end of the first bearing section far away from the first bending section;

the bending section of the second piezoelectric assembly comprises a fourth bending section, the bearing section of the second piezoelectric assembly comprises a fourth bearing section, and the fourth bending section and the fourth bearing section are sequentially connected from the end part, far away from the second bending section, of the second bearing section;

the bending directions of the third bending section and the fourth bending section are the same;

the first bearing section and the second bearing section are used for connecting one of the positive circuit board and the negative circuit board, and the third bearing section and the fourth bearing section are used for connecting the other of the positive circuit board and the negative circuit board.

7. The piezoelectric module of claim 2, wherein the at least two piezoelectric elements comprise: a third piezoelectric component and a fourth piezoelectric component;

the bearing section of the third piezoelectric assembly comprises a fifth bearing section connected with the set edge;

the bending section of the fourth piezoelectric assembly comprises a fifth bending section, the bearing section of the fourth piezoelectric assembly comprises a sixth bearing section, and the fifth bending section and the sixth bearing section are sequentially connected from the set edge;

the bending direction of the fifth bending section is configured as follows: the distance between the first surfaces of the sixth bearing segment and the fifth bearing segment is less than or equal to a set threshold; and the fifth bearing section and the sixth bending section are connected with the positive circuit board or the negative circuit board.

8. The piezoelectric module according to claim 7, wherein the bending section of the third piezoelectric element further comprises a sixth bending section, the bearing section of the third piezoelectric element further comprises a seventh bearing section, and the sixth bending section and the seventh bearing section are sequentially connected from the end of the fifth bearing section away from the setting edge;

the bending section of the fourth piezoelectric assembly further comprises a seventh bending section, the bearing section of the fourth piezoelectric assembly further comprises an eighth bearing section, and the seventh bending section and the eighth bearing section are sequentially connected from the end part of the sixth bearing section, which is far away from the fifth bending section;

the sixth bending section and the seventh bending section have the same bending direction, and the seventh bearing section and the eighth bearing section are used for connecting the positive circuit board or the negative circuit board.

9. The piezoelectric module according to claim 1, wherein the positive electrode circuit boards and the negative electrode circuit boards are arranged alternately in an extending direction of the connecting portion.

10. The piezoelectric module of claim 1, wherein the piezoelectric assembly comprises: the connecting part comprises a first main body part and a second main body part, and two ends of the connecting part are respectively connected with the first main body part and the second main body part.

11. An electronic device, characterized in that the electronic device comprises the piezoelectric module according to any one of claims 1 to 10.

12. An assembly process of a piezoelectric module, the process comprising:

providing at least two piezoelectric components, wherein each piezoelectric component comprises a main body part and a connecting part, and the connecting part protrudes from a set edge of the main body part; the main body part and the first surface of the connecting part are positive electrodes, the main body part and the second surface of the connecting part are negative electrodes, and the first surface is opposite to the second surface;

stacking body portions of at least two piezoelectric assemblies so that a first surface of one piezoelectric assembly faces a second surface of the other piezoelectric assembly, and connecting portions of at least two piezoelectric assemblies are distributed in a staggered manner along the set edge;

and connecting the first surface of the connecting part with a positive circuit board, connecting the second surface of the connecting part with a negative circuit board, wherein the connecting part is connected with different positions of the positive circuit board, and the connecting part is connected with different positions of the negative circuit board.

13. The assembly process of claim 12, wherein prior to said connecting the positive circuit board to the first side of the connecting portion and the negative circuit board to the second side of the connecting portion, the process further comprises:

and bending the connecting parts, so that the distance between any two first surfaces of the piezoelectric component connecting parts after bending is less than or equal to a set threshold value.

14. The assembly process of claim 13, wherein the at least two piezoelectric assemblies comprise: a first piezoelectric component and a second piezoelectric component;

the bending the connecting portion includes:

and bending the connecting parts of the first piezoelectric component and the second piezoelectric component for the first time in opposite directions, so that the distance between the first surfaces of the connecting parts of the first piezoelectric component and the second piezoelectric component after the first bending is smaller than or equal to a set threshold value.

15. The assembly process of claim 14, wherein the connecting the first surface of the connecting part with a positive circuit board and the second surface of the connecting part with a negative circuit board comprises:

after the first bending, the first surface of the connecting part of the first piezoelectric component and the second piezoelectric component is connected with the positive circuit board, and the second surface of the connecting part of the first piezoelectric component and the second piezoelectric component is connected with the negative circuit board.

16. The assembly process of claim 14, wherein the connecting the first surface of the connecting part with a positive circuit board and the second surface of the connecting part with a negative circuit board comprises:

after the first bending, connecting the connecting part of the first piezoelectric assembly and the second piezoelectric assembly with one of the positive electrode circuit board and the negative electrode circuit board;

bending the connecting parts of the first piezoelectric assembly and the second piezoelectric assembly for the second time in the same direction;

and after the second bending, connecting the connecting part of the first piezoelectric assembly and the second piezoelectric assembly with the other one of the positive electrode circuit board and the negative electrode circuit board.

17. The assembly process of claim 13, wherein the at least two piezoelectric assemblies comprise: a third piezoelectric component and a fourth piezoelectric component; the bending the connecting portion includes:

18. The assembly process of claim 17, wherein the connecting the first surface of the connecting part with a positive circuit board and the second surface of the connecting part with a negative circuit board comprises:

after the first bending, connecting the connecting part of the third piezoelectric assembly and the fourth piezoelectric assembly with one of the positive electrode circuit board and the negative electrode circuit board;

bending the connecting part of the third piezoelectric assembly and the fourth piezoelectric assembly for the second time in the same direction;

and after the second bending, connecting the connecting part of the third piezoelectric assembly and the fourth piezoelectric assembly with the other one of the positive electrode circuit board and the negative electrode circuit board.

19. The assembly process according to claim 12, wherein a connection position of the positive electrode circuit board to the first face and a connection position of the negative electrode circuit board to the second face are staggered in an extending direction of the connection portion.

Technical Field

The present disclosure relates to the field of piezoelectric module technology, and in particular, to a piezoelectric module, an electronic device, and a piezoelectric module assembling process.

Background

The non-porous design of electronic equipment is a popular trend of current mobile phones, tablet computers, wearable equipment and other equipment. In order to remove the sound outlet on the electronic equipment, the piezoelectric module drives the screen to vibrate integrally, so that sound production is realized. Therefore, it is desirable to provide a piezoelectric module adapted to an electronic device.

Disclosure of Invention

The present disclosure provides a piezoelectric module, an electronic apparatus, and a piezoelectric module assembly process, which can be applied to an electronic apparatus.

In a first aspect, an embodiment of the present disclosure provides a piezoelectric module, which includes: at least two piezoelectric components, a positive circuit board, and a negative circuit board;

the piezoelectric assembly includes: the connecting part protrudes from a set edge of the main body part;

the positive circuit board is connected with the first surface of the connecting part, and the negative circuit board is connected with the second surface of the connecting part.

In one embodiment, the connection portion includes:

the first surface of the bearing section is the anode, and the second surface of the bearing section is the cathode; and

In one embodiment, in any two of the piezoelectric assemblies, the distance between the first faces of the carrier sections is less than or equal to a set threshold.

In one embodiment, the at least two piezoelectric assemblies comprise: a first piezoelectric component and a second piezoelectric component;

In one embodiment, the first carrier segment and the second carrier segment connect the positive circuit board and the negative circuit board; or

The first bearing section and the second bearing section are connected with one of the positive circuit board and the negative circuit board.

In one embodiment, the bending section of the first piezoelectric assembly comprises a third bending section, the bearing section of the first piezoelectric assembly further comprises a third bearing section, and the third bending section and the third bearing section are sequentially connected from the end part of the first bearing section far away from the first bending section;

the bending directions of the third bending section and the fourth bending section are the same;

In one embodiment, the at least two piezoelectric assemblies comprise: a third piezoelectric component and a fourth piezoelectric component;

the bearing section of the third piezoelectric assembly comprises a fifth bearing section connected with the set edge;

In one embodiment, the bending section of the third piezoelectric assembly further includes a sixth bending section, the bearing section of the third piezoelectric assembly further includes a seventh bearing section, and the sixth bending section and the seventh bearing section are sequentially connected from the end of the fifth bearing section away from the setting edge;

In one embodiment, the positive electrode circuit boards and the negative electrode circuit boards are arranged alternately in the extending direction of the connecting portion.

In one embodiment, the piezoelectric assembly includes: the connecting part comprises a first main body part and a second main body part, and two ends of the connecting part are respectively connected with the first main body part and the second main body part.

In a second aspect, an embodiment of the present disclosure provides an electronic device, which includes the piezoelectric module provided in the first aspect.

In a third aspect, an embodiment of the present disclosure provides an assembly process of a piezoelectric module, where the process is used to assemble the piezoelectric module provided in the first aspect, and the process includes:

In one embodiment, before the connecting the first side of the connecting part with the positive circuit board and the second side of the connecting part with the negative circuit board, the process further comprises:

and bending the connecting parts, so that the distance between any two first surfaces of the piezoelectric component connecting parts after bending is less than or equal to a set threshold value.

In one embodiment, the at least two piezoelectric assemblies comprise: a first piezoelectric component and a second piezoelectric component;

the bending the connecting portion includes:

In one embodiment, the connecting part is connected with a positive circuit board on a first side and connected with a negative circuit board on a second side, and the connecting part comprises:

bending the connecting parts of the first piezoelectric assembly and the second piezoelectric assembly for the second time in the same direction;

In one embodiment, the at least two piezoelectric assemblies comprise: a third piezoelectric component and a fourth piezoelectric component; the bending the connecting portion includes:

In one embodiment, the connecting part is connected with a positive circuit board on a first side and connected with a negative circuit board on a second side, and the connecting part comprises:

bending the connecting part of the third piezoelectric assembly and the fourth piezoelectric assembly for the second time in the same direction;

In one embodiment, along the extending direction of the connecting part, the connecting position of the positive electrode circuit board and the first surface and the connecting position of the negative electrode circuit board and the second surface are staggered.

The piezoelectric module, the electronic equipment and the piezoelectric module assembling process provided by the disclosure at least have the following beneficial effects:

the piezoelectric module provided by the embodiment of the disclosure is characterized in that the thickness of the joint of the piezoelectric module and the circuit board (the positive circuit board and the negative circuit board) is always the thickness of the connection of the piezoelectric module and the circuit board through the connecting parts which are arranged in a staggered manner. Therefore, the thickness of the joint of the piezoelectric component and the positive electrode circuit board and the negative electrode circuit board is reduced. Further, the volume of the piezoelectric module is reduced for mounting. In addition, the piezoelectric module that this disclosed embodiment provided still processes simply, the advantage of the volume production of being convenient for.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram illustrating a structure of a piezoelectric module according to an exemplary embodiment;

FIG. 2-1 is a schematic diagram of a piezoelectric assembly according to an exemplary embodiment;

2-2 are schematic structural views of a piezoelectric assembly according to another exemplary embodiment;

FIG. 3 is a schematic structural diagram of a piezoelectric module in accordance with another exemplary embodiment;

FIG. 4 is a schematic structural diagram of a piezoelectric module in accordance with another exemplary embodiment;

FIG. 5 is a schematic structural diagram of a piezoelectric module in accordance with another exemplary embodiment;

FIG. 6 is a schematic structural diagram of a piezoelectric module in accordance with another exemplary embodiment;

FIG. 7 is a schematic structural diagram of a piezoelectric module in accordance with another exemplary embodiment;

FIG. 8 is a flow chart illustrating a piezoelectric module assembly process in accordance with an exemplary embodiment;

FIG. 9 is a flow chart illustrating a piezoelectric module assembly process in accordance with another exemplary embodiment;

fig. 10 is a flow chart illustrating a piezoelectric module assembly process according to another exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this disclosure do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprises" or "comprising" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in the specification and claims of this disclosure, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein is meant to encompass any and all possible combinations of one or more of the associated listed items.

In some embodiments, the piezoelectric module includes at least two piezoelectric elements arranged in a stack, a positive circuit board connected to a positive electrode of the piezoelectric elements, and a negative circuit board connected to a negative electrode of the piezoelectric elements. An electric field is applied to the piezoelectric assembly through the positive circuit board and the negative circuit board, the inverse piezoelectric effect of the piezoelectric assembly is excited, the piezoelectric assembly is deformed under the action of the electric field, and then the screen is driven to vibrate and sound.

However, the portion of the piezoelectric assembly connected to the positive electrode circuit board or the negative electrode circuit board is thick, which increases the volume of the entire piezoelectric module and affects the installation of the piezoelectric module. In addition, the difficulty of the connection process of the piezoelectric component and the circuit board is high, and the piezoelectric component and the circuit board are not suitable for mass production.

Based on the above circumstances, the embodiments of the present disclosure provide a piezoelectric module, an electronic apparatus, and a piezoelectric module assembly process.

Fig. 1 is a schematic structural diagram illustrating a piezoelectric module according to an exemplary embodiment. As shown in fig. 1, the piezoelectric module provided by the embodiment of the present disclosure includes at least two piezoelectric components 100, a positive electrode circuit board 200, and a negative electrode circuit board 300.

One piezoelectric assembly 100 includes a body portion 110 and a connection portion 120. The first surfaces 100a of the body 110 and the connector 120 are positive electrodes, and the second surfaces 100b of the body 110 and the connector 120 are negative electrodes. The first surface 100a and the second surface 100b are opposite surfaces of the piezoelectric element 100. Illustratively, the first surface 100a is an upper surface of the body portion 110 and the connecting portion 120, and the second surface 100b is a lower surface of the body portion 110 and the connecting portion 120.

In the main body 110, a piezoelectric element is provided between the positive electrode 110a and the negative electrode 110 b. The piezoelectric element is made of a material having piezoelectric properties, for example, the material of the piezoelectric element includes polyvinylidene fluoride (pure polyvinylidene fluoride, or a mixture of polyvinylidene fluoride and zirconia, alumina, carbon nanotubes, or the like). The inverse piezoelectric effect of the piezoelectric element is excited through the electric field action of the anode and the cathode, electric energy is converted into mechanical energy, and the piezoelectric module realizes vibration.

The connecting portion 120 protrudes from the setting edge 110x of the main body portion 110. Fig. 2-1 and 2-2 are schematic structural views of a piezoelectric assembly according to various exemplary embodiments.

Illustratively, as shown in fig. 2-1, the piezoelectric assembly 100 includes a main body portion 110, and the connecting portion 120 is connected to a set edge 110x of the main body portion 110. Illustratively, as shown in fig. 2-2, the piezoelectric assembly 100 includes: the first body portion 111 and the second body portion 112, and both ends of the connecting portion 120 are connected to the setting edge 110x of the first body portion 111 and the setting edge 110x of the second body portion 112, respectively.

Alternatively, the piezoelectric assembly 100 is a complete piezoelectric film assembly, and the main body 110 and the connecting portion 120 are formed by cutting, shearing, and the like.

Fig. 3 is a schematic structural diagram illustrating a piezoelectric module according to another exemplary embodiment. As shown in fig. 1 and 3, the piezoelectric module includes at least two piezoelectric elements 110. In fig. 1, 2 piezoelectric elements 110 are taken as an example, and 3 piezoelectric elements 110 are taken as an example in fig. 3. Of course, the number of the piezoelectric elements 110 can be selected to be 4, 5, 6, etc.

In the piezoelectric module, the main body portions 110 of at least two piezoelectric elements 100 are stacked. Optionally, the body portions 110 of adjacent piezoelectric assemblies 100 are connected by an optical adhesive.

In the two connected main bodies 110, the first surface 100a of one main body 110 is disposed toward the second surface 100b of the other main body 110. In this way, the first faces 100a of the connecting portions 120 in at least two piezoelectric elements 110 are oriented in the same direction. For example, in fig. 1, the first surfaces 100a of the two connection portions 120 are both disposed upward, and the second surfaces 100b of the two connection portions 120 are both disposed downward.

In addition, the connecting portions 120 of at least two piezoelectric elements 110 are staggered along the set edge 110x of the main body portion 110. The staggered distribution means that: the projections of the connecting portions 120 of different piezoelectric elements 110 do not coincide in a plane perpendicular to the thickness direction of the piezoelectric elements 110. Alternatively, the connecting portion 120 may have different distances from the specified end of the set edge 110x of the main body portion 110 in different piezoelectric assemblies 100.

For example, as shown in fig. 1, the projections of the connecting portions 120 of the two piezoelectric elements 110 do not coincide with each other in the plane formed by the x-axis and the y-axis. As shown in fig. 3, the projections of the connecting portions 120 of the three piezoelectric elements 110 do not coincide with each other in the plane formed by the x-axis and the y-axis.

The positive electrode circuit board 200 is connected to the first surfaces 100a of the at least two connection parts 120, and the negative electrode circuit board 300 is connected to the second surfaces 100b of the at least two connection parts 120. Accordingly, a driving signal is input to the piezoelectric element 100 through the positive electrode circuit board 200 and the negative electrode circuit board 300 to drive the piezoelectric element 100 to vibrate. Alternatively, the positive electrode Circuit Board 200 and the negative electrode Circuit Board 300 are Flexible Printed Circuit Boards (FPCBs).

In this case, the first surfaces 100a of at least two connection parts 120 are oriented in the same direction, facilitating the connection of the positive electrode circuit board 200 with the connection parts 120. The second surfaces 100b of the at least two connecting portions 120 are oriented in the same direction, so that the negative electrode circuit board 200 is connected to the connecting portions 120.

And, at least two connection parts 120 are distributed in a staggered manner, so that the parts of the positive electrode circuit board 200 and the negative electrode circuit board 300 within a set length range are connected to only one connection part 120. Taking the positive electrode circuit board 200 in fig. 1 as an example, the positive electrode circuit board 200 is divided into a first section 210 and a second section 220 along the length direction. The first section 210 is only used for connecting the connecting portion 120 of the upper piezoelectric element 100, and the second section 220 is only used for connecting the connecting portion 120 of the lower piezoelectric element 100.

At this time, the thickness of the joint of the positive electrode circuit board 200 and the piezoelectric element 100 is: the thickness of the junction of the positive electrode circuit board 200 and one of the connection parts 120. In other words, in the case where the piezoelectric module includes at least two piezoelectric elements 100, the thickness of the connection portion 120 of the positive electrode circuit board 200 is not increased. Similarly, the thickness of the junction between the negative electrode circuit board 200 and the piezoelectric assembly 100 is always: the thickness of the junction of the negative electrode circuit board 300 and one of the connection parts 120.

In summary, with the piezoelectric module provided by the embodiment of the present disclosure, the thickness of the joint between the piezoelectric assembly 100 and the circuit board (the positive circuit board 200 and the negative circuit board 300) is reduced by the connection portions 120 arranged in a staggered manner. Moreover, by setting the orientations of the first surfaces 100a of the at least two connecting parts 120 to be the same and the orientations of the second surfaces 100b of the at least two connecting parts 120 to be the same, the circuit board and the connecting parts 120 can be conveniently connected, the assembly process is simplified, and the piezoelectric module is suitable for mass production.

In one embodiment, as shown in fig. 1, the positive electrode circuit boards 200 and the negative electrode circuit boards 300 are alternately arranged along the extending direction of the connection part 120. Specifically, the connection portion 120 extends along the x-axis, and in this case, projections of the positive electrode circuit board 200 and the negative electrode circuit board 300 on the plane formed by the x-axis and the y-axis do not overlap. Accordingly, the positive circuit board 200 and the negative circuit board 300 are distributed in a staggered manner, so that the thickness of the joint of the circuit board and the piezoelectric module is further reduced.

In one embodiment, FIG. 4 is a schematic diagram of a piezoelectric assembly, according to one exemplary embodiment. As shown in fig. 4, the connection portion 120 in the piezoelectric assembly 100 includes: a load bearing section 121 and a bending section 122.

The first surface 100a of the carrier segment 121 is a positive electrode, and the first surface 100a of the carrier segment 121 is used for connecting the positive electrode circuit board 200. The second surface 100b of the bearing segment 121 is a positive electrode, and the second surface 100b of the bearing segment 121 is used for connecting the negative circuit board 300.

The bending section 122 is connected to the carrying section 121. Optionally, the bend 122 includes a curved surface, or at least one bevel. Wherein the bending direction of the bending section 122 is configured as: the carrier segments 121 of at least two piezoelectric assemblies 100 are close to each other in the thickness direction (z-axis) of the connecting portion 120. In this way, the height difference between the connection points of the bearing segments 121 and the circuit boards (the positive circuit board 200 and the negative circuit board 300) in the different connection portions 120 is reduced.

Optionally, in any two piezoelectric assemblies, the distance between the first faces 100a of the carrier segments 121 is less than or equal to a set threshold. For example, the threshold value is set to 1mm, 1.5mm, 2mm, or the like. Accordingly, the carrier section 121 of different connection portions 120 can be connected to one surface of the circuit board. In this way, the structural thickness of the connection portion 120 to the positive electrode circuit board 200 and the connection portion 120 to the negative electrode circuit board 300 is reduced, further reducing the volume of the connection portion 120 to the circuit board.

In the disclosed embodiment, the bearing section 121 and the bending section 122 have various implementations. The following description will be made by taking an example in which the piezoelectric module includes two piezoelectric elements 100.

First implementation

As shown in fig. 4, the piezoelectric module includes: a first piezoelectric element 100A and a second piezoelectric element 100B, and a main body portion 110A of the first piezoelectric element 100A is disposed above a main body portion 110B of the first piezoelectric element 100B.

The bending section of the first piezoelectric assembly 100A includes a first bending section 122A, and the bearing section of the first piezoelectric assembly 100A includes a first bearing section 121A. The first bending section 122A and the first bearing section 121A are sequentially connected from a set edge of the main body 110A.

The bending section of the second piezoelectric assembly 100B includes a second bending section 122B, and the bearing section of the second piezoelectric assembly 100B includes a second bearing section 121B. The second bending section 122B and the second bearing section 121B are sequentially connected from a set edge of the main body 110B.

The bending directions of the first bending section 122A and the second bending section 122B are opposite, so that the distance between the first faces 100a of the first bearing section 121A and the second bearing section 121B is smaller than or equal to a set threshold. Illustratively, as shown in fig. 4, the first bending section 122A bends downward, and the second bending section 122B bends upward, so that the first bearing section 121A and the second bearing section 121B are close to each other.

Optionally, the bending curvature and length of the first bending section 122A and the second bending section 122B satisfy: the first face 100a of the first load bearing segment 121A is planar with the first face 100a of the second load bearing segment 121B, and the second face 100B of the first load bearing segment 121A is planar with the second face 100B of the second load bearing segment 121B.

In this implementation, the first and second carrier segments 121A and 121B are used to connect the positive and negative circuit boards 200 and 300. Specifically, the first faces 100a of the first and second carrier segments 121A and 121B are used for connecting the positive circuit board 200, and the second faces 100B of the first and second carrier segments 121A and 121B are used for connecting the negative circuit board 300.

In this way, the first bending section 122A and the second bending section 122B converge the first bearing section 121A and the second bearing section 121B at the middle position of the piezoelectric module in the thickness direction (z axis), so as to reduce the thickness of the connection part of the piezoelectric assembly 100 with the positive circuit board 200 and the negative circuit board 300.

Second implementation

Fig. 5 is a schematic diagram illustrating a structure of a piezoelectric element in a piezoelectric module according to an exemplary embodiment. A second implementation is an improvement over the first implementation. Wherein the first bearing segment 121A and the second bearing segment 121B are connected to one of the positive circuit board 200 and the negative circuit board 300. As shown in fig. 5, the first faces 100a of the first and second carrier segments 121A and 121B are connected to the positive circuit board.

In a second implementation, the bending section of the first piezoelectric assembly 100A further includes a third bending section 122C, and the bearing section of the first piezoelectric assembly 100A further includes: a third bearer segment 121C. The third bending section 122C and the third bearing section 121C are sequentially connected from the end of the first bearing section 121A far away from the first bending section 122A.

The bending section of the second piezoelectric assembly 100B further includes a fourth bending section 122D, and the bearing section of the second piezoelectric assembly 100B further includes a fourth bearing section 121D. The fourth bending section 122D and the fourth bearing section 121D are sequentially connected from the end of the second bearing section 121B far away from the second bending section 122B.

The third bending section 122C and the fourth bending section 122D have the same bending direction. As shown in fig. 5, the upward bending of the third bending section 122C and the fourth bending section 122D raises the height of the third bearing section 121C and the fourth bearing section 121D. Furthermore, the second faces 100b of the third and fourth carrier segments 121C and 121D are connected to the negative circuit board.

In addition to the manner shown in fig. 5, optionally, the second faces 100B of the first and second carrier segments 121A and 121B are connected to a negative circuit board. At this time, the third bending section 122C and the fourth bending section 122D are bent downward to reduce the height of the third bearing section 121C and the fourth bearing section 121D. Further, the first faces 100a of the third and fourth carrier segments 121C and 121D are connected to the positive electrode circuit board.

That is, the first and second carrier segments 121A and 121B are connected to one of the positive and negative circuit boards, and the third and fourth carrier segments 121C and 121D are connected to the other of the positive and negative circuit boards.

In this embodiment, one piezoelectric element 100 is connected to the positive and negative circuit boards via different carrier segments (121C and 121D). And, the positions of the third bearing section 121C and the fourth bearing section 121D are changed in the thickness direction (z-axis) by the third bending section 122C and the fourth bending section 122D, thereby providing a mounting space for the circuit board.

In this way, the positive electrode circuit board and the negative electrode circuit board do not exceed the upper surface of the main body portion 110A and the lower surface of the main body portion 110B in the thickness direction (z-axis), and the thickness of the connection portion 120 and the connection portion of the positive electrode circuit board and the negative electrode circuit board is effectively reduced.

Third implementation

Fig. 6 is a schematic diagram illustrating a structure of a piezoelectric element in a piezoelectric module according to an exemplary embodiment. As shown in fig. 6, the piezoelectric module includes: a third piezoelectric element 100C and a fourth piezoelectric element 100D, and a main body portion 110C of the third piezoelectric element 100C is disposed above a main body portion 110D of the fourth piezoelectric element 100D.

The carrier section of the third piezoelectric assembly 100C includes: and a fifth bearing section 121E coupled to a set edge of the body 110C. The bending section of the fourth piezoelectric assembly 100D includes a fifth bending section 122E, and the bearing section of the fourth piezoelectric assembly 100D includes a sixth bearing section 121F. The fifth bending section 122E and the sixth bearing section 121F are sequentially connected from a set edge of the main body 110D.

Wherein the bending direction of the fifth bending section 122E is configured as: the distance between the sixth carrier segment 121F and the first face 100a of the fifth carrier segment 121E is less than or equal to a set threshold. As shown in fig. 6, the fifth bending section 122E is bent upward such that the sixth bearing section 121F is adjacent to the fifth bearing section 121E. Preferably, the fifth bending section 122E makes the sixth bearing section 121F not to exceed the upper surface of the main body portion 110C of the third piezoelectric assembly 100C.

The fifth carrier segment 121E and the sixth carrier segment 121F are connected to one of the positive or negative circuit boards. Optionally, the fifth carrier segment 121E and the sixth carrier segment 121F are connected to the positive circuit board and the negative circuit board. The main body 110C of the third piezoelectric element 100C is disposed above the main body 110D of the fourth piezoelectric element 100D, and in order to avoid the circuit board from exceeding the upper surface of the main body 110C, it is preferable to use the space below the fifth bearing segment 121E and the sixth bearing segment 121F. That is, the second faces of the fifth bearing segment 121E and the sixth bearing segment 121F are connected to the negative circuit board.

In addition, the bending section of the third piezoelectric assembly 100C further includes a sixth bending section 122F, and the bearing section of the third piezoelectric assembly 100C further includes a seventh bearing section 121G. The sixth bending section 122F and the seventh bearing section 121G are sequentially connected from the end of the fifth bearing section 121E far away from the main body 110C.

The bending section of the fourth piezoelectric assembly 100D further includes a seventh bending section 122G, and the bearing section of the fourth piezoelectric assembly 100D further includes an eighth bearing section 121H. The seventh bending section 122G and the eighth bearing section 121H are sequentially connected from the end of the sixth bearing section 121F far away from the fifth bending section 122E.

The bending directions of the sixth bending section 122F and the seventh bending section 122G are the same. For example, as shown in fig. 6, the sixth bending section 122F and the seventh bending section 122G are bent downward to reduce the height of the seventh bearing section 121G and the eighth bearing section 121H. In this case, the space above the seventh carrier segment 121G and the eighth carrier segment 121H is large, and the positive electrode circuit board is preferably connected thereto.

In the implementation mode, the bending section 122 is arranged to reasonably utilize the space above or below the bearing section 121, so that the thickness of the connecting part 120 and the connecting part of the positive circuit board and the negative circuit board is reduced. In this way, the connection part 120, the positive electrode circuit board and the negative electrode circuit board form a woven structure, so that the connection stability of the three is optimized, and the structural stability of the entire piezoelectric module is improved.

Of course, the connection portion of the third piezoelectric element 100C may be bent downward first, and then the connection portion of the fourth piezoelectric element 100D may be bent upward simultaneously. At this time, the positive electrode circuit board is disposed close to the main body 110, and the negative electrode circuit board is disposed away from the main body 110.

In addition, in the vibration module having two or more piezoelectric elements 100, the connection portion 120 of the piezoelectric element 100 may be disposed in the above three manners. FIG. 7 is a schematic diagram illustrating a configuration of piezoelectric elements in a piezoelectric stack, according to an exemplary embodiment.

As shown in fig. 7, the connecting portions 120 of the upper three piezoelectric elements 100 are bent downward to be flush with the connecting portion 120 of the lowermost piezoelectric element 100 in order from top to bottom to connect the positive electrode circuit board 200. Thereafter, the connection parts 120 of the four piezoelectric components 100 are simultaneously bent upward to connect the negative electrode circuit board 300.

It should be noted that fig. 7 is only an exemplary implementation of four piezoelectric elements. The arrangement of the connecting portion 120 provided above can be arbitrarily selected and combined by those skilled in the art based on the number of the piezoelectric assemblies 100, and the implementation manner thereof is disclosed in the present disclosure.

In a second aspect, an embodiment of the present disclosure further provides an electronic device, where the electronic device includes the piezoelectric module provided in the first aspect. Optionally, a display screen and the piezoelectric module provided by the first aspect.

Adopt the electronic equipment that this disclosed embodiment provided, wherein the small installation of being convenient for of piezoelectricity module effectively reduces whole electronic equipment's the equipment degree of difficulty, also can satisfy the frivolous design demand of electronic equipment simultaneously.

In one embodiment, the electronic device further comprises a display screen, and the piezoelectric module is connected with the back surface of the display screen. For example, the piezoelectric module is attached to the back surface of the display screen; or the piezoelectric module is connected with the back of the display screen through other transmission pieces. The back of the display screen refers to a portion of the display screen facing the inside of the electronic device. In this way, drive the display screen vibration through the vibration of piezoelectricity module and realize the screen sound production, reach the purpose of getting rid of electronic equipment sound outlet.

In one embodiment, the electronic device further comprises a middle frame for fixing the display screen. The piezoelectric module is attached to the middle frame. In this way, drive the center vibration through the vibration of piezoelectricity module and realize the sound production, reach the purpose of getting rid of electronic equipment sound outlet hole equally.

Further, in embodiments of the present disclosure, electronic devices include, but are not limited to: cell-phone, panel computer, wearable equipment (intelligent wrist-watch, intelligent bracelet etc.), on-vehicle equipment and medical equipment.

In a third aspect, the disclosed embodiments provide a process for assembling a piezoelectric module. The assembly process is used for processing the piezoelectric module provided by the first aspect, and fig. 8 is a flowchart illustrating the assembly process of the piezoelectric module according to an exemplary embodiment.

As shown in fig. 8, the assembly process provided by the embodiment of the present disclosure includes:

step 801 provides at least two piezoelectric assemblies.

The structure of the piezoelectric component refers to the implementation manner provided by the first aspect. Specifically, a piezoelectric assembly includes a main body portion and a connecting portion protruding from a set edge of the main body portion; the first surfaces of the main body part and the connecting part are positive electrodes, the second surfaces of the main body part and the connecting part are negative electrodes, and the first surfaces and the second surfaces are opposite. Also, referring to fig. 2-1 and 2-2, the arrangement position of the connection portion along the set edge is different in different piezoelectric assemblies.

And 802, stacking the main body parts of at least two piezoelectric components, enabling the first surface of one piezoelectric component to face the second surface of the other piezoelectric component, and enabling the connecting parts of at least two piezoelectric components to be distributed in a staggered mode along a set edge. Optionally, the body portions of different piezoelectric assemblies are connected by an optical adhesive.

Step 803, the first surface of the connecting part is connected to the positive circuit board, the second surface of the connecting part is connected to the negative circuit board, different connecting parts are connected to different positions of the positive circuit board, and different connecting parts are connected to different positions of the negative circuit board.

By adopting the piezoelectric module assembly process provided by the embodiment of the disclosure, the thickness of the joint of the connecting part and the circuit board is always the thickness of the circuit board connected with one connecting part through the connecting parts arranged in a staggered manner. In this way, in the case of having at least two piezoelectric components, the connection thickness of the connection portion and the circuit board is reduced. And the positive circuit board is connected with the first surface of the connecting part, and the negative circuit board is connected with the second surface of the connecting part, so that the whole process is simple, convenient and easy to operate, and is suitable for mass production of the piezoelectric module.

In one embodiment, the piezoelectric assembly is a flexible assembly, for example the piezoelectric assembly is a thin film piezoelectric assembly. At this time, before step 803, the process further includes: and bending the connecting part, so that the distance between the first surfaces of any two piezoelectric component connecting parts after bending is less than or equal to a set threshold value.

In this way, the connecting parts of any two piezoelectric components are close to each other in the thickness direction of the piezoelectric module, and the thickness of the connecting part and the circuit board is further reduced.

In the disclosed embodiment, the bending the piezoelectric element and the step 803 have various implementations. Which are described below in different examples.

In a first example, the at least two piezoelectric assemblies comprise: a first piezoelectric component and a second piezoelectric component. At this moment, the bending connection part specifically comprises: and bending the connecting part of the first piezoelectric component and the second piezoelectric component for the first time in the opposite direction, so that the distance between the first surfaces of the connecting part of the first piezoelectric component and the second piezoelectric component after the first bending is smaller than or equal to a set threshold value.

With reference to the structure shown in fig. 4, the connecting portion of the first piezoelectric element is bent downward, and the connecting portion of the second piezoelectric element is bent upward. In this way, the connecting portions of the first piezoelectric element and the second piezoelectric element converge toward the middle position in the thickness direction of the piezoelectric module. Further, the overall thickness of the connection portion and the circuit board is further reduced.

Based on the above process steps of bending the connection portion, the step 803 has two implementation manners.

Optionally, step 803 comprises: after the first bending, the first surface of the connecting part of the first piezoelectric component and the second piezoelectric component is connected with the positive circuit board, and the second surface of the connecting part of the first piezoelectric component and the second piezoelectric component is connected with the negative circuit board.

Alternatively, fig. 9 is a flowchart illustrating a piezoelectric module assembly process according to another exemplary embodiment. As shown in fig. 9, step 803 includes:

step 8031, after the first bending, connecting the connecting portion of the first piezoelectric assembly and the second piezoelectric assembly to one of the positive electrode circuit board and the negative electrode circuit board.

With the structure shown in fig. 5, after the first bending, the first surface of the connecting portion between the first piezoelectric assembly and the second piezoelectric assembly is connected to the positive electrode circuit board.

Step 8032, bending the connecting portion of the first piezoelectric assembly and the second piezoelectric assembly in the same direction for the second time.

With the structure shown in fig. 5, the connecting portion of the first piezoelectric element and the second piezoelectric element is bent upward.

Step 8033, after the second bending, connecting the connecting portion of the first piezoelectric assembly and the second piezoelectric assembly to the other of the positive electrode circuit board and the negative electrode circuit board.

With the structure shown in fig. 5, after the second bending, the second surface of the connecting portion between the first piezoelectric assembly and the second piezoelectric assembly is connected to the negative electrode circuit board. It can be seen that, by bending for the second time in step 8032, the connection portion of the first piezoelectric assembly and the second piezoelectric assembly is raised, so as to provide an installation space for the negative electrode circuit board.

Of course, optionally, in step 8031, the second side of the connecting portion of the first piezoelectric assembly and the second piezoelectric assembly is connected to the negative electrode circuit board. In step 8031, the connecting portion of the first piezoelectric element and the second piezoelectric element is bent downward. In step 8033, the first surface of the connecting portion of the first piezoelectric element and the second piezoelectric element after the second bending is connected to the positive electrode circuit board

In a second example, the at least two piezoelectric assemblies comprise: a third piezoelectric component and a fourth piezoelectric component.

At this moment, the bending connection part specifically comprises:

and bending the connecting part of the fourth piezoelectric assembly for the first time, so that the distance between the fourth piezoelectric assembly and the first surface of the connecting part of the third piezoelectric assembly is smaller than or equal to a set threshold value. In this way, the connection portion of the first piezoelectric element approaches the connection portion of the third piezoelectric element.

Alternatively, fig. 10 is a flowchart illustrating a piezoelectric module assembly process according to another exemplary embodiment. As shown in fig. 10, step 803 specifically includes:

step 8034, after the first bending, connecting the connecting portion of the third piezoelectric assembly and the fourth piezoelectric assembly to one of the positive electrode circuit board and the negative electrode circuit board.

With the structure shown in fig. 6, the second surface of the connecting portion of the third piezoelectric element and the fourth piezoelectric element is connected to the negative electrode circuit board.

Step 8035, bending the connecting portion of the third piezoelectric assembly and the fourth piezoelectric assembly for the second time in the same direction.

With the structure shown in fig. 6, the connecting portion of the third piezoelectric element and the fourth piezoelectric element is bent downward.

Step 8036, after the second bending, connecting the connecting portion of the third piezoelectric assembly and the fourth piezoelectric assembly to the other of the positive electrode circuit board and the negative electrode circuit board.

With the structure shown in fig. 6, the first surface of the connecting portion between the third piezoelectric element and the fourth piezoelectric element is connected to the positive electrode circuit board.

In one embodiment, in step 803, the connection position of the positive electrode circuit board and the first surface and the connection position of the negative electrode circuit board and the second surface are staggered along the extending direction of the connection portion. That is, along the extending direction of the connecting portion, the connecting position of the positive electrode circuit board and the first surface and the connecting position of the negative electrode circuit board and the second surface are staggered. Accordingly, the thickness of the connecting portion between the positive electrode circuit board and the negative electrode circuit board is reduced.

It should be noted that the number of the piezoelectric elements is not specifically limited in the above embodiments, and in the case that the piezoelectric module includes more than 2 piezoelectric elements, the assembling process may be performed with reference to the process steps provided above.

Through the piezoelectric module assembly process provided by the embodiment of the disclosure, the thickness of the joint of the piezoelectric component and the circuit board in the assembled piezoelectric module can be effectively reduced, and the volume of the whole piezoelectric module is reduced. And the whole process is simple and convenient, is easy to operate and is suitable for mass production of the piezoelectric module.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

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Piezoelectric module, electronic device, and piezoelectric module assembly process

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