阅读说明：本技术 用于制造发光装置的方法 (Method for producing a light-emitting device ) 是由 吉德留斯·斯鲁奥吉斯 于 2020-05-29 设计创作，主要内容包括：本公开涉及一种用于制造发光装置的方法,包括：围绕布置于电路基板上的多个光源的每个光源来执行第一注塑操作,以形成环绕所述光源的透镜架；以及在所述透镜架上布置透镜,以形成在所述电路基板通电时发光的所述发光装置。根据本公开的方法,能够有效的保证透镜的安装准确度和精度,以及降低对电路板的厚度和硬度等的要求。(The present disclosure relates to a method for manufacturing a light emitting device, comprising: performing a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light sources; and disposing a lens on the lens holder to form the light emitting device that emits light when the circuit substrate is energized. According to the method disclosed by the invention, the mounting accuracy and precision of the lens can be effectively ensured, and the requirements on the thickness, the hardness and the like of the circuit board are reduced.)

1. A method for manufacturing a light emitting device, comprising:

performing a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light sources; and

arranging a lens on the lens holder to form the light emitting device that emits light when the circuit substrate is energized.

2. The method of claim 1, wherein disposing the lens on the lens holder comprises performing a second injection molding operation against an interior space of the lens holder to form the lens surrounding the light source.

3. The method of claim 2, wherein prior to performing the first injection molding operation, the method further comprises:

disposing a light source cover on the circuit substrate covering each of the light sources, wherein a space exists between the light source cover and the light sources to form a first air gap.

4. The method of claim 1, wherein disposing the lens on the lens holder comprises inserting and securing the lens in a shape conforming to an inner surface of the lens holder within the lens holder.

5. The method of claim 4, wherein securing the lens within the lens holder comprises securing the lens within the lens holder with a snap fit.

6. The method of claim 5, wherein performing the first injection molding operation to form the lens holder further comprises:

in the first injection molding operation, an inner edge suitable for being clamped with the lens is formed on one side, close to the light source, of the inner surface of the lens holder.

7. The method of claim 6, wherein the inner edge includes an annular protrusion for engaging the lens and the bottom of the lens includes an annular recess for engaging the annular protrusion.

8. The method of claim 4, wherein the entrance face of the lens has a curved or straight structure that covers the light source, and there is a spacing between the entrance face and the light source to form a second air gap when the lens is secured within the lens holder.

9. The method of claim 1, wherein prior to performing a first injection molding operation, the method further comprises applying adhesive, perforating, or forming a groove on the circuit substrate at a location where the first injection molding operation is performed to further secure the lens holder.

10. The method of claim 1, wherein the plurality of light sources are a plurality of LED lights regularly arranged on the circuit substrate, the circuit substrate being a flexible circuit board or a printed circuit board.

11. The method of claim 10, further comprising:

and additionally installing a shell outside the light-emitting device to encapsulate the light-emitting device.

Technical Field

The present disclosure relates generally to the field of manufacturing. More particularly, the present disclosure relates to a method for manufacturing a light emitting device.

Background

In daily life, light emitting devices have been widely used. In the manufacturing process of the light emitting device, some components need to be fixed on the circuit board. For example, in order to meet the requirements of different light emission angles or changing the light emission angle, it is usually necessary to mount a lens and align the lens with the light source, and the lens is usually placed on and fixed on the circuit board by glue, snap fit, screw fastening or the like. However, the method of bonding by glue has problems of precision and accuracy, and it is difficult to ensure the relative position of the lens and the light source, thereby possibly affecting the optical effect of the light-emitting device. The circuit board needs to have certain hardness and thickness by adopting a clamping or screw fastening mode, and is not suitable for a flexible circuit board or a thin circuit board, so that the requirement for the thin development of the flexible circuit board cannot be met.

Disclosure of Invention

In view of the above-mentioned technical problem, an aspect of the present disclosure provides a method for manufacturing a light emitting device, including: performing a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light sources; and disposing a lens on the lens holder to form the light emitting device that emits light when the circuit substrate is energized.

According to one embodiment of the disclosure, disposing the lens on the lens holder includes performing a second injection molding operation for an interior space of the lens holder to form the lens surrounding the light source.

According to another embodiment of the present disclosure, before performing the first injection molding operation, the method further comprises: disposing a light source cover on the circuit substrate covering each of the light sources, wherein a space exists between the light source cover and the light sources to form a first air gap.

According to yet another embodiment of the present disclosure, disposing the lens on the lens holder includes inserting and fixing the lens in a shape fitting an inner surface of the lens holder into the lens holder.

According to one embodiment of the present disclosure, securing the lens within the lens holder includes securing the lens within the lens holder with a snap-fit.

According to another embodiment of the present disclosure, performing the first injection molding operation to form the lens holder further comprises: in the first injection molding operation, an inner edge suitable for being clamped with the lens is formed on one side, close to the light source, of the inner surface of the lens holder.

According to yet another embodiment of the present disclosure, the inner rim includes an annular convex portion for engaging with the lens, and the bottom of the lens includes an annular concave portion for engaging with the annular convex portion.

According to one embodiment of the present disclosure, the incident surface of the lens has a curved structure or a straight structure covering the light source, and there is a space between the incident surface and the light source to form a second air gap when the lens is fixed in the lens holder.

According to another embodiment of the present disclosure, before performing the first injection molding operation, the method further comprises applying an adhesive, perforating, or forming a groove on the circuit substrate at a location where the first injection molding operation is performed in order to further secure the lens holder.

According to still another embodiment of the present disclosure, the plurality of light sources are a plurality of LED lamps regularly arranged on the circuit substrate, which is a flexible circuit board or a printed circuit board.

According to an embodiment of the present disclosure, further comprising: and additionally installing a shell outside the light-emitting device to encapsulate the light-emitting device.

From the above description of the technical solution of the present disclosure and the embodiments thereof, those skilled in the art can understand that the method for manufacturing a light emitting device of the present disclosure can effectively ensure the mounting accuracy and precision of the lens by performing the first injection molding operation around each light source to form the lens holder fixed on the circuit substrate and defining the arrangement position of the lens by the lens holder. And through the fixed components such as lens holder of mode through moulding plastics, can reduce to requirements such as circuit board thickness and hardness, consequently can be applicable to flexible circuit board and slim circuit board etc. to satisfy the development demand in aspects such as the slimming of flexible circuit board and circuit board.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. In the drawings, several embodiments of the disclosure are illustrated by way of example and not by way of limitation, and like or corresponding reference numerals indicate like or corresponding parts and in which:

fig. 1 is a flow chart generally illustrating a method for manufacturing a light emitting device according to the present disclosure;

FIG. 2 is a flow chart illustrating a method including a second injection molding operation according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram illustrating an embodied implementation of the method shown in FIG. 2;

FIG. 4 is a flow chart illustrating a method including arranging a light source cover according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram illustrating an embodied implementation of the method shown in FIG. 4;

FIG. 6 is a flow chart illustrating a method including inserting a lens according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram illustrating an embodied implementation of the method shown in FIG. 6;

FIG. 8 is a flow chart illustrating a method including retrofitting a housing according to an embodiment of the present disclosure; and

fig. 9a and 9b are various diagrams illustrating an application embodiment according to the method illustrated in fig. 8.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It should be understood that the terms "first," "second," "third," and "fourth," etc. in the claims, description, and drawings of the present disclosure are used to distinguish between different objects and are not used to describe a particular order. The terms "comprises" and "comprising," when used in the specification and claims of this disclosure, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the disclosure. As used in the specification and claims of this disclosure, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the specification and claims of this disclosure refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.

As used in this specification and claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

The present disclosure addresses the deficiencies of the prior art by providing a completely new and realizable solution. In particular, the method for manufacturing a light emitting device of the present disclosure may include performing an injection molding operation around each light source to form a lens holder fixed on a circuit substrate, and defining an arrangement position of a lens by the lens holder, thereby effectively ensuring mounting accuracy and precision of the lens. As will be appreciated by those skilled in the art from the following description, the present disclosure also provides various embodiments to achieve the arrangement of the lenses. For example, the lens may be formed by performing a second injection molding operation. It is also possible to insert and fix the lens in the lens holder, for example. Specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

Fig. 1 is a flow chart generally illustrating a method 100 for manufacturing a light emitting device according to the present disclosure. As shown in fig. 1, at step 102, the method 100 may perform a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light source. In one embodiment, the method 100 may perform a first injection molding operation centered on and around a light source to form a lens holder secured to a circuit substrate.

The first injection molding operation described hereinabove may be an operation by, for example, injection molding into a mold, the shape and size of which may be set as desired. The injection material of the first injection molding operation may be at least one of silicone rubber, nylon, Ethylene Vinyl Acetate (EVA), thermoplastic polyurethane elastomer rubber (TPU), and the like. The lens holder formed according to the method 100 of the present disclosure can be made transparent or opaque as desired. The opaque lens holder can have a reflective effect. In one embodiment, the lens holder may be white opaque.

The method 100 according to the present disclosure can form the lens holder fixed on the circuit substrate by injection molding, can improve the accuracy and precision of the mounting position of the lens holder, and can also reduce the requirements on the thickness, hardness, and the like of the circuit substrate. For example, in one embodiment, the circuit substrate may be a flexible circuit board FPC or a printed circuit board PCB. The circuit board may be a single-sided circuit board or a double-sided circuit board. For example, in another embodiment, the circuit substrate may be a double-sided circuit substrate and the method 100 may perform the first injection molding operation around each of the plurality of light sources disposed on both sides of the circuit substrate.

The light source may be a light emitting device such as a small incandescent lamp, a fluorescent lamp, or a Light Emitting Diode (LED). The plurality of light sources arranged on the circuit substrate may be regularly or irregularly arranged. For example, in one embodiment, the plurality of light sources may be a plurality of LED lamps regularly arranged on the circuit substrate. In another embodiment, the plurality of light sources are of different types, and the method 100 may perform the first injection molding operation for each of the plurality of different types of light sources disposed on the circuit substrate.

Further, according to an embodiment of the present disclosure, before performing the first injection molding operation, the method 100 may further include applying an adhesive, perforating, or forming a groove on the circuit substrate at a location where the first injection molding operation is performed, so as to further fix the lens holder. The method 100 may include the step of punching or forming a groove in the circuit substrate by injecting a molding material into the hole or the groove of the circuit substrate when the first injection molding operation is performed, thereby forming an effect of engaging the lens holder with the circuit substrate. With this arrangement, the connection between the lens holder and the circuit board can be further enhanced.

Next, at step 104, the method 100 may arrange a lens on the lens holder to form the light emitting device that emits light when the circuit substrate is energized. The method 100 can generate a restriction effect on the shape or position of the lens through the lens holder by forming the lens holder first and then arranging the lens, thereby ensuring more accurate and fine arrangement of the lens with respect to the light source to ensure the optical effect of the light emitting device. The method 100 may be implemented in a variety of ways to arrange lenses on a lens holder, for example, in one embodiment, the method 100 may perform a second injection molding operation to form the lenses. In another embodiment, the method 100 may insert a lens into the lens holder that conforms to the shape of the interior surface of the lens holder. In order to enhance the understanding of the technical solutions of the present disclosure for those skilled in the art, the following detailed description is given with reference to a plurality of embodiments.

FIG. 2 is a flow chart illustrating a method including a second injection molding operation according to an embodiment of the present disclosure. It will be appreciated that the method 100 shown in fig. 2 is one embodiment of the method described above in connection with fig. 1.

As shown in fig. 2, at step 102, the method 100 may perform a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light source. Step 102 has already been described in detail above in conjunction with fig. 1, and is not described here again.

Next, at step 106, the method 100 may perform a second injection molding operation for the interior space of the lens holder to form the lens surrounding the light source. It is understood that step 106 is one specific embodiment of disposing lenses on the lens holder in step 104 shown in fig. 1. The second injection molding operation may be injection molding directly into the interior space of the lens holder or by injection molding into a mold disposed on the lens holder, for example. In one embodiment, the method 100 may perform the second injection molding operation by injection molding into the interior space of the lens holder and simultaneously injection molding the exit surface of the lens through a mold. The lens formed by the second injection molding operation may form a package for the light source or may be spaced from the light source. The temperature at which the method 100 performs the second injection molding operation should be lower than the temperature that the light source can withstand.

Further, according to an embodiment of the present disclosure, before performing the second injection molding operation, the method 100 may further include applying an adhesive, perforating, or forming a groove on the circuit substrate at a location where the second injection molding operation is performed to further secure the lens. The method 100 may form the hole or groove in the circuit substrate by injecting a molding material into the hole or groove of the circuit substrate when performing the second molding operation, thereby forming an effect of the lens engaging with the circuit substrate. With this arrangement, the connection between the lens and the circuit board can be further enhanced.

While the method of arranging the lenses by injection molding is described above with reference to fig. 2, it will be understood by those skilled in the art from the above description that the lenses formed by performing the second injection molding operation can form a better fit with the inner surface of the lens holder, and the bottom of the lenses can be fixed on the circuit substrate, which is beneficial to increase the stability and firmness of the lenses. To facilitate understanding of the method described in this embodiment by those skilled in the art, the method shown in fig. 2 will be further described with reference to the specific implementation process shown in fig. 3.

Fig. 3 is a pictorial representation of an embodied implementation of the method 100 of fig. 2. As shown in fig. 3, a circuit substrate 10 and a plurality of light sources 20 arranged on the circuit substrate 10 are shown in fig. 3 (a). The plurality of light sources 20 may be regularly arranged at certain intervals on the circuit substrate 10. Next, fig. 3(b) shows a semi-finished light-emitting device with the lens holder 30 mounted thereon, which is formed after the method 100 performs step 102. That is, the method 100 performs a first injection molding operation around each light source 20 of the plurality of light sources 20 disposed on the circuit substrate 10 to form the lens holder 30. For example, lens holders 30 are formed around the four light sources 20 in the figure.

The flow then proceeds to fig. 3(c), where the light emitting device may be formed after the method 100 performs a second injection molding operation (i.e., step 106 shown in fig. 2) for the interior space of the lens holder 30. Fig. 3(d) is an enlarged sectional view showing fig. 3(c) in order to facilitate observation of the structure of the light emitting device formed after the two-shot molding. As shown, the lens 40 formed by the second injection molding operation may wrap the light source 20, and the bottom of the lens 40 is fixed with the circuit substrate 10. The internal shape of the lens 40 may be defined by the lens holder 30 and the exit face of the lens 40 may also be formed in a second injection molding operation.

While the embodiments of forming lenses by injection molding in accordance with the present disclosure have been described above in connection with fig. 2 and 3, it will be understood by those skilled in the art that the devices illustrated and described above are exemplary and not limiting, and that modifications may be made by those skilled in the art as desired. For example, the number of light sources may not be limited to four as shown in fig. 3, and may be more or less arranged as necessary. The shape of the lens holder and the shape of the lens may not be limited to those shown in the drawings, and may be adjusted as needed. The manner in which the lens surrounds the light source is not limited to the tight packing shown in the figures, and may be spaced from the light source.

Fig. 4 is a flow chart illustrating a method including arranging a light source cover according to an embodiment of the present disclosure. As shown in fig. 4, at step 101, the method 100 may arrange a light source cover covering each light source on a circuit substrate, wherein there may be a spacing between the light source cover and the light source to form a first air gap. The light source cover may be disposed centering on the light source. The light source cover may be fixed on the circuit substrate. In one embodiment, the method 100 may secure the light source cover to the circuit substrate with glue and may apply the glue to the circuit substrate by, for example, spraying, silk screening, or potting with a potting machine. In another embodiment, the method 100 may use Surface Mount Technology (SMT) to secure the light source cover to the circuit substrate, and may assemble the light source cover using, for example, a standard mounter.

The shape of the light source cover according to the present disclosure may be provided in a dome shape, a hemispherical shape, a semi-ellipsoidal shape, a square shape, a cylindrical shape, etc. The material of the light source cover can be plastic, rubber, silica gel and the like. The light source cover may be provided to be transparent or translucent as necessary. For example, in scenarios where a beam narrowing or collimation application is required, the light source cover may be provided transparent. Also for example, the light source cover may be translucent for diffusion or color mixing purposes.

In further description of step 101, there may be a spacing between the light source cover and the light source to form a first air gap. The first air gap at the light source surface creates design flexibility for changing optical performance. According to such an arrangement, incident light from the light source can be optically refracted through the first air gap before entering the lens, thereby enabling enhancement of optical effects such as light condensation.

Next, at step 102, the method 100 may perform a first injection molding operation around each light source cover to form a lens holder. This step is the same as or similar to step 102 described above in connection with fig. 1 and 2 and will not be described again here.

Then, at step 104, the method 100 may arrange a lens on the lens holder to form a light emitting device that emits light when the circuit substrate is energized. In one embodiment, the method 100 disposing the lens on the lens holder may include performing a second injection molding operation with respect to the interior space of the lens holder to form a lens that surrounds the light source and the light source cover, wherein the lens may wrap around the light source cover without affecting the formation of the first air gap. The second injection molding operation has been described in detail in the foregoing with reference to step 106 in fig. 2, and is not described again here. The arrangement of the light source cover can protect the light source, and can avoid the influence on the light source caused by factors such as temperature in the second injection molding operation process, so that the arrangement of the light source cover can also reduce the limitation on conditions such as injection molding temperature.

The method including disposing the light source cover is exemplarily described above with reference to fig. 4, and in order to facilitate understanding of the method described in the present embodiment by those skilled in the art, the method shown in fig. 4 will be further described with reference to fig. 5. It will be appreciated from the following description that the light emitting device fabrication process shown in fig. 5 is an embodiment of the method shown in fig. 4, and thus the statements made with respect to the method 100 apply equally to the following description.

Fig. 5 is a schematic diagram illustrating an embodied implementation of the method 100 shown in fig. 4. Fig. 5(a) schematically shows the circuit substrate 10 and a plurality of light sources 20 arranged on the circuit substrate 10. The plurality of light sources 20 may be regularly arranged at certain intervals on the circuit substrate 10. Next, the light source cover 50 is shown in FIG. 5(b) as it is arranged when the method 100 performs step 101. That is, the method 100 according to the present disclosure arranges the light source cover 50 covering each light source 20 on the circuit substrate 10. After the light source covers 50 are fixedly disposed on the circuit substrate 10, the method 100 may perform a first injection molding operation to form the lens holder 30 surrounding each light source cover 50 as shown in fig. 5 (c). That is, in step 102, the method 100 performs a first injection molding operation around each of the light sources 20 of the plurality of light sources 20 arranged on the circuit substrate 10 and the light source cover 50 to form the lens holder 30. For example, the lens holder 30 is formed around each of the four light source covers 50 in the drawing.

Then, the flow advances to fig. 5(d), and the method 100 may arrange lenses in the lens holder 30 formed in fig. 5(c), forming a light emitting device that emits light when the circuit substrate 10 is energized. The method of arranging the lenses may employ, for example, step 106 shown in fig. 2, i.e., the method 100 may perform a second injection molding operation for the inner space of the lens holder 30 to form a light emitting device as shown in fig. 5 (d). Fig. 5(e) is an enlarged sectional view showing fig. 5(d) in order to facilitate observation of the structure of the light emitting device formed after the light source cover is disposed. As shown, the lens 40 disposed in the light emitting device may wrap the light source cover 50, and the bottom of the lens 40 is fixed with the circuit substrate 10. The inner shape of the lens 40 may be defined by the lens holder 30, and the incident surface shape of the lens 40 may be defined by the shape of the light source cover 50. The light source cover 50 surrounds the light source 20, and a first air gap 61 may exist between the light source cover 50 and the light source 20, which arrangement is advantageous to increase optical refraction, thereby improving optical performance of the light emitting device.

While the embodiments of the method including the method of arranging the light source cover according to the present disclosure are described above in conjunction with fig. 4 and 5, it will be understood by those skilled in the art that the devices illustrated and the above description are exemplary and not limiting, and that modifications may be made by those skilled in the art as desired. For example, the number of light sources may not be limited to four as shown in fig. 5, and may be more or less arranged as necessary. The shape of the lens holder and the shape of the lens may not be limited to those shown in the drawings, and may be adjusted as needed. The manner in which the lenses are arranged in the lens holder may not be limited to injection molding, but other manners may be utilized, as will be described below with reference to fig. 6 and 7.

Fig. 6 is a flow chart illustrating a method including inserting a lens according to an embodiment of the present disclosure. As shown in fig. 6, at step 102, the method 100 may perform a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light source. The step 102 has been described in detail in the foregoing with reference to various embodiments, and is not described in detail here.

The process then proceeds to step 108, where the method 100 may insert and secure the lens into the lens holder with the lens shaped to fit the inner surface of the lens holder. It is understood that step 108 may be a specific implementation of step 104 described above in connection with fig. 1, i.e. step 108 is one embodiment of arranging lenses in a lens holder. In step 108, the lens may be a separate device manufactured according to the shape of the inner surface of the lens holder to facilitate assembly when needed. Individual devices are more convenient to store and mount. Such a lens may not be limited to conditions such as temperature when assembled with the lens holder, and thus may not affect the light source.

As further described in step 108, the method 100 may secure the lens within the lens holder. The arrangement can prevent the lens from falling off or losing and ensure the integrity and the optical effect of the light-emitting device. The manner of fixing the lens may include various ways. For example, according to one embodiment of the present disclosure, the method 100 securing the lens within the lens holder may include adhesively securing the lens within the lens holder. For example, the method 100 may use glue, adhesives, or the like to bond the outer surface of the lens to the inner surface of the lens holder. According to another embodiment of the present disclosure, the method 100 securing the lens within the lens holder may include securing the lens within the lens holder with a snap-fit. In this way, the method 100 can fix the lens by simple clamping operation when the lens is inserted into the lens holder, which is not only simple and convenient to operate, but also can accelerate the assembly speed, thereby improving the production efficiency.

The above-described snap-fit manner may be implemented in various forms, for example, according to an embodiment of the present disclosure, in step 102, the method 100 performing the first injection molding operation to form the lens holder may further include: in the first injection molding operation, an inner edge suitable for being clamped with the lens is formed on one side, close to the light source, of the inner surface of the lens holder. In particular, in one embodiment, the inner rim may include an annular protrusion for engaging with the lens, and the bottom of the lens may include an annular recess for engaging with the annular protrusion. In another embodiment, the inner rim may include a plurality of protrusions for engaging with the lens, and the lens may include a plurality of recesses at corresponding positions for engaging with the plurality of protrusions.

While another embodiment of arranging lenses according to the method for manufacturing a light emitting device of the present disclosure is described above with reference to fig. 6, the method shown in fig. 6 will be further described below with reference to fig. 7 in order to facilitate understanding of the method described in the present embodiment by those skilled in the art. It will be appreciated from the following description that the light emitting device fabrication process shown in fig. 7 is an embodiment of the method shown in fig. 6, and thus the statements made with respect to the method 100 apply equally to the following description.

Fig. 7 is a schematic diagram illustrating an embodied implementation of the method 100 shown in fig. 6. Fig. 7(a) schematically shows the circuit substrate 10 and a plurality of light sources 20 arranged on the circuit substrate 10. The plurality of light sources 20 may be regularly arranged at certain intervals on the circuit substrate 10. Next, the method 100 performs a first injection molding operation for each light source 20 of the plurality of light sources 20 on the circuit substrate 10 as shown in fig. 7(a) to form the lens holder 30 surrounding each light source 20 as shown in fig. 7 (b). For example, lens holders 30 are formed around the four light sources 20 in the figure.

Then, as shown in fig. 7(c), the method 100 may prepare to insert a lens conforming to the shape of the inner surface of the lens holder 30 into the lens holder. For ease of viewing, an enlarged cross-sectional view and a full view of the lens 40 in fig. 7(c) are shown in fig. 7 (e). As shown, the shape of the lens 40 is adapted to the shape of the inner surface of the lens holder 30. In one embodiment, the bottom of the lens 40 may include an annular recess 41 for engaging with the lens holder 30. As further shown in fig. 7(e), according to one embodiment of the present disclosure, the incident surface 42 of the lens 40 may have a curved surface structure covering the light source 20. It should be noted that the structure of the incident surface of the lens 40 may not be limited to the curved surface structure shown in the figure. For example, in another embodiment, the incident surface 42 of the lens 40 may have a flat structure covering the light source 20.

Further, the flow proceeds to fig. 7(d), and the method 100 inserts and fixes the lens 40 in the lens holder 30 to form the light emitting device. Fig. 7(f) is a partially enlarged view showing fig. 7(d) for convenience of observation and description. As shown in the figure, the lens holder 30 formed by the first injection molding operation is fixed on the circuit substrate 10, and an annular convex portion 31 adapted to engage with the lens 40 is formed on the side of the inner surface of the lens holder 30 close to the light source 20 in the injection molding operation, and the annular convex portion 31 can be engaged and fixed with the annular concave portion 41 at the bottom of the lens 40. As further shown in fig. 7(f), when the lens 40 is fixed in the lens holder 30, since the incident surface of the lens 40 has a curved surface structure, there may be a space between the incident surface 42 and the light source 20 to form a second air gap 62. The second air gap at the surface of the light source 20 creates design flexibility for changing optical performance. According to such an arrangement, incident light from the light source 20 may undergo optical refraction by the second air gap 62 before entering the lens 40, thereby enabling enhancement of optical effects such as light condensation.

While another embodiment of a method including arranging lenses according to the present disclosure is described above in conjunction with fig. 6 and 7, it will be understood by those skilled in the art that the apparatus shown in the drawings and the above description are exemplary and not limiting, and that modifications may be made by those skilled in the art as desired. For example, the shape of the lens holder and the shape of the lens may not be limited to those shown in the drawings, and may be adjusted as necessary. In one embodiment, the light source cover may be disposed to protect the light source before the lens is inserted into the lens holder, and then the shape-fitting lens is inserted and fixed into the lens holder. The manner of engaging the lens with the lens holder is not limited to the engagement between the annular concave portion and the annular convex portion, and other engagement manners may be provided as necessary.

FIG. 8 is a flow chart illustrating a method including retrofitting a housing according to an embodiment of the present disclosure. As shown in fig. 8, at step 102, the method 100 may perform a first injection molding operation around each of a plurality of light sources disposed on a circuit substrate to form a lens holder surrounding the light source. Next, at step 104, the method 100 arranges a lens on the lens holder to form the light emitting device that emits light when the circuit substrate is energized. Step 102 and step 104 have already been described in detail in conjunction with fig. 1 and so on, and are not described here again.

Further, at step 110, the method 100 may attach a housing to the exterior of the light emitting device to encapsulate the light emitting device. The components inside the light-emitting device can be protected through packaging, the appearance of the light-emitting device is more attractive and regular, and the light-emitting device is convenient to transport and use. The housing attached to the method 100 may include various forms, such as a housing that encloses components within the lighting device, a housing that is spaced apart from components within the lighting device, etc. The following description will be made in conjunction with the application examples of fig. 9a and 9 b.

As shown in fig. 9a, the light emitting device-attached housing may include a tray 70 and an encapsulation layer 80 filled in the tray 70. The method 100 may insert the circuit substrate 10, on which the light source 20, the lens holder 30, and the lens 40 are disposed, into the tray 70, and fill the encapsulation layer 80 into the tray 70 to implement encapsulation of the light emitting device. The tray 70 may be made of metal, plastic, rubber, etc. The color of the tray 70 may be set as desired. The transparency of the tray 70 may be set as desired, for example, transparent or translucent, or opaque. The opaque tray 70 may have some function of reflecting light. In one embodiment, encapsulation layer 80 may be made of a potting adhesive, which may be applied by, for example, a potting machine.

As shown in fig. 9b, the light-emitting device-attached housing may include a tray 70 and a cover plate 90 covering the top of the tray 70. The method 100 may insert the circuit substrate 10, on which the light source 20, the lens holder 30, and the lens 40 are disposed, into the tray 70, and implement packaging of the light emitting device by inserting the cover plate 90 on the top of the tray 70. The cover plate 90 may be spaced apart from the components such as the lens 40 in the tray 70, thereby producing an optical refraction effect. The material, color, etc. of the tray 70 have been described above in connection with fig. 9a, and will not be described again here. The height of the side plates of both sides of the tray 70 can be adjusted as desired. The cover plate 90 may be made transparent or translucent as desired. The cover plate 90 may be made of at least one material such as glass, polycarbonate, Acrylonitrile Butadiene Styrene (ABS) resin, polycarbonate PC, polymethylmethacrylate PMMA, polyvinyl chloride PVC, and the like.

Through the above description of the technical solutions and the multiple embodiments of the method for manufacturing a light emitting device according to the present disclosure, it can be understood by those skilled in the art that the present disclosure forms a lens holder fixed on a circuit substrate around a light source by injection molding, and can define the arrangement position of a lens by the lens holder, so that the mounting accuracy and precision of the lens can be effectively ensured. And components such as the lens holder are fixed in an injection molding mode, so that the requirements on the thickness, the hardness and the like of the circuit board can be reduced, and the development requirements on the aspects of thinning of the flexible circuit board and the circuit board can be met.

Further, the present disclosure also provides various embodiments of arranging the lenses in the lens holder, which can be selected as needed by those skilled in the art. For example, the method of the present disclosure may form the lens by performing the second injection molding operation, may form the lens having a higher degree of fitting with the inner surface of the lens holder, and may simultaneously fix the lens on the circuit substrate by injection molding. The method of the present disclosure may also insert and fix a separately manufactured lens in a lens holder, for example, and the like. Such an arrangement enables the lens to be mounted more conveniently and quickly, and the shape of the separately manufactured lens is controllable, and a specific shape or structure, such as an incident surface including a curved structure or a straight structure, can be manufactured as required to improve the optical effect of the light emitting device. Therefore, the method for manufacturing the light-emitting device not only can improve the accuracy, precision, firmness and the like of the lens, but also can reduce the limit on the circuit substrate and improve the optical effect and the like of the light-emitting device, thereby having wide application prospect.

Although the embodiments of the present disclosure are described above, the descriptions are only used for facilitating the understanding of the present disclosure, and are not intended to limit the scope and application scenarios of the present disclosure. It will be understood by those skilled in the art of the present disclosure that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure, and that the scope of the disclosure is to be limited only by the appended claims.