阅读说明：本技术 一种减少活化钯流失的电镀工艺 (Electroplating process capable of reducing loss of activated palladium ) 是由 王景贵 谢明运 李仕武 罗佳佳 于 2021-08-31 设计创作，主要内容包括：本发明涉及线路板技术领域,特别是涉及一种减少活化钯流失的电镀工艺,该工艺包括以下步骤S1、预处理待电镀的板件,将预处理后的板件置入预浸槽中预浸,预浸槽内装有预浸盐；S2、将S1处理后的板件置入第一活化缸中,第一活化缸内装第一活化液；S3、将S2处理后的板件置入第二活化缸中,第二活化缸内装有第二活化液；S4、将S3处理后的板件返回并置入第一活化缸内,停留活化一定时间；S5、水洗S4处理后的板件,获得水洗后的板件；其中,第一活化液的浓度比第二活化液的浓度低,该工艺能有效地减少活化钯的带出量,进而有效降低了板件电镀的成本。(The invention relates to the technical field of circuit boards, in particular to an electroplating process for reducing loss of activated palladium, which comprises the following steps of S1, pretreating a plate to be electroplated, placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove; s2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid; s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder; s4, returning the plate processed in the step S3 to be placed in a first activation cylinder, and staying and activating for a certain time; s5, washing the plate processed by the S4 to obtain the plate after washing; the concentration of the first activating solution is lower than that of the second activating solution, and the process can effectively reduce the carrying-out amount of activated palladium, so that the plating cost of the plate is effectively reduced.)

1. An electroplating process for reducing loss of activated palladium is characterized in that: comprises the following steps of (a) carrying out,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove;

s2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid;

s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder;

s4, returning the plate processed in the step S3 to the first activation cylinder, and staying and activating for a certain time;

s5, washing the plate processed by the S4 to obtain the plate after washing;

wherein the concentration of the first activating liquid is lower than the concentration of the second activating liquid.

2. An electroplating process to reduce loss of activated palladium according to claim 1, wherein: the board is a PCB board.

3. An electroplating process to reduce loss of activated palladium according to claim 1, wherein: the time for placing the plate in the pre-soaking tank is 30-60 s.

4. A plating process with reduced loss of activated palladium according to claim 3 wherein: in S2, the time for placing the plate member in the first activation cylinder is 20 to 40 seconds.

5. An electroplating process according to claim 4, wherein the plating process is characterized by: in S3, the time for placing the plate member in the second activation cylinder is 5 to 7 seconds.

6. An electroplating process according to claim 5, wherein the plating process is characterized by: in S4, the time for placing the plate member in the first activation cylinder is 20 to 40 seconds.

7. An electroplating process to reduce loss of activated palladium according to claim 1, wherein: and after S5, depositing copper to treat the washed plate.

8. An electroplating process to reduce loss of activated palladium according to claim 1, wherein: and a circulating filter is arranged in the first activation cylinder.

9. An electroplating process according to claim 8, wherein the plating process is characterized by: the temperature of the first activation liquid in the first activation cylinder is controlled to be 25-30 ℃.

10. An electroplating process to reduce loss of activated palladium according to claim 9, wherein: and a defoaming shaker is arranged in the first activation cylinder.

Technical Field

The invention relates to the technical field of circuit boards, in particular to an electroplating process for reducing loss of activated palladium.

Background

The plate activation procedure of the conventional gantry line process design at present is to pre-soak the plate, then activate the plate in an activation cylinder, and wash the activated plate with water to wash away the activated palladium solution on the plate.

In practical application, because the concentration of the activated palladium in the activation cylinder is higher, after the plate is taken out of the activation cylinder, the plate can take more activated palladium out, so that the activated palladium in the activation cylinder is continuously taken out along with the electroplating process, and the loss of the activated palladium is more and more. The price of the current palladium metal is also continuously increased, so the activation process in the electroplating process directly affects the cost of the user and the supplier.

Disclosure of Invention

The invention aims to avoid the defects of the prior art and provide the electroplating process for reducing the loss of the activated palladium, and the process can effectively reduce the carrying-out amount of the activated palladium so as to effectively reduce the electroplating cost of the plate.

The first purpose of the invention is realized by the following technical scheme:

provides an electroplating process for reducing the loss of activated palladium, which comprises the following steps,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove;

s2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid;

s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder;

s4, returning the plate processed in the step S3 to the first activation cylinder, and standing and activating the plate for a certain time'

S5, washing the plate processed by the S4 to obtain the plate after washing;

wherein the concentration of the first activating liquid is lower than the concentration of the second activating liquid.

The principle of the steps is as follows: for the first plate, the first plate is immersed in a pre-soaking cylinder, then the first plate is placed in a first activation cylinder for activation, then the first plate is placed in a second activation cylinder for activation again, the first plate returns to the first activation cylinder again after coming out of the second activation cylinder for staying, and then the plate is washed by water; because the first plate can stay in the first activation cylinder after coming out of the second activation cylinder, the activated palladium brought out by the first plate can be brought into the first activation cylinder, namely, the activated palladium is recovered into the first activation cylinder, the subsequent plate can use the recovered activated palladium, and meanwhile, the first plate is neutralized by the low-concentration activation solution in the first activation cylinder and then is lifted out, so that the carrying-out amount of the palladium can be effectively reduced.

For the second plate, the second plate sequentially enters the prepreg cylinder, the first activation cylinder and the second activation cylinder and then returns to the first activation cylinder again, and after the second plate comes out of the first activation cylinder, the second plate also brings the activated palladium in the first activation cylinder back to the second activation cylinder, so that the activated palladium in the second activation cylinder is supplemented, the liquid level of the second activation cylinder is further supplemented, the stability of the concentration of the activated palladium is kept, the loss of the activated palladium is reduced, and similarly, after the second plate is neutralized by the low-concentration activation liquid in the first activation cylinder, the carrying amount of the palladium can be effectively reduced.

By analogy, the activated palladium is recovered from the second activation cylinder to the first activation cylinder and is brought back to the second activation cylinder from the first activation cylinder, so that the loss of the activated palladium of the second activation cylinder can be effectively avoided, the activation effect is maintained, and the activated palladium on the plate is diluted in the first activation cylinder after the plate comes out of the first activation cylinder due to the fact that the concentration of the first activation liquid is lower than that of the second activation liquid, and the carrying amount of the palladium is reduced.

That is, in S2, the panel is placed in the first activation cylinder to preliminarily activate the panel and bring the activated palladium in the first activation cylinder back to the second activation cylinder; at S3, the plate member is placed in a second activation cylinder to reactivate the plate; in S4, the plate member is returned from the second activation cylinder to the first activation cylinder to recover the carried-out activated palladium, and the circulation is performed so as to reduce the amount of the activated palladium, and since the concentration of the first activation liquid is lower than that of the second activation liquid, the activated palladium on the plate member is diluted in the first activation cylinder after the plate member is brought out from the first activation cylinder, thereby reducing the amount of the palladium carried-out.

In some embodiments, the board is a PCB board.

In some embodiments, the plate member is placed in the pre-dip tank for a time period of 30 to 60 seconds.

In some embodiments, in S2, the plate is inserted into the first activation cylinder for 20S to 40S.

In some embodiments, in S3, the plate is inserted into the second activation cylinder for 5S to 7S.

In some embodiments, in S4, the plate is inserted into the first activation cylinder for 20S to 40S.

In some embodiments, after S4, the washed plate is subjected to a copper deposition treatment.

In some embodiments, the first activation cylinder is internally provided with a circulation filter.

In some embodiments, the temperature of the first activation liquid in the first activation cylinder is controlled at 25 ℃ to 30 ℃.

In some embodiments, a defoaming shaker is disposed within the first activation cylinder.

The electroplating process for reducing the loss of the activated palladium has the beneficial effects that:

(1) according to the invention, another activation cylinder is added between the pre-soaking tank and the activation cylinder, and the plate passes through the first activation cylinder, then passes through the second activation cylinder, and then returns to the first activation cylinder from the second activation cylinder, so that the activated palladium carried out by the plate is effectively recovered, and the activation effect is ensured.

(2) The concentration of the first activation liquid is lower than that of the second activation liquid, and after the plate comes out of the first activation cylinder, the activated palladium on the plate is diluted in the first activation cylinder, so that the amount of palladium carried out is reduced.

(3) The electroplating process can reduce the brought-out activated palladium, thereby reducing the quantity of the tin palladium mud washed by water and reducing the discharge quantity of the tin mud.

(4) The higher the concentration of the adopted palladium in the electroplating process is, the larger the amount of the saved palladium is, and the electroplating process is suitable for large-scale production and application.

Drawings

The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.

FIG. 1 is a flow chart of an electroplating process with reduced loss of activated palladium in accordance with the present invention.

Detailed Description

The invention is further described with reference to the following examples and the accompanying drawings.

Example 1

This example discloses an electroplating process to reduce the loss of activated palladium, as shown in FIG. 1, comprising the following steps,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove; wherein the step relating to the pretreatment of the plate member to be plated mainly includes the removal of stains and unnecessary impurities.

S2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid;

s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder;

s4, returning the plate processed in the step S3 to the first activation cylinder, and staying and activating for a certain time;

s5, washing the plate processed by the S4 to obtain the plate after washing;

wherein the concentration of the first activating liquid is lower than the concentration of the second activating liquid. Specifically, the palladium concentration of the second activation liquid was 60 ppm.

The function of the steps is as follows: the activated palladium brought out by the activation cylinder is brought back to the second activation cylinder again through the first activation cylinder, so that the liquid level of the second activation cylinder and the stability of the palladium concentration of the second activation cylinder are ensured, the carrying-out amount is reduced, and the purpose of saving cost is achieved.

In this embodiment, the board is a PCB. In practical application, the device can also be applied to other plate members.

In this embodiment, the time for placing the plate member in the pre-dip tank is 30 seconds.

In this embodiment, in S2, the time for placing the plate member into the first activation cylinder is 20S, so that the preliminary activation is performed.

In this embodiment, in S3, the plate member is placed in the second activation cylinder for 5 seconds, so that the plate member is activated again.

In this embodiment, in S4, the plate is placed in the first activation cylinder for 20S, and not only the re-activation is performed, but also the activated palladium is brought back to the second activation cylinder.

In this embodiment, after S4, the plate after washing is subjected to a copper deposition treatment.

In some embodiments, a circulation filter is arranged in the first activation cylinder, and the circulation filter is used for circularly removing impurities of the first activation liquid in the first activation cylinder.

In some embodiments, the temperature of the first activation liquid in the first activation cylinder is controlled at 25 ℃, and the temperature of the first activation liquid is controlled at normal temperature, so that the stability of the activation quality can be effectively ensured.

In some embodiments, a defoaming vibrator is arranged in the first activation cylinder, and the defoaming vibrator vibrates bubbles in pores of the plate by vibration force, so that the uniformity of activation is ensured.

Example 2

This example discloses an electroplating process to reduce the loss of activated palladium, as shown in FIG. 1, comprising the following steps,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove; wherein the step relating to the pretreatment of the plate member to be plated mainly includes the removal of stains and unnecessary impurities.

S2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid;

s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder;

s4, returning the plate processed in the step S3 to the first activation cylinder, and staying and activating for a certain time;

s5, washing the plate processed by the S4 to obtain the plate after washing;

wherein the concentration of the first activating liquid is lower than the concentration of the second activating liquid. Specifically, the palladium concentration of the second activation liquid was 70 ppm.

The function of the steps is as follows: the activated palladium brought out by the activation cylinder is brought back to the second activation cylinder again through the first activation cylinder, so that the liquid level of the second activation cylinder and the stability of the palladium concentration of the second activation cylinder are ensured, the carrying-out amount is reduced, and the purpose of saving cost is achieved.

In this embodiment, the board is a PCB. In practical application, the device can also be applied to other plate members.

In this embodiment, the time for placing the plate member in the pre-dip tank is 60 s.

In this embodiment, in S2, the time for placing the plate member into the first activation cylinder is 40S, so that the preliminary activation is performed.

In this embodiment, in S3, the plate member is placed in the second activation cylinder for 7 seconds, so that the plate member is activated again.

In this embodiment, in S4, the plate is placed in the first activation cylinder for 40S, and not only the re-activation is performed, but also the activated palladium is brought back to the second activation cylinder.

In this embodiment, after S4, the plate after washing is subjected to a copper deposition treatment.

In this embodiment, a circulation filter is disposed in the first activation cylinder, and the circulation filter is configured to circularly remove impurities in the first activation liquid in the first activation cylinder.

In this embodiment, the temperature of the first activation liquid in the first activation cylinder is controlled to be 30 ℃, and the temperature of the first activation liquid is controlled to be at a normal temperature, so that the stability of the activation quality can be effectively ensured.

In this embodiment, establish the defoaming electromagnetic shaker in the first activation jar, this defoaming electromagnetic shaker shakes out through the bubble of shaking force in with the plate hole, has guaranteed the degree of consistency of activation.

Example 3

This example discloses an electroplating process to reduce the loss of activated palladium, as shown in FIG. 1, comprising the following steps,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove; wherein the step relating to the pretreatment of the plate member to be plated mainly includes the removal of stains and unnecessary impurities.

S2, placing the plate processed in the step S1 into a first activation cylinder, wherein the first activation cylinder is filled with a first activation liquid;

s3, placing the plate processed in the step S2 into a second activation cylinder, wherein a second activation liquid is filled in the second activation cylinder;

s4, returning the plate processed in the step S3 to the first activation cylinder, and staying and activating for a certain time;

s5, washing the plate processed by the S4 to obtain the plate after washing;

wherein the concentration of the first activating liquid is lower than the concentration of the second activating liquid. Specifically, the palladium concentration of the second activation liquid was 65 ppm.

The function of the steps is as follows: the activated palladium brought out by the activation cylinder is brought back to the second activation cylinder again through the first activation cylinder, so that the liquid level of the second activation cylinder and the stability of the palladium concentration of the second activation cylinder are ensured, the carrying-out amount is reduced, and the purpose of saving cost is achieved.

In this embodiment, the board is a PCB. In practical application, the device can also be applied to other plate members.

In this embodiment, the time for placing the plate member in the pre-dip tank is 40 s.

In this embodiment, in S2, the time for placing the plate member into the first activation cylinder is 30S, so that the preliminary activation is performed.

In this embodiment, in S3, the plate member is placed in the second activation cylinder for 6 seconds, so that the plate member is activated again.

In this embodiment, in S4, the plate is placed in the first activation cylinder for 30S, and not only the re-activation is performed, but also the activated palladium is brought back to the second activation cylinder.

In this embodiment, after S4, the plate after washing is subjected to a copper deposition treatment.

In some embodiments, a circulation filter is arranged in the first activation cylinder, and the circulation filter is used for circularly removing impurities of the first activation liquid in the first activation cylinder.

In some embodiments, the temperature of the first activation solution in the first activation cylinder is controlled at 27 ℃, and the temperature of the first activation solution is controlled at normal temperature, so that the stability of the activation quality can be effectively ensured.

In some embodiments, a defoaming vibrator is arranged in the first activation cylinder, and the defoaming vibrator vibrates bubbles in pores of the plate by vibration force, so that the uniformity of activation is ensured.

Comparative example 1

The plating process of this comparative example differs from that of example 1 in that it includes the following steps,

s1, pretreating the plate to be electroplated, and placing the pretreated plate into a presoaking groove for presoaking, wherein presoaking salt is filled in the presoaking groove; wherein the step relating to the pretreatment of the plate member to be plated mainly includes the removal of stains and unnecessary impurities.

S2, placing the plate processed in the step S1 into an activation cylinder, wherein the activation cylinder is filled with activation liquid;

and S3, washing the plate processed by the S2 to obtain the washed plate.

In this example, in S2, the time for placing the plate member in the first activation cylinder was 5 seconds, and the palladium concentration of the activation solution was 60 ppm.

Recovery efficiency effect verification

Using the plating processes of example 1 and comparative example 1, the palladium consumptions of example 1 and comparative example 1 were compared, respectively, to obtain the results shown in Table 1

TABLE 1

As can be seen from Table 1, the actual palladium consumption per unit time of the plating process of the present invention is 0.27mL/S, and the actual palladium consumption per unit time of comparative example 1 is 0.8mL/SF, it can be seen that the plating process of the present invention can significantly reduce the palladium consumption per unit time, and the unit consumption saving rate reaches 66.25% as compared with comparative example 1, and thus it can be seen that the plating process of the present invention can be widely applied to plating.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.