阅读说明：本技术 一种微通道的液冷板的焊接装置及方法 (Welding device and method for liquid cooling plate of micro-channel ) 是由 王海红 季祥 李仁� 刘宁宁 翟天嵩 盖晓华 刘忠超 张季萌 屈保中 于 2021-01-14 设计创作，主要内容包括：本发明涉及微通道液冷板直接钎焊的技术领域,特别涉及一种微通道的液冷板的焊接装置及方法,其特征是：至少包括微通道基板与盖板,所述的微通道基板和盖板具有相同的面积和形状,在同样的位置微通道基板和盖板分别有m列电缆接头过孔,每列电缆接头过孔有n个,其中盖板上并排的n列电缆接头过孔一侧有通槽,微通道基板上并排的n列电缆接头过孔一侧有凸台,通槽用于盖板上与微通道基板的凸台配合使用,凸台在微通道基板焊接薄弱处设计；在盖板的两个对角分别有冷却液流入冒口和冷却液流出冒口；盖板和微通道基板采用直接钎焊焊接。它以便解决盖板与微通道基板接触面积较小的部位在压力状态下不容易发生脱焊,漏液等缺陷。(The invention relates to the technical field of direct brazing of a microchannel liquid cooling plate, in particular to a welding device and a welding method of the microchannel liquid cooling plate, which are characterized in that: the novel micro-channel connector at least comprises a micro-channel substrate and a cover plate, wherein the micro-channel substrate and the cover plate have the same area and shape, m rows of cable connector through holes are respectively arranged on the micro-channel substrate and the cover plate at the same position, n cable connector through holes are arranged in each row, a through groove is arranged on one side of the cover plate, which is parallel to each other, of the n rows of cable connector through holes, a boss is arranged on one side of the micro-channel substrate, the through groove is used for being matched with the boss of the micro-channel substrate on the cover plate, and the boss is designed at the welding weak position of the micro; two opposite corners of the cover plate are respectively provided with a cooling liquid inflow riser and a cooling liquid outflow riser; the cover plate and the micro-channel substrate are welded by direct brazing. The micro-channel substrate structure is convenient for solving the defects that the part with smaller contact area between the cover plate and the micro-channel substrate is not easy to generate desoldering, liquid leakage and the like under the pressure state.)

1. The utility model provides a welding set of liquid cooling board of microchannel which characterized by: the novel micro-channel connector at least comprises a micro-channel substrate (2) and a cover plate (1), wherein the micro-channel substrate (2) and the cover plate (1) have the same area and shape, m rows of cable connector through holes (3) are respectively arranged on the micro-channel substrate (2) and the cover plate (1) at the same position, a through groove (9) is arranged on one side of n rows of cable connector through holes arranged side by side on the cover plate (1), bosses (6) are arranged on one side of 3 rows of cable connector through holes arranged side by side on the micro-channel substrate (2), the through groove (9) is used on the cover plate (1) and matched with the bosses (6) of the micro-channel substrate (2) for use, and the bosses (6) are designed at the welding weak part; two opposite corners of the cover plate (1) are respectively provided with a cooling liquid inflow riser (4) and a cooling liquid outflow riser (5); the cover plate (1) and the micro-channel substrate (2) are welded by direct brazing.

2. The apparatus of claim 1, wherein: m and n be not more than 5, the cable joint via hole 3 is listed as, every cable joint via hole 3 has n =5, when m =4, n =4, 4 cable joint via holes (3) of microchannel base plate (2) and 4 cable joint via holes (3) of apron (1) have the same structure, be oval rectangular structure, microchannel base plate (2) and apron (1) be the rectangle, oval rectangular orientation rectangle minor face direction.

3. The apparatus of claim 2, wherein: the 4 rows of elliptic long strips of the micro-channel substrate (2) and the cover plate (1) are distributed at equal intervals.

4. The apparatus of claim 1, wherein: the two sides of the short side of the microchannel substrate (2) are respectively provided with an inlet and outlet main flow passage (7) of the microchannel substrate, the inlet and outlet main flow passage (7) of the microchannel substrate is of a long strip groove-shaped structure, and two ends of the long strip groove-shaped structure are respectively close to the positions of 4 rows of oval strips.

5. The apparatus of claim 2, wherein: two microchannels (8) are respectively arranged between the 4 rows of elliptic strips of the microchannel substrate (2), and two ends of each microchannel (8) are flush with the inlet and outlet main flow channel (7) of the microchannel substrate.

6. The apparatus of claim 1, wherein: the height of the boss (6) is consistent with the thickness of the cover plate (1).

7. The apparatus of claim 1, wherein: the cover plate (1) is provided with a through groove (9) at the position corresponding to the boss (6), the cross section of the through groove (9) is the same as the boss interface, and the boss is ensured to be matched with the through groove tightly.

8. The apparatus of claim 1, wherein: preferably, the width of the boss is 0.5 to 0.8 times the width of the contact weakness.

9. The apparatus of claim 1, wherein: and the surface of the cover plate (1), the boss (6) and the cover plate (1) are matched and positioned by adopting argon arc welding spot welding.

10. A welding method of a liquid cooling plate of a micro-channel is characterized by comprising the following steps: the utility model provides a welding set of liquid cooling board of microchannel which characterized by: the novel micro-channel connector at least comprises a micro-channel substrate (2) and a cover plate (1), wherein the micro-channel substrate (2) and the cover plate (1) have the same area and shape, m rows of cable connector through holes (3) are formed in the micro-channel substrate (2) and the cover plate (1) at the same position respectively, n cable connector through holes (3) are formed in each row, m and n are not more than 5, when m =3 and n =3, a through groove (9) is formed in one side of the 3 rows of cable connector through holes which are arranged side by side on the cover plate (1), a boss (6) is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the micro-channel substrate (2), the through groove (9) is used for being matched with the boss (6) of the micro-channel substrate (2) on the cover plate (1), and the boss (6); two opposite corners of the cover plate (1) are respectively provided with a cooling liquid inflow riser (4) and a cooling liquid outflow riser (5); the cover plate (1) is welded on the upper surface of the micro-channel substrate (2) in a brazing mode, so that cooling liquid flows into the riser (4) through the cooling liquid and is output through the coolant flowing out of the riser (5), pressure generated on the cover plate when high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation is enabled to be avoided, and the parts, with small contact area, of the cover plate and the micro-channel substrate are not affected by pressure to generate desoldering and liquid leakage.

Technical Field

The invention relates to the technical field of direct brazing of a microchannel liquid cooling plate, in particular to a welding device and a welding method of the microchannel liquid cooling plate.

Background

In recent years, phased array radars are more and more widely applied, and phased array antennas are more and more high in integration level. Thousands of T/R components are integrated in a limited space of a phased array radar, and generate a large amount of heat in the radar working process, especially in the application of GaN devices for several years, so that the power density of the devices reaches more than three times of the power density of the devices, and the element assembly density, the power consumption and the heat load are rapidly increased. The micro-channel liquid cooling plate is an ideal heat dissipation device, and is widely popularized and applied as a heat dissipation device in a phased array radar.

A microchannel liquid cooled plate generally refers to a heat exchanger having channels with equivalent diameters of 10-1000 μm. The liquid flow microchannel cooling device generally comprises a cover plate and a microchannel base plate, wherein a liquid flow microchannel is processed on the microchannel base plate through a reasonable process, and a riser, a cable through hole and the like for enabling cooling liquid to enter and exit the microchannel base plate are processed on the cover plate. The cover plate is welded on the upper surface of the micro-channel substrate in a brazing mode, and cooling liquid enters and exits the micro-channel radiator through the riser to meet the heat dissipation requirement.

Conventional microchannel heat sinks have been fabricated by soldering the cover plate and microchannel substrate together by a direct brazing process. The method is specifically described in that a brazing welding sheet is placed between a cover plate and a micro-channel substrate, the cover plate, the micro-channel substrate and the micro-channel substrate are compressed, the workpiece is not melted after being heated, a prefabricated welding flux is melted, and metal is connected together through reactions such as metallurgy and diffusion at the gap of a flow channel welding seam by utilizing liquid brazing filler metal.

However, in some high-density phased array radar systems, some special designs require that the contact area of the cover plate of the cold plate and the micro-channel substrate is quite limited at some positions, and the contact width is less than 5 mm. If the positions are welded firmly by a direct brazing method, the welding quality is poor.

When the high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation, large pressure is generated on the cover plate, and the part with small contact area between the cover plate and the micro-channel substrate is easy to have the defects of welding failure, liquid leakage and the like in a pressure state, which is not allowed by the system.

Disclosure of Invention

Aiming at the problems of the existing direct brazing technology, the invention provides a welding device and a welding method for a liquid cooling plate of a micro-channel, so as to solve the defects that the part with smaller contact area between a cover plate and a micro-channel substrate is not easy to generate desoldering, liquid leakage and the like in a pressure state.

In order to achieve the above object, the present invention provides a welding apparatus for a microchannel liquid-cooled plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, n rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, m cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the n rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.

The n cable joint via holes 3 of the n row of the micro-channel substrate 2 and the n cable joint via holes 3 of the cover plate 1 have the same structure and are of an oval strip structure, the micro-channel substrate 2 and the cover plate 1 are rectangular, and the oval strip faces the short side direction of the rectangle.

The specific position size is designed between the 4 rows of elliptic long strips of the micro-channel substrate 2 and the cover plate 1 according to the design requirement.

The inlet and outlet main flow channel 7 of the micro-channel substrate is respectively arranged on two sides of the short side of the micro-channel substrate 2, the inlet and outlet main flow channel 7 of the micro-channel substrate is of a long-strip groove-shaped structure, and the specific position size is designed at two ends of the long-strip groove-shaped structure according to design requirements.

The microchannel substrate 2 is provided with a plurality of microchannels 8 to meet the heat dissipation requirement, and two ends of each microchannel 8 are flush with the inlet and outlet main flow channel 7 of the microchannel substrate.

The height of the boss 6 is consistent with the thickness of the upper cover plate 1.

The upper cover plate 1 is provided with a through groove 9 corresponding to the boss 6, the cross section of the through groove 9 is the same as that of the boss, and the boss is tightly matched with the through groove.

Preferably, the width of the boss is 0.5-0.8 times of the width of the contact weak part;

and the surface of the cover plate 1, the matching position of the lug boss 6 and the cover plate 1 are packaged by adopting argon arc welding spot welding.

The invention has the advantages that: in order to overcome the problems that the contact width of the micro-channel substrate and the cover plate is too narrow, and the welding is not firm and too narrow in the direct brazing process, bosses 6 are designed on one side of through holes of 3 rows of cable connectors arranged side by side on the micro-channel substrate 2, the heights of the bosses are consistent with the thickness of the upper cover plate, through grooves are formed in the positions, corresponding to the bosses, of the upper cover plate, the cross sections of the through grooves are the same as the interfaces of the bosses, and the bosses. The width of the boss is preferably 0.5-0.8 times of the width of the weak contact part, the cover plate and the base plate are welded by a direct brazing method, the surface of the cover plate, the boss and the cover plate are matched, the interface position is packaged by adopting argon arc welding spot welding, the welding quality at the position with the too narrow contact width is ensured, and finally the design flatness requirement of the surface of the whole cover plate is ensured by milling the upper surface of the cover plate 1.

Drawings

The invention is further illustrated by the following examples and figures:

FIG. 1 is a schematic diagram of an improved microchannel liquid cooling plate configuration;

FIG. 2A is a front view of a microchannel substrate structure;

FIG. 2B is a side view of a microchannel substrate structure;

FIG. 3A is a front view of a cover plate construction;

fig. 3B is a side view of the cover plate structure.

In the figure, 1, a cover plate; 2. a microchannel substrate; 3. a cable connector via hole; 4. cooling liquid flows into the riser; 5. the coolant flows out of the riser; 6. a boss; 7. an inlet and outlet main channel of the microchannel substrate; 8. a microchannel; 9. a through groove.

Detailed Description

Example 1

As shown in fig. 1, 2A, 2B, 3A, and 3B, a welding apparatus for a microchannel liquid-cooled plate is characterized in that: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, 4 rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, 4 cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the 3 rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.

The specific values of m and n are determined according to different application scenarios and the number of cable joints, and are generally not more than 5.

The 4 rows of cable connector through holes 3 of the microchannel substrate 2 and the 4 rows of cable connector through holes 3 of the cover plate 1 shown in fig. 2A and 2B have the same structure and are oval long structures, and the microchannel substrate 2 and the cover plate 1 are rectangular.

The 4 rows of elliptic long strips of the micro-channel substrate 2 and the cover plate 1 are distributed at equal intervals.

The inlet and outlet main flow channel 7 of the micro-channel substrate is respectively arranged on two sides of the short side of the micro-channel substrate 2, the inlet and outlet main flow channel 7 of the micro-channel substrate is of a long-strip groove-shaped structure, and two ends of the long-strip groove-shaped structure are respectively close to the positions of 4 rows of oval strips.

Two microchannels 8 are respectively arranged between the 4 rows of elliptic strips of the microchannel substrate 2, and two ends of each microchannel 8 are flush with the inlet and outlet main flow channels 7 of the microchannel substrate.

The height of the boss 6 is consistent with the thickness of the upper cover plate 1.

As shown in fig. 3A and 3B, the cover plate 1 has a through groove 9 formed at a position corresponding to the boss 6, and the cross section of the through groove 9 is the same as the boss interface, so that the boss and the through groove are tightly fitted.

Preferably, the width of the boss is 0.5-0.8 times of the width of the contact weak part;

and the surface of the cover plate 1, the boss 6 and the cover plate 1 are matched, and argon arc welding spot welding is adopted to package the interface position. And finally, the design flatness requirement of the surface of the whole cover plate is ensured in a mode of milling the upper surface of the cover plate 1.

The cover plate 1 is provided with a cooling liquid inflow riser 4, a cooling liquid outflow riser 5 and a cable joint via hole 3, the cover plate 1 is welded on the upper surface of the micro-channel substrate 2 in a direct brazing mode, the cooling liquid flows into the riser 4 through the cooling liquid, and the cooling liquid outflow riser 5 outputs the cooling liquid, so that the heat dissipation requirement is guaranteed.

Example 2

Referring to fig. 1, 2A, 2B, 3A, 3B, a welding apparatus for a microchannel liquid cooling plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, 4 rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, 5 cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the 3 rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.

This embodiment gives m =4 columns of cable connector vias 3, with n =5 cable connector vias 3 per column.

Example 3

Referring to fig. 1, 2A, 2B, 3A, 3B, a welding apparatus for a microchannel liquid cooling plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, m rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, n cable connector through holes 3 are arranged in each row, m and n are not more than 5, when m =3 and n =3, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the cover plate 1, a boss 6 is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the micro-channel substrate 2, the through groove 9 is used for being matched with the boss 6 of the micro-channel substrate 2 on the cover plate 1, and the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 is welded on the upper surface of the micro-channel base plate 2 in a brazing mode, so that cooling liquid flows into the riser 4 through the cooling liquid and flows out of the riser 5 for output, pressure generated on the cover plate when high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation is enabled, and the situation that the part, with a small contact area, of the cover plate and the micro-channel base plate is subjected to pressure to generate desoldering and liquid leakage is not influenced.

In fact, the specific values of m and n are determined according to different application scenarios and the number of cable joints, and are generally not more than 5.

The components and structures of the present embodiments that are not described in detail are well known in the art and do not constitute essential structural elements or elements.