Laser equipment for micro-control chip processing

文档序号:839057 发布日期:2021-04-02 浏览:6次 中文

阅读说明:本技术 一种用于微控芯片加工用的激光设备 (Laser equipment for micro-control chip processing ) 是由 骆仁川 于 2020-12-15 设计创作,主要内容包括:本发明公开了一种用于微控芯片加工用的激光设备,其结构包括:矫正器、送料器、机箱、控制器、激光头,矫正器安设在送料器的顶部,送料器安设在机箱的上端,控制器通过导线与激光头内部电路相连接,激光头通过螺栓固定在机箱的顶部;有益效果:本发明通过定位触条在芯片推进的过程中与芯片进行接触,直至芯片与夹轴的平面贴合,能够避免芯片在移动的过程中再次产生回弹顶部的限位环杆嵌套在环轨内部,通过环轨内部的挤压弹簧产生应力对芯片进行加固,避免在进入激光雕刻工作的时候再次产生偏离。(The invention discloses a laser device for micro-control chip processing, which structurally comprises: the laser head is fixed on the top of the case through bolts; has the advantages that: according to the invention, the positioning contact strip is contacted with the chip in the chip propelling process until the chip is attached to the plane of the clamping shaft, so that the situation that the limiting ring rod at the rebound top is nested in the ring rail again in the chip moving process can be avoided, the chip is reinforced by stress generated by the extrusion spring in the ring rail, and the situation that the chip deviates again when the chip enters the laser engraving work is avoided.)

1. A laser device for micro-control chip processing, the structure includes: unscrambler (1), feeder (2), quick-witted case (3), controller (4), laser head (5), its characterized in that:

the corrector (1) is arranged at the top of the feeder (2), the feeder (2) is arranged at the upper end of the case (3), the controller (4) is connected with an internal circuit of the laser head (5) through a lead, and the laser head (5) is fixed at the top of the case (3) through a bolt.

2. A laser apparatus for micro-control chip processing according to claim 1, wherein: the corrector (1) comprises an adjusting wheel belt (11), a correcting motor (12) and a supporting frame body (13), wherein the adjusting wheel belt (11) is fixed at the bottom of the correcting motor (12) and is connected through a transmission belt, an inner groove of the supporting frame body (13) is arranged on the correcting motor (12), and the middle part of the supporting frame body (13) is arranged on the adjusting wheel belt (11).

3. A laser apparatus for micro-control chip processing according to claim 2, wherein: the adjustment pulley (11) comprises: balance wheel (111), drive wheel (112), elasticity connect pole (113), diaphragm (114), link block (115), balance wheel (111) are installed on the right side of drive wheel (112), and are horizontal array and arrange, elasticity connects pole (113) to be equipped with more than two, and passes through welded fastening with diaphragm (114), diaphragm (114) are through link block (115) and the support frame body (13) swing joint of both sides.

4. A laser apparatus for micro-control chip processing according to claim 3, wherein: balance wheel (111) comprises locating clip (1111), support main shaft (1112), wheel rim (1113), swing area (1114), xarm (1115), locating clip (1111) are installed in the bottom of supporting main shaft (1112), support main shaft (1112) and install the middle part at wheel rim (1113), wheel rim (1113) is outer to be taken (1114) nestification each other along the recess and swing, xarm (1115) level is fixed between wheel rim (1113) and drive wheel (112).

5. The laser apparatus for micro-control chip processing according to claim 4, wherein: the locating clip (1111) comprises: the anti-disengaging device comprises an anti-disengaging plate (a1), a clamping arm (a2), a clamping shaft (a3), a transposition column (a4), a sliding groove (a5) and an adjusting rod (a6), wherein the anti-disengaging plate (a1) is arranged between the clamping arms (a2), the clamping arm (a2) is movably connected with the transposition column (a4) through the clamping shaft (a3) on the right side, the transposition column (a4) is arranged at the bottom of the sliding groove (a5), and the upper end of the sliding groove (a5) and the adjusting rod (a6) are welded to form an integral structure.

6. The laser apparatus for micro-control chip processing according to claim 5, wherein: the anti-trip plate (a1) includes: guide up board (a11), location feeler (a12), spacing ring pole (a13), circular rail (a14), loose axle (a15), guide up board (a11) bottom and location feeler (a12) closely laminate, guide up board (a11) right side is equipped with loose axle (a15), spacing ring pole (a13) passes through swing joint with circular rail (a 14).

7. The laser apparatus for micro-control chip processing according to claim 5, wherein: the inside of the transposition post (a4) is provided with an extrusion block.

8. The laser apparatus for micro-control chip processing according to claim 6, wherein: the number of the positioning touch bars (a12) is more than two, and the positioning touch bars are transversely arranged.

Technical Field

The invention relates to laser equipment for micro-control chip processing, belonging to the field of laser processing equipment.

Background

With the technological progress, the micro-control chip becomes the brain of the equipment to improve the running efficiency at the side of the body, and meanwhile, the more complicated operation can be achieved through fewer elements, and the production cost and the whole volume of the equipment are greatly reduced.

Need mark its surface after the chip package finishes, carve model etc. on the surface through the mode of laser sculpture, but the condition of skew appears easily in the sculpture in-process because the drive belt is at the mechanical vibration that the in-process produced of marcing, leads to the chip, and then makes the chip appear the skew condition in the in-process of beating easily.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide a laser device for micro-control chip processing, so as to solve the problem that the chip is easy to deviate due to mechanical vibration generated in the process of moving a transmission belt in the engraving process, and further the chip is easy to incline in the marking process.

In order to achieve the purpose, the invention is realized by the following technical scheme: a laser device for micro-control chip processing, the structure includes: corrector, feeder, quick-witted case, controller, laser head, the top at the feeder is installed to the corrector, the upper end at quick-witted case is installed to the feeder, the controller is connected with laser head internal circuit through the wire, the top at quick-witted case is passed through the bolt fastening to the laser head.

Preferably, the straightener consists of an adjusting wheel belt, a correcting motor and a support frame body, the adjusting wheel belt is fixed at the bottom of the correcting motor and is connected through a transmission belt, the correcting motor is arranged in an inner groove of the support frame body, and the adjusting wheel belt is arranged in the middle of the support frame body.

Preferably, the adjustment belt comprises: the balance wheel is installed on the right side of the driving wheel and is arranged in a horizontal array mode, more than two elastic connecting rods are arranged and fixed with the transverse plate in a welding mode, and the transverse plate is movably connected with the supporting frame body through the connecting sliding blocks on the two sides.

Preferably, the balance wheel consists of a positioning clamp, a supporting main shaft, a wheel rim, a swinging belt and a cross arm, wherein the positioning clamp is arranged at the bottom of the supporting main shaft, the supporting main shaft is arranged in the middle of the wheel rim, a groove at the outer edge of the wheel rim is nested with the swinging belt, and the cross arm is horizontally fixed between the wheel rim and the driving wheel.

Preferably, the positioning clip includes: the anti-falling contact plate is arranged between the clamping arms, the clamping arms are movably connected with the transposition column through the clamping shafts on the right side, the transposition column is arranged at the bottom of the sliding groove, and the upper end of the sliding groove and the adjusting rod are welded to form an integrated structure.

Preferably, the anti-trip plate includes: the guide device comprises a guide upper plate, a positioning contact strip, a limiting ring rod, a ring rail and a movable shaft, wherein the bottom of the guide upper plate is tightly attached to the positioning contact strip, the movable shaft is arranged on the right side of the guide upper plate, and the limiting ring rod is movably connected with the ring rail.

Preferably, an extrusion block is arranged inside the transposition column.

Preferably, the number of the positioning touch strips is more than two, and the positioning touch strips are transversely arranged.

Preferably, the positioning tentacles are made of rubber.

Advantageous effects

The invention relates to a laser device for micro-control chip processing, which has the following effects:

according to the chip positioning clamp, the driving wheel in the adjusting wheel belt is driven by the correcting motor, the driving wheel enables the swinging belt to push the chip to the positioning clamp, the chip moves to the right side and is embedded into the clamp arm, the small-amplitude displacement is carried out by the clamp shaft according to the size of the chip, and the chip corner collision caused by over-strong clamping stress is avoided.

According to the invention, the positioning contact strip is contacted with the chip in the chip propelling process until the chip is attached to the plane of the clamping shaft, so that the situation that the limiting ring rod at the rebound top is nested in the ring rail again in the chip moving process can be avoided, the chip is reinforced by stress generated by the extrusion spring in the ring rail, and the situation that the chip deviates again when the chip enters the laser engraving work is avoided.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural diagram of a laser apparatus for micro-control chip processing according to the present invention.

Fig. 2 is a front view of the corrector of the present invention.

FIG. 3 is a schematic cross-sectional view of an adjustment belt according to the present invention.

Fig. 4 is a schematic sectional structure view of the balance wheel of the present invention.

FIG. 5 is a cross-sectional structural view of the alignment clip of the present invention.

Fig. 6 is a schematic cross-sectional view of the anti-releasing contact plate of the present invention.

In the figure: the device comprises a corrector-1, a feeder-2, a case-3, a controller-4, a laser head-5, an adjusting wheel belt-11, a correcting motor-12, a support frame body-13, a balance wheel-111, a driving wheel-112, an elastic connecting rod-113, a transverse plate-114, a connecting slide block-115, a positioning clamp-1111, a support main shaft-1112, a wheel rim-1113, a swing belt-1114, a cross arm-1115, an anti-disengagement contact plate-a 1, a clamping arm-a 2, a clamping shaft-a 3, a transposition column-a 4, a sliding groove-a 5, an adjusting rod-a 6, a guide upper plate-a 11, a positioning contact bar-a 12, a limiting ring rod-a 13, a ring rail-a 14 and a movable shaft-a 15.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Referring to fig. 1 to 6, the present invention provides a technical solution of a laser device for micro-control chip processing: the structure includes: corrector 1, feeder 2, quick-witted case 3, controller 4, laser head 5, corrector 1 is installed at the top of feeder 2, feeder 2 is installed in the upper end of quick-witted case 3, controller 4 is connected with 5 internal circuit of laser head through the wire, laser head 5 passes through the bolt fastening at the top of quick-witted case 3.

The corrector 1 consists of an adjusting wheel belt 11, a correcting motor 12 and a supporting frame body 13, wherein the adjusting wheel belt 11 is fixed at the bottom of the correcting motor 12 and is connected through a transmission belt, the correcting motor 12 is arranged in an inner groove of the supporting frame body 13, and the adjusting wheel belt 11 is arranged in the middle of the supporting frame body 13.

The adjustment belt 11 includes: the balance wheel 111 is arranged on the right side of the driving wheel 112 and is arranged in a horizontal array, more than two elastic connecting rods 113 are arranged and fixed with the transverse plate 114 in a welding mode, and the transverse plate 114 is movably connected with the support frame body 13 through the connecting sliders 115 on two sides.

The balance wheel 111 is composed of a positioning clamp 1111, a support spindle 1112, a wheel rim 1113, a swing belt 1114 and a cross arm 1115, wherein the positioning clamp 1111 is arranged at the bottom of the support spindle 1112, the support spindle 1112 is arranged at the middle part of the wheel rim 1113, the outer edge groove of the wheel rim 1113 and the swing belt 1114 are nested with each other, and the cross arm 1115 is horizontally fixed between the wheel rim 1113 and the driving wheel 112.

The positioning clip 1111 includes: the laser gun comprises an anti-disengaging contact plate a1, a clamping arm a2, a clamping shaft a3, a transposition column a4, a sliding groove a5 and an adjusting rod a6, wherein the anti-disengaging contact plate a1 is arranged between the clamping arm a2, the clamping arm a2 is movably connected with the transposition column a4 through a clamping shaft a3 on the right side, the transposition column a4 is arranged at the bottom of the sliding groove a5, the upper end of the sliding groove a5 and the adjusting rod a6 are welded to form an integrated structure, and a plurality of chips are positioned according to the limited position through a positioning frame 1111, so that the laser gun at the top can rapidly work on the chips at the same time.

The anti-trip plate a1 includes: the guide device comprises a guide upper plate a11, a positioning contact bar a12, a limit ring rod a13, a ring rail a14 and a movable shaft a15, wherein the bottom of the guide upper plate a11 is tightly attached to the positioning contact bar a12, the movable shaft a15 is arranged on the right side of the guide upper plate a11, and the limit ring rod a13 is movably connected with the ring rail a 14.

The inside extrusion piece that is equipped with of transposition post a4 rises at the in-process that the front end removed, and makes the arm lock a2 separation of both sides, avoids the in-process that breaks away from, causes the secondary displacement of chip.

The positioning touch strips a12 are more than two and transversely arranged, so that downward pressure can be improved in the positioning process, and the situation that the chip is not aligned due to the fact that the chip is not aligned due to the resilience force generated by the positioning touch strips is avoided.

The positioning tentacle a12 is made of rubber.

When in use

The chips are placed on the surface of the feeder 2 at a substantially constant distance, and the angle of the chips is adjusted by the aligner 1 at the top of the case 3, so that the chips can be aligned when engraving parameters.

The in-process of alignment, through the inside drive wheel 112 of correction motor 12 drive regulating wheel area 11, drive wheel 112 makes the pendulum move area 1114 to the chip towards the propulsion of locating clip 1111 for the chip moves to the right side, in the embedding arm lock a2, carries out the displacement of small amplitude according to the big small clamp shaft a3 of chip and adapts to, avoids the stress of centre gripping to cause the chip corner to take place to collide with by force.

The positioning contact strip a12 at the bottom of the guide upper plate a11 contacts the chip in the chip pushing process until the chip is attached to the plane of the clamping shaft a3, so that the situation that the limiting ring rod a13 at the rebound top of the chip is embedded in the ring rail a14 in the moving process can be avoided, and the chip is reinforced by the stress generated by the extrusion spring in the ring rail a 14.

After the correction is finished, the sliding groove a5 moves towards the front end, the contact at the bottom of the transposition column a4 is extruded, the clamping shaft a3 is separated, the chip is positioned downwards under the action of the anti-falling contact plate a1 at the top, and the adjusting rod a6 moves upwards along with the improvement of the jacking height, so that the chip is completely separated, and the separation is still in a horizontal state.

The foregoing merely illustrates the principles and preferred embodiments of the invention and many variations and modifications may be made by those skilled in the art in light of the foregoing disclosure, which are intended to be within the scope of the invention.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

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