阅读说明：本技术 一种激光超硬材料深雕工艺 (Laser superhard material deep carving process ) 是由 陈聪 陈德贡 李贵林 李国栋 于 2020-08-04 设计创作，主要内容包括：本发明公开了一种激光超硬材料深雕工艺,涉及超硬材料加工技术。针对现有技术中激光不能实现深雕的问题提出本方案,通过以下步骤实现：根据待加工工件的尺寸特性,建立三维数据模型；将所述三维数据模型的虚拟位置调整与所述待加工工件一致；将所述三维数据模块切层；根据每层中三维数据模型的被雕刻部分和保留部分计算出激光的走线路径参数；根据所述走线路径参数控制激光对待加工工件逐层雕刻。优点在于,对于超硬材料的雕刻不再受到纵向尺寸的限制,而且也不受加工曲面的形状限制,对于任何开放式的曲面均能快速和准确地进行雕刻。复杂的曲面至少包括弧面、倒角、倒圆、凸台、凹台以及所述各曲面的组合情况,还能实现工件的整体深度减薄。(The invention discloses a laser superhard material deep carving process, and relates to a superhard material processing technology. The method is provided for solving the problem that the laser cannot realize deep carving in the prior art, and is realized through the following steps: establishing a three-dimensional data model according to the size characteristics of a workpiece to be processed; adjusting the virtual position of the three-dimensional data model to be consistent with the workpiece to be processed; cutting the three-dimensional data module into layers; calculating the routing path parameters of the laser according to the engraved part and the reserved part of the three-dimensional data model in each layer; and controlling laser to carve the workpiece to be processed layer by layer according to the routing path parameters. The method has the advantages that the carving of the superhard material is not limited by the longitudinal dimension any more, and is not limited by the shape of the processed curved surface, and the carving can be quickly and accurately carried out on any open curved surface. The complex curved surface at least comprises an arc surface, a chamfer, a radius, a boss and a concave table and the combination condition of each curved surface, and the integral depth thinning of the workpiece can be realized.)

1. A laser superhard material deep carving process is characterized by comprising the following steps:

establishing a three-dimensional data model according to the size characteristics of a workpiece to be processed;

adjusting the virtual position of the three-dimensional data model to be consistent with the workpiece to be processed;

cutting the three-dimensional data module into layers;

calculating the routing path parameters of the laser according to the engraved part and the reserved part of the three-dimensional data model in each layer;

and controlling laser to carve the workpiece to be processed layer by layer according to the routing path parameters.

2. The laser superhard material deep carving process of claim 1, wherein the routing path parameter comprises a spot diameter of the laser, and the spot diameter ranges from 5um to 200 um.

Technical Field

The invention relates to a superhard material processing technology, in particular to a laser superhard material deep carving process.

Background

Due to the important application status of the superhard material in the fields of aviation, aerospace, stone, automobiles, electronics, mining and the like and the increasing production requirements of the superhard material, the breakthrough of the processing technology of the superhard material is particularly urgent. Among them, the superhard materials represented by diamond have characteristics of high hardness, good wear resistance, high compressive strength and the like, so that the surface forming process of the materials is extremely complex and difficult, a large amount of engineering time is consumed for completion, and the reject ratio is high.

Conventional machining such as mechanical cutting, grinding and the like is contact machining in which a certain machining tool directly acts on a material surface to cause relative motion of the tool and the material surface in pressing, thereby forming a specific shape. In the process, the problem of consumable materials consumed by tools is solved, and the inevitable problems of mechanical damage caused by friction pressure, environmental pollution caused by treatment of cutting fluid and the like are solved.

The electric spark belongs to non-contact thermoelectric machining, no cutting force exists, but the electric spark cannot machine non-conductive materials, particularly under the condition that the quality of diamond finished products is influenced by material doping components, more and more diamonds do not add conductive materials in the production process, so that the electric spark machining is not applicable any more, meanwhile, the speed is low when a workpiece with a relatively complex curved surface shape is machined, the efficiency is low, the energy consumption is high, the electrode size and the electric parameters need to be adjusted for multiple times on the finish machining surface, the technical requirement on workers is high, in addition, for some products with special requirements, the electric spark of a traditional common machine tool cannot meet special requirements such as high-precision chamfering and chamfering.

The traditional laser etching processing is also non-contact processing, and can only carve a shallow surface plane shape, but cannot solve the problem of processing a workpiece with a certain relative depth and a complex surface curved surface shape.

Therefore, aiming at various processing modes and some special requirements, the scheme provides the laser superhard material processing technology which can accurately and efficiently finish the thinning, polishing, cleaning, size changing, complex curved surface processing, secondary chamfering and other processing on semi-finished products processed by the traditional means, and solves the problem that the traditional processing process cannot be avoided. The superhard material specifically comprises a diamond compact.

Disclosure of Invention

The invention aims to provide a laser superhard material deep carving process to solve the problems in the prior art.

The invention relates to a laser superhard material deep carving process, which is realized by the following steps:

establishing a three-dimensional data model according to the size characteristics of a workpiece to be processed;

adjusting the virtual position of the three-dimensional data model to be consistent with the workpiece to be processed;

cutting the three-dimensional data module into layers;

calculating the routing path parameters of the laser according to the engraved part and the reserved part of the three-dimensional data model in each layer;

and controlling laser to carve the workpiece to be processed layer by layer according to the routing path parameters.

The routing path parameters comprise the spot diameter of laser, and the spot diameter value range is 5um-200 um.

The laser superhard material deep carving process has the advantages that carving of the superhard material is not limited by the longitudinal size any more, and is not limited by the shape of a processed curved surface, and the carving can be quickly and accurately carried out on any open curved surface. The complex curved surface at least comprises an arc surface, a chamfer, a radius, a boss and a concave table and the combination condition of each curved surface, and the integral depth thinning of the workpiece can be realized.

Drawings

FIG. 1 is a schematic diagram of the structure of a three-dimensional data model according to the present invention;

FIG. 2 is a schematic view of a slice of a processed portion of the three-dimensional data model;

FIG. 3 is a schematic diagram of a laser trace in which one layer of the three-dimensional data model is processed;

fig. 4 is a CCD image of a corresponding product deep-engraved according to the three-dimensional data model of fig. 1.

FIG. 5 is a schematic diagram of a complex curved surface finished product machined by a conventional machining process;

FIG. 6 is a schematic diagram of a finished complex surface machined by the deep-engraving process of the present invention.

Detailed Description

The invention provides a novel processing method for processing a superhard material by laser, which takes a special-shaped complex curved surface of the superhard material as a processing object and comprises the steps of thinning, polishing and cleaning the superhard material, changing the diameter to form a boss, deeply carving and digging a concave table, processing the complex curved surface, carrying out secondary chamfering and chamfering on a semi-finished product processed by a traditional means and the like.

The implementation scheme comprises the following steps:

three-dimensional data models were created using three-dimensional mapping software based on the dimensional characteristics of the material to be processed, as shown in fig. 1.

And importing the established three-dimensional data model into a processing system, and rotating and adjusting the position of the three-dimensional data model to be consistent with the workpiece to be processed.

The three-dimensional data model at the confirmed position is subjected to slice data setting, and the number of required processing layers is selected, as shown in fig. 2. The thickness of the cutting layer can be 0.003 mm-1 mm, the material surface is generally cleaned and polished, and the processing layer number is 1-2 layers of the outermost surface of the three-dimensional data model. All the layers of the part to be processed are needed for thinning, diameter size changing, complex curved surface processing and secondary chamfering and chamfering of the semi-finished product processed by the traditional means.

And setting a laser routing path and a line spacing interval according to the characteristics of the three-dimensional data model. The routing path parameters comprise routing modes and routing angles, the routing directions and the reciprocity are selected from 0 to 180 degrees, and the routing distance is selectable from 0.003 to 0.2mm as shown in figure 3. Wherein FIG. 3 is a laser perpendicular to the cut layer and the splits within the cut layer are laser trace traces. The part to be engraved on the track, where the laser can output corresponding power; instead, the laser would sweep at a non-engraving power.

And (3) placing the workpiece to be processed in the laser processing working space range, and simultaneously adjusting the position of the laser focus to enable the laser focus to be at the highest point processing position of the workpiece to be processed.

And setting appropriate processing parameters according to different processing requirements. The general laser routing speed can be selected between 100mm/s and 10000mm/s, the laser light-on delay is 0-100 ms, the laser light-off delay is 0-150 ms, the laser corner delay is 0-100 ms, the laser end delay is 0-150 ms, the routing jumping speed is 1000 mm/s-10000 mm/s, the laser linear transformation power can be selected between 1-100%, and the spot diameter is 5-200 um.

And adjusting the position of the workpiece to be processed on the workbench to enable the workpiece to be processed to be arranged right below the laser so as to ensure that the laser routing path always covers the processing surface of the workpiece. The laser processing system is started to process a target workpiece, the laser focus, the laser energy and the walking track are accurately controlled through computer data processing, so that laser can be accurately wired on a deep plane of each layer in a three-dimensional space, various deep carving requirements on superhard materials can be met, a complex curved surface finished product shown in figure 4 is obtained after processing, and the finished product has obvious chamfers. And finishing the processing flow.

The existing laser etching can not process a workpiece with a thicker size, and can only process a deep longitudinal processing mode in a contact mode. In the product shown in fig. 5, the two ends of the upper part respectively form a distinct lower arc, but the edges cannot be chamfered or rounded. By utilizing the processing method provided by the invention, the characteristic position of the edge to be chamfered is firstly obtained through camera positioning, and then the angle and the position of the processing drawing are automatically rotated and adjusted through software, so that the product shown in figure 5 can be further processed to obtain the effect shown in figure 6, and the required chamfered edge can be obtained.

Taking the cleaning of the surface of the superhard material as an example, the heterogeneous and the heterochromatic surfaces can be effectively removed through laser cleaning because the heterogeneous and the heterochromatic surfaces can be possibly caused in the process of forming the superhard material in the working procedure before the finished product. The number of processing layers of the model is 1 ~ 2 layers of outermost surface in the cleanness, cuts the layer less and generally at 0.005mm, walks that the line speed is higher more than 5000mm/s, and laser energy is less, and facula diameter is 200 um.

Taking polishing of superhard materials as an example, the purpose is to increase the smoothness of the surface of the superhard materials and reduce the abrasion of finished products in the next working procedure. Similar with clean, the number of processing layers is 1 ~ 2 layers of surface, cuts the layer less generally at 0.005mm, walks that the line speed is higher more than 5000mm/s, facula diameter 150um, and local roughness can drop to Ra <0.2um after the polishing.

When the superhard material is required to be thinned, the diameter is changed to be small, the complex curved surface is required to be machined, all layers to be machined of the built model are required to be selected and machined, the parameter setting is determined according to the characteristics of the superhard material, the layer cutting speed is generally 0.005-0.2 mm, the light spot diameter is 2 microns, the wiring speed is 1000-10000 mm/s, the flatness is 0.005mm after machining, the surface type precision is 0.01mm, and the chamfering precision is 0.02 mm.

It will be apparent to those skilled in the art that various other changes and modifications may be made in the above-described embodiments and concepts and all such changes and modifications are intended to be within the scope of the appended claims.