阅读说明：本技术 一种信标 (Beacon ) 是由 范为 �成真 曹拥华 于翔 蒋晨曦 于 2019-03-22 设计创作，主要内容包括：本发明公开了一种信标,属于通讯电子装置技术领域。该信标包括电路板和用于储存电能的超级电容器,所述超级电容器呈扁平结构,所述超级电容器与所述电路板贴合设置,且所述电路板设置有焊接孔,所述超级电容器的引脚折弯后伸入所述焊接孔内与所述电路板焊接。本发明通过将超级电容器设置为扁平结构,使得其面积较大的一侧能与电路板贴合设置,将整个超级电容器的重量由电路板支撑,而不再是引脚,而引脚由于不承担整个超级电容器的重量,其故障率降低,进而可靠性提高；并且,基于引脚的可靠性得到提高,超级电容器与电路板连接的稳定性得到提高,故障率降低,从而使得有效工作时间得到保障。(The invention discloses a beacon, and belongs to the technical field of communication electronic devices. This beacon includes circuit board and the ultracapacitor system who is used for storing the electric energy, ultracapacitor system is the flat structure, ultracapacitor system with the laminating of circuit board sets up, just the circuit board is provided with the welding hole, ultracapacitor system's pin stretches into after bending the welding hole in with the circuit board welding. According to the invention, the supercapacitor is arranged into a flat structure, so that one side with a larger area can be attached to the circuit board, the weight of the whole supercapacitor is supported by the circuit board and is not a pin, and the pin does not bear the weight of the whole supercapacitor, so that the failure rate is reduced, and the reliability is improved; and, reliability based on the pin is improved, and the stability of ultracapacitor system and circuit board connection is improved, and the fault rate reduces to make effective operating time obtain the guarantee.)

1. The utility model provides a beacon, its characterized in that includes circuit board (2) and ultracapacitor system (5) that is used for storing electric energy, ultracapacitor system (5) are the flat structure, ultracapacitor system (5) with circuit board (2) laminating sets up, just circuit board (2) are provided with welding hole (21), stretch into after pin (502) of ultracapacitor system (5) are bent in welding hole (21) with circuit board (2) welding.

2. The beacon according to claim 1, characterised in that the soldering holes (21) on the circuit board (2) run through from the upper surface of the circuit board (2) to the lower surface of the circuit board (2).

3. The beacon according to claim 2, characterised in that the pins (502) of the supercapacitor (5) extend from one end of the soldering hole (21) and out of the other end of the soldering hole (21), and the pins (502) are bent towards the surface of the circuit board (2) after extending out.

4. The beacon according to claim 1, characterised in that there is a transition distance (d) between the end of the supercapacitor (5) setting pin (502) and the welding hole (21).

5. The beacon according to any of claims 1 to 4, characterised in that the supercapacitor (5) comprises a set of positive plates (51), negative plates (52) each having a planar structure and a separator layer (53) arranged between the positive plates (51) and the negative plates (52), the positive plates (51), the separator layer (53) and the negative plates (52) being arranged in a pack (54) having a planar structure in a stack.

6. The beacon according to claim 5, wherein the positive electrode tab (51) and the negative electrode tab (52) each include a collector body (501) and the pin (502) provided on one side of the collector body (501), and the pin (502) and the collector body (501) are integrally formed.

7. The beacon of claim 5, characterized in that the pins (502) of the supercapacitor (5) extend from the inside of the packaging bag (54) to the outside of the packaging bag (54), and the outer side of one end of the pins (502) close to the packaging bag (54) is provided with an insulating protective film (55).

8. The beacon of claim 7, wherein a portion of the protective insulating film (55) is located inside the envelope (54) and another portion of the protective insulating film (55) is located outside the envelope (54).

Technical Field

The present invention relates to the field of communications electronic devices, and in particular, to a beacon.

Background

Beacons are used in location confirmation systems. The position confirmation system includes, in addition to the beacon, a position information server device and a mobile terminal device, where the mobile terminal device may be any device that can be connected to the information server device via a wireless communication line such as WIFI, and may be a portable mobile terminal device such as a smart phone, a tablet terminal device, or a personal computer.

Specifically, the beacon has a function of transmitting a beacon signal including identifier information for specifying the own device via a wireless communication line such as WIFI. When the mobile terminal approaches the vicinity of the location of the beacon, the mobile terminal receives the beacon signal transmitted by the beacon and transmits information of the identifier included in the received beacon signal to the server device, and the server device estimates the position of the mobile device from the identifier information in the beacon information device.

In order to avoid the limitation of a use place, the beacon usually replaces a connected AC power supply with a dry battery power supply, but the service life of the battery power supply is limited, and an internal battery needs to be replaced periodically, so that the battery power supply is replaced with a solar battery power supply in a place where the beacon can receive a light source, and the trouble that the beacon needs to replace the battery power supply periodically is eliminated.

However, the inventor finds in practice that the beacons provided with the solar cell power supply store electric energy by using a cylindrical capacitor, and when the cylindrical capacitor is electrically connected with the circuit board, the cylindrical capacitor is generally vertically arranged, that is, the axis of the cylindrical capacitor is perpendicular to the circuit board, and then the cylindrical capacitor is connected with the circuit board only through a pin at one end of the cylindrical capacitor. The pins need not only to make electrical connection to the capacitors and the circuit board, but also to support the capacitors. Therefore, the pins of the cylindrical capacitor are easy to fail, so that the connection stability of the cylindrical capacitor and the circuit board is low, and the failure rate of the beacon is high.

To this end, it is desirable to provide a beacon to solve the above problems.

Disclosure of Invention

The invention aims to provide a beacon, which is high in connection stability between a super capacitor and a circuit board and low in failure rate.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a beacon, includes circuit board and the ultracapacitor system that is used for storing electric energy, ultracapacitor system is the flat structure, ultracapacitor system with the circuit board laminating sets up, just the circuit board is provided with the welding hole, ultracapacitor system's pin is bent the back and is stretched into in the welding hole with the circuit board welding.

As an alternative to the above-described beacon, the solder holes on the circuit board penetrate from the upper surface of the circuit board to the lower surface of the circuit board.

As an alternative to the above-mentioned beacon, the pin of the super capacitor extends into one end of the welding hole and extends out from the other end of the welding hole, and the pin is bent toward the surface of the circuit board after extending out.

As an alternative to the above beacon, there is a transition distance between the end of the supercapacitor pack pin and the solder hole.

As an alternative of the above beacon, the super capacitor includes a set of positive electrode plates, negative electrode plates, and a separator layer disposed between the positive electrode plates and the negative electrode plates, and the positive electrode plates, the separator layer, and the negative electrode plates are sequentially stacked and disposed in a package bag having a planar structure.

As an alternative of the above beacon, each of the positive electrode sheet and the negative electrode sheet includes a current collector body and the pin provided on one side of the current collector body, and the pin and the current collector body are integrally formed.

As an alternative of the above beacon, the pins of the supercapacitor extend from the inside of the packaging bag to the outside of the packaging bag, and an insulating protective film is provided on the outer side of one end of the pins close to the packaging bag.

As an alternative to the above beacon, a part of the insulating protective film is located inside the package bag, and another part of the insulating protective film is located outside the package bag.

The invention has the beneficial effects that:

the supercapacitor is arranged to be in a flat structure, so that one side with a larger area can be attached to the circuit board, the weight of the whole supercapacitor is supported by the circuit board and is not a pin, and the pin does not bear the weight of the whole supercapacitor, so that the failure rate is reduced, and the reliability is improved; and, reliability based on the pin is improved, and the stability of ultracapacitor system and circuit board connection is improved, and the fault rate reduces to make effective operating time obtain the guarantee.

Drawings

Fig. 1 is a schematic structural diagram of a beacon provided in an embodiment of the present invention;

fig. 2 is a cross-sectional view of a beacon provided by an embodiment of the invention;

FIG. 3 is a schematic structural diagram of a super capacitor according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a current collector provided in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a super capacitor adopting a first pin arrangement manner according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a super capacitor adopting a second pin arrangement manner according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a super capacitor adopting a third pin arrangement manner according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of a supercapacitor provided with an insulation protection film according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a super capacitor and a circuit board according to a first pin connection manner provided in an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a supercapacitor and a circuit board according to a second pin connection method provided in an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a super capacitor and a circuit board adopting a third pin connection manner according to an embodiment of the present invention;

FIG. 12 is a schematic structural diagram of the connection of the supercapacitor and the circuit board provided with the annular boss according to the embodiment of the invention;

fig. 13 is a bottom view of a super capacitor according to an embodiment of the present invention, wherein the lead pins are bent in a second manner when the super capacitor is connected to a circuit board;

fig. 14 is a schematic structural diagram of a supercapacitor according to an embodiment of the present invention, in which pins of the supercapacitor are bent in a third manner when the supercapacitor is connected to a circuit board;

fig. 15 is a schematic structural diagram of a supercapacitor according to an embodiment of the present invention, in which pins of the supercapacitor are bent in a fourth manner when the supercapacitor is connected to a circuit board;

FIG. 16 is a schematic structural diagram of a transition distance between the connection pins of the super capacitor and the circuit board and the welding holes provided by the embodiment of the invention;

fig. 17 is a schematic structural diagram of a fixed connection between a super capacitor and a circuit board according to an embodiment of the present invention;

fig. 18 is a schematic structural diagram of a fixed connection between a super capacitor and a circuit board according to another embodiment of the present invention.

In the figure:

1. a housing; 2. a circuit board; 21. welding the hole; 3. a main body member; 4. an adjuster;

5. a super capacitor; 50. a current collector; 501. a current collector body; 502. a pin; 5021. a first lead part; 5022. a second lead portion; 5023. a third lead part; 51. a positive plate; 52. a negative plate; 53. a separation layer; 54. packaging bags; 55. an insulating protective film;

6. a photoelectric conversion membrane; 7. a light-transmitting hole; 8. an annular boss; 91. gluing; 92. a single-sided tape;

d. a transition distance.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are used only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have specific orientations, be constructed in specific orientations, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

Fig. 1 is a schematic structural diagram of a beacon provided in this embodiment. As shown in fig. 1, the present embodiment discloses a beacon used in a position confirmation system. The position confirmation is realized by matching with the position information server device and the mobile terminal device. The mobile terminal device can be a portable mobile terminal device such as a smart phone, a tablet personal computer terminal device, a personal computer and the like. Specifically, the beacon has a function of transmitting a beacon signal including identifier information for specifying the own device via a wireless communication line such as bluetooth. When the mobile terminal device approaches the vicinity of the location of the beacon, the mobile terminal device receives the beacon signal transmitted by the beacon and transmits information of the identifier included in the received beacon signal to the location information server device, and the location information server device estimates the location of the mobile terminal device based on the identifier information in the beacon.

Fig. 2 is a cross-sectional view of a beacon provided in the present embodiment. As shown in fig. 2, the beacon in the present embodiment includes a housing 1, and a circuit board assembly disposed in the housing 1, the circuit board assembly including a circuit board 2, a main body part 3 electrically connected to the circuit board 2, a regulator 4, a power supply part capable of supplying power to the main body part 3, and the like. The main unit 3 can operate to transmit a beacon signal including identifier information of the beacon to a peripheral transmitting unit via a wireless communication line such as bluetooth. The regulator 4 is used to convert the voltage of the power supply unit to the operating level of the body unit 3.

Specifically, referring again to fig. 1 and 2, the power supply section includes a photoelectric conversion film 6 for converting light energy into electric energy, and an energy storage device for storing the electric energy converted by the photoelectric conversion film 6. By the arrangement, when the beacon is arranged in various places such as offices, meeting rooms and corridors, under the condition that the illumination of the place is in an on state, the photoelectric conversion diaphragm 6 can convert light energy into electric energy for the beacon to work. On one hand, the trouble of regularly replacing the battery power supply is saved, and on the other hand, the phenomenon that the beacon needing to be connected with the AC power supply cannot be used in the place due to the limited freedom degree of the place is avoided. It can be understood that the housing 1 is further provided with a light hole 7, and the photoelectric conversion film 6 is disposed towards the light hole 7, so that the photoelectric conversion film 6 can receive the light source conveniently.

Correspondingly, the beacon comprises energy storage means for storing the electrical energy converted by the photoelectric conversion membrane 6. Optionally, the energy storage device is selected from the super capacitor 5. Wherein the stability of the connection of the supercapacitor 5 to the circuit board 2 directly affects the effective working time of the beacon.

Specifically, the super capacitor 5 for the beacon in this embodiment is a flat structure, and is attached to the circuit board 2, and the circuit board 2 is provided with a welding hole 21, and the pin 502 of the super capacitor 5 is bent and then extends into the welding hole 21 to be welded with the circuit board 2. By arranging the super capacitor 5 into a flat structure, one side with a larger area can be attached to the circuit board 2, the weight of the whole super capacitor 5 can be supported by the circuit board 2 instead of the pin 502, and the pin 502 does not bear the weight of the whole super capacitor 5, so that the failure rate is reduced, and the reliability is improved; and, the reliability based on pin 502 is improved, the stability of the connection of supercapacitor 5 and circuit board 2 is improved, and the failure rate is reduced, so that the effective working time is ensured. Simultaneously, set up ultracapacitor system 5 into the flat structure, it sets up with the laminating of circuit board 2, for cylindrical ultracapacitor system 5 among the prior art, former focus is less than the latter far away, after pin 502 and circuit board 2 of ultracapacitor system 5 are connected, even the condenser that is the flat structure takes place to rock a little, and is less to pin 502's influence, and the ultracapacitor system 5 that is the flat structure promptly is connected the back stability with the laminating of circuit board 2 and is better.

Fig. 3 is a schematic structural diagram of a supercapacitor provided in this embodiment. Referring to fig. 3, the supercapacitor 5 of the present embodiment has a flat configuration including a positive electrode tab 51 having a planar configuration, a negative electrode tab 52, and a separator 53 located between the positive electrode tab 51 and the negative electrode tab 52, wherein the positive electrode tab 51, the separator 53, and the negative electrode tab 52 are stacked in this order in a packaging bag 54 having a planar configuration. Alternatively, only one set of the positive electrode tab 51, the separator 53, and the negative electrode tab 52, i.e., one positive electrode tab 51, one separator 53, and one negative electrode tab 52, may be provided in the supercapacitor 5, and multiple sets of the positive electrode tab 51, the separator 53, and the negative electrode tab 52 may be provided. In this embodiment, the photoelectric conversion film 6 can convert light energy into electric energy to be supplied to the main body part 3 for working, and the photoelectric conversion film 6 can convert the electric energy only at a place where a light source is provided, so that the super capacitor 5 does not need to adopt a large-capacity specification. Based on this, only one set of positive electrode tab 51, separator 53 and negative electrode tab 52 is provided in the supercapacitor 5 of this embodiment. In addition, the weight of the super capacitor 5 can be reduced by arranging the positive plate 51, the separation layer 53 and the negative plate 52, accordingly, the load of the pins 502 can be reduced, the stability of the structure of the super capacitor 5 can be improved, and the stability of the connection between the super capacitor 5 and the circuit board 2 can be improved.

Further alternatively, the positive electrode tab 51 and the negative electrode tab 52 of the supercapacitor 5, which are packaged in the packaging bag 54, each include the current collector 50. Fig. 4 is a schematic structural diagram of a current collector provided in an embodiment of the present invention. Referring to fig. 4, the collector 50 includes a collector body 501 and leads 502, and the leads 502 may laterally extend from the inside to the outside of the packaging bag 54. Optionally, the lead 502 is a flat sheet structure, for example, the ratio of the width to the thickness of the lead 502 is at least 10:1, that is, the width of the lead 502 is much greater than the thickness, so as to increase the connection strength between the lead 502 and the current collector body 501 of the sheet structure, and further improve the structural stability of the supercapacitor 5 itself. Further optionally, the current collector body 501 and the pins 502 are integrally formed, so that the structural stability of the supercapacitor 5 is ensured, and therefore, when the pins 502 of the supercapacitor 5 are connected with the circuit board 2, the connection stability of the two is correspondingly improved. Of course, in the supercapacitor 5 in which the current collector body 501 and the leads 502 are provided separately, by increasing the ratio of the width to the thickness, the stability of the connection between the leads 502 and the current collector body 501 can be improved, and the stability of the structure of the supercapacitor 5 itself can be improved.

Further alternatively, the current collector 50 of the positive electrode sheet 51 and the current collector 50 of the negative electrode sheet 52 in the supercapacitor 5 each extend laterally from the inside to the outside of the packaging bag 54, wherein the lateral direction means extending along the planar direction of the current collectors 50 and 50 of the sheet-like positive electrode sheet 51 and the negative electrode sheet 52. The transverse extension of the current collector 50 in the supercapacitor 5 to the outside of the packaging bag 54 avoids stresses occurring inside the current collector 50 due to bending. Alternatively, the pins 502 extending laterally outside of the package 54 include a variety of arrangements. Fig. 5 is a schematic structural diagram of a super capacitor adopting a first pin arrangement manner according to this embodiment; fig. 6 is a schematic structural diagram of a supercapacitor adopting a second pin arrangement manner according to this embodiment; fig. 7 is a schematic structural diagram of a supercapacitor adopting a third pin arrangement manner according to this embodiment. The supercapacitor 5 in a flat structure has a first plane defined as the surface with the largest area. When the first plane is rectangular, as shown in fig. 5, the positive pin 502 and the negative pin 502 may be disposed on the same side, the welding holes 21 on the corresponding circuit board 2 connected to the super capacitor 5 are correspondingly disposed, and the distance between the two welding holes 21 is short, which is convenient for processing; as shown in fig. 6, the positive pin 502 and the negative pin 502 may be disposed at two adjacent sides, that is, when the positive pin 502 is disposed at the short side of the rectangle, the negative pin 502 is disposed at the long side of the rectangle, and when the positive pin 502 and the negative pin 502 are connected to the circuit board 2, the two sides of the super capacitor 5 may be fixed relative to the circuit board 2; in addition, as shown in fig. 7, the positive pin 502 and the negative pin 502 may be disposed on opposite sides, that is, when the positive pin 502 is disposed on the side of the short side, the negative pin 502 is disposed on the side of the other short side, wherein preferably, the positive pin 502 and the negative pin 502 are both disposed at the midpoint of the short sides, the positive pin 502 and the negative pin 502 are located on the same straight line, and after the positive pin 502 and the negative pin 502 are connected to the circuit board 2, not only the electrical connection between the super capacitor 5 and the circuit board 2 is achieved, but also the fixation of the whole super capacitor 5 relative to the circuit board 2 is achieved. Therefore, the stability of the connection between the whole super capacitor 5 and the circuit board 2 can be improved by adjusting the arrangement mode of the positive pin 502 and the negative pin 502 in the super capacitor 5. When the first plane is in a symmetrical shape such as a circle, a diamond, etc., the positive pin 502 and the negative pin 502 may be arranged oppositely to improve the stability of the connection between the super capacitor 5 and the circuit board 2.

In addition, fig. 8 is a schematic structural diagram of a supercapacitor provided with an insulating protective film according to this embodiment. Alternatively, referring to fig. 8, the pins 502 of the supercapacitor 5 extend from the inside of the packaging bag 54 to the outside of the packaging bag 54, and the outside of one end of the pins 502 near the packaging bag 54 is provided with the insulating protective film 55. After the pin 502 near one end of the packaging bag 54 is coated with the insulating protective film 55, stress at the joint of the pin 502 and the packaging bag 54 can be relieved, so that the packaging bag 54 can be prevented from damaging the pin 502 to a certain extent in the packaging process, meanwhile, the bonding force of the connection area of the pin 502 and the packaging bag 54 can be improved, and the internal sealing effect of the supercapacitor 5 can be further improved. Preferably, a portion of the insulating protective film 55 is located inside the package 54, and another portion of the insulating protective film 55 is located outside the package 54, so as to protect the portion of the leads 502 near the package of the package 54. The insulating protective film 55 may be a Polypropylene film, which is also called PP film Polypropylene for short, and has light weight, good toughness, good chemical resistance, and a higher melting point. For the super capacitor 5 in which the current collector body 501 and the pins 502 are separately provided, the PP film is coated on the connection part of the current collector body 501 and the pins 502, so that the connection stability of the current collector body 501 and the pins 502 can be improved, and the stability of the structure of the super capacitor 5 can be improved. Of course, as the development of material technology, the insulating protection film 55 may also be made of other materials with better characteristics, and the embodiment is not limited herein.

In order to improve the connection stability of the super capacitor 5 and the circuit board 2, in addition to the above description of improving the connection stability of the super capacitor 5 and the circuit board 2 by improving the structural stability of the super capacitor 5 itself, the connection stability of the super capacitor 5 and the circuit board 2 can be improved by adjusting the connection mode of the two.

The super capacitor 5 adopted in this embodiment is a flat structure, and the first plane with a large surface area is attached to the circuit board 2, wherein the pins 502 of the super capacitor 5 can be bent and then extended into the welding holes 21 to be welded to the circuit board 2. Alternatively, the welding holes 21 of the circuit board 2 may be provided as metalized welding holes, and when the pins 502 of the super capacitor 5 are required to be connected with the circuit board 2, metal in the metal welding holes is directly melted and connected with the pins 502, so that the stability of the connection between the super capacitor 5 and the circuit board 2 is ensured, and the connection with the pins 502 is no longer realized only through the welding pads provided at the orifices of the welding holes 21.

Alternatively, the depth of the soldering hole 21 may be set according to actual conditions, wherein the depth of the soldering hole 21 may account for 1/3, 1/2, 2/3, or any other ratio of the thickness of the circuit board 2. Of course, the soldering holes 21 on the circuit board 2 may also penetrate from the upper surface of the circuit board 2 to the lower surface of the circuit board 2. When the depth of the soldering hole 21 is equal to the thickness of the circuit board 2, the depth of the pins 502 extending into the soldering hole 21 can be set selectively, i.e. various pin 502 connection modes can be included. Fig. 9 is a schematic structural diagram of the super capacitor and the circuit board provided in this embodiment, which adopt a first pin connection manner. Referring to fig. 9, a first pin connection method: the depth of the pins 502 extending into the soldering holes 21 can be not less than 1/5 of the thickness of the circuit board 2, so as to ensure that the pins 502 have certain connection strength with the circuit board 2; optionally, the portion of the solder hole 21 not plugged into the pin 502 may be provided with a test pad, so that the test assembly can test the supercapacitor 5 through the test pad. Fig. 10 is a schematic structural diagram of the super capacitor and the circuit board provided in this embodiment, which adopts a second pin connection manner. Optionally, referring to fig. 10, the second pin connection method: the pin 502 of the super capacitor 5 extends from one end of the welding hole 21 to reach the other end of the welding hole 21, and does not extend out of the welding hole 21; compared with the first pin connection method, the pin 502 can be fully connected with the welding hole 21 of the circuit board 2, and the connection stability of the super capacitor 5 is further improved. In addition, fig. 11 is a schematic structural diagram of the super capacitor and the circuit board provided in this embodiment, which adopt a third pin connection manner. Optionally, referring to fig. 11, a third pin connection manner: a pin 502 of the super capacitor 5 extends into one end of the welding hole 21 and extends out of the other end of the welding hole 21, and the pin 502 bends towards the surface of the circuit board 2 after extending out; compared with the second pin connection mode, the connection mode includes a part of the pins 502 which are positioned on one side of the circuit board 2 far away from the super capacitor 5 except that the pins 502 are completely connected with the welding holes 21, and the part of the pins 502 are bent to be attached to the circuit board 2, so that the possibility that the pins 502 are separated from the welding holes 21 is further reduced, and the connection stability of the super capacitor 5 and the circuit board 2 is improved. When the second pin connection mode and the third pin connection mode are used for testing the super capacitor 5, the detection element can be directly connected with the pin 502 on the other side of the circuit board 2 for testing. Fig. 12 is a schematic structural diagram of connection of the supercapacitor provided in the embodiment and the circuit board provided with the annular boss. Optionally, referring to fig. 12, for the second pin connection manner, an annular boss 8 may be additionally arranged at a position of the welding hole 21 on the other side of the circuit board 2 away from the super capacitor 5, and when a connection test is to be performed, the connection test is similar to the connection test in the first pin connection manner, and details are not repeated here.

The bending modes of the pins 502 in the first pin connection mode and the second pin connection mode are both the first bending mode, the pins 502 in the first bending mode include a first pin portion 5021 which does not extend into the welding hole 21 and a second pin portion 5022 which extends into the welding hole 21, and the first pin portion 5021 and the second pin portion 5022 are arranged at an included angle, such as an included angle of 90 degrees. The pins 502 of the third pin connection mode also include a first pin portion 5021 that does not extend into the welding hole 21 and a second pin portion 5022 that extends into the welding hole 21, and in addition, the pin connection mode further includes a third pin portion 5023 that extends out of the other end of the welding hole 21 and is bent towards the other side of the circuit board 2, wherein the first pin portion 5021 and the second pin portion 5022 are arranged at any included angle, the second pin portion 5022 and the third pin portion 5023 can also be arranged at any included angle, that is, the bending form of the pins 502 of the third pin connection mode can include multiple types. Fig. 13 is a bottom view of the super capacitor provided in this embodiment, in which the pins are bent in a second manner when the super capacitor is connected to the circuit board. Referring to fig. 13, the first lead part 5021 and the second lead part 5022 form an included angle, the second lead part 5022 and the third lead part 5023 also form an included angle, and the first lead part 5021 and the third lead part 5023 are not located in the same plane; optionally, the structure further includes a third bending manner, and fig. 14 is a schematic structural diagram of the supercapacitor provided in this embodiment, in which the pins of the supercapacitor are bent in the third bending manner when the supercapacitor is connected to the circuit board. Referring to fig. 14, the third lead portion 5023 may be bent toward a direction close to the first lead portion 5021 at the other side of the circuit board 2, such that the first lead portion 5021 and the third lead portion 5023 are both located at the same side of the second lead portion 5022, wherein the first lead portion 5021 and the third lead portion 5023 may be located in the same plane; optionally, the structure further includes a fourth bending manner, and fig. 15 is a schematic structural diagram of the supercapacitor provided in this embodiment, where the pins of the supercapacitor are bent in the fourth bending manner when the supercapacitor is connected to the circuit board. Referring to fig. 15, the third lead portion 5023 may be bent away from the first lead portion 5021, such that the first lead portion 5021 and the third lead portion 5023 are respectively located at two opposite sides of the second lead portion 5022, and the first lead portion 5021 and the third lead portion 5023 may be located in the same plane. As shown in fig. 14, the third leg portion 5023 can be bent towards the left side at the other side of the circuit board 2, and the overall leg 502 can be substantially C-shaped; as shown in fig. 15, or the third leg portion 5023 may be bent toward the right side on the other side of the circuit board 2, the leg 502 may be substantially Z-shaped as a whole. When the lead 502 is a flat sheet structure, a third bending manner and a fourth bending manner can be adopted.

In addition, fig. 16 is a schematic structural diagram illustrating the arrangement of the transition distance between the connection pins of the super capacitor and the circuit board and the welding holes 21 provided in the present embodiment. Optionally, referring to fig. 16, a transition distance d exists between one end of the pin 502 of the supercapacitor 5 and the welding hole 21, that is, the pin 502 of the supercapacitor 5 is prevented from being directly bent from the end of the supercapacitor 5 and then being connected to the welding hole 21 of the circuit board 2, which easily causes the phenomenon that the pin 502 is easily damaged due to excessive stress at the connection between the pin 502 and the packaging bag 54 and at the connection between the pin 502 and the current collector body 501. Certainly, the transition distance d should not be too large or too small; if transition distance d is great, when ultracapacitor system 5 only laminates with circuit board 2 and does not carry out fixed connection, if ultracapacitor system 5 takes place to rock, it is great to the junction influence of pin 502 and welding hole 21, and transition distance d value is big, and the influence is big. Thus, a stable connection of the supercapacitor 5 to the circuit board 2 can be ensured by a suitable transition distance d. In other embodiments, the setting of the transition distance d may be adjusted according to the specific model of the product, which is only exemplary and not limiting.

Fig. 17 is a schematic structural diagram of a fixed connection between a super capacitor and a circuit board according to this embodiment;

fig. 18 is a schematic structural diagram of a fixed connection between a supercapacitor and a circuit board according to another embodiment of the present invention. Further optionally, after the super capacitor 5 and the circuit board 2 are arranged in a laminating mode, the super capacitor 5 and the circuit board 2 are fixedly connected through a connecting piece, after the super capacitor 5 and the circuit board 2 are fixedly connected, the pin 502 of the super capacitor 5 is connected with the welding hole 21 of the circuit board 2, the super capacitor 5 does not shake due to the arrangement, the influence of the super capacitor 5 on the joint of the pin 502 and the welding hole 21 does not naturally exist, and therefore the connection between the super capacitor 5 and the circuit board 2 is more stable. Wherein, optionally, referring to fig. 17, the connecting member may be an adhesive 91 or a double-sided adhesive, and the connecting member may be disposed between the super capacitor 5 and the circuit board 2; referring to fig. 18, the connecting element may also be a single-sided adhesive tape 92, and the connecting element is disposed on a side of the super capacitor 5 away from the circuit board 2, and is bonded to both the circuit board 2 and the super capacitor 5; the connecting piece can also be an elastic pressing piece arranged on the circuit board 2, and the super capacitor 5 is elastically pressed on the circuit board 2, so that the super capacitor 5 is fixed relative to the circuit board 2.

The connection stability of the super capacitor 5 and the circuit board 2 is improved by improving the stability of the structure of the super capacitor 5 and adjusting the connection mode of the super capacitor 5 and the circuit board, so that the effective working time of the beacon is increased, and the failure rate is reduced.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.