阅读说明：本技术 一种适用于不平整表面的激光加工方法、系统以及装置 (Laser processing method, system and device suitable for uneven surface ) 是由 何煦 马云灿 李军 于 2020-05-29 设计创作，主要内容包括：本发明公开了一种适用于不平整表面的激光加工方法、系统以及装置,该方法包括以下步骤：在待加工样品表面划分一个或多个区域；在区域内建立空间直角坐标系,其中,x轴和y轴平行于放置待加工样品的水平面；并在区域内选取至少3个采样点,并根据采样点拟合一个试验平面；根据试验平面调节加工点的z坐标；根据调节后的加工点坐标调节激光的聚焦位置,进行激光加工。本发明的目的在于提供一种适用于不平整表面的激光加工方法、系统以及装置,使用该方法和系统时,激光加工前的测量工作量小、效率高,可有效减小由于样品表面不平整造成的激光聚焦位置误差,提高表面处理或切割加工时的加工质量和加工精度。(The invention discloses a laser processing method, a system and a device suitable for uneven surfaces, wherein the method comprises the following steps: dividing one or more areas on the surface of a sample to be processed; establishing a spatial rectangular coordinate system in the region, wherein the x axis and the y axis are parallel to a horizontal plane for placing a sample to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points; adjusting the z coordinate of the processing point according to the test plane; and adjusting the focusing position of the laser according to the adjusted machining point coordinates, and performing laser machining. The invention aims to provide a laser processing method, a system and a device suitable for an uneven surface.)

1. A laser machining method for uneven surfaces, comprising the steps of:

s1: dividing one or more areas on the surface of a sample (5) to be processed; wherein the machining point is located within the region;

s2: establishing a spatial rectangular coordinate system in the region, wherein the x-axis and the y-axis are parallel to a horizontal plane on which the sample (5) to be processed is placed; selecting at least 3 sampling points in the area, and fitting a test plane according to the sampling points;

s3: adjusting the z coordinate of the processing point according to the test plane;

s4: and adjusting the focusing position of the laser according to the adjusted machining point coordinates, and performing laser machining.

2. The laser machining method for uneven surfaces as claimed in claim 1, wherein the step S3 includes the sub-steps of:

s31: acquiring a z coordinate difference value of the processing point on the test plane and a processing origin horizontal plane; wherein the horizontal plane of the processing origin is a plane perpendicular to the z axis;

s32: and compensating the z coordinate of the processing point by using the z coordinate difference to obtain the adjusted processing point coordinate.

3. The laser processing method suitable for the uneven surface according to claim 1 or 2, wherein the step S3 is preceded by the steps of:

evaluating the fitting degree of the deviation of the sampling point and the test plane; if the deviation of the sampling point from the test plane is too large, the region is divided into a plurality of sub-regions, and step S2 is repeated.

4. A laser processing system suitable for uneven surfaces is characterized by comprising a dividing module, a processing module and a processing module;

the dividing module is used for dividing the surface of the sample (5) to be processed into one or more areas; wherein the machining point is located within the region;

the processing module is used for fitting a test plane according to the area and adjusting the coordinates of the processing points according to the test plane;

and the processing module is used for adjusting the focusing position of the laser according to the adjusted processing point coordinate to perform laser processing.

5. The laser machining system suitable for uneven surfaces as claimed in claim 4, wherein the processing module comprises a configuration module, a calculation module and a compensation module;

the construction module is used for establishing a spatial rectangular coordinate system in the area, wherein an x axis and a y axis are parallel to a horizontal plane for placing the sample (5) to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points;

the calculation module is used for calculating the z coordinate difference value of the machining point on the test plane and the horizontal plane of the machining origin; wherein the horizontal plane of the processing origin is a plane perpendicular to the z axis;

and the compensation module is used for compensating the z coordinate of the processing point by the z coordinate difference value to obtain the adjusted processing point coordinate.

6. The laser machining system suitable for uneven surfaces as claimed in claim 5, wherein the processing module further comprises an evaluation module for evaluating a degree of fit of the deviation of the sampling point from the test plane; and if the deviation of the sampling point and the test plane is overlarge, dividing the area into a plurality of sub-areas and returning to the construction module.

7. A laser processing device for the uneven surface laser processing method according to any one of claims 1 to 3, comprising a three-dimensional electric translation stage (1), a z-axis distance measuring unit and a beam focusing unit;

the three-dimensional electric translation table (1) is used for bearing the sample (5) to be processed;

the z-axis distance measuring unit is used for measuring the height of the surface of the sample (5) to be processed in the z-axis direction;

and the light beam focusing unit is used for processing the sample (5) to be processed after focusing the laser beam.

8. The laser processing device for uneven surface according to claim 7, wherein the z-axis distance measuring unit is a laser displacement sensor (10) or a coaxial monitoring system; the coaxial monitoring system comprises a microscopic imaging system and a CCD (4).

9. The laser processing device with the uneven surface as claimed in claim 8, wherein when the z-axis distance measuring unit is the coaxial monitoring system, the laser processing device comprises a three-dimensional motorized translation stage (1), a microscope objective (2), a semi-transparent mirror (3) and the CCD (4); the CCD (4), the semi-transparent reflector (3), the microscope objective (2) and the three-dimensional electric platform are sequentially arranged from top to bottom;

when the device works, the sample (5) to be processed is placed on the three-dimensional electric platform, and after a laser beam is reflected by the semi-transparent reflector (3), the laser beam is transmitted to the microscope objective (2) and is focused on the sample (5) to be processed through the microscope objective (2); and (3) forming a clear image of the sample to be processed (5) in the CCD (4) by moving the three-dimensional electric translation table (1), and simultaneously enabling the sample to be processed (5) to move relative to the laser beam focus so as to realize processing.

10. The laser processing device for uneven surface according to claim 8, wherein when the z-axis distance measuring unit is the laser displacement sensor (10), the laser processing device comprises a three-dimensional electric translation stage (1), a dynamic focusing mirror (7), a scanning galvanometer (8), a focusing lens (9) and the laser displacement sensor (10);

when the three-dimensional electric platform is in work, the sample (5) to be processed is placed on the three-dimensional electric platform, the laser beam sequentially passes through the dynamic focusing lens (7) and the scanning galvanometer (8), and then the focusing lens (9) focuses the laser beam on the sample (5) to be processed; the divergence angle of the laser beam and the direction of the laser beam are adjusted by adjusting the dynamic focusing mirror (7) and the scanning galvanometer (8), so that the three-dimensional movement of a focusing focus relative to the sample (5) to be processed is realized, and the processing is realized; the laser displacement sensor (10) is used for measuring the distance of the surface of the sample (5) to be processed in the z-axis direction.

Technical Field

The invention relates to the technical field of laser processing, in particular to a laser processing method, a laser processing system and a laser processing device suitable for an uneven surface.

Background

Laser machining is an important machining method in material machining. During the machining process, the laser beam is usually focused first, and the spot at the focal point is used to ablate and remove material. Because the light spot at the focus is minimum and the laser energy density is highest, the processing precision is highest and the capability of removing materials is strongest relative to the light spot at the defocusing position.

When the surface of a material is uneven or the flexible material is inevitably warped in the fixing and clamping process, if the focal position is not corrected, the actual focusing position and the surface of the material to be removed have deviation during processing, which can cause the structure, the tissue and the component obtained by surface treatment to be uneven or the cutting processing size to be deviated.

For materials with smooth surface fluctuation, such as bulk materials, thin film materials, thin sheet materials, etc. with polished surfaces, the existing processing methods include: some materials are not corrected for the focal position, and the processing surface of the materials is defaulted to an ideal plane vertical to the direction of the processing laser beam, so that the processing is uneven and the size is deviated; and the other method is used for correcting the focal position, the common method is to measure the z coordinates of all points on the processing path before processing, and then add the z coordinates into the processing path for processing.

Disclosure of Invention

The invention aims to provide a laser processing method, a system and a device suitable for uneven surfaces, when the method and the system are used, the measurement workload before laser processing is small, the efficiency is high, the laser focusing position error caused by uneven sample surfaces can be effectively reduced, and the processing quality and the processing precision during surface treatment or cutting processing are improved; when the device is used, the device is easy to build, convenient to use, saves a large amount of building time, and improves the working efficiency.

The invention is realized by the following technical scheme:

a laser machining method for uneven surfaces, comprising the steps of:

s1: dividing one or more areas on the surface of a sample to be processed; wherein the machining point is located within the region;

s2: establishing a spatial rectangular coordinate system in the region, wherein an x axis and a y axis are parallel to a horizontal plane for placing the sample to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points;

s3: adjusting the z coordinate of the processing point according to the test plane;

s4: and adjusting the focusing position of the laser according to the adjusted machining point coordinates, and performing laser machining.

Further, the S3 includes the following sub-steps:

s31: acquiring a z coordinate difference value of the processing point on the test plane and a processing origin horizontal plane; wherein the horizontal plane of the processing origin is a plane perpendicular to the z axis;

s32: and compensating the z coordinate of the processing point by using the z coordinate difference to obtain the adjusted processing point coordinate.

Further, the step S3 is preceded by the following steps:

evaluating the fitting degree of the deviation of the sampling point and the test plane; if the deviation of the sampling point from the test plane is too large, the region is divided into a plurality of sub-regions, and step S2 is repeated.

In the laser processing process, due to the fact that the surface of a material is not flat or the flexible material warps in the fixing and clamping process, the deviation exists between the actual focusing position and the surface of the material to be removed during processing, the structure, the tissue and the component obtained by surface treatment are not uniform, or the cutting processing size deviates, so that the use is affected.

Therefore, in the application, the laser processing method suitable for the uneven surface is provided, the surface of a sample to be processed is subjected to region division, the bent part of the surface of the material to be processed is divided into different regions, so that the bending degree of the surface of the sample to be processed in the same region is reduced, and the z-axis coordinate of the processing path can be adjusted along with the fluctuation of the fitted test plane by fitting a test plane in each region and adjusting the position coordinate of the processing path according to the test plane.

In addition, in the scheme, the fitting degree of the test plane is evaluated, so that the deviation degree of the test plane and the surface of the sample to be processed is small, the laser focusing position can move along with the surface of the sample to be processed in the laser processing process, and the processing quality and the processing precision are improved.

A laser processing system suitable for uneven surfaces comprises a dividing module, a processing module and a processing module;

the dividing module is used for dividing the surface of the sample to be processed into one or more areas; wherein the machining point is located within the region;

the processing module is used for fitting a test plane according to the area and adjusting the coordinates of the processing points according to the test plane;

and the processing module is used for adjusting the focusing position of the laser according to the adjusted processing point coordinate to perform laser processing.

Further, the processing module comprises a construction module, a calculation module and a compensation module;

the construction module is used for establishing a spatial rectangular coordinate system in the area, wherein an x axis and a y axis are parallel to a horizontal plane for placing the sample to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points;

the calculation module is used for calculating the z coordinate difference value of the machining point on the test plane and the horizontal plane of the machining origin; wherein the horizontal plane of the processing origin is a plane perpendicular to the z axis;

and the compensation module is used for compensating the z coordinate of the processing point by the z coordinate difference value to obtain the adjusted processing point coordinate.

Further, the processing module further comprises an evaluation module for evaluating the degree of fit of the deviation of the sampling point from the test plane; and if the deviation of the sampling point and the test plane is overlarge, dividing the area into a plurality of sub-areas and returning to the construction module.

According to the laser processing system provided by the scheme, the z-axis coordinate of the processing path is adjusted along with the fluctuation of the fitting test plane through the fitting test plane; meanwhile, the fitting degree of the test plane is evaluated, the surface of the sample to be processed can be subdivided, the deviation degree of the test plane and the surface of the sample to be processed is small, the laser focusing position can move along with the surface of the sample to be processed in the laser processing process, and the processing quality and the processing precision are improved.

A laser processing device with an uneven surface comprises a three-dimensional electric translation table, a z-axis distance measuring unit and a light beam focusing unit;

the three-dimensional electric translation table is used for bearing the sample to be processed;

the z-axis distance measuring unit is used for measuring the height of the surface of the sample to be processed in the z-axis direction;

and the beam focusing unit is used for processing the sample to be processed after focusing the laser beam.

Furthermore, the z-axis distance measuring unit is a laser displacement sensor or a coaxial monitoring system; the coaxial monitoring system comprises a microscopic imaging system and a CCD.

Further, when the z-axis ranging unit is the coaxial monitoring system, the laser processing device comprises a three-dimensional electric translation stage, a microscope objective, a semi-transparent reflector and the CCD; the CCD, the semi-transparent reflector, the microscope objective and the three-dimensional electric platform are sequentially arranged from top to bottom;

when the device works, the sample to be processed is placed on the three-dimensional electric platform, and after a laser beam is reflected by the semi-transparent reflector, the laser beam is transmitted to the microscope objective and is focused on the sample to be processed through the microscope objective; and moving the three-dimensional electric translation table to enable the sample to be processed to form a clear image in the CCD and enable the sample to be processed and the laser beam focus to move relatively, thereby realizing processing.

Further, when the z-axis distance measuring unit is the laser displacement sensor, the laser processing device comprises a three-dimensional electric translation table, a dynamic focusing mirror, a scanning galvanometer, a focusing lens and the laser displacement sensor;

when the three-dimensional electric platform works, the sample to be processed is placed on the three-dimensional electric platform, the laser beam sequentially passes through the dynamic focusing lens and the scanning vibration lens, and then the focusing lens focuses the laser beam on the sample to be processed; adjusting the divergence angle of the laser beam and the direction of the laser beam by adjusting the dynamic focusing mirror and the scanning galvanometer, so as to realize the three-dimensional movement of a focusing focus relative to the sample to be processed, thereby realizing the processing; the laser displacement sensor is used for measuring the distance of the surface of the sample to be processed in the z-axis direction.

According to the laser processing device provided by the scheme, the three-dimensional electric translation table can adjust the horizontal position (front, back, left and right) of a sample to be processed, so that the position coordinates of a processing point on an x axis and a y axis are obtained; the distance of the sample to be processed on the z axis can be measured by using the z axis distance measuring unit, so that the position coordinate of the processing point on the z axis is obtained; the beam focusing unit is used for focusing the laser beam to a processing point, so that the laser is ensured to be accurately focused on the surface of a workpiece to be processed, and the processing quality of laser processing is improved.

Compared with the prior art, the invention has the following advantages and beneficial effects:

when the method and the system are used, the measurement workload before laser processing is small, the efficiency is high, the laser focusing position error caused by the unevenness of the sample surface can be effectively reduced, and the processing quality and the processing precision during surface treatment or cutting processing are improved; when the device is used, the device is easy to build, convenient to use, saves a large amount of building time, and provides working efficiency.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a schematic diagram of a laser processing apparatus suitable for uneven surfaces according to an embodiment of the present invention;

fig. 2 is a schematic diagram of processing area division and sampling point selection provided in the embodiment of the present invention;

FIG. 3 is a diagram illustrating an effect of processing objects according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a laser processing apparatus suitable for uneven surfaces according to an embodiment of the present invention;

fig. 5 is a schematic diagram of processing area division and sampling point selection provided in the embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating the division of the processing regions according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a fitted test plane provided by an embodiment of the present invention;

reference numbers and corresponding part names in the drawings:

1. a three-dimensional motorized translation stage; 2. a microscope objective; 3. a semi-transparent mirror; 4. a CCD; 5. a sample to be processed; 6. a region A; 7. a dynamic focusing mirror; 8. scanning a galvanometer; 9. a focusing lens; 10. a laser displacement sensor; 11. a region B; 12. and (C) a region.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.

A laser machining method for uneven surfaces, comprising the steps of:

s1: dividing one or more areas on the surface of a sample 5 to be processed; wherein the processing point is located in the divided region;

s2: establishing a spatial rectangular coordinate system in the region, wherein the x axis and the y axis are parallel to a horizontal plane for placing the sample 5 to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points;

s3: adjusting the z coordinate of the processing point according to the test plane;

s4: and adjusting the focusing position of the laser according to the adjusted machining point coordinates, and performing laser machining.

Further, in the present embodiment, S3 includes the following sub-steps:

s31: acquiring a z coordinate difference value of a processing point on a test plane and a processing origin horizontal plane; wherein, the horizontal plane of the processing origin is a plane vertical to the z axis;

s32: and compensating the z coordinate of the processing point by using the z coordinate difference to obtain the adjusted processing point coordinate.

Further, in this embodiment, step S3 is preceded by the following steps:

evaluating the fitting degree of the deviation of the sampling point and the test plane; if the deviation between the sampling point and the test plane is too large, the area is divided into a plurality of sub-areas, and the step S2 is repeated, specifically as follows:

selecting not less than 4 sampling points in the divided area, and fitting a test plane by using any three sampling points;

judging whether the rest sampling points are positioned in the fitted test plane or not;

if the rest sampling points are located in the fitted test plane, or the rest sampling points are not located in the fitted test plane but have very small deviation with the fitted test plane, the fitted test plane is considered to be usable;

otherwise, the region is divided to obtain more sub-regions, and a test plane is fitted in each sub-region until the test plane is available.

In the embodiment, the z-axis coordinate of the machining path is adjusted to follow the fluctuation of the fitting test plane by fitting the test plane; and meanwhile, the fitting degree is evaluated, so that the deviation degree of the test plane and the surface of the sample 5 to be processed is small, the laser focusing position can move along with the surface of the sample 5 to be processed in the laser processing process, and the processing quality and the processing precision are improved.

A laser processing system suitable for uneven surfaces comprises a dividing module, a processing module and a processing module;

the dividing module is used for dividing the surface of the sample 5 to be processed into one or more areas; wherein the processing point is located in the divided region;

the processing module is used for fitting a test plane according to the divided areas and adjusting the coordinates of the processing points according to the test plane;

and the processing module is used for adjusting the focusing position of the laser according to the adjusted processing point coordinate to perform laser processing.

Further, the processing module comprises a construction module, a calculation module and a compensation module;

the device comprises a construction module, a processing module and a processing module, wherein the construction module is used for establishing a space rectangular coordinate system in a region, and an x axis and a y axis are parallel to a horizontal plane for placing a sample 5 to be processed; selecting at least 3 sampling points in the region, and fitting a test plane according to the sampling points;

the calculation module is used for calculating the z coordinate difference value of the processing point on the test plane and the horizontal plane of the processing origin; wherein, the horizontal plane of the processing origin is a plane vertical to the z axis;

and the compensation module is used for compensating the z coordinate of the processing point by the z coordinate difference value to obtain the adjusted processing point coordinate.

Furthermore, the processing module also comprises an evaluation module, and the evaluation module is used for evaluating the fitting degree of the deviation of the sampling point and the test plane; and if the deviation of the sampling point and the test plane is overlarge, dividing the area into a plurality of sub-areas and returning to the construction module.

A laser processing device with an uneven surface comprises a three-dimensional electric translation table 1, a z-axis distance measuring unit and a light beam focusing unit;

the three-dimensional electric translation table 1 is used for bearing a sample 5 to be processed;

the z-axis distance measuring unit is used for measuring the height of the surface of the sample 5 to be processed in the z-axis direction;

and the beam focusing unit is used for processing the sample 5 to be processed after focusing the laser beam.

The z-axis distance measuring unit may be a laser displacement sensor 10, or may be a coaxial monitoring system.

When the z-axis distance measuring unit is a coaxial monitoring system, the laser processing device comprises a three-dimensional electric translation table 1, a microscope objective 2, a semi-transparent reflector 3 and a CCD 4; the CCD4, the semi-transparent reflector 3, the microscope objective 2 and the three-dimensional electric platform are arranged in sequence from top to bottom;

when the device works, a sample 5 to be processed is placed on the three-dimensional electric platform, and after a laser beam is reflected by the semi-transparent reflector 3, the laser beam is transmitted to the microscope objective 2 and is focused on the sample 5 to be processed through the microscope objective 2; by moving the three-dimensional electric translation table 1, the sample 5 to be processed forms a clear image in the CCD4, and meanwhile, the relative movement of the sample 5 to be processed and the focus of the laser beam is realized, so that the processing is realized.

When the z-axis distance measuring unit is a laser displacement sensor 10, the laser processing device comprises a three-dimensional electric translation table 1, a dynamic focusing mirror 7, a scanning galvanometer 8, a focusing lens 9 and the laser displacement sensor 10;

when the device works, a sample 5 to be processed is placed on a three-dimensional electric platform, a laser beam sequentially passes through a dynamic focusing lens 7 and a scanning vibrating lens 8, and then the focusing lens 9 focuses the laser beam on the sample 5 to be processed; the divergence angle and the direction of the laser beam are adjusted by adjusting the dynamic focusing mirror 7 and the scanning galvanometer 8, so that the three-dimensional movement of a focusing focus relative to the sample 5 to be processed is realized, and the processing is realized; the laser displacement sensor 10 is used to measure the distance of the surface of the sample 5 to be processed in the z-axis direction.

According to the laser processing device provided by the scheme, the three-dimensional electric translation table 1 can adjust the horizontal position (front, back, left and right) of the sample 5 to be processed, so that the position coordinates of a processing point on an x axis and a y axis are obtained; the distance of the sample 5 to be processed on the z axis can be measured by using the z-axis distance measuring unit, so that the position coordinate of the processing point on the z axis is obtained; the beam focusing unit is used for focusing the laser beam to a processing point, so that the laser is ensured to be accurately focused on the surface of a workpiece to be processed, and the processing quality of laser processing is improved.

The present solution is illustrated below by specific examples: