阅读说明：本技术 一种激光点焊拼版方法 (Laser spot welding makeup method ) 是由 朱昊枢 贾俊伟 蔡文静 周聚鹤 张德智 朱志坚 陈林森 于 2018-07-26 设计创作，主要内容包括：本发明公开了一种激光点焊拼版方法,包括如下步骤：A、将全息图像的单元镍版裁切至所需形状和尺寸,以获得裁切后的单元镍版；B、将若干个所述裁切后的单元镍版进行拼接,以全息图像向下,用激光点焊的方法将所述拼接的各单元镍版间局部固定,以获得带有缝隙的单元组合版；C、将所述单元组合版放入电铸槽中进行电铸处理,使单元组合版的缝隙填平,进而获得拼版母版。本发明公开的方法,可适用具有较大版厚差值的单元镍版之间的拼版,单元镍版厚度差可达100μm,且采用镍版背面点焊结合电铸的拼版方法,对镍版正面全息图像无损伤。(The invention discloses a laser spot welding makeup method, which comprises the following steps: A. cutting the unit nickel plate of the holographic image to a required shape and size to obtain a cut unit nickel plate; B. splicing a plurality of the cut unit nickel plates, enabling holographic images to face downwards, and locally fixing the spliced unit nickel plates by using a laser spot welding method to obtain a unit combined plate with gaps; C. and placing the unit combined plate into an electroforming groove for electroforming treatment to fill and level the gap of the unit combined plate so as to obtain an imposition master plate. The method disclosed by the invention is suitable for the makeup among unit nickel plates with larger plate thickness difference, the thickness difference of the unit nickel plates can reach 100 mu m, and the makeup method of spot welding and electroforming on the back surfaces of the nickel plates is adopted, so that the holographic images on the front surfaces of the nickel plates are not damaged.)

1. A laser spot welding makeup method is characterized by comprising the following steps:

A. cutting the unit nickel plate of the holographic image to a required shape and size to obtain a cut unit nickel plate;

B. splicing a plurality of cut unit nickel plates, enabling holographic images to face downwards, and locally fixing the spliced unit nickel plates by using a laser spot welding method to obtain a unit combined plate with gaps;

C. and placing the unit combined plate into an electroforming groove for electroforming treatment to fill and level the gap of the unit combined plate so as to obtain an imposition master plate.

2. The laser spot welding imposition method according to claim 1 wherein in said step C, the hologram image of said unit composite plate is placed outside the electroforming solution in said electroforming tank.

3. The laser spot welding imposition method according to any one of claims 1-2, wherein in step C, the electroforming solution comprises sodium sulfamate, sulfamic acid, sodium chloride, boric acid and a wetting agent, wherein the concentration of the sodium sulfamate is 280-400 g/L, the concentration of the sulfamic acid is 0.2-0.8 g/L, the concentration of the sodium chloride is 10-40 g/L, the concentration of the boric acid is 20-50 g/L, and the concentration of the wetting agent is 0.1-0.6 g/L.

4. A laser spot welding imposition method according to claim 3 wherein said electroforming solution has a temperature of 40-50 ℃.

5. A laser spot welding imposition method according to claim 3 wherein said electrocasting solution has a baume degree of 30 to 40.

6. A laser spot welding imposition method according to claim 3 wherein said electrocasting solution has a pH of 3.8 to 4.2.

7. A laser spot welding imposition method according to claim 3 wherein said electroforming solution has a circulation flow rate of 10m³/h。

8. The laser spot welding imposition method according to any one of claims 1-2 wherein in said step C, said electroforming is performed at a current of 60-140A.

9. The laser spot welding imposition method according to any one of claims 1-2 wherein in said step C, said electroforming is performed for a period of time ranging from 2 to 12 hours.

10. A laser spot welding imposition method according to any one of claims 1 to 2 wherein in said step C, said electroformed stencil has a thickness of 50 to 200 μm.

Technical Field

The invention relates to a laser spot welding makeup method, and belongs to the field of holographic processing.

Background

Laser light-variable images are widely applied to packages, certificates, stamps, cards and coins as anti-counterfeiting marks, and generally transfer grain patterns from a metal master plate to a product to be stamped in a stamping mode. With the development of the market, people have higher and higher requirements on laser patterns on a metal master plate, and often need to design laser patterns with various visual effects on one metal master plate, while the laser patterns with different visual effects have different grain fine structures, and the manufacturing methods and manufacturing processes are different, so that the laser patterns with different grain structures are difficult to be formed on one metal master plate at one time, usually, the laser patterns with different grain structures are manufactured on different metal sub-plates, and then, the metal sub-plates are combined into a large-size metal master plate.

The patent with application number CN200910063600.1 discloses a method for manufacturing a holographic master by laser welding imposition, which utilizes the energy of laser to weld each nickel plate with unit holographic patterns to make a large-size holographic master containing a plurality of unit holographic patterns, but the requirement for the nickel plate of each unit holographic pattern is high, the plate thickness error is controlled within ± 5 μm, and the method is not suitable for nickel plate imposition with large thickness difference, and the front welding of the nickel plate causes partial holographic image loss.

Disclosure of Invention

The invention aims to provide a laser spot welding makeup method which is suitable for makeup among nickel plates with large plate thickness difference, the thickness difference of unit nickel plates can reach 100 mu m, and the front holographic image of the nickel plate is not damaged by adopting the makeup method of spot welding and electroforming on the back of the nickel plate.

In order to achieve the purpose, the invention provides the following technical scheme: a laser spot welding makeup method comprises the following steps:

A. cutting the unit nickel plate of the holographic image to a required shape and size to obtain a cut unit nickel plate;

B. splicing a plurality of cut unit nickel plates, enabling holographic images to face downwards, and locally fixing the spliced unit nickel plates by using a laser spot welding method to obtain a unit combined plate with gaps;

C. and placing the unit combined plate into an electroforming groove for electroforming treatment to fill and level the gap of the unit combined plate so as to obtain an imposition master plate.

Further, in the step C, the holographic image of the cell combination plate is placed outside the electroforming solution in the electroforming tank. The holographic image of the unit combined plate is prevented from being damaged in the electroforming process.

Further, in the step C, the electroforming solution for electroforming includes sodium sulfamate, sulfamic acid, sodium chloride, boric acid and a wetting agent, wherein the concentration of the sodium sulfamate is 280-400 g/L, the concentration of the sulfamic acid is 0.2-0.8 g/L, the concentration of the sodium chloride is 10-40 g/L, the concentration of the boric acid is 20-50 g/L, and the concentration of the wetting agent is 0.1-0.6 g/L. Under the action of each component with specific content, the gap of the filled unit combined plate is smooth and flat, and the surface flatness of the obtained imposition master plate is high.

Further, the temperature of the electroforming solution is 40-50 ℃. The conductivity of the electroforming solution is best, so that the filled and leveled gap of the unit combined plate is smooth and flat.

Further, the Baume degree of the electroforming solution is 30-40.

Further, the pH value of the electroforming solution is 3.8-4.2. The gap strength of the filled unit combination plate is optimal.

Further, the circulation flow rate of the electroforming solution is 10m³/h。

Further, in the step C, the current of the electroforming treatment is 60-140A. Further, the gap of the filled unit combination plate is smooth and flat.

Further, in the step C, the electroforming time is 2-12 h.

Further, in the step C, the thickness of the electroformed stencil is 50 to 200 μm. So as to ensure the connection strength of each unit nickel plate in the unit combined plate.

The invention has the beneficial effects that: the back of each unit nickel plate is locally fixed by laser spot welding, and then the plate-splicing master plate is obtained by electroforming, so that the method is suitable for plate splicing between nickel plates with large plate thickness difference, the thickness difference of each unit nickel plate can reach 100 micrometers, leftover nickel plates can be fully utilized, the manufacturing of the nickel plates with specific thickness is reduced, the treatment capacity of heavy metal-containing wastewater is further reduced, the method is beneficial to energy conservation and emission reduction, the holographic image on the front surface of the nickel plate is not damaged, and the method is suitable for high-end products requiring fine joint splicing.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

Fig. 1 is a schematic structural diagram of an imposition master according to an embodiment of the present invention.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.