阅读说明：本技术 硅棒快速解裂的激光加工装备及其方法 (Laser processing equipment and method for rapidly cracking silicon rod ) 是由 孙青� 吴超越 陈海洋 于 2021-09-27 设计创作，主要内容包括：本发明涉及硅棒快速解裂的激光加工装备及方法,包括用于驱使硅棒上下移动及360度旋转的X-θ二维运动机构、用于扫描测量硅棒侧壁三维轮廓的三维轮廓扫描仪、用于在硅棒的侧壁表面形成预切刻痕的预切激光加工系统以及用于沿着预切刻痕扫描加热并解裂分离的解裂激光加工系统,三维轮廓扫描仪设置于X-θ二维运动机构的侧部,预切激光加工系统和解裂激光加工系统布置于X-θ二维运动机构的侧部；预切激光加工系统包含沿光路依次设置的脉冲激光器、第一3D扫描振镜和第一扫描场镜,解裂激光加工系统包含沿光路依次设置的连续激光器、第二3D扫描振镜和第二扫描场镜。解裂均匀一致性较好,破裂效果佳,破碎粒径占比稳定。(The invention relates to laser processing equipment and a method for rapidly cracking a silicon rod, which comprises an X-theta two-dimensional motion mechanism for driving the silicon rod to move up and down and rotate by 360 degrees, a three-dimensional profile scanner for scanning and measuring the three-dimensional profile of the side wall of the silicon rod, a pre-cutting laser processing system for forming pre-cutting nicks on the surface of the side wall of the silicon rod and a cracking laser processing system for scanning, heating and cracking and separating along the pre-cutting nicks, wherein the three-dimensional profile scanner is arranged at the side part of the X-theta two-dimensional motion mechanism; the precutting laser processing system comprises a pulse laser, a first 3D scanning galvanometer and a first scanning field lens which are sequentially arranged along a light path, and the splitting laser processing system comprises a continuous laser, a second 3D scanning galvanometer and a second scanning field lens which are sequentially arranged along the light path. The uniform and consistent cracking is better, the cracking effect is good, and the proportion of the crushed grain size is stable.)

1. Laser beam machining equipment that silicon rod cracked fast, its characterized in that: the silicon rod pre-cutting device comprises an X-theta two-dimensional movement mechanism (14) for driving a silicon rod to move up and down and rotate 360 degrees, a three-dimensional profile scanner (21) for scanning and measuring the three-dimensional profile of the side wall of the silicon rod, a pre-cutting laser processing system for forming pre-cutting nicks on the surface of the side wall of the silicon rod and a cracking laser processing system for scanning, heating and cracking and separating along the pre-cutting nicks, wherein the three-dimensional profile scanner (21) is arranged on the side portion of the X-theta two-dimensional movement mechanism (14), and the pre-cutting laser processing system and the cracking laser processing system are arranged on the side portion of the X-theta two-dimensional movement mechanism (14);

the pre-cutting laser processing system comprises a pulse laser (31), a first 3D scanning galvanometer (32) and a first scanning field lens (33) which are sequentially arranged along a light path, wherein the first 3D scanning galvanometer (32) and the first scanning field lens (33) are connected into a whole and are positioned on the side surface of the X-theta two-dimensional movement mechanism (14);

the splitting laser processing system comprises a continuous laser (41), a second 3D scanning galvanometer (42) and a second scanning field lens (43) which are sequentially arranged along a light path, wherein the second 3D scanning galvanometer (42) and the second scanning field lens (43) are connected into a whole and are positioned on the side surface of the X-theta two-dimensional movement mechanism (14).

2. The laser processing equipment for rapidly breaking the silicon rod according to claim 1, wherein: the pulse laser (31) has a wavelength of 500-1100 nm, a laser power of more than 50w and a pulse width of 300 fs-1 us.

3. The laser processing equipment for rapidly breaking the silicon rod according to claim 1, wherein: the continuous laser (41) has a wavelength of 500-10700 nm and a laser power of more than 500W.

4. The laser processing equipment for rapidly breaking the silicon rod according to claim 1, wherein: the X-theta two-dimensional movement mechanism (14) comprises an X-axis movement module (11) and a theta-axis movement module (12) connected to the X-axis movement module, the X-axis movement module (11) comprises an X-axis marble bottom frame, an X-axis linear guide rail, an X-axis movement plate and an X-axis linear motor for controlling the movement of the X-axis movement plate, the X-axis linear guide rail and the X-axis linear motor are installed on the X-axis marble bottom frame, the X-axis movement plate is arranged on the X-axis linear guide rail, and the X-axis linear motor is in driving connection with the X-axis movement plate so as to control the movement of the X-axis movement plate along the X-axis linear guide rail; the theta axis movement module (12) comprises a rotary DD motor and a quartz carrier, the quartz carrier is arranged on the rotary DD motor, and the rotary DD motor is fixed on the X axis movement plate.

5. The laser processing equipment for rapidly breaking the silicon rod according to claim 4, wherein: the X-axis linear guide rail is vertically arranged, and the X-axis linear motor drives the X-axis motion plate to move up and down.

6. The laser processing equipment for rapidly breaking the silicon rod according to claim 4, wherein: and a clamping mechanism (13) for clamping and fixing the silicon rod is arranged on the theta axis movement module (12).

7. The laser processing method for realizing the rapid silicon rod cracking by using the device of claim 1, wherein the laser processing method comprises the following steps: the silicon rod is fixed on the X-theta two-dimensional motion mechanism (14), the silicon rod is inverted and sagged, and the X-theta two-dimensional motion mechanism (14) can drive the silicon rod to move up and down and rotate for 360 degrees;

the silicon rod is driven to move by the X-theta two-dimensional movement mechanism (14), and a three-dimensional profile scanner (21) positioned on one side of the X-theta two-dimensional movement mechanism (14) scans and measures the three-dimensional profile of the side wall of the silicon rod;

a pulse laser (31) of the pre-cutting laser processing system outputs pulse laser, the pulse laser is incident to a first 3D scanning galvanometer (32) and a first scanning field lens (33), and the first 3D scanning galvanometer (32) forms a preset pre-cutting track according to the three-dimensional profile of the side wall of the silicon rod measured by a three-dimensional profile scanner (21); pre-cutting nicks are formed on the surface of the side wall of the silicon rod along a pre-cutting track through stepping of the X-theta two-dimensional motion mechanism (14) and regional scanning of the first 3D scanning galvanometer (32);

and a continuous laser (41) of the cracking laser processing system outputs continuous laser, the continuous laser is incident to a second 3D scanning galvanometer (42) and a second scanning field lens (43), scanning heating is carried out along the laser pre-cut nick, the thermal stress is utilized to extend the pre-cut nick crack, and the silicon rod is cracked and separated according to a preset track.

8. The laser processing method for rapidly cleaving a silicon rod according to claim 7, wherein: the depth of the pre-cut score is greater than 0.1 mm.

9. The laser processing method for rapidly cleaving a silicon rod according to claim 7, wherein: the pulse laser (31) outputs pulse laser with the wavelength of 500 nm-1100 nm, the laser power of more than 50w and the pulse width of 300 fs-1 us.

10. The laser processing method for rapidly cleaving a silicon rod according to claim 7, wherein: the continuous laser (41) outputs continuous laser with the wavelength of 500 nm-10700 nm and the laser power of more than 500W.

Technical Field

The invention relates to laser processing equipment and a method for rapidly cracking a silicon rod.

Background

At present, a silicon rod crushing method is that a silicon rod is heated to 500-600 ℃, then is put into water, cracks are generated inside the silicon rod by a water explosion method, and then the silicon rod is crushed by a jaw crusher. On one hand, the crushing effect is good and bad due to uneven heating, and the requirement of the required particle size ratio cannot be met; on the other hand, the risk of sparking exists in the heating process, and the quality and normal production of the crystal bar are influenced; in addition, metal impurities are introduced into the jaw crusher, and the proportion of crushed particle size is unstable.

In view of the above problems, there is an urgent need to develop a device for rapidly cracking a silicon rod.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides laser processing equipment and a method for rapidly cracking a silicon rod.

The purpose of the invention is realized by the following technical scheme:

laser processing equipment that silicon rod cracked fast, characteristics are: the device comprises an X-theta two-dimensional movement mechanism for driving a silicon rod to move up and down and rotate by 360 degrees, a three-dimensional profile scanner for scanning and measuring the three-dimensional profile of the side wall of the silicon rod, a pre-cutting laser processing system for forming pre-cutting nicks on the surface of the side wall of the silicon rod and a cracking laser processing system for scanning, heating and cracking and separating along the pre-cutting nicks, wherein the three-dimensional profile scanner is arranged on the side part of the X-theta two-dimensional movement mechanism, and the pre-cutting laser processing system and the cracking laser processing system are arranged on the side part of the X-theta two-dimensional movement mechanism;

the precutting laser processing system comprises a pulse laser, a first 3D scanning galvanometer and a first scanning field lens which are sequentially arranged along a light path, wherein the first 3D scanning galvanometer and the first scanning field lens are connected into a whole and are positioned on the side surface of the X-theta two-dimensional motion mechanism;

the splitting laser processing system comprises a continuous laser, a second 3D scanning galvanometer and a second scanning field lens which are sequentially arranged along a light path, wherein the second 3D scanning galvanometer and the second scanning field lens are connected into a whole and positioned on the side surface of the X-theta two-dimensional movement mechanism.

Further, the laser processing equipment for rapidly cracking the silicon rod is characterized in that the pulse laser is a pulse laser with the wavelength of 500-1100 nm, the laser power of more than 50w and the pulse width of 300 fs-1 us.

Further, the laser processing equipment for rapidly cracking the silicon rod is characterized in that the continuous laser is a continuous laser with the wavelength of 500 nm-10700 nm and the laser power of more than 500W.

Further, the laser processing equipment for rapidly cracking the silicon rod comprises an X-theta two-dimensional motion mechanism, an X-axis motion module and a theta-axis motion module, wherein the X-axis motion module comprises an X-axis marble underframe, an X-axis linear guide rail, an X-axis motion plate and an X-axis linear motor, the X-axis linear guide rail and the X-axis linear motor are used for controlling the X-axis motion plate to move, the X-axis linear guide rail and the X-axis linear motor are mounted on the X-axis marble underframe, the X-axis motion plate is arranged on the X-axis linear guide rail, and the X-axis linear motor is in driving connection with the X-axis motion plate, so that the X-axis motion plate is controlled to move along the X-axis linear guide rail; the theta axis movement module comprises a rotary DD motor and a quartz carrier, the quartz carrier is mounted on the rotary DD motor, and the rotary DD motor is fixed on the X axis movement plate.

Further, according to the laser processing equipment for rapidly cracking the silicon rod, the X-axis linear guide rail is vertically arranged, and the X-axis linear motor drives the X-axis moving plate to move up and down.

Further, according to the laser processing equipment for rapidly cracking the silicon rod, a clamping mechanism for clamping and fixing the silicon rod is mounted on the theta-axis movement module.

According to the laser processing method for rapidly cracking the silicon rod, the silicon rod is fixed on the X-theta two-dimensional motion mechanism, the silicon rod is inverted and droops, and the X-theta two-dimensional motion mechanism can drive the silicon rod to move up and down and rotate 360 degrees;

the silicon rod is driven to move by the X-theta two-dimensional movement mechanism, and a three-dimensional profile scanner positioned on one side of the X-theta two-dimensional movement mechanism scans and measures the three-dimensional profile of the side wall of the silicon rod;

a pulse laser of the precutting laser processing system outputs pulse laser, the pulse laser is incident to a first 3D scanning galvanometer and a first scanning field lens, and the first 3D scanning galvanometer forms a preset precutting track according to the three-dimensional profile of the side wall of the silicon rod measured by a three-dimensional profile scanner; pre-cutting nicks are formed on the surface of the side wall of the silicon rod along a pre-cutting track through stepping of the X-theta two-dimensional motion mechanism and regional scanning of the first 3D scanning galvanometer;

and a continuous laser of the cracking laser processing system outputs continuous laser, the continuous laser is incident to a second 3D scanning galvanometer and a second scanning field lens, scanning heating is carried out along the laser pre-cut nick, the thermal stress is utilized to extend the crack of the pre-cut nick, and the silicon rod is cracked and separated according to a preset track.

Furthermore, according to the laser processing method for rapidly cracking the silicon rod, the depth of the pre-cutting nick is more than 0.1 mm.

Furthermore, the laser processing method for rapidly cracking the silicon rod is characterized in that the pulse laser outputs pulse laser with the wavelength of 500-1100 nm, the laser power of more than 50w and the pulse width of 300 fs-1 us.

Furthermore, the laser processing method for rapidly cracking the silicon rod is characterized in that the continuous laser outputs continuous laser with the wavelength of 500 nm-10700 nm and the laser power of more than 500W.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:

firstly, the silicon rod to be broken is fixed on the X-theta two-dimensional motion mechanism, the center of a cylinder of the silicon rod is downward, the silicon rod can rotate along the theta axis perpendicular to the center of the cylinder, the silicon rod inversely droops, the X-axis motion module can drive the silicon rod to move up and down, and the theta-axis motion module drives the silicon rod to rotate for 360 degrees;

driving the silicon rod to move by the X-theta two-dimensional movement mechanism, detecting the three-dimensional profile of the silicon rod by using a three-dimensional profile scanner, and determining a precutting track and a splitting track;

two sets of laser processing systems are ingeniously designed, precutting nicks are formed on the surface of the side wall of the silicon rod along a precutting track by the precutting laser processing systems, scanning heating is carried out on the precutting nicks by the splitting laser processing systems along the laser precutting nicks, cracks of the precutting nicks are extended by utilizing thermal stress, and therefore the silicon rod is split and separated according to a preset track;

and fourthly, the cracking is uniform and consistent, the cracking effect is good, the proportion of the crushed particle size is stable, and no metal impurity is introduced.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1: the invention discloses a shaft measuring and indicating diagram of laser processing equipment;

FIG. 2: the invention discloses a laser processing device.

The meanings of the reference symbols in the figures are given in the following table:

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.

As shown in fig. 1 and 2, the laser processing equipment for rapidly cracking the silicon rod comprises an X-theta two-dimensional movement mechanism 14 for driving the silicon rod 101 to move up and down and rotate 360 degrees, a three-dimensional profile scanner 21 for scanning and measuring a three-dimensional profile of a side wall of the silicon rod, a pre-cutting laser processing system for forming a pre-cut score on a surface of the side wall of the silicon rod 101, and a cracking laser processing system for scanning, heating and cracking and separating along the pre-cut score, wherein the three-dimensional profile scanner 21 is arranged at a side portion of the X-theta two-dimensional movement mechanism 14, and the pre-cutting laser processing system and the cracking laser processing system are arranged at a side portion of the silicon rod 101 on the X-theta two-dimensional movement mechanism 14;

the precutting laser processing system comprises a pulse laser 31, a first 3D scanning galvanometer 32 and a first scanning field lens 33 which are sequentially arranged along a light path, wherein the first 3D scanning galvanometer 32 and the first scanning field lens 33 are connected into a whole and are positioned on the side surface of the X-theta two-dimensional movement mechanism 14;

the splitting laser processing system comprises a continuous laser 41, a second 3D scanning galvanometer 42 and a second scanning field lens 43 which are sequentially arranged along an optical path, wherein the second 3D scanning galvanometer 42 and the second scanning field lens 43 are connected into a whole and are positioned on the side surface of the X-theta two-dimensional movement mechanism 14.

In the specific design, the pulse laser 31 is a pulse laser with a wavelength of 500nm to 1100nm, a laser power of more than 50w and a pulse width of 300fs to 1 us.

The continuous laser 41 has a wavelength of 500nm to 10700nm and a laser power of more than 500W.

The X-theta two-dimensional movement mechanism 14 comprises an X-axis movement module 11 and a theta-axis movement module 12 connected to the X-axis movement module, the X-axis movement module 11 comprises an X-axis marble underframe, an X-axis linear guide rail, an X-axis movement plate and an X-axis linear motor for controlling the movement of the X-axis movement plate, the X-axis linear guide rail and the X-axis linear motor are installed on the X-axis marble underframe, the X-axis linear guide rail is vertically arranged, the X-axis movement plate is arranged on the X-axis linear guide rail, and the X-axis linear motor is in driving connection with the X-axis movement plate so as to control the X-axis movement plate to move up and down along the X-axis linear guide rail; the theta axis motion module 12 comprises a rotary DD motor and a quartz carrier, the quartz carrier is mounted on the rotary DD motor, and the rotary DD motor is fixed on the X axis motion plate; the theta axis movement module 12 is provided with a clamping mechanism 13 for clamping and fixing the silicon rod.

According to the laser processing technology for rapidly cracking the silicon rod, the silicon rod 101 is fixed on an X-theta two-dimensional movement mechanism 14, the silicon rod is inverted and droops, and the X-theta two-dimensional movement mechanism 14 can drive the silicon rod to move up and down and rotate 360 degrees;

the silicon rod 101 is driven to move by the X-theta two-dimensional movement mechanism 14, and the three-dimensional profile scanner 21 positioned on one side of the X-theta two-dimensional movement mechanism 14 scans and measures the three-dimensional profile of the side wall of the silicon rod;

a pulse laser 31 of the precutting laser processing system outputs pulse laser with the wavelength of 500 nm-1100 nm, the laser power of more than 50w and the pulse width of 300 fs-1 us, the pulse laser is incident to a first 3D scanning galvanometer 32 and a first scanning field lens 33, and the first 3D scanning galvanometer 32 forms a preset precutting track according to the three-dimensional profile of the silicon rod side wall measured by a three-dimensional profile scanner 21; the three-dimensional profile scanner 21 is a 3D scanner of the Simi-Tech technology, is configured with the geogenic software, processes the dot matrix data after scanning to generate 3D data of a processed sample, converts the 3D data into a processing file, and transmits the processing file to a galvanometer scanning system for processing;

pre-cut nicks are formed on the surface of the side wall of the silicon rod 101 along a pre-cut track through the stepping of the X-theta two-dimensional movement mechanism 14 and the regional scanning of the first 3D scanning galvanometer 32, and the depth of the pre-cut nicks is larger than 0.1 mm; the stepping of the X-theta two-dimensional movement mechanism 14 is accurately controlled by setting the power, the repetition frequency, the scanning speed, the scanning times and the scanning range of the laser and controlling the synchronous control of the light-on signal of the laser and the movement of the scanning galvanometer by the controller, so that the accurate processing of the preset track of the side wall of the silicon rod is realized;

and a continuous laser 41 of the cracking laser processing system outputs continuous laser with the wavelength of 500 nm-10700 nm and the laser power of more than 500W, the continuous laser is incident to a second 3D scanning galvanometer 42 and a second scanning field lens 43, scanning and heating are carried out along the laser pre-cut nick, the thermal stress is utilized to extend the pre-cut nick crack, and the silicon rod is cracked and separated according to a preset track.

In conclusion, the silicon rod breaking device is novel in design and easy to operate, the silicon rod to be broken is fixed on the X-theta two-dimensional movement mechanism, the center of a cylinder of the silicon rod is downward, the silicon rod can rotate along the theta axis perpendicular to the center of the cylinder, the silicon rod inversely droops, the X-axis movement module can drive the silicon rod to move up and down, and the theta-axis movement module drives the silicon rod to rotate for 360 degrees;

the X-theta two-dimensional movement mechanism drives the silicon rod to move, a three-dimensional profile scanner is adopted to detect the three-dimensional profile of the silicon rod, and the precutting track and the splitting track are determined;

the method comprises the following steps that two sets of laser processing systems are ingeniously designed, precutting nicks are formed on the surface of the side wall of a silicon rod along a precutting track by the precutting laser processing systems, scanning heating is carried out on the precutting nicks by the splitting laser processing systems along the laser precutting nicks, cracks of the precutting nicks are extended by utilizing thermal stress, and therefore the silicon rod is split and separated according to a preset track;

the cracking is uniform and consistent, the cracking effect is good, the proportion of the crushed grain size is stable, and no metal impurity is introduced.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.