阅读说明：本技术 一种带定向仪的半导体激光切割机 (Semiconductor laser cutting machine with direction finder ) 是由 张海涛 李骏杰 许彬 于 2021-07-28 设计创作，主要内容包括：本发明公开了一种带定向仪的半导体激光切割机,包括下机柜,所述下机柜的顶部外壁固定连接有立柱和Y轴直线电机,所述立柱的顶部外壁固定连接有横梁,所述横梁的顶部外壁固定连接有激光器,所述激光器的一端设有导光机构,所述横梁的一边外壁设有Z轴模组,所述Y轴直线电机的顶部外壁设有X轴直线电机,所述X轴直线电机的顶部外壁设有DD马达,所述DD马达的顶部设有真空接头。本发明将产品送至晶体定向仪工位,在晶体定向仪的工作下对产品进行二次切割,二次切割完毕后,再通过Y轴直线电机将产品送至上下料口,人工取出,晶体定向仪能够对产品的位置朝向进行精准的把握,使得切割造成的误差减小。(The invention discloses a semiconductor laser cutting machine with a direction finder, which comprises a lower cabinet, wherein the outer wall of the top of the lower cabinet is fixedly connected with an upright post and a Y-axis linear motor, the outer wall of the top of the upright post is fixedly connected with a cross beam, the outer wall of the top of the cross beam is fixedly connected with a laser, one end of the laser is provided with a light guide mechanism, the outer wall of one side of the cross beam is provided with a Z-axis module, the outer wall of the top of the Y-axis linear motor is provided with an X-axis linear motor, the outer wall of the top of the X-axis linear motor is provided with a DD motor, and the. According to the invention, the product is conveyed to the station of the crystal orientation instrument, the product is cut secondarily under the work of the crystal orientation instrument, after the secondary cutting is finished, the product is conveyed to the feeding hole and the discharging hole through the Y-axis linear motor and is taken out manually, and the crystal orientation instrument can accurately control the position orientation of the product, so that the error caused by cutting is reduced.)

1. The semiconductor laser cutting machine with the orientation instrument comprises a lower machine cabinet (3) and is characterized in that the outer wall of the top of the lower machine cabinet (3) is fixedly connected with an upright post (12) and a Y-axis linear motor (18), the outer wall of the top of the upright post (12) is fixedly connected with a cross beam (11), the outer wall of the top of the cross beam (11) is fixedly connected with a laser (10), one end of the laser (10) is provided with a light guide mechanism, one side outer wall of the cross beam (11) is provided with a Z-axis module (14), the outer wall of the top of the Y-axis linear motor (18) is provided with an X-axis linear motor (17), the outer wall of the top of the X-axis linear motor (17) is provided with a DD motor (19), the top of the DD motor (19) is provided with a vacuum joint (20), one end of the Y-axis linear motor (18) is provided with a Z-axis fine tuning platform (21), and the top of the Z-axis fine tuning platform (21) is provided with a crystal orientation instrument (13), the outer wall of the top of the lower cabinet (3) is provided with a cabinet upper cover (9), and the outer wall of one side of the lower cabinet (3) is provided with a main switch (4).

2. The semiconductor laser cutting machine with the direction finder according to claim 1, wherein the light guide mechanism comprises a light guide pipe and a reflector (15), the light guide pipe and the reflector (15) are used in cooperation, and one end of the light guide pipe is connected with a light source (16).

3. The semiconductor laser cutting machine with the direction finder according to claim 1, wherein a feeding and discharging opening (5) is formed in an outer wall of one side of the cabinet upper cover (9), and a hand-pull door (6) is arranged on an inner wall of the feeding and discharging opening (5).

4. The semiconductor laser cutting machine with the direction finder according to claim 1, wherein the top outer wall of the cabinet upper cover (9) is provided with a three-color lamp (1).

5. The semiconductor laser cutting machine with the direction finder according to claim 1, wherein an operation area is arranged on one outer wall of the cabinet upper cover (9), and a control button (2) is arranged in the operation area.

6. The semiconductor laser cutting machine with the direction finder according to claim 1, wherein a display (8) is arranged on one outer wall of the cabinet upper cover (9).

7. The semiconductor laser cutting machine with the direction finder according to claim 6, wherein a mouse box (7) is arranged below the display (8), and a keyboard and a mouse are arranged inside the mouse box (7).

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a semiconductor laser cutting machine with a direction finder.

Background

The semiconductor laser cutting machine is cutting equipment taking a semiconductor pump laser as a main body, and the semiconductor pump laser is a novel laser which is the fastest in international development in recent years and is widely applied. This type of laser has achieved a new development by using a semiconductor laser that outputs a fixed wavelength instead of a conventional krypton or xenon lamp to pump a laser crystal, and is referred to as a second-generation laser. The laser is a second-generation novel solid laser with high efficiency, long service life, high beam quality, good stability, compact structure and miniaturization, and has unique application prospect in high-tech fields such as space communication, optical fiber communication, atmospheric research, environmental science, medical instruments, optical image processing, laser printers and the like at present.

The existing semiconductor laser cutting machine has the following defects: when the conventional semiconductor laser cutting machine works, a product to be cut is firstly conveyed to a laser cutting position, the product is firstly cut, then the product is taken out, the crystal face of the product is oriented, and secondary cutting is carried out after the angle is confirmed.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a semiconductor laser cutting machine with a direction finder.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a take semiconductor laser cutting machine of direction finder, includes lower rack, the top outer wall fixedly connected with stand and the Y axle linear electric motor of rack down, the top outer wall fixedly connected with crossbeam of stand, the top outer wall fixedly connected with laser instrument of crossbeam, the one end of laser instrument is equipped with leaded light mechanism, one side outer wall of crossbeam is equipped with Z axle module, Y axle linear electric motor's top outer wall is equipped with X axle linear electric motor, X axle linear electric motor's top outer wall is equipped with the DD motor, the top of DD motor is equipped with vacuum joint, Y axle linear electric motor's one end is equipped with Z axle fine setting platform, the top of Z axle fine setting platform is equipped with the crystal direction finder, the top outer wall of rack is equipped with the rack upper shield down, one side outer wall of rack is equipped with the master switch down.

Further, the light guide mechanism comprises a light guide pipe and a reflector, the light guide pipe and the reflector are matched for use, and one end of the light guide pipe is connected with a light source.

Furthermore, an upper feed opening and a lower feed opening are formed in the outer wall of one side of the upper cover of the machine cabinet, and a hand-pull door is arranged on the inner wall of the upper feed opening and the lower feed opening.

Furthermore, the outer wall of the top of the upper cover of the cabinet is provided with a three-color lamp.

Furthermore, an operation area is arranged on the outer wall of one side of the upper cover of the cabinet, and an operation button is arranged in the operation area.

Furthermore, a display is arranged on the outer wall of one side of the upper cover of the cabinet.

Furthermore, a keyboard and mouse box is arranged below the display, and a keyboard and a mouse are arranged inside the keyboard and mouse box.

The invention has the beneficial effects that:

1. this take semiconductor laser cutting machine of direction finder, through being provided with crystal direction finder and Z axle fine setting platform, at laser cutting machine during operation, put into the product from material loading and unloading mouth, it is fixed to place on vacuum joint's top, deliver to the cutting position with the product through X axle linear electric motor and Y axle linear electric motor, fix a position and cut the product through the vision, the back finishes in the cutting, X axle linear electric motor and Y axle linear electric motor continue to deliver to the crystal direction finder station with the product, carry out the secondary cutting to the product under the work of crystal direction finder, the back is finished in the secondary cutting, the rethread Y axle linear electric motor delivers to material loading and unloading mouth with the product, the manual work is taken out, the crystal direction finder can carry out accurate assurance to the position orientation of product, make the error that the cutting caused reduce.

2. This take semiconductor laser cutting machine of direction finder through being provided with vacuum joint, fixes the product through vacuum joint, can produce stronger adsorption affinity for the fixed of product is more stable, and can remote control vacuum joint.

The part not related in the device all is the same with prior art or can adopt prior art to realize, and the device design structure is reasonable, and convenient to use satisfies people's user demand.

Drawings

FIG. 1 is an overall three-dimensional structure diagram of a semiconductor laser cutting machine with a direction finder according to the present invention;

FIG. 2 is a three-dimensional structure diagram of a laser of a semiconductor laser cutting machine with a direction finder according to the present invention;

FIG. 3 is a three-dimensional structure diagram of a light source of a semiconductor laser cutting machine with a direction finder according to the present invention;

fig. 4 is a three-dimensional structure diagram of a vacuum joint of a semiconductor laser cutting machine with a direction finder provided by the invention.

In the figure: the three-color mouse light source comprises a 1-three-color lamp, a 2-operation button, a 3-lower cabinet, a 4-main switch, a 5-upper feed opening and a 5-lower feed opening, a 6-hand-operated door, a 7-mouse box, an 8-display, a 9-cabinet upper cover, a 10-laser, an 11-beam, a 12-column, a 13-crystal orientation instrument, a 14-Z axis module, a 15-reflector, a 16-light source, a 17-X axis linear motor, a 18-Y axis linear motor, a 19-DD motor, a 20-vacuum joint and a 21-Z axis fine adjustment platform.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1-4, a semiconductor laser cutting machine with an orientation device, which comprises a lower cabinet 3, a column 12 and a Y-axis linear motor 18 are fixedly connected to the outer wall of the top of the lower cabinet 3, a beam 11 is fixedly connected to the outer wall of the top of the column 12, a laser 10 is fixedly connected to the outer wall of the top of the beam 11, a light guide mechanism is arranged at one end of the laser 10, a Z-axis module 14 is arranged on the outer wall of one side of the beam 11, an X-axis linear motor 17 is arranged on the outer wall of the top of the Y-axis linear motor 18, a DD motor 19 is arranged on the outer wall of the top of the X-axis linear motor 17, a vacuum joint 20 is arranged at the top of the DD motor 19, a Z-axis fine tuning platform 21 is arranged at one end of the Y-axis linear motor 18, a crystal orientation device 13 is arranged at the top of the Z-axis fine tuning platform 21, an upper cabinet cover 9 is arranged on the outer wall of the top of the lower cabinet 3, and a main switch 4 is arranged on the outer wall of one side of the lower cabinet 3.

In the invention, the light guide mechanism comprises a light guide pipe and a reflector 15, the light guide pipe and the reflector 15 are matched for use, one end of the light guide pipe is connected with a light source 16, and the light source 16 provides brightness guarantee for product cutting.

In the invention, the outer wall of one side of the upper cover 9 of the cabinet is provided with the feeding and discharging opening 5, the inner wall of the feeding and discharging opening 5 is provided with the hand-pulled door 6, and the hand-pulled door 6 is used for closing or opening the feeding and discharging opening 5.

In the invention, the outer wall of the top of the upper cover 9 of the cabinet is provided with the three-color lamp 1, and the three-color lamp 1 is used for prompting.

In the invention, an operation area is arranged on the outer wall of one side of the upper cover 9 of the cabinet, an operation button 2 is arranged in the operation area, and the operation button 2 is used for simply operating the internal mechanism of the device.

In the invention, a display 8 is arranged on the outer wall of one side of the upper cover 9 of the cabinet, and the display 8 is used for showing the product cutting condition for workers.

In the invention, a keyboard and mouse box 7 is arranged below a display 8, a keyboard and a mouse are arranged inside the keyboard and mouse box 7, and the keyboard, the mouse and the display 8 are matched for use.

In the embodiment, the technical parameters of the laser part comprise that the type of the laser is ultraviolet light; the wavelength is 355 nm; the laser power is 10 w; the pulse energy is more than 200 mu J; the pulse width is less than 13 ns; the roundness of the light spot is more than 95 percent; light beam quality less than 1.2M²(ii) a The cooling method is water cooling.

In this embodiment, the overall machine parameters include the effective stroke of the platform is 300mm x 500 mm; the maximum moving speed of the platform is 1000 mm/s; the repeated precision of the platform is +/-2 mu m; the cutting pattern is a straight line/curve/special shape; the cutting precision is +/-0.02 mm; the maximum processing range is 200mm by 200 mm; the power of the whole machine is 3.5 kw.

The working principle is as follows: when the laser cutting machine works, a product is put in from the upper and lower material openings 5 and is placed at the top end of the vacuum joint 20 for fixation, the product is sent to a cutting position by an X-axis linear motor 17 and a Y-axis linear motor 18, the product is positioned and cut by vision, after the cutting is finished, the X-axis linear motor 17 and the Y-axis linear motor 18 continue to deliver the product to the crystal orienter 13 station, the product is cut for the second time under the work of the crystal orientation instrument 13, after the secondary cutting is finished, the product is sent to the upper feed opening 5 through the Y-axis linear motor 18 and is taken out manually, the crystal orientation instrument 13 can accurately grasp the position and the orientation of the product, the cutting is more accurate, the error caused is reduced, fixing the product through the vacuum connector 20 can generate stronger adsorption force, so that the product can be more stably fixed, and the vacuum connector 20 can be remotely controlled.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.