阅读说明：本技术 板状部件的制造方法和层叠体 (Method for manufacturing plate-like member and laminate ) 是由 国本知道 浅野秀树 于 2019-10-25 设计创作，主要内容包括：提供一种能够抑制板状部件的形状不良且能够提高成品率的板状部件的制造方法。一种通过切割板状部件的母材(11)来制造多个板状部件的方法,其特征在于,包括：准备具有彼此相对的第一主面(11a)和第二主面(11b)的板状部件的母材(11)的工序；在板状部件的母材(11)的第一主面(11a)形成分割槽(12a、13a)的工序；在板状部件的母材(11)的第二主面(11b)粘贴支承膜(14)的工序；以覆盖板状部件的母材(11)的第一主面(11a)的方式粘贴粘附膜(17)的工序；和通过在板状部件的母材(11)上粘贴有粘附膜(17)的状态下,从支承膜(14)侧按压板状部件的母材(11)的形成有分割槽(12a、13a)的区域,来沿着分割槽(12a、13a)切割板状部件的母材(11)的切割工序。(Provided is a method for manufacturing a plate-shaped member, wherein defective shapes of the plate-shaped member can be suppressed and the yield can be improved. A method of manufacturing a plurality of plate-like members by cutting a base material (11) of the plate-like members, characterized by comprising: a step of preparing a base material (11) of a plate-like member having a first main surface (11a) and a second main surface (11b) that face each other; forming dividing grooves (12a, 13a) in a first main surface (11a) of a base material (11) of a plate-like member; a step of attaching a support film (14) to the second main surface (11b) of the base material (11) of the plate-like member; a step of attaching an adhesive film (17) so as to cover the first main surface (11a) of the base material (11) of the plate-like member; and a cutting step of cutting the plate-shaped member base material (11) along the dividing grooves (12a, 13a) by pressing the region of the plate-shaped member base material (11) where the dividing grooves (12a, 13a) are formed from the support film (14) side in a state where the adhesive film (17) is adhered to the plate-shaped member base material (11).)

1. A method of manufacturing a plurality of plate-like members by cutting a base material of the plate-like members, comprising:

preparing a base material of a plate-like member having a first main surface and a second main surface opposed to each other;

forming a dividing groove in the first main surface of the base material of the plate-like member;

a step of attaching a support film to the second main surface of the base material of the plate-like member;

a step of attaching an adhesive film so as to cover the first main surface of the base material of the plate-like member; and

and a cutting step of pressing the region of the base material of the plate-like member where the cutting grooves are formed from the support film side in a state where the adhesive film is adhered to the base material of the plate-like member, thereby cutting the base material of the plate-like member along the cutting grooves.

2. The method of manufacturing a plate-like member according to claim 1, wherein:

the dividing grooves are a first dividing groove and a second dividing groove which are mutually crossed,

the cutting process comprises the following steps: a first cutting step of cutting the base material of the plate-like member along the first dividing groove; and a second cutting step of cutting the base material of the plate-like member along the second cutting groove after the first cutting step.

3. The method of manufacturing a plate-like member according to claim 2, wherein:

the first dividing groove is orthogonal to the second dividing groove.

4. The method of manufacturing a plate-like member according to any one of claims 1 to 3, wherein:

in the cutting step, the base material of the plate-shaped member is pressed from the support film side by using a pressing member extending linearly in parallel with the first main surface of the base material of the plate-shaped member, thereby cutting the base material of the plate-shaped member along the dividing grooves.

5. The method of manufacturing a plate-like member according to claim 4, wherein:

in the cutting step, the base material of the plate-shaped member is cut along the dividing grooves by pressing the base material of the plate-shaped member from the side of the support film using the pressing member and by nipping the base material of the plate-shaped member using the support member and the pressing member while supporting the base material of the plate-shaped member from the side of the adhesive film using a support member having a slit.

6. The method of manufacturing a plate-like member according to any one of claims 1 to 5, wherein:

an area of the support film is larger than an area of the second main surface of the base material of the plate-like member in a plan view,

when the adhesive film is attached so as to cover the first main surface of the base material of the plate-like member, the adhesive film is attached so as to reach the support film from the first main surface.

7. The method of manufacturing a plate-like member according to any one of claims 1 to 6, wherein:

the adhesive film is a self-adhesive film.

8. The method of manufacturing a plate-like member according to any one of claims 1 to 7, wherein:

an adhesive layer is arranged on the surface of the supporting film,

and adhering the adhesive layer of the support film to the second main surface of the base material of the plate-like member.

9. The method of manufacturing a plate-like member according to any one of claims 1 to 8, wherein:

the adhesive film has a lower adhesion than the support film.

10. The method of manufacturing a plate-like member according to any one of claims 1 to 9, wherein:

the plate-like member is a wavelength conversion member in which phosphor particles are dispersed in an inorganic matrix.

11. A laminated body used for manufacturing a plurality of plate-like members by cutting a base material of the plate-like members, comprising:

a base material of a plate-like member having a first main surface and a second main surface opposed to each other, the first main surface being provided with a dividing groove;

a support film attached to the second main surface of the base material of the plate-like member; and

and an adhesive film attached so as to cover the first main surface of the base material of the plate-like member.

Technical Field

The present invention relates to a method for producing a plate-like member such as a wavelength conversion member and a laminate used in the method for producing the plate-like member.

Background

In recent years, light emitting devices using LEDs or LDs have been attracting attention as next-generation light sources replacing fluorescent lamps and incandescent lamps. As an example of such a next-generation light source, a light emitting device is disclosed in which an LED emitting blue light and a wavelength conversion member that absorbs a part of the light from the LED and converts the light into yellow light are combined. The light emitting device emits white light which is a composite light of blue light emitted from the LED and transmitted through the wavelength conversion member and yellow light emitted from the wavelength conversion member.

As a method for manufacturing a wavelength conversion member, a method may be employed in which a base material of the wavelength conversion member is made into a single piece to obtain a plurality of wavelength conversion members at once. As an example of such a method for manufacturing a wavelength conversion member, patent document 1 describes a method for obtaining a plurality of wavelength conversion members by forming division grooves having a grid-like pattern in a base material of the wavelength conversion member and cutting the base material along the division grooves to form individual pieces. The singulation is performed by cutting the base material of the wavelength conversion member along the dividing grooves extending in one direction of the grid-like pattern and then cutting the base material along the dividing grooves extending in the other direction.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2018 and 097060.

Disclosure of Invention

Problems to be solved by the invention

When the base material of the plate-like member such as the wavelength conversion member is singulated, a crack extending in the thickness direction of the base material of the plate-like member from the dividing groove is generated, and the base material of the plate-like member is cut. However, cracks may occur which extend in a direction away from the thickness direction from the dividing grooves. Therefore, a shape defect such as a burr may occur in the plate-like member after the plate-like member is singulated.

The invention aims to provide a method for manufacturing a plate-shaped component and a laminated body used in the method for manufacturing the plate-shaped component, wherein the method can inhibit the shape defect of the plate-shaped component and improve the yield.

Means for solving the problems

A method for manufacturing a plurality of plate-like members by cutting a plate-like member base material according to the present invention includes: preparing a base material of a plate-like member having a first main surface and a second main surface opposed to each other; forming a dividing groove on a first main surface of a base material of a plate-shaped member; a step of attaching a support film to the second main surface of the base material of the plate-like member; a step of attaching an adhesive film so as to cover the first main surface of the base material of the plate-like member; and a cutting step of pressing the region of the base material of the plate-like member where the cutting grooves are formed from the support film side in a state where the adhesive film is adhered to the base material of the plate-like member, thereby cutting the base material of the plate-like member along the cutting grooves.

Preferably, the dividing groove is a first dividing groove and a second dividing groove intersecting each other, and the dicing step includes: a first cutting step of cutting the base material of the plate-like member along the first cutting groove; and a second cutting step of cutting the base material of the plate-like member along the second cutting grooves after the first cutting step. In this case, the first divided groove is preferably orthogonal to the second divided groove.

Preferably, in the cutting step, the base material of the plate-like member is cut along the dividing grooves by pressing the base material of the plate-like member from the support film side using a pressing member extending linearly in parallel with the first main surface of the base material of the plate-like member. In this case, in the cutting step, it is preferable that the base material of the plate-like member is cut along the dividing grooves by pressing the base material of the plate-like member from the side of the support film using the pressing member and by nipping the base material of the plate-like member using the supporting member having the slit and the pressing member while supporting the base material of the plate-like member from the side of the adhesive film using the supporting member having the slit.

Preferably, the support film has an area larger than an area of the second main surface of the base material of the plate-like member in a plan view, and the adhesive film is attached so as to reach the support film from the first main surface when the adhesive film is attached so as to cover the first main surface of the base material of the plate-like member.

Preferably the adhesive film is a self-adhesive film.

Preferably, an adhesive layer is provided on the surface of the support film, and the adhesive layer of the support film is bonded to the second main surface of the base material of the plate-like member.

The adhesive film preferably has a lower adhesion than the support film.

The plate-like member is preferably a wavelength conversion member in which phosphor particles are dispersed in an inorganic matrix.

A laminate according to the present invention is a laminate used for manufacturing a plurality of plate-like members by cutting a base material of the plate-like members, the laminate including: a base material of a plate-like member having a first main surface and a second main surface opposed to each other, the first main surface being provided with a dividing groove; a support film attached to the second main surface of the base material of the plate-like member; and an adhesive film attached so as to cover the first main surface of the base material of the plate-like member.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to provide a method for manufacturing a plate-like member and a laminate used in the method for manufacturing a plate-like member, which can suppress a defective shape of the plate-like member and can improve the yield.

Drawings

Fig. 1 is a schematic front cross-sectional view showing an example of a plate-like member manufactured by the method for manufacturing a plate-like member according to the present invention.

Fig. 2 is a schematic plan view showing a base material of a plate-like member in which first divided grooves and second divided grooves are formed, the base material being used in a method for manufacturing a plate-like member according to an embodiment of the present invention.

Fig. 3 (a) and 3 (b) are schematic front cross-sectional views for explaining a step of producing a laminate in the method of producing a plate-like member according to the embodiment of the present invention.

Fig. 4 is a schematic enlarged front cross-sectional view of a support film used in the method for manufacturing a plate-like member according to the embodiment of the present invention.

Fig. 5 is a schematic enlarged front cross-sectional view of an adhesive film used in the method for manufacturing a plate-like member according to the embodiment of the present invention.

Fig. 6 is a schematic enlarged front cross-sectional view showing a modification of the adhesive film used in the method for manufacturing the plate-like member according to the embodiment of the present invention.

Fig. 7 (a) to 7 (d) are schematic front cross-sectional views for explaining a cutting step in the method for manufacturing a plate-like member according to the embodiment of the present invention.

Fig. 8 is a schematic plan view showing an example of a defective shape of the plate-like member.

Fig. 9 (a) and 9 (b) are schematic front cross-sectional views for explaining a method of manufacturing a plate-like member of a comparative example.

Detailed Description

Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. In the drawings, components having substantially the same functions are sometimes referred to by the same reference numerals.

(plate-like Member)

Fig. 1 is a schematic front cross-sectional view showing an example of a plate-like member manufactured by the method for manufacturing a plate-like member according to the present invention. The plate-like member shown in fig. 1 is a rectangular plate-like wavelength converting member 1 having a first main surface 1a and a second main surface 1b opposed to each other. The shape of the wavelength conversion member 1 is not limited to a rectangular plate.

The wavelength conversion member 1 is configured by dispersing phosphor particles 2 in an inorganic matrix 3. The phosphor particles 2 emit fluorescence by incidence of the excitation light a. Therefore, when the excitation light a enters the wavelength conversion member 1, the combined light B of the excitation light and the fluorescence is emitted from the wavelength conversion member 1.

The phosphor particles 2 are not particularly limited as long as they emit fluorescence by incidence of excitation light. Specific examples of the phosphor particles 2 include 1 or more selected from the group consisting of an oxide phosphor, a nitride phosphor, an oxynitride phosphor, a chloride phosphor, an oxychloride phosphor, a sulfide phosphor, an oxysulfide phosphor, a halide phosphor, a chalcogenide phosphor, a chlorate phosphor, a halophosphate compound phosphor, and a garnet compound phosphor. When blue light is used as the excitation light, for example, a phosphor that emits green light, yellow light, or red light as fluorescence can be used.

The average particle diameter of the phosphor particles 2 is preferably 1 to 50 μm, and more preferably 5 to 30 μm. When the average particle diameter of the phosphor particles 2 is too small, the emission intensity may decrease. On the other hand, when the average particle diameter of the phosphor particles 2 is too large, the emission color may be uneven.

The content of the phosphor particles 2 in the wavelength conversion member 1 is preferably 1 vol% or more, 1.5 vol% or more, and particularly preferably 2 vol% or more, and is preferably 70 vol% or less, 50 vol% or less, and particularly preferably 30 vol% or less. If the content of the phosphor particles 2 is too small, the wavelength conversion member 1 needs to be formed thick to obtain a desired emission color, and as a result, the internal scattering of the obtained wavelength conversion member increases, and the light extraction efficiency may decrease. On the other hand, if the content of the phosphor particles 2 is too large, the wavelength conversion member 1 needs to be formed thin in order to obtain a desired emission color, and thus the mechanical strength of the wavelength conversion member 1 may be reduced.

The inorganic material used for the inorganic matrix 3 is not particularly limited as long as it can be used as a dispersion medium for the phosphor particles 2, and for example, glass can be used. Examples of the glass used for the inorganic substrate 3 include borosilicate glass, phosphate glass, and the like,Tin phosphate glass, bismuthate glass, and the like. The borosilicate glass may contain 30 to 85 mass% of SiO₂0 to 30 percent of Al₂O₃0 to 50 percent of B₂O₃0 to 10% of Li₂O+Na₂O+K₂O and 0 to 50 percent of MgO + CaO + SrO + BaO glass. Examples of the tin phosphate glass include those containing 30 to 90 mol% of SnO and 1 to 70 mol% of P₂O₅The glass of (2).

Referring to fig. 1, a wavelength conversion member is shown as an example of a plate-like member manufactured by the method for manufacturing a plate-like member according to the present invention, but the plate-like member is not limited to the wavelength conversion member. Examples of the plate-like member manufactured by the manufacturing method of the present invention include a brittle material substrate made of an inorganic material such as a glass plate or a ceramic plate, a plate-like semiconductor element, and the like, in addition to the wavelength conversion member.

[ method for producing plate-like Member ]

An example of a method for manufacturing a plate-like member according to an embodiment of the present invention will be described below. The plate-like member in the present embodiment is the above-described plate-like wavelength conversion member.

(Process for producing laminate)

Fig. 2 is a schematic plan view showing a base material of a plate-like member in which first divided grooves and second divided grooves are formed, the base material being used in a method for manufacturing a plate-like member according to an embodiment of the present invention. Fig. 3 (a) and 3 (b) are schematic front cross-sectional views for explaining a step of producing a laminate in the method of producing a plate-like member according to the embodiment of the present invention. Fig. 4 is a schematic enlarged front cross-sectional view of a support film used in the method for manufacturing a plate-like member according to the embodiment of the present invention. Fig. 5 is a schematic enlarged front cross-sectional view of an adhesive film used in the method for manufacturing a plate-like member according to the embodiment of the present invention.

First, a base material 11 of a rectangular plate-like wavelength conversion member as shown in fig. 2 is prepared. The base material 11 of the wavelength conversion member has a first main surface 11a and a second main surface 11b that face each other (see fig. 3 (a)). The base material 11 of the wavelength conversion member is formed by dispersing phosphor particles in an inorganic matrix. The base material 11 of the wavelength conversion member may be made of the same material as that of the wavelength conversion member 1. The base material of the plate-like member may be, for example, a brittle material substrate made of an inorganic material such as a glass plate or a ceramic plate, or a plate-like semiconductor element, in addition to the base material 11 of the wavelength conversion member.

Next, as shown in fig. 2, a dividing groove is formed in the first main surface 11a of the base material 11 of the wavelength conversion member. Specifically, the first divided groove 12a and the second divided groove 13a are formed to intersect each other. In the present embodiment, the first divided groove 12a is orthogonal to the second divided groove 13 a.

Here, the directions extending parallel to the first main surface 11a of the base material 11 of the wavelength conversion member and orthogonal to each other are the x direction and the y direction. Let the z direction be the direction orthogonal to the x direction and the y direction. In the present embodiment, the plurality of first dividing grooves 12a extend in the y direction and are aligned in the x direction. On the other hand, the plurality of second divided grooves 13a extend in the x direction and are aligned in the y direction. The first divided groove 12a and the second divided groove 13a are not necessarily orthogonal to each other. Further, only one of the first divided groove 12a and the second divided groove 13a may be provided. Alternatively, another dividing groove different from the first dividing groove 12a and the second dividing groove 13 may be further provided.

In the present embodiment, the pattern of the first divided grooves 12a and the second divided grooves 13a is formed in a grid shape. However, the pattern of the dividing grooves is not particularly limited, and a pattern corresponding to the shape of the finally manufactured plate-like member can be appropriately selected.

The depths of the first divided groove 12a and the second divided groove 13a are not particularly limited, but are preferably in the range of 0.1% to 10%, and more preferably in the range of 0.5% to 5%, of the thickness of the base material 11 of the wavelength conversion member. If the depth of the dividing groove is too shallow, the cutting by the dividing groove may be difficult. If the depth of the dividing groove is too deep, the load at the time of forming the dividing groove may be too large, and the crack may extend in an undesired direction, and the dicing may not be performed in the direction perpendicular to the first main surface 11 a.

The widths of the first divided groove 12a and the second divided groove 13a are preferably 0.001mm or more, more preferably 0.002mm or more, further preferably 0.010mm or less, and more preferably 0.005mm or less, respectively. If the width is too large, the part may become a defective part when cut. When the width is too small, cutting with the dividing groove may be difficult.

The first and second dividing grooves 12a and 13a are preferably formed by scribing. As a specific method for forming the first and second divided grooves 12a and 13a, it can be selected appropriately according to the material of the inorganic substrate, and when the inorganic substrate is glass, it is preferably formed by a scribe needle or the like using diamond particles or the like. The first and second divided grooves 12a and 13a may be formed by laser irradiation depending on the material of the inorganic substrate.

Next, as shown in fig. 3 (a), the support film 14 is attached to the base material 11 of the wavelength conversion member on the second main surface 11b side. As shown in fig. 4, the support film 14 includes a support layer 14a and an adhesive layer 14b provided on the support layer 14 a.

In the present embodiment, the support layer 14a is formed of a polyethylene film. However, the support layer 14a is not particularly limited, and may be formed of an appropriate resin film. In the present embodiment, the adhesive layer 14b is made of an ultraviolet curable resin. As the ultraviolet curable resin, acrylic resin, epoxy resin, urethane resin, or the like can be used. However, the adhesive layer 14b may be made of other resins, and is not particularly limited. In the present embodiment, the adhesive layer 14b of the support film 14 is attached to the second main surface 11b of the base material 11 of the wavelength conversion member, whereby the support film 14 can be attached to the base material 11 of the wavelength conversion member.

Next, as shown in fig. 3 (b), the adhesive film 17 is attached so as to cover the first main surface 11a of the base material 11 of the wavelength conversion member. In the present embodiment, the adhesive film 17 is attached to the entire first main surface 11 a. In the present invention, the adhesive film 17 may be applied to a part of the first main surface 11a, and is not necessarily applied to the entire first main surface 11 a. However, as described later, from the viewpoint of further suppressing the shape failure of the wavelength conversion member 1, the adhesive film 17 is preferably attached to the entire first main surface 11 a.

In the present embodiment, the area of the support film 14 is larger than the area of the second main surface 11b of the base material 11 of the plate-like member in a plan view. Then, the adhesive film 17 is attached so as to reach the support film 14 from the first main surface 11a of the base material 11 of the wavelength conversion member. Therefore, the adhesive film 17 can be more reliably brought into close contact with the first main surface 11 a.

As shown in fig. 5, the adhesive film 17 is a film having adhesiveness by itself. The adhesive film 17 preferably has an adhesion to an adherend such as a plate-like member of 1g/25mm or more. The value of the adhesion can be measured according to JIS-Z-0237. In the present embodiment, the adhesive film 17 is made of polyvinyl chloride. However, the adhesive film 17 may be made of other resins.

As shown in a modification of fig. 6, the adhesive film 17 may include a base material layer 17a and an adhesive layer 17b laminated on the base material layer 17 a. As the base layer 17a, for example, polyethylene terephthalate, polyvinyl chloride, or the like can be used. The adhesive layer 17b is not particularly limited, and an appropriate adhesive such as an acrylic adhesive or a rubber adhesive can be used, and the adhesive layer 17b may be formed of an ultraviolet curable resin.

In the present embodiment, a self-adhesive film is particularly used as the adhesive film 17. The self-adhesiveness is a property of being adhered to an adherend by the weight of the film without using any other adhesive and without pressing.

The adhesive force of the adhesive film 17 is more preferably 3g/25mm or more, 5g/25mm or more, 7g/25mm or more, 9g/25mm or more, 11g/25mm or more, particularly 13g/25mm or more. In this case, the adhesive film 17 can be brought into close contact with the first main surface 11a more reliably.

The thickness of the adhesive film 17 is preferably 0.01 to 1mm, 0.05 to 0.5mm, and particularly 0.1 to 0.2 mm. If the thickness of the adhesive film 17 is too small, the mechanical strength of the adhesive film 17 is reduced, which may cause damage in the cutting step or insufficient fixation of the base material 11 of the wavelength conversion member. On the other hand, if the thickness of the adhesive film 17 is too large, the cutting accuracy is lowered, and the shape failure of the plate-like member is likely to occur.

However, it is preferable that the adhesion force of the adhesive film 17 is lower than that of the support film 14. In this case, the adhesive film 17 can be more easily peeled off from the first main surface 11a of the base material 11 of the wavelength conversion member.

From the viewpoint of more easily peeling the adhesive film 17 from the first main surface 11a of the base material 11 of the wavelength conversion member, the adhesive force of the adhesive film 17 is preferably 100g/25mm or less, 50g/25m or less, and particularly preferably 30g/25mm or less. When the adhesive film 17 is peeled off from the base material 11 of the wavelength conversion member, it is preferable that no smear is generated on the first main surface 11a of the base material 11 of the wavelength conversion member.

As described above, by attaching the adhesive film 17 so as to cover the first main surface 11a of the base material 11 of the wavelength conversion member, the laminated body 10 serving as an intermediate body in the production of the wavelength conversion member 1 can be obtained.

(cutting Process)

Fig. 7 (a) to 7 (d) are schematic front cross-sectional views for explaining a cutting step in the method for manufacturing a plate-like member according to the embodiment of the present invention.

The cutting process has a first cutting process shown in fig. 7 (a) and 7 (b) and a second cutting process shown in fig. 7 (c) and 7 (d). In the dicing step of the present embodiment, the pressing member 18 and the support body 19 are used. The pressing member 18 has a blade 18a extending linearly in parallel with the first main surface 11a of the base material 11 of the wavelength conversion member. On the other hand, the support body 19 has a slit 19 a.

First, a first cutting process is performed. As shown in fig. 7 (a), the support 19 is disposed so as to be in contact with the adhesive film 17. At this time, the support 19 is disposed so that the slit 19a overlaps the first dividing groove 12a to be cut when viewed from the adhesive film 17 side. On the other hand, a pressing member 18 is disposed at a position facing the first dividing groove 12a to be cut. At this time, the blade 18a of the pressing member 18 and the slit 19a of the support 19 linearly extend in the y direction.

Next, with the support 19 disposed as described above, the base material 11 of the wavelength conversion member is pressed from the support film 14 side by the blade 18a of the pressing member 18. As described above, by sandwiching and pressing the wavelength conversion member base material 11 between the support body 19 and the pressing member 18, as shown in fig. 7 (b), cracks are extended in the thickness direction of the wavelength conversion member base material 11 starting from the first divided grooves 12 a. Thereby, the base material 11 of the wavelength conversion member is cut along the first dividing groove 12 a. In addition, a cut surface 12b is formed at this time.

Next, the pressing member 18 and the support 19 are moved in the x direction, and the base material 11 of the wavelength conversion member is cut along the adjacent first dividing grooves 12 a. By repeating this operation, the base material 11 of the wavelength conversion member is cut along all the first dividing grooves 12a arranged in the x direction.

Subsequently, a second dicing step is performed. As shown in fig. 7 (c), in the second dicing step, the blade 18a of the pressing member 18 and the slit 19a of the support body 19 are arranged to extend linearly in the x direction. By nipping and pressing the base material of the plate-like member by the support body 19 and the pressing member 18 in the same manner as in the first cutting step, as shown in fig. 7 (d), a crack is extended in the thickness direction of the base material 11 of the wavelength conversion member starting from the second dividing groove 13 a. Thereby, the base material 11 of the wavelength conversion member is cut along the second dividing groove 13 a.

Next, the pressing member 18 and the support 19 are moved in the y direction, and the base material 11 of the wavelength conversion member is cut along the adjacent second dividing grooves 13 a. By repeating this operation, the base material 11 of the wavelength conversion member is cut along all the second dividing grooves 13a arranged in the y direction. Thereby, the base material 11 of the wavelength conversion member is singulated into the plurality of wavelength conversion members 1.

Next, the adhesive film 17 is peeled off from the base material 11 of the wavelength conversion member and the support film 14. Then, UV light is irradiated to the support film 14, thereby ultraviolet-curing the adhesive layer 14b of the support film 14. Then, the wavelength conversion member 1 formed into a single piece is peeled from the support film 14. Through the above process, a plurality of wavelength conversion members 1 are obtained.

The present embodiment is characterized by including a cutting step of cutting the base material 11 of the wavelength conversion member along the dividing grooves in a state where the adhesive film 17 is attached to the base material 11 of the wavelength conversion member. This can suppress a defective shape of the wavelength converting member 1 as a plate-like member, and can improve the yield. This will be described below by comparing the present embodiment with a comparative example. The manufacturing method of the comparative example differs from the present embodiment in that the adhesive film 17 is not used.

As a base material of the wavelength conversion member, a phosphor glass master (50 mm. times.50 mm. times.0.2 mm, phosphor concentration 8.3 vol%) in which YAG phosphor powder was dispersed in a borosilicate glass matrix (softening point 850 ℃ C.) was prepared. Using the base material of the wavelength conversion member, 2304 substantially square wavelength conversion members each having a side of about 1mm were produced by the production method of the present embodiment and the production method of the comparative example. In the present embodiment and comparative example, the occurrence rate of defective shape was compared. Here, an example of the shape failure is shown with reference to fig. 8 described below.

Fig. 8 is a schematic plan view showing an example of a defective shape of the wavelength conversion member. Fig. 8 shows a state before the plurality of wavelength conversion members 1 are peeled off from the support film 14. As shown in fig. 8, when viewed from the first main surface 1a side of the wavelength conversion member 1, a portion of the outer peripheral edge of the second main surface 1b protruding outward of the outer peripheral edge of the first main surface 1a is a burr C. The longest distance in the distance between the outer peripheral edge of the first main surface 1a and the outer peripheral edge of the second main surface 1b in the portion of the burr C is defined as a dimension D of the burr. When the burr size D is 20 μm or more, the shape is defective.

When the wavelength conversion member 1 was produced by the production method of the comparative example, the percentage of occurrence of the shape failure was 30%. On the other hand, when the wavelength conversion member was produced by the production method of the present embodiment (a polyvinyl chloride film having a thickness of about 0.12mm and an adhesive strength of 13g/25mm was used as the adhesive film), the percentage of occurrence of shape defects was 0%. As described above, in the present embodiment, it is possible to suppress the shape failure of the wavelength conversion member 1 as the plate-like member, and to improve the yield. This is considered to be for the following reason.

As shown in fig. 9 (a), in the comparative example, the base material 11 of the wavelength conversion member was cut along the first dividing grooves 12a in the same manner as in the present embodiment except that the adhesive film 17 was not used. In the case of the comparative example, in the first cutting step, the pieces (short grid-shaped pieces) of the base material 11 of the wavelength conversion member are pressed against each other on the support 19, and thereby the movement is facilitated, and as shown in fig. 9 (b), the pieces of the base material 11 of the wavelength conversion member may be displaced after cutting. In this case, after the first cutting step, the first main surface 11a is in a state where irregularities are generated. In this state, when the second cutting step is performed, the extending direction of the crack starting from the second dividing groove 13a is likely to be deviated from the thickness direction of the base material 11 of the wavelength conversion member. Thus, in the comparative example, the shape defect due to the burr is likely to occur.

In contrast, in the present embodiment, as shown in fig. 3 (b), the laminate 10 including the support film 14, the base material 11 of the wavelength conversion member, and the adhesive film 17 attached to the support film 14 and the base material 11 of the wavelength conversion member is formed. Then, a first cutting process is performed. As shown in fig. 7 (a), the first cutting step is performed in a state where the adhesive film 17 is adhered to the first main surface 11a of the base material 11 of the wavelength conversion member, and the periphery of the first dividing groove 12a and the periphery of the cut surface 12b can be effectively fixed at the time of cutting. Thus, when the base material 11 of the wavelength conversion member is cut along the first dividing groove 12a to form the cut surface 12b, displacement of a single piece of the base material 11 of the wavelength conversion member is less likely to occur around the cut surface 12 b. This can suppress the occurrence of irregularities on the first main surface 11a of the base material 11 of the wavelength conversion member after the first cutting step.

In the present embodiment, the second cutting step shown in fig. 7 (c) and 7 (d) is performed in a state where almost no unevenness is generated on the first main surface 11a of the base material 11 of the wavelength conversion member. Thus, when the base material 11 of the wavelength conversion member is cut along the second divided grooves 13a, cracks starting from the second divided grooves 13a can be more reliably stretched in the thickness direction of the base material 11 of the wavelength conversion member. Therefore, the occurrence of the shape defect can be effectively suppressed, and the yield can be effectively improved.

Further, in the present embodiment, in the first cutting step and the second cutting step, the first main surface 11a of the base material 11 of the wavelength conversion member is covered with the adhesive film 17. This allows the base material 11 of the wavelength conversion member to be held and pressed between the support 19 and the pressing member 18 without bringing the support 19 into contact with the base material 11 of the wavelength conversion member. Therefore, the first main surface 1a of the wavelength conversion member 1 after singulation is less likely to be damaged.

Therefore, as in the present embodiment, it is preferable that the entire surface of the base material 11 of the wavelength conversion member be covered with the adhesive film 17 in the first cutting step and the second cutting step. This can protect the first main surface 11a more reliably when the base material 11 of the wavelength conversion member is sandwiched and pressed. This makes it more difficult for the first main surface 1a of the wavelength conversion member 1 that has been singulated to be damaged. Further, in the first cutting step, the periphery of the first dividing groove 12a and the periphery of the cut surface 12b can be further fixed. Thus, the displacement of the periphery of the cut surface 12b is less likely to occur in the second cutting step of the base material 11 of the wavelength conversion member. Therefore, the occurrence of the shape failure of the wavelength conversion member 1 as the plate-like member can be further suppressed.

In addition, in the case of using the adhesive film 17 having self-adhesiveness, the portion bonded to the base material 11 of the wavelength conversion member tends to be less movable in the shearing direction (the direction parallel to the first main surface 11a of the base material 11 of the wavelength conversion member). Thus, in the first cutting step, the periphery of the first dividing groove 12a and the periphery of the cut surface 12b can be more reliably fixed. Therefore, the occurrence of the shape failure of the wavelength conversion member 1 as the plate-like member can be more reliably suppressed.

[ laminate ]

As shown in fig. 3 (b), the laminate 10 includes a wavelength conversion member base material 11, a support film 14, and an adhesive film 17. The laminate 10 is an intermediate product in the production of the wavelength conversion member 1. However, the base material 11 of the wavelength conversion member may be a base material of another plate-like member. That is, the intermediate may be used in the production of other plate-like members than the wavelength conversion member 1. Examples of the other plate-like member include a brittle material substrate made of an inorganic material such as a glass plate or a ceramic plate, a plate-like semiconductor element, and the like. In this case, the above-described plate-like member base material may be used instead of the wavelength conversion member base material 11.

The base material 11 of the wavelength conversion member has a rectangular plate shape having a first main surface 11a and a second main surface 11b opposed to each other. The first main surface 11a is provided with first divided grooves 12a and second divided grooves 13 a. The support film 14 is bonded to the second main surface 11 b. The adhesive film 17 is attached so as to cover the first main surface 11 a. In the present embodiment, the adhesive film 17 is attached so as to reach the support film 14 from the first main surface 11 a. However, in the present invention, the adhesive film 17 may be attached to a part of the first main surface 11a, and is not necessarily attached so as to reach the support film 14. In addition, the same support film 14, the base material 11 of the wavelength conversion member, and the adhesive film 17 as those used in the above-described manufacturing method can be used.

When a plurality of plate-like members are manufactured by cutting such a laminated body 10, as described in the above-mentioned section of the manufacturing method, it is possible to effectively suppress the occurrence of a shape failure in the wavelength converting member 1 as the obtained plate-like member, and to effectively improve the yield.

Description of reference numerals

1 … wavelength conversion member

1a … first major surface

1b … second major surface

2 … phosphor particles

3 … inorganic matrix

10 … laminate

11 … base material of wavelength conversion member

11a … first major surface

11b … second major surface

12a … first dividing groove

12b … cut surface

13a … second divided groove

14 … support membrane

14a … supporting layer

14b … adhesive layer

17 … adhesive film

17a … base material layer

17b … adhesive layer

18 … pressing component

18a … blade

19 … support body

19a … slit