阅读说明：本技术 一种难熔高熵合金粉末用粘结剂及其制备方法 (Binder for refractory high-entropy alloy powder and preparation method thereof ) 是由 陈维平 陈凌 丁光信 樊浩仑 于 2019-09-28 设计创作，主要内容包括：本发明公开了一种难熔高熵合金粉末用粘结剂及其制备方法。所述制备方法包括：将磷酸二氢铝、丙烯酸酯、丙二醇丁醚、对羟基苯磺酸、脂肪酸铵盐、抗氧剂和表面活性剂混合均匀,得到所述难熔高熵合金粉末用粘结剂。本发明提供的难熔高熵合金粉末用粘结剂,其组分中加入的磷酸二氢铝在高熵合金粉末粘结成形后可在坯体中形成骨架结构,粘结力好,稳定性高,与丙烯酸酯、丙二醇丁醚、对羟基苯磺酸、脂肪酸铵盐配合经过红外固化后,可以使高熵合金粉末具有较高的强度,同时保持了难熔高熵合金原有的高熔点特性。(The invention discloses a binder for refractory high-entropy alloy powder and a preparation method thereof. The preparation method comprises the following steps: uniformly mixing aluminum dihydrogen phosphate, acrylic ester, propylene glycol butyl ether, p-hydroxyphenylsulfonic acid, fatty acid ammonium salt, an antioxidant and a surfactant to obtain the binder for the refractory high-entropy alloy powder. The aluminum dihydrogen phosphate added into the components of the binder for the refractory high-entropy alloy powder can form a skeleton structure in a blank after the high-entropy alloy powder is bonded and formed, has good bonding force and high stability, and can enable the high-entropy alloy powder to have higher strength and simultaneously keep the original high-melting point characteristic of the refractory high-entropy alloy after being matched with acrylate, propylene glycol butyl ether, p-hydroxybenzene sulfonic acid and fatty acid ammonium salt and subjected to infrared curing.)

1. The preparation method of the binder for the refractory high-entropy alloy powder is characterized by comprising the following steps of: uniformly mixing aluminum dihydrogen phosphate, acrylic ester, propylene glycol butyl ether, p-hydroxyphenylsulfonic acid, fatty acid ammonium salt, an antioxidant and a surfactant to obtain the binder for the refractory high-entropy alloy powder.

2. The preparation method of the binder for the refractory high-entropy alloy powder, according to claim 1, characterized in that the binder for the refractory high-entropy alloy powder comprises the following components in parts by mass:

35-50 parts of aluminum dihydrogen phosphate;

15-30 parts of acrylic ester;

5-10 parts of propylene glycol butyl ether;

1-2 parts of p-hydroxybenzene sulfonic acid;

7-15 parts of fatty acid ammonium salt;

2-6 parts of an antioxidant;

1-4 parts of a surfactant.

3. The method for preparing the binder for the refractory high-entropy alloy powder according to claim 1, wherein the surfactant is one of fatty acid glyceride and betaine fatty acid glyceride.

4. The preparation method of the binder for the refractory high-entropy alloy powder according to claim 1, wherein the antioxidant is benzotriazole.

5. A binder for refractory high-entropy alloy powder produced by the production method according to any one of claims 1 to 4.

Technical Field

The invention relates to the field of binders, and particularly relates to a binder for refractory high-entropy alloy powder and a preparation method thereof.

Background

Powder-bonded sintering technology is an emerging forming technology that has emerged in the 90 s of the 20 th century with many potential advantages as an additive manufacturing technology. The high-entropy alloy is generally composed of more than 4 elements, the content of each element is not less than 5 at.%, but not more than 35 at.%, and the interaction among the various components shows the special performance through the combined action of various main elements. In order to fully exert the effect of high disorder degree in an alloy system and be distinguished from the traditional alloy, the number n of main elements of the high-entropy alloy is generally defined to be more than or equal to 5. High entropy alloys have numerous characteristics: high strength and hardness, good wear resistance, excellent heat and corrosion resistance, and certain magnetic properties. The high-entropy alloy containing Ta, Wu, Mo, V and Zr elements has a high melting point (> 2000 ℃), is difficult to carry out laser cladding, and can be used for producing metal parts with complex shapes and high precision in a large batch by bonding and sintering, so that the manufacturing cost can be greatly reduced. The core technology of the bonding and sintering process is the preparation of a bonding agent, which directly influences the mixing of materials, the injection molding efficiency and the performance of a final product. The wax-based binder is a binder which is widely applied in the early stage of metal powder bonding and forming technology. However, the paraffin wax in the binder must be extracted with an organic solvent such as hexane or heptane, which is toxic and causes environmental problems. In recent years, a mixed-base binder of ethylene glycol monobutyl ether and ethylene glycol is mainly used as a metal binder in the market, but the mixed-base binder is easy to generate a dispersion-diffusion generating reaction in the bonding and sintering process of the high-entropy alloy, and can affect the performance of the high-entropy alloy. The conventional Binder is decomposed too fast in the high-temperature sintering process, so that powder falls off, holes are formed in the sintered material, the performance is deteriorated (Ziaee Mohsen, cane Nathan B, "Binder spinning: A review of processes, materials, and methods", Additive Manufacturing, 28 (2019) 781-one 801), and the powder falls off easily due to the shortage of the Binder.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention aims to provide a binder for refractory high-entropy alloy powder and a preparation method thereof.

The purpose of the invention is realized by at least one of the following technical solutions.

The invention provides a preparation method of a binder for refractory high-entropy alloy powder, which comprises the following steps: uniformly mixing aluminum dihydrogen phosphate, acrylic ester, propylene glycol butyl ether, p-hydroxyphenylsulfonic acid, fatty acid ammonium salt, an antioxidant and a surfactant to obtain the binder for the refractory high-entropy alloy powder.

Further, the binder for the refractory high-entropy alloy powder comprises the following components in parts by weight:

35-50 parts of aluminum dihydrogen phosphate;

15-30 parts of acrylic ester;

5-10 parts of propylene glycol butyl ether;

1-2 parts of p-hydroxybenzene sulfonic acid;

7-15 parts of fatty acid ammonium salt;

2-6 parts of an antioxidant;

1-4 parts of a surfactant.

Preferably, the binder for the refractory high-entropy alloy powder comprises the following components in parts by weight:

35-40 parts of aluminum dihydrogen phosphate;

20-30 parts of acrylic ester;

5-10 parts of propylene glycol butyl ether;

1-2 parts of p-hydroxybenzene sulfonic acid;

7-15 parts of fatty acid ammonium salt;

2-4 parts of an antioxidant;

1-4 parts of a surfactant.

Preferably, the binder for the refractory high-entropy alloy powder comprises the following components in parts by weight:

40-50 parts of aluminum dihydrogen phosphate;

15-25 parts of acrylic ester;

5-10 parts of propylene glycol butyl ether;

1-2 parts of p-hydroxybenzene sulfonic acid;

7-15 parts of fatty acid ammonium salt;

4-6 parts of an antioxidant;

1-4 parts of a surfactant.

Further, the surfactant is one of fatty glyceride and betaine fatty glyceride.

Further, the antioxidant is benzotriazole.

The invention provides a binder for refractory high-entropy alloy powder, which is prepared by the preparation method.

Compared with the prior art, the invention has the following advantages and beneficial effects:

the aluminum dihydrogen phosphate added into the components of the binder for the refractory high-entropy alloy powder can form a skeleton structure in a blank after the high-entropy alloy powder is bonded and formed, has good bonding force and high stability, and can enable the high-entropy alloy powder to have higher strength and simultaneously keep the original high-melting point characteristic of the refractory high-entropy alloy after being matched with acrylate, propylene glycol butyl ether, p-hydroxybenzene sulfonic acid and fatty acid ammonium salt and subjected to infrared curing.

Detailed Description

The following examples are presented to further illustrate the practice of the invention, but the practice and protection of the invention is not limited thereto. It is noted that the processes described below, if not specifically described in detail, are all realizable or understandable by those skilled in the art with reference to the prior art. The reagents or apparatus used are not indicated to the manufacturer, and are considered to be conventional products available by commercial purchase.

The weight (mass) parts used in the following examples and comparative examples may be given by way of example in the form of grams, kilograms, etc., or may be any other amount commonly used in the art.

Example 1

The binder for the refractory high-entropy alloy powder comprises aluminum dihydrogen phosphate, acrylate, propylene glycol butyl ether, p-hydroxybenzene sulfonic acid, fatty acid ammonium salt, benzotriazole and fatty glyceride, and comprises the following components in parts by weight:

45 parts of aluminum dihydrogen phosphate;

20 parts of acrylic ester;

7 parts of propylene glycol butyl ether;

2 parts of p-hydroxybenzene sulfonic acid;

10 parts of fatty acid ammonium salt;

4 parts of benzotriazole;

and 2 parts of fatty glyceride.

The substances are uniformly mixed, and the binder for the refractory high-entropy alloy powder can be obtained.

Example 2

The binder for the refractory high-entropy alloy powder comprises aluminum dihydrogen phosphate, acrylate, propylene glycol butyl ether, p-hydroxybenzene sulfonic acid, fatty acid ammonium salt, benzotriazole and fatty glyceride, and comprises the following components in parts by weight:

40 parts of aluminum dihydrogen phosphate;

25 parts of acrylic ester;

5 parts of propylene glycol butyl ether;

1 part of p-hydroxybenzene sulfonic acid;

12 parts of fatty acid ammonium salt;

5 parts of benzotriazole;

1 part of fatty glyceride.

The substances are uniformly mixed, and the binder for the refractory high-entropy alloy powder can be obtained.

Example 3

The binder for the refractory high-entropy alloy powder comprises aluminum dihydrogen phosphate, acrylate, propylene glycol butyl ether, p-hydroxybenzene sulfonic acid, fatty acid ammonium salt, benzotriazole and fatty glyceride, and comprises the following components in parts by weight:

47 parts of aluminum dihydrogen phosphate;

25 parts of acrylic ester;

8 parts of propylene glycol butyl ether;

2 parts of p-hydroxybenzene sulfonic acid;

11 parts of fatty acid ammonium salt;

5 parts of benzotriazole;

and 3 parts of betaine fatty acid glyceride.

The substances are uniformly mixed, and the binder for the refractory high-entropy alloy powder can be obtained.

The invention has the beneficial effects that: aluminum dihydrogen phosphate added into the binder component can form a skeleton structure in a blank after the high-entropy alloy powder is bonded and formed, has good bonding force and high stability, and can enable the high-entropy alloy powder to have higher strength after being matched with acrylic ester, propylene glycol butyl ether, p-hydroxyphenylsulfonic acid and fatty acid ammonium salt and subjected to infrared curing, and simultaneously keep the original high-melting point characteristic of the refractory high-entropy alloy.

The above examples are only preferred embodiments of the present invention, which are intended to be illustrative and not limiting, and those skilled in the art should understand that they can make various changes, substitutions and alterations without departing from the spirit and scope of the invention.