阅读说明：本技术 一种半导体激光器芯片贴片装置及方法 (Semiconductor laser chip mounting device and method ) 是由 詹敦平 于 2020-06-22 设计创作，主要内容包括：本发明提供一种半导体激光器芯片贴片装置及方法,包括工作台,所述工作台上分别设有加热运行机构、物料槽和贴片运行机构；所述加热运行机构包括设在所述工作台上的第一直线导轨、推进气缸和加热台,所述加热台滑动设在所述第一直线导轨上,所述推进气缸连接并推拉所述加热台,所述加热台上设有加热凹槽,所述加热凹槽内设有标记线；所述贴片运行机构包括设在所述工作台上的第二直线导轨,所述Y轴导轨架滑动设在所述第二直线导轨上,所述Y轴导轨架之间滑动设有Y轴运行架,所述Y轴运行架下设有升降气缸,所述升降气缸升降连接有吸盘架,所述吸盘架上设有所述真空吸头。本发明采用一体化加工平台,提高贴片精度,降低生产升本。(The invention provides a semiconductor laser chip mounting device and a semiconductor laser chip mounting method, which comprise a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the heating platform is arranged on the first linear guide rail in a sliding mode, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism is including establishing second linear guide on the workstation, the Y axle guide rail frame slides and establishes on the second linear guide, it is equipped with Y axle operation frame to slide between the Y axle guide rail frame, Y axle operation frame has the lift cylinder, the lift cylinder goes up and down to be connected with the sucking disc frame, be equipped with on the sucking disc frame vacuum suction head. The invention adopts an integrated processing platform, improves the patch precision and reduces the production cost.)

1. A chip mounting device of a semiconductor laser is characterized by comprising a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the propulsion cylinder is arranged between the first linear guide rail, the heating platform is arranged on the first linear guide rail in a sliding manner, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism comprises a second linear guide rail, a Y-axis guide rail frame and a vacuum suction head, the second linear guide rail, the Y-axis guide rail frame and the vacuum suction head are arranged on the workbench, the Y-axis guide rail frame is arranged on the second linear guide rail in a sliding mode, a Y-axis running frame is arranged between the Y-axis guide rail frames in a sliding mode, a lifting cylinder is arranged below the Y-axis running frame, the lifting cylinder is connected with a suction head frame in a lifting mode, the vacuum suction head is arranged on the suction head frame, the vacuum suction head corresponds to the material groove and the heating groove along with the motion direction of the second linear guide rail, a center mark position is arranged in the material groove, and the center.

2. A semiconductor laser chip mounting device as claimed in claim 1, wherein support plates are respectively disposed on two sides of the heating stage, and support holes are disposed on the support plates, and the support holes are hinged with pinch plates.

3. A semiconductor laser chip mounting device as claimed in claim 1 wherein the first linear guide has two ends provided with a limiting block.

4. A semiconductor laser chip mounting device as claimed in claim 1 wherein said second linear guide is disposed outside of said first linear guide, said Y-axis carriage being movable to traverse over said material slot and said heating stage.

5. A semiconductor laser chip mounting device as claimed in claim 1, wherein said Y-axis rail frame and said Y-axis running frame are respectively connected to an orbiting motor, and said propulsion cylinder, said orbiting motor, said lifting cylinder and said vacuum suction head are controlled by a PLC controller.

6. A method for mounting a semiconductor laser chip mounting device according to claim 1, comprising the steps of:

the vacuum suction head is adopted to sink heat into the material tank, and the position of the solder piece placed by the heat sink corresponds to the central mark position;

the solder sheet and the chip are sequentially sucked and placed on the heat sink center mark position by adopting a vacuum suction head again, then the whole heat sink is sucked up, the Y-axis guide rail frame runs to the position above the heating table on the second linear guide rail, and the vacuum suction head sinks heat in the heating groove;

the heating groove works and is heated until the welding flux is melted, and the vacuum suction head is pressed on the upper surface of the chip to ensure that the chip is attached to the heat sink flatly;

and pulling out the heating table by adopting a propelling cylinder, connecting a nitrogen protection device to blow nitrogen to the heating groove to rapidly cool the solder, and sucking out the heat sink from the heating table by using a vacuum suction head and placing the heat sink on a material table to finish surface mounting.

Technical Field

The invention belongs to the technical field of chip mounting, and particularly relates to a semiconductor laser chip mounting device and method.

Background

The traditional paster is pasted under a microscope by conductive adhesive and tweezers, so that the paster precision is in the range of dozens of micrometers, and the heat dissipation of a chip is not good. The conventional automatic paster system is characterized in that a paster workbench is arranged separately, and elements are not in the same coordinate system in the alignment process due to the fact that the material table and the processing table are arranged separately in the process from the material table to the processing table, so that the paster accuracy is influenced due to unstable factors.

Disclosure of Invention

The invention aims to provide a semiconductor laser chip mounting device and a semiconductor laser chip mounting method, which adopt an integrated processing platform to improve the mounting precision and reduce the production cost.

The invention provides the following technical scheme:

a chip mounting device of a semiconductor laser comprises a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the propulsion cylinder is arranged between the first linear guide rail, the heating platform is arranged on the first linear guide rail in a sliding manner, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism comprises a second linear guide rail, a Y-axis guide rail frame and a vacuum suction head, the second linear guide rail, the Y-axis guide rail frame and the vacuum suction head are arranged on the workbench, the Y-axis guide rail frame is arranged on the second linear guide rail in a sliding mode, a Y-axis running frame is arranged between the Y-axis guide rail frames in a sliding mode, a lifting cylinder is arranged below the Y-axis running frame, the lifting cylinder is connected with a suction head frame in a lifting mode, the vacuum suction head is arranged on the suction head frame, the vacuum suction head corresponds to the material groove and the heating groove along with the motion direction of the second linear guide rail, a center mark position is arranged in the material groove, and the center.

Preferably, support plates are arranged on two sides of the heating table respectively, support holes are formed in the support plates, and buckling plates are hinged to the support holes.

Preferably, two ends of the first linear guide rail are provided with limiting blocks.

Preferably, the second linear guide is arranged at the outer side position of the first linear guide, and the Y-axis running frame can run to cross over the material groove and the heating platform.

Preferably, the Y-axis guide rail frame and the Y-axis running frame are respectively connected with an orbital running motor, and the propulsion cylinder, the orbital running motor, the lifting cylinder and the vacuum suction head are controlled by a PLC (programmable logic controller) to run.

A chip mounting method of a semiconductor laser chip mounting device comprises the following steps:

the vacuum suction head is adopted to sink heat into the material tank, and the position of the solder piece placed by the heat sink corresponds to the central mark position;

the solder sheet and the chip are sequentially sucked and placed on the heat sink center mark position by adopting a vacuum suction head again, then the whole heat sink is sucked up, the Y-axis guide rail frame runs to the position above the heating table on the second linear guide rail, and the vacuum suction head sinks heat in the heating groove;

the heating groove works and is heated until the welding flux is melted, and the vacuum suction head is pressed on the upper surface of the chip to ensure that the chip is attached to the heat sink flatly;

and pulling out the heating table by adopting a propelling cylinder, connecting a nitrogen protection device to blow nitrogen to the heating groove to rapidly cool the solder, and sucking out the heat sink from the heating table by using a vacuum suction head and placing the heat sink on a material table to finish surface mounting.

The invention has the beneficial effects that: the paster workstation adopts integrated design and linear guide design, has improved the paster precision of chip greatly, through mechanical operation structure, accomplishes paster work automatically, reduces artifical manufacturing cost.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present invention;

labeled as: 1. a work table; 2. a heating operation mechanism; 21. propelling the cylinder; 22. a first linear guide rail; 221. a limiting block; 23. a heating stage; 24. heating the groove; 241. marking a line; 25. a bracket hole; 251. buckling the plate; 3. a material groove; 31. a central marker bit; 4. a patch running mechanism; 41. a second linear guide; a Y-axis rail mount; a Y-axis running carriage; 431. a lifting cylinder; 432. a suction cup holder; 44. a vacuum chuck.

Detailed Description

As shown in fig. 1, a semiconductor laser chip mounting device comprises a workbench 1, wherein a heating operation mechanism 2, a material tank 3 and a mounting operation mechanism 4 are respectively arranged on the workbench 1; the heating operation mechanism 2 comprises a first linear guide rail 22, a propulsion cylinder 21 and a heating platform 23 which are arranged on the workbench 1, the propulsion cylinder 21 is arranged between the first linear guide rails 22, the heating platform 23 is arranged on the first linear guide rail 22 in a sliding mode, and two ends of the first linear guide rail 22 are provided with limiting blocks 221 to prevent the heating platform 23 from running out. The propulsion cylinder 21 is connected with and pushes and pulls the heating platform 23, a heating groove 24 is formed in the heating platform 23, a marking line 241 is arranged in the heating groove 24, support plates are respectively arranged on two sides of the heating platform 23, a support hole 25 is formed in each support plate, a buckle plate 251 is hinged to each support hole 25 and used for connecting and arranging a nitrogen protection device, and an air blowing pipe of the nitrogen protection device corresponds to the heating groove to achieve rapid cooling; the patch running mechanism 4 comprises a second linear guide rail 41 arranged on the workbench 1, a Y-axis guide rail frame 42 and a vacuum suction head 44, the Y-axis guide rail frame 42 is arranged on the second linear guide rail 41 in a sliding mode, a Y-axis running frame 43 is arranged between the Y-axis guide rail frames 42 in a sliding mode, the second linear guide rail 41 is arranged at the outer side position of the first linear guide rail 22, and the Y-axis running frame 43 can run to stretch over the material groove 3 and the heating table 23. A lifting cylinder 431 is arranged below the Y-axis running frame 43, the lifting cylinder 431 is connected with a sucker frame 432 in a lifting mode, a vacuum sucker 44 is arranged on the sucker frame 432, the vacuum sucker 44 corresponds to the material groove 3 and the heating groove 24 along with the moving direction of the second linear guide rail 41, a central marking position 31 is arranged in the material groove 3, and the central marking position 31 corresponds to the vacuum suckers 44 one by one. Further, the Y-axis rail mount 42 and the Y-axis moving mount 43 are respectively connected to an orbiting motor, and the propulsion cylinder 21, the orbiting motor, the lift cylinder 431, and the vacuum suction head 44 are controlled by a PLC controller to operate, thereby completing an automatic control process of the patch mounting.

As shown in fig. 1, in the using process of a semiconductor laser chip mounting device, a vacuum suction head 44 is adopted to adjust the position of a chip to be mounted in a material tank 3 according to a central mark position 31, in the adjusting and adsorbing process, a lifting cylinder 431 is used for driving a suction disc rack 432 to move up and down so as to drive the vacuum suction head 44 to work up and down, and the large-distance up-and-down adjustment can be carried out by adopting a Y-axis running rack 43 to move up and down on a Y-axis guide rail rack 42; the adjusted patch raw material is transversely moved into the heating groove 24 through the vacuum suction head 44, and the mark line 241 in the heating groove 24 is convenient for marking the relative position, so that the patch is more accurate; after the patch pressing is completed by the up-and-down operation of the vacuum suction head 44 in the heating groove 24 again, the propulsion cylinder 21 pulls back the heating table 23, and a nitrogen protection device can be connected to quickly cool the patch chip, so that the final patch working is completed.

A chip mounting method of a semiconductor laser chip mounting device comprises the following steps:

the vacuum suction head is adopted to sink heat into the material tank, and the position of the solder piece placed by the heat sink corresponds to the central mark position;

the solder sheet and the chip are sequentially sucked and placed on the heat sink center mark position by adopting a vacuum suction head again, then the whole heat sink is sucked up, the Y-axis guide rail frame runs to the position above the heating table on the second linear guide rail, and the vacuum suction head sinks heat in the heating groove;

the heating groove works and is heated until the welding flux is melted, and the vacuum suction head is pressed on the upper surface of the chip to ensure that the chip is attached to the heat sink flatly;

and pulling out the heating table by adopting a propelling cylinder, connecting a nitrogen protection device to blow nitrogen to the heating groove to rapidly cool the solder, and sucking out the heat sink from the heating table by using a vacuum suction head and placing the heat sink on a material table to finish surface mounting.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.