阅读说明：本技术 一种激光切割方法及激光切割装置 (Laser cutting method and laser cutting device ) 是由 黄舜林 庄昌辉 冯玙璠 王晓光 李志辉 马雪梅 吴智峰 尹建刚 高云峰 于 2018-08-07 设计创作，主要内容包括：本发明公开了一种激光切割方法,属于激光加工技术领域,包括如下步骤：将被切割件放置于切割平台,并保持相对固定；控制激光器发射激光束,所述激光束的波长为8-15μm；将所述激光束向所述被切割件的预设切割线的任一侧区域倾斜,并沿所述预设切割线进行激光切割。本发明技术方案提出了所述被切割件以及作用于所述被切割件上的激光切割方法,使得所述被切割件沿切割线形成大小不一的两侧热影响区域,其中,小面积热影响区域的一侧为所述被切割件要保留的重要部分,将切割影响降至最低,保护了所述被切割件。同时,本发明也公开了一种用以实施所述激光切割方法的激光切割装置。(The invention discloses a laser cutting method, which belongs to the technical field of laser processing and comprises the following steps: placing the cut piece on a cutting platform and keeping the cut piece relatively fixed; controlling a laser to emit laser beams, wherein the wavelength of the laser beams is 8-15 mu m; and inclining the laser beam to any side area of a preset cutting line of the cut piece, and carrying out laser cutting along the preset cutting line. The technical scheme of the invention provides the cut piece and a laser cutting method acting on the cut piece, so that the cut piece forms two heat affected areas with different sizes along a cutting line, wherein one side of the small-area heat affected area is an important part to be reserved for the cut piece, the cutting influence is reduced to the minimum, and the cut piece is protected. Meanwhile, the invention also discloses a laser cutting device for implementing the laser cutting method.)

1. A laser cutting method, comprising the steps of:

placing the cut piece on a cutting platform and keeping the cut piece relatively fixed;

controlling a laser to emit laser beams, wherein the wavelength of the laser beams is 8-15 mu m;

and inclining the laser beam to any side area of a preset cutting line of the cut piece, and carrying out laser cutting along the preset cutting line.

2. The laser cutting method according to claim 1, wherein the step of inclining the laser beam to either side of a preset cutting line of the cut object and performing laser cutting along the preset cutting line specifically comprises:

adjusting the direction of the laser beam to enable the laser beam to incline towards one side area of a preset cutting line of the cut piece;

focusing the laser beam, and applying a focusing point on the preset cutting line;

and the laser beam and the cut piece move relatively, so that the laser beam focus point performs laser cutting along the preset cutting line.

3. The laser cutting method according to claim 1 or 2, wherein when the laser beam performs laser cutting, a back portion of the predetermined cutting line of the cut object is subjected to a cooling process.

4. The laser cutting method according to claim 3, wherein when the laser beam performs laser cutting, the cooling process is performed on the back of the preset cutting line of the cut object, and specifically includes:

and when the laser beam performs laser cutting, cooling air flow is introduced into the air flow channel to cool the back of the preset cutting line of the cut piece.

5. The laser cutting method according to claim 4, wherein the piece to be cut is an OLED display panel and comprises a first structural layer and a second structural layer which are integrally connected; the first structural layer comprises a polyethylene terephthalate material, and the second structural layer comprises a polyimide material; wherein the laser beam laser cuts the first structural layer.

6. A laser cutting device is characterized by comprising a laser, a light path system and a direction adjusting component;

the laser is used for emitting laser beams;

the optical path system guides the laser beam to the direction-adjusting component;

the direction adjusting assembly adjusts the direction of the laser beam, so that the laser beam inclines to one side area of a preset cutting line of the cut piece, and laser beam spots act on the preset cutting line.

7. The laser cutting device according to claim 6, further comprising a cutting platform; the cutting platform is used for placing the cut piece and can rotate and move together with the cut piece, so that the position of the cut piece can be changed.

8. The laser cutting device according to claim 7, wherein the cutting platform has a material placing panel for placing the cut object, and an air flow channel is opened at a position of the material placing panel corresponding to the preset cutting line of the cut object.

9. The laser cutting device according to claim 6, wherein the direction-adjusting component comprises a plane mirror and a focusing mirror; the plane mirror can be arranged in a rotating way and is used for receiving the laser beam emitted by the optical path system and reflecting the laser beam so as to adjust and change the direction of the laser beam; and the focusing lens focuses the laser beam with the changed direction, and a focusing point acts on the preset cutting line.

10. The laser cutting device according to claim 9, further comprising a moving mechanism; the moving mechanism moves the laser beam to enable the laser beam spot to carry out laser cutting along the preset cutting line.

Technical Field

The invention relates to the technical field of laser processing, in particular to a laser cutting method and a laser cutting device for implementing the laser cutting method, and the laser cutting device can be particularly applied to laser cutting operation of a display panel.

Background

In the manufacturing process of the display panel, a whole motherboard is generally cut into a single display panel unit so as to be applicable to product production. In the cutting process, the cutting may cause the areas of the display panel along the two sides of the cutting line to be affected by the cutting operation, which affects the quality of the display panel.

Therefore, how to avoid the cut piece from being influenced by the cutting process or minimize the influence on the cut piece during the cutting process of the cut piece is an important issue to be considered during the cutting process.

Disclosure of Invention

In view of the above, the present invention provides a laser cutting method and a laser cutting apparatus for implementing the laser cutting method, which aims to minimize the influence on a cut piece in the cutting process so as to ensure the quality of a cut product.

In order to solve the above problem, a first aspect of the embodiments of the present invention discloses a laser cutting method, including the following steps:

placing the cut piece on a cutting platform and keeping the cut piece relatively fixed;

controlling a laser to emit laser beams, wherein the wavelength of the laser beams is 8-15 mu m;

and inclining the laser beam to any side area of a preset cutting line of the cut piece, and carrying out laser cutting along the preset cutting line.

Further, the step of inclining the laser beam to any side region of a preset cutting line of the cut piece and performing laser cutting along the preset cutting line specifically includes:

adjusting the direction of the laser beam to enable the laser beam to incline towards one side area of a preset cutting line of the cut piece;

focusing the laser beam, and applying a focusing point on the preset cutting line;

and the laser beam and the cut piece move relatively, so that the laser beam focus point performs laser cutting along the preset cutting line.

Further, when the laser beam performs laser cutting, the back of the preset cutting line of the cut piece is subjected to cooling treatment.

Further, when the laser beam carries out laser cutting, the back of the preset cutting line of the piece to be cut is cooled, and the method specifically comprises the following steps:

and when the laser beam performs laser cutting, cooling air flow is introduced into the air flow channel to cool the back of the preset cutting line of the cut piece.

Furthermore, the cut piece is an OLED display panel and comprises a first structural layer and a second structural layer which are connected into a whole; the first structural layer comprises a polyethylene terephthalate material, and the second structural layer comprises a polyimide material; wherein the laser beam laser cuts the first structural layer.

Meanwhile, the second aspect of the embodiment of the invention also discloses a laser cutting device for implementing the laser cutting method, which comprises a laser, an optical path system and a direction adjusting component;

the laser is used for emitting laser beams;

the optical path system guides the laser beam to the direction-adjusting component;

the direction adjusting assembly adjusts the direction of the laser beam, so that the laser beam inclines to one side area of a preset cutting line of the cut piece, and laser beam spots act on the preset cutting line.

Further, the laser cutting device also comprises a cutting platform; the cutting platform is used for placing the cut piece and can rotate and move together with the cut piece, so that the position of the cut piece can be changed.

Furthermore, the cutting platform is provided with a material placing panel for placing the cut piece, and an airflow channel is arranged at the position of the material placing panel corresponding to the preset cutting line of the cut piece.

Further, the direction adjusting component comprises a plane reflecting mirror and a focusing mirror; the plane mirror can be arranged in a rotating way and is used for receiving the laser beam emitted by the optical path system and reflecting the laser beam so as to adjust and change the direction of the laser beam; and the focusing lens focuses the laser beam with the changed direction, and a focusing point acts on the preset cutting line.

Further, the laser cutting device also comprises a moving mechanism; the moving mechanism moves the laser beam to enable the laser beam spot to carry out laser cutting along the preset cutting line.

In the step of selecting the laser in the technical scheme of the invention, the wavelength of the laser beam emitted by the laser is 8-15 μm, the laser beam belongs to an infrared band, and the laser beam in the band has strong thermal effect and can be applied to laser cutting operation.

The laser cutting method comprises the steps of inclining the laser beam to one side area of a preset cutting line of the cut piece and carrying out laser cutting along the preset cutting line, so that a first heat affected zone and a second heat affected zone are formed on the cut piece along two sides of the cutting line.

During the cutting process, the cut piece is divided into two side areas by the cutting line, one side of which has a first heat affected zone, which is an important part that needs to be retained or further processed to yield the actual product, and the other side of which has a second heat affected zone, which is a non-important part that can be discarded. Therefore, during the processing of the cut piece, the important cut piece part is far away from the laser beam, the area of the heat affected zone is small, while the unimportant cut piece part is influenced by the obliquely arranged laser beam to cause a larger heat affected zone, and the heat affected zone of the important part is reduced, so that the quality of a cut product is ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the structures shown in the drawings without inventive labor.

FIG. 1 is a schematic structural diagram of a cut object according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a laser cutting method according to an embodiment of the present invention;

FIG. 3 is a flow chart of a laser cutting method according to an embodiment of the present invention;

FIG. 4 is a detailed diagram of step S30 in FIG. 3;

fig. 5 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention.

Wherein the main reference signs illustrate:

to-be-cut member 10	First structural layer 11	First heat-affected zone 111
			Second heat-affected zone 112	The predetermined cut line 113	Second structural layer 12
Base layer 13	Laser 20	Laser beam 21
			Optical path system 30	Beam expander 31	Mirror 32
Direction-adjusting assembly 40	Plane mirror 41	Focusing mirror 42
			Cutting platform 50	Material placing panel 51	Airflow passage 511

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

Referring to fig. 1-5, fig. 1 is a schematic structural diagram of a cut object according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a laser cutting method according to an embodiment of the present invention; FIG. 3 is a flow chart of a laser cutting method according to an embodiment of the present invention; FIG. 4 is a detailed diagram of step S30 in FIG. 3; fig. 5 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention. The embodiment of the invention provides a piece to be cut 10 and a laser cutting method acting on the piece to be cut 10, so that the piece to be cut 10 forms two side heat affected zones with different sizes along a cutting line, wherein one side of the small area heat affected zone is an important part to be reserved on the piece to be cut 10.

The first aspect of the embodiment of the present invention discloses a laser cutting method, as shown in fig. 1 to 5, including the following steps:

step S10, placing the cut piece 10 on the cutting platform 50 and keeping the relative fixation;

step S20, controlling the laser 20 to emit a laser beam 21, wherein the wavelength of the laser beam 21 is 8-15 μm;

step S30, tilting the laser beam 21 to either side of the preset cutting line 113 of the piece to be cut 10, and performing laser cutting along the preset cutting line 113.

In the present embodiment, as shown in fig. 1, the cut object 10 is an Organic Light-Emitting Diode (OLED) display panel, and includes a two-layer structure integrally connected together: a first structural layer 11 and a second structural layer 12. The first structural layer 11 comprises a Polyethylene Terephthalate (PET) material, and may typically have a thickness of 100 and 150 μm. The second structural layer 12 comprises a Polyimide (PI) material, and may have a thickness of 20 μm. The polyimide material layer of the second structure layer 12 has a functional circuit and is an important functional area of the OLED display panel, and the polyethylene terephthalate material layer of the first structure layer 11 is a protective layer for packaging and protecting the functional circuit and the light-transmitting display in the second structure layer 12. The cut piece 10 further includes a base layer 13, and the base layer 13 is an encapsulating glass layer and may have a thickness of generally 500 μm. The second structural layer 12 is bonded to the base layer 13 on the other side of the first structural layer 11, so that the second structural layer 12 is in an intermediate layer state, and the functional circuit in the second structural layer 12 is in an encapsulation protection state.

The cut object 10 is placed on the cutting platform 50, and the cut object 10 and the cutting platform 50 are kept relatively fixed. In this embodiment, the cutting platform 50 has a material placing panel 51 for placing the piece to be cut 10. The material placing panel 51 is a vacuum adsorption plate, and the cut object 10 is adsorbed and fixed on the material placing panel 51 by the vacuum condition of the material placing panel 51.

As shown in fig. 2, when the workpiece 10 is subjected to laser cutting, the laser beam 21 performs laser cutting on the polyethylene terephthalate material layer of the first structural layer 11, so that the connection terminals of the functional circuit in the second structural layer 12 are exposed to be electrically connected to an external circuit. Obviously, the laser beam 21 performs laser cutting along a preset cutting line 113, a cutting line is formed on the first structural layer 11, and a first heat affected zone 111 and a second heat affected zone 112 are formed along two sides of the cutting line.

As shown in fig. 2, the first heat-affected zone 111 is located in a significant portion of the cut piece 10, which still includes the primary functional circuit, and this portion of the cut piece 10 needs to be preserved and used for further processing, while the second heat-affected zone 112 is located in a minor portion of the cut piece 10, and this portion of the cut piece 10 having the second affected zone can tear the first structural layer 11 to enable the connection terminals of the functional circuit in the second structural layer 12 to be exposed.

In order to ensure that the first structural layer 11 is cut off at one time and the area of the first heat affected zone 111 is minimized to ensure the quality of a cut product, the embodiment of the invention adopts the following cutting processing steps: a laser 20 is selected, and the laser beam 21 emitted by the laser 20 has a wavelength of 8-15 μm and belongs to the infrared band. The laser beam 21 is inclined towards one side area of the preset cutting line 113 of the cut piece 10, and laser cutting is carried out along the preset cutting line 113.

Specifically, as shown in FIG. 2, the laser 21 emitted from the laser 20 has a wavelength of 8-15 μm, and the laser 21 is inclined toward the second heat-affected zone 112 on the side of the predetermined cutting line 113 of the piece 10 to be cut. The area of the work piece 10 near the infrared band laser beam 21 is affected by a large thermal effect to form a second heat-affected zone 112 having a large area, and the area of the work piece 10 far from the infrared band laser beam 21 is affected by a small thermal effect to form a first heat-affected zone 111 having a small area, thereby reducing the thermal effect of the laser beam 21 on the work piece 10 on the side of the first heat-affected zone 111.

The use of the laser beam 21 in the infrared band enables the first structural layer 11 in the cut piece 10 to be cut efficiently at one time while avoiding the influence on the second structural layer 12. The thermal effect of the laser beam 21 in the infrared band is strong, the cutting trace is large, and it is not only beneficial to laser cutting the first structural layer 11, but also to form the first heat affected zone 111 and the second heat affected zone 112 on the first structural layer 11. In order to protect one side region having a main function circuit, a cutting processing manner of obliquely entering the laser beam 21 is adopted, so that the first heat affected zone 111 in one side region having the main function circuit is a small area region, and the second heat affected zone 112 in the other side region is a large area region, thereby achieving the effect of protecting the main function circuit, reducing the influence on the cut piece 10 during the cutting processing, and ensuring the quality of a cut product.

Particularly, one side of the second heat affected zone 112 having a large area can be treated as a waste material, and the connection terminal of the functional circuit in the second structural layer 12 can be exposed by tearing off the area, so as to electrically connect the functional circuit with an external circuit, thereby ensuring the quality of the cut product and achieving the purpose of cutting and processing the product.

Further, in this embodiment, as shown in fig. 4 and step S30, the step of inclining the laser beam 21 to either side of the preset cutting line 113 of the piece to be cut 10 and performing laser cutting along the preset cutting line 113 specifically includes:

step S301, adjusting the direction of the laser beam 21 to enable the laser beam 21 to incline towards one side area of a preset cutting line 113 of the cut piece 10;

step S302, focusing the laser beam 21 and applying a focusing point on the preset cutting line 113;

step S303, the laser beam 21 and the cut object 10 move relatively, so that the focusing point of the laser beam 21 performs laser cutting along the preset cutting line 113.

The laser beam 21 is focused, and a focusing point is acted on the preset cutting line 113, and a laser beam 21 spot with high energy density can act on the preset cutting line 13 of the cut piece 10 to perform laser cutting. The smaller the focused light spot is, the higher the energy density is, and the better the processing effect is.

Further, in the present embodiment, when the laser beam 21 performs laser cutting, the back of the preset cutting line 13 of the piece to be cut 10 is subjected to a cooling process.

During the laser cutting process, the laser beam 21 melts or vaporizes the predetermined cutting line 113, and the cut object 10 is cut, and at the same time, the edge of the cutting mark is also affected by heat, so that the laser cutting process affects the final product. Therefore, the back of the preset cutting line 113 of the cut object 10 is subjected to cooling treatment, so that the heat of the laser beam 21 can be absorbed in time in one direction, and the cut object 10 is prevented from being greatly influenced by heat; on the other hand, the mode of adopting the back cooling is easy to realize, and the equipment structure is simple and convenient.

Further, in this embodiment, when the laser beam 21 performs laser cutting, the cooling process is performed on the back of the preset cutting line 13 of the piece to be cut 10, which specifically includes: an airflow channel 511 is formed at a position of the cutting platform 50 corresponding to the preset cutting line 13, and when the laser beam 21 performs laser cutting, cooling airflow is introduced into the airflow channel 511 to cool the back of the preset cutting line 13 of the cut object 10.

In this embodiment, the cutting platform 50 has a material placing panel 51, and the material placing panel 51 is used for placing the cut piece 10. An air flow channel 511 is formed at a position of the material placing panel 51 corresponding to the preset cutting line 113, and in the laser cutting process, cooling air is continuously introduced into the air flow channel 511, so that heat of the laser beam 21 acting on the cut piece 10 is taken away, and the heat influence on the cut piece 10 is reduced to the minimum. Alternatively, the air flow passage 511 is larger than the cutting trace to effectively remove the heat applied by the laser beam 21.

Further, in order to obtain a better cooling effect, the cooling gas may be a low-temperature gas. Of course, the temperature of the cooling gas may be selected according to the particular laser cutting process in order to most effectively remove the heat applied by the laser beam 21 while also ensuring that the workpiece 10 is not damaged by the low temperature gas.

A second aspect of the embodiments of the present invention provides a laser cutting apparatus for implementing the laser cutting method proposed in the first aspect, with reference to fig. 1 to 5, specifically including: laser 20, optical path system 30 and steering component 40.

The laser 20 is used to emit a laser beam 21. The optical path system 30 directs the laser beam 21 to the steering assembly 40. The direction adjusting component 40 adjusts the direction of the laser beam 21, so that the laser beam 21 is inclined to an area on one side of a preset cutting line 113 of the piece to be cut 10, and a light spot of the laser beam 21 is applied to the preset cutting line 113.

Specifically, the laser 20 may employ a carbon dioxide laser, which has a typical wavelength of 9.3 μm, 9.4 μm, 9.6 μm, or 10.6 μm. Of course, the present invention may adopt other forms of laser, and optionally, the laser beam 21 emitted by the laser 20 has a wavelength of 8-15 μm, and belongs to the infrared band.

In the present embodiment, as shown in fig. 5, the optical path system 30 employs optical components so that the laser beam 21 emitted from the laser 20 can be guided to the direction-adjusting component 40. Optionally, the optical path system 30 includes a beam expander 31, and the beam expander 31 can expand and collimate the laser beam 21 emitted from the laser 20, so that the optical path can be focused to obtain a smaller spot, so as to act on the preset cutting line 113 of the piece to be cut 10. Of course, it should be understood by those skilled in the art that the optical path system 30 further includes an optical fiber, and the optical fiber can transmit the laser beam 21 emitted from the laser 20 to other components in the optical path system 30, such as the beam expander 31, so as to realize the transmission of the laser beam 21.

The optical path system 30 further includes a mirror 32, and the mirror 32 can change the path of the laser beam 21 emitted from the beam expander 31. It should be understood by those skilled in the art that a plurality of lenses or mirrors may be added to the optical path system 30 in order to obtain a better path of the laser beam 21.

The optical path system 30 not only has the function of guiding the laser beam 21, but also shapes the laser beam 21 in the optical path of the laser beam 21, so that good properties of the laser beam 21 can be obtained, and the laser beam 21 is ensured to be propagated, collimated and stable.

In the present embodiment, as shown in fig. 5, the direction adjustment component 40 is used to adjust the direction of the laser beam 21 emitted from the optical path system 30. Optionally, the steering assembly 40 comprises a plane mirror 41. The plane mirror 41 is rotatably disposed and configured to receive the laser beam 21 emitted from the optical path system 30 and reflect the laser beam. The plane mirror 41 is rotationally adjusted, and the direction of the laser beam 21 reflected by the plane mirror 41 is changed, thereby realizing direction adjustment. The redirected laser beam 21 may be tilted toward a region of the cut object 10 on one side of the predetermined cut line 113, and a spot of the laser beam 21 may be applied to the predetermined cut line 113.

The plane mirror 41 can change the direction of the laser beam 21 to a larger degree, the plane mirror 41 is rotated to adjust a small angle, the laser beam 21 can change along with the larger direction, and the adjustment of the direction of the laser beam 21 is sensitive and convenient.

In another embodiment, the steering assembly 40 includes a plurality of plane mirrors 41. A plurality of plane mirrors 41 are combined to make the direction adjustment of the laser beam 21 more convenient and flexible. Of course, in another embodiment, the direction-adjusting component 40 may further include one or more lenses, and the lenses may not only be used for changing the optical path direction of the laser beam 21, but also may shape the laser beam 21 to make the laser beam 21 propagate in a collimated and stable manner.

Further, in the present embodiment, as shown in fig. 5, the direction-adjusting assembly 40 further includes a focusing mirror 42. The laser beam 21 emitted through the plane mirror 41 is focused by the focusing mirror 42, and a focusing point is applied to the preset cutting line 113. The laser beam 21 is focused, so that the laser beam 21 has small light spot, high energy density and small cutting trace, the extra influence on the cut piece 10 is low, and the quality of a cut product is ensured.

Further, in this embodiment, the laser cutting apparatus further includes a moving mechanism (not shown). The moving mechanism is used for moving the laser beam 21 so as to enable the laser beam 21 to perform laser cutting along the preset cutting line 113.

When the direction adjusting assembly 40 adjusts the direction of the laser beam 21 so that the laser beam 21 is inclined toward the area on one side of the preset cutting line 113 of the piece to be cut 10, the moving mechanism moves the laser beam 21 in parallel so that the laser beam 21 performs laser cutting along the preset cutting line 113.

In particular, the moving mechanism rotates and moves the optical path system 30 and the part of the hardware devices in the direction-adjusting assembly 40 together to adjust the direction of the laser beam 21, so that the direction of the laser beam 21 can be adjusted quickly, and a large inclination adjustment range can be obtained, so that the laser beam 21 is inclined along the area on the side of the preset cutting line 113 of the piece to be cut 10.

Further, in the present embodiment, as shown in fig. 5, the laser cutting apparatus further includes a cutting platform 50. The cutting platform 50 is used for placing the piece to be cut 10 and keeping the piece to be cut 10 relatively fixed. Specifically, the cutting platform 50 has a material placing panel 51 for placing the cut object 10. Optionally, the material placing panel 51 is internally provided with a vacuum chamber communicated with a vacuum generator, and one surface of the material placing panel 51 for placing the cut piece 10 is provided with a fine hole communicated with the vacuum chamber. The vacuum generator can make the vacuum chamber in a vacuum state, and the cut piece 10 is adsorbed and fixed on the material placing panel 51 under the action of the external atmospheric pressure and the air pressure difference of the vacuum chamber.

Furthermore, the material placing panel 51 has a matching groove (not shown) corresponding to the outer contour of the cut object 10. When the cut piece 10 is placed in the fitting groove, the cut piece 10 is fitted with the fitting groove, so that the cut piece 10 and the material placing panel 51 are kept relatively fixed.

Further, an air flow channel 511 is disposed at a position of the material placing panel 51 corresponding to the preset cutting line 113 of the cut object 10. The gas flow path 511 is introduced with a cooling gas to cool the back of the predetermined cutting line 113 of the workpiece 10. During the laser cutting process, the laser beam 21 melts or vaporizes the predetermined cutting line 113, and the cut object 10 is cut, and at the same time, the edge of the cutting mark is also affected by heat, so that the laser cutting process affects the final product. Therefore, the back of the preset cutting line 113 of the cut object 10 is subjected to cooling treatment, so that the heat of the laser beam 21 can be absorbed in time in one direction, and the cut object 10 is prevented from being greatly influenced by heat; on the other hand, the mode of adopting the back cooling is easy to realize, and the equipment structure is simple and convenient.

Further, in order to obtain a better cooling effect, the cooling gas may be a low-temperature gas. Of course, the temperature of the cooling gas may be selected according to the particular laser cutting process in order to most effectively remove the heat applied by the laser beam 21 while also ensuring that the workpiece 10 is not damaged by the low temperature gas.

Further, in another embodiment, a cooling material is attached to the back of the predetermined cutting line 113 of the cut object 10. The cooling material neutralizes the high heat of the laser beam 21 in a low temperature manner, so as to avoid the high heat from impacting the cut piece 10 and protect the main part of the cut piece 10. In addition, the temperature reducing material can also be a material which is vaporized by heating. The cooling material is heated to vaporize and take away a large amount of heat, can effectively play a cooling role, protect by cutting member 10, avoid being heated the influence and cause the quality damage.

Optionally, the cutting platform 50 is rotationally movable with the piece 10 to enable the position of the piece 10 to be changed. Under the condition that the laser 20, the optical path system 30 and the direction adjusting component 40 are not moved, the cutting platform 50 is moved to change the position of the cut object 10, so as to achieve the purpose of adjusting the direction of the laser beam 21, so that the laser beam 21 is inclined towards the area on one side of the preset cutting line 113 of the cut object 10, and the light spot of the laser beam 21 is applied to the preset cutting line 113.

With continuing reference to fig. 1-5, an embodiment of the present invention provides a specific laser cutting process, as follows:

an OLED display panel is used as the cut object 10, and the laser beam 21 is applied to the first structural layer 11.

And placing the cut piece 10 on a material placing panel 51 of the cutting platform 50, wherein the material placing panel 51 is a vacuum adsorption plate. The cut object 10 is fixed to the material placing panel 51 by being sucked by the vacuum condition of the material placing panel 51. In addition, an airflow channel 511 is added in advance at the position of the material placing panel 51 corresponding to the preset cutting line 113 for introducing cooling gas.

A carbon dioxide laser 20 is selected, which carbon dioxide laser 20 outputs a laser beam 21 having a wavelength of 9.4 μm.

The direction of the laser beam 21 is adjusted. Specifically, the light path is adjusted by the plane mirror 41 in the direction-adjusting assembly 40, so that the laser beam 21 is inclined to a side region of the preset cutting line 113 of the cut object 10, and the laser beam 21 is applied to the preset cutting line 113 in a light spot manner. In the process of adjusting the direction, the adjustment can be performed in a manner of moving the optical path system 30 and part of the hardware devices of the direction adjusting component 40, or in a manner of rotationally moving the cutting platform 50, so that the adjustment of the direction of the laser beam 21 can be conveniently and flexibly achieved.

When the laser beam 21 is inclined toward one side region of the preset cut line 113 of the cut object 10, the laser beam 21 is moved in parallel to enable the laser beam 21 to perform laser cutting along the preset cut line 113. The laser beam 21 is moved in parallel, the thermal effect of the laser beam 21 is dispersed, and the phenomenon that the laser beam 21 acts on a certain local area for a long time, so that the heat dissipation of the certain local area is insufficient, and the thermal effect is obviously increased is avoided.

In summary, the wavelength of the laser beam 21 emitted by the laser 20 in the embodiment of the present invention is 8-15 μm, and belongs to the infrared band, and the laser beam 21 in this band has a strong thermal effect, and can be applied to laser cutting operation.

Of course, although the thermal effect of the laser beam 21 in this wavelength band can be applied to the laser cutting work, there is a disadvantage in the cutting process. Since the laser beam 21 has a strong thermal effect, the non-cutting material areas on both sides of the cutting line are also affected by heat, forming the first heat affected zone 111 and the second heat affected zone 112 (fig. 2).

The laser beam 21 is inclined towards the preset cutting line 113 side of the cut object 10, and the cutting processing mode of laser cutting is performed along the preset cutting line 113, so that the sizes of the first heat affected zone 111 and the second heat affected zone 112 on two sides of the cutting line are different, specifically, the area of the laser beam 21 inclined towards the preset cutting line 113 side of the cut object 10 is a large heat affected zone, and the other heat affected zone is a small heat affected zone.

During the cutting process, the cut line divides the piece 10 into two side regions, one side of which has a first heat-affected zone 111, which is a critical part that needs to be retained or further processed to yield the actual product, and the other side of which has a second heat-affected zone 112, which is a non-critical part that can be discarded. Therefore, during the processing of the cut piece 10, the important part of the cut piece 10 is far away from the laser beam 21, the heat affected zone area is small, while the unimportant part of the cut piece 10 is affected by the obliquely arranged laser beam 21 to cause a large heat affected zone, and the heat affected of the important part is reduced, so that the quality of a cut product is ensured.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.