阅读说明：本技术 一种半导体激光器及其制备方法 (Semiconductor laser and preparation method thereof ) 是由 贾鹏 梁磊 陈泳屹 秦莉 宁永强 *** 于 2019-11-29 设计创作，主要内容包括：本发明公开了一种半导体激光器,传输层背向衬底一侧表面刻蚀有窄条形波导,沿窄条形波导轴线的一端设置有第一布拉格光栅,窄条形波导轴线的另一端设置有第二布拉格光栅,第一布拉格光栅中凸起处的折射率小于第二布拉格光栅中凸起处的折射率,第一布拉格光栅中凹陷处的折射率小于第二布拉格光栅中凹陷处的折射率；第一布拉格光栅的反射光谱与第二布拉格光栅的反射光谱在预设波长处重叠。上述半导体激光器输出的激光可以获得类似游标效应的反射光谱叠加,实现超窄化反射光谱,降低器件光谱线宽,实现高功率的窄线宽激光。本发明还提供了一种制备方法,同样具有上述有益效果。(The invention discloses a semiconductor laser, wherein a narrow strip-shaped waveguide is etched on the surface of one side of a transmission layer, which is back to a substrate, a first Bragg grating is arranged at one end along the axis of the narrow strip-shaped waveguide, a second Bragg grating is arranged at the other end of the axis of the narrow strip-shaped waveguide, the refractive index of a convex part in the first Bragg grating is smaller than that of a convex part in the second Bragg grating, and the refractive index of a concave part in the first Bragg grating is smaller than that of a concave part in the second Bragg grating; the reflection spectrum of the first bragg grating overlaps the reflection spectrum of the second bragg grating at a predetermined wavelength. The laser output by the semiconductor laser can obtain the reflection spectrum superposition similar to vernier effect, realize ultra-narrow reflection spectrum, reduce the spectral line width of the device and realize high-power narrow line width laser. The invention also provides a preparation method, and the preparation method also has the beneficial effects.)

1. A semiconductor laser is characterized by comprising a substrate, a transmission layer, a first electrode and a second electrode;

the transmission layer is positioned on the surface of the substrate, a narrow strip waveguide is etched on the surface of one side, back to the substrate, of the transmission layer, a first Bragg grating is arranged at one end along the axis of the narrow strip waveguide, a second Bragg grating is arranged at the other end along the axis of the narrow strip waveguide, the refractive index of a protrusion in the first Bragg grating is smaller than that of a protrusion in the second Bragg grating, and the refractive index of a recess in the first Bragg grating is smaller than that of a recess in the second Bragg grating; the reflection spectrum of the first Bragg grating is overlapped with the reflection spectrum of the second Bragg grating at a preset wavelength;

the first electrode is positioned on the surface of one side of the substrate, which is back to the transmission layer, and the second electrode is positioned on the surface of one side of the narrow strip-shaped waveguide, which is back to the substrate.

2. A semiconductor laser as claimed in claim 1 wherein the width of the overlap of the reflection spectrum of the first bragg grating with the reflection spectrum of the second bragg grating ranges from 0.2nm to 0.4nm, inclusive.

3. A semiconductor laser as claimed in claim 2 wherein the difference between the central reflection wavelength of the reflection spectrum of the first bragg grating and the central reflection wavelength of the reflection spectrum of the second bragg grating ranges from 0.1nm to 0.3nm, inclusive.

4. A semiconductor laser as claimed in claim 1 wherein the distance between the top of the protrusion in the first bragg grating and the top of the strip waveguide is greater than the distance between the top of the protrusion in the second bragg grating and the top of the strip waveguide; the distance between the bottom of the recess in the first Bragg grating and the top of the narrow strip-shaped waveguide is greater than the distance between the bottom of the recess in the second Bragg grating and the top of the narrow strip-shaped waveguide.

5. The semiconductor laser of claim 4, wherein the substrate is an n-type substrate; the transport layer includes:

an n-type cladding layer on the surface of the substrate;

the n-type waveguide layer is positioned on the surface of one side, back to the substrate, of the n-type cladding layer;

the active layer is positioned on the surface of one side, back to the substrate, of the n-type waveguide layer;

the p-type waveguide layer is positioned on the surface of one side, back to the substrate, of the active layer;

the p-type cladding layer is positioned on the surface of one side, back to the substrate, of the p-type waveguide layer;

and the cover layer is positioned on the surface of the p-type cladding layer, which faces away from the substrate.

6. The semiconductor laser interference array of claim 5 wherein the raised top portion of the first Bragg grating is located in the p-type cladding layer or the p-type waveguide layer and the recessed bottom portion of the first Bragg grating is located in the p-type waveguide layer; the top of the protrusion in the second Bragg grating is positioned on the cover layer, and the bottom of the recess in the second Bragg grating is positioned on the p-type waveguide layer.

7. A semiconductor laser as claimed in any one of claims 1 to 6 wherein said narrow stripe waveguide comprises first and second narrow stripe shaped waveguide segments, said first narrow stripe shaped waveguide segment having a smaller width than said second narrow stripe shaped waveguide segment, said first and second narrow stripe shaped waveguide segments being alternately disposed along an axis of said narrow stripe waveguide;

the second electrode is located on the surface of the first narrow strip waveguide segment, which faces away from the substrate, and the surface of the second narrow strip waveguide segment, which faces away from the substrate.

8. A method for fabricating a semiconductor laser, comprising:

epitaxially growing a transmission layer on the surface of the substrate;

etching a narrow strip-shaped waveguide, a first Bragg grating and a second Bragg grating on the surface of one side, back to the substrate, of the transmission layer; the first Bragg grating is positioned at one end of the narrow strip-shaped waveguide along the axial line, the second Bragg grating is positioned at the other end of the narrow strip-shaped waveguide along the axial line, the refractive index of a protrusion in the first Bragg grating is smaller than that of a protrusion in the second Bragg grating, and the refractive index of a recess in the first Bragg grating is smaller than that of a recess in the second Bragg grating; the reflection spectrum of the first Bragg grating is overlapped with the reflection spectrum of the second Bragg grating at a preset wavelength;

and arranging a first electrode on the surface of one side of the substrate, which is back to the transmission layer, and arranging a second electrode on the surface of one side of the narrow strip-shaped waveguide, which is back to the substrate, so as to manufacture the semiconductor laser.

9. The method of claim 8, wherein etching the narrow strip waveguide, the first bragg grating, and the second bragg grating on the surface of the transmission layer on the side opposite to the substrate comprises:

etching a region, corresponding to the first Bragg grating, in the surface of one side, back to the substrate, of the transmission layer to a preset depth;

etching the transmission layer at the preset depth to form the first Bragg grating;

etching a region, corresponding to the second Bragg grating, in the surface of one side, back to the substrate, of the transmission layer to form the second Bragg grating;

etching a region, corresponding to the narrow strip-shaped waveguide, in the surface of one side, back to the substrate, of the transmission layer to form the narrow strip-shaped waveguide; the distance between the top of the bulge in the first Bragg grating and the narrow strip-shaped waveguide is greater than the distance between the top of the bulge in the second Bragg grating and the narrow strip-shaped waveguide; the distance between the bottom of the recess in the first Bragg grating and the narrow strip-shaped waveguide is greater than the distance between the bottom of the recess in the second Bragg grating and the narrow strip-shaped waveguide.

10. The method of claim 8, further comprising, after etching the narrow strip waveguide from a surface of the transmission layer facing away from the substrate:

etching a first narrow strip-shaped waveguide segment and a second narrow strip-shaped waveguide segment on the surface of one side, back to the substrate, of the transmission layer; the first narrow-strip waveguide segment has a smaller width than the second narrow-strip waveguide segment, and the first narrow-strip waveguide segment and the second narrow-strip waveguide segment are alternately arranged along the axis of the narrow strip waveguide;

the step of arranging a second electrode on the surface of the narrow strip-shaped waveguide on the side opposite to the substrate comprises the following steps:

and second electrodes are arranged on the surface of the first narrow-strip waveguide segment, which faces away from the substrate, and the surface of the second narrow-strip waveguide segment, which faces away from the substrate.

Technical Field

The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser and a preparation method of the semiconductor laser.

Background

The semiconductor laser is a laser using a semiconductor material as a gain medium, and has the advantages of small size, high efficiency, long service life, easy integration and the like. The narrow linewidth semiconductor laser has the advantages of narrow spectral linewidth, high output power and the like, can be used as an ideal pumping source of doped optical fibers and alkali metal atomic gas with narrow absorption spectrum characteristics, and has wide application prospects in the aspects of optical communication, ocean detection, space communication, atomic clock pumping and the like.

Existing single chip narrow linewidth semiconductor lasers typically include Distributed Feedback (DFB) lasers, as well as ridge DBR lasers, although great progress has been made in increasing output power and reducing spectral linewidth. However, the preparation of the grating structure of the distributed feedback semiconductor laser (DFB) generally requires secondary epitaxy or electron beam lithography and other technologies, resulting in high chip preparation cost and low yield; the ridge DBR generally adopts a ridge (with the width of 2-5 microns) waveguide structure to inhibit a high-order side mode and reduce the line width of laser, so that the saturated output power of the ridge DBR is low, and narrow-line-width laser with high power cannot be realized.

In view of this, those skilled in the art need to solve the problem of how to realize high-power and narrow-linewidth semiconductor laser output.

Disclosure of Invention

The invention aims to provide a semiconductor laser, which has high-power and narrow-linewidth semiconductor laser output; another objective of the present invention is to provide a method for fabricating a semiconductor laser, which has high power and narrow linewidth semiconductor laser output.

In order to solve the above technical problem, the present invention provides a semiconductor laser, including a substrate, a transmission layer, a first electrode and a second electrode;

the transmission layer is positioned on the surface of the substrate, a narrow strip waveguide is etched on the surface of one side, back to the substrate, of the transmission layer, a first Bragg grating is arranged at one end along the axis of the narrow strip waveguide, a second Bragg grating is arranged at the other end along the axis of the narrow strip waveguide, the refractive index of a protrusion in the first Bragg grating is smaller than that of a protrusion in the second Bragg grating, and the refractive index of a recess in the first Bragg grating is smaller than that of a recess in the second Bragg grating; the reflection spectrum of the first Bragg grating is overlapped with the reflection spectrum of the second Bragg grating at a preset wavelength;

the first electrode is positioned on the surface of one side of the substrate, which is back to the transmission layer, and the second electrode is positioned on the surface of one side of the narrow strip-shaped waveguide, which is back to the substrate.

Optionally, a width of the overlap between the reflection spectrum of the first bragg grating and the reflection spectrum of the second bragg grating ranges from 0.2nm to 0.4nm, inclusive.

Optionally, a value of a difference between a central reflection wavelength of the reflection spectrum of the first bragg grating and a central reflection wavelength of the reflection spectrum of the second bragg grating ranges from 0.1nm to 0.3nm, inclusive.

Optionally, a distance between a top of the protrusion in the first bragg grating and a top of the narrow strip waveguide is greater than a distance between a top of the protrusion in the second bragg grating and a top of the narrow strip waveguide; the distance between the bottom of the recess in the first Bragg grating and the top of the narrow strip-shaped waveguide is greater than the distance between the bottom of the recess in the second Bragg grating and the top of the narrow strip-shaped waveguide.

Optionally, the substrate is an n-type substrate; the transport layer includes:

an n-type cladding layer on the surface of the substrate;

the n-type waveguide layer is positioned on the surface of one side, back to the substrate, of the n-type cladding layer;

the active layer is positioned on the surface of one side, back to the substrate, of the n-type waveguide layer;

the p-type waveguide layer is positioned on the surface of one side, back to the substrate, of the active layer;

the p-type cladding layer is positioned on the surface of one side, back to the substrate, of the p-type waveguide layer;

and the cover layer is positioned on the surface of the p-type cladding layer, which faces away from the substrate.

Optionally, the convex top portion of the first bragg grating is located on the p-type cladding layer or the p-type waveguide layer, and the concave bottom portion of the first bragg grating is located on the p-type waveguide layer; the top of the protrusion in the second Bragg grating is positioned on the cover layer, and the bottom of the recess in the second Bragg grating is positioned on the p-type waveguide layer.

Optionally, the narrow strip waveguide includes a first narrow strip waveguide segment and a second narrow strip waveguide segment, the first narrow strip waveguide segment has a smaller width than the second narrow strip waveguide segment, and the first narrow strip waveguide segment and the second narrow strip waveguide segment are alternately arranged along an axis of the narrow strip waveguide;

the second electrode is located on the surface of the first narrow strip waveguide segment, which faces away from the substrate, and the surface of the second narrow strip waveguide segment, which faces away from the substrate.

The invention also provides a preparation method of the semiconductor laser, which comprises the following steps:

epitaxially growing a transmission layer on the surface of the substrate;

etching a narrow strip-shaped waveguide, a first Bragg grating and a second Bragg grating on the surface of one side, back to the substrate, of the transmission layer; the first Bragg grating is positioned at one end of the narrow strip-shaped waveguide along the axial line, the second Bragg grating is positioned at the other end of the narrow strip-shaped waveguide along the axial line, the refractive index of a protrusion in the first Bragg grating is smaller than that of a protrusion in the second Bragg grating, and the refractive index of a recess in the first Bragg grating is smaller than that of a recess in the second Bragg grating; the reflection spectrum of the first Bragg grating is overlapped with the reflection spectrum of the second Bragg grating at a preset wavelength;

and arranging a first electrode on the surface of one side of the substrate, which is back to the transmission layer, and arranging a second electrode on the surface of one side of the narrow strip-shaped waveguide, which is back to the substrate, so as to manufacture the semiconductor laser.

Optionally, the etching the narrow strip waveguide, the first bragg grating and the second bragg grating on the surface of the transmission layer on the side opposite to the substrate includes:

etching a region, corresponding to the first Bragg grating, in the surface of one side, back to the substrate, of the transmission layer to a preset depth;

etching the transmission layer at the preset depth to form the first Bragg grating;

etching a region, corresponding to the second Bragg grating, in the surface of one side, back to the substrate, of the transmission layer to form the second Bragg grating;

etching a region, corresponding to the narrow strip-shaped waveguide, in the surface of one side, back to the substrate, of the transmission layer to form the narrow strip-shaped waveguide; the distance between the top of the bulge in the first Bragg grating and the top of the narrow strip-shaped waveguide is greater than the distance between the top of the bulge in the second Bragg grating and the top of the narrow strip-shaped waveguide; the distance between the bottom of the recess in the first Bragg grating and the top of the narrow strip-shaped waveguide is greater than the distance between the bottom of the recess in the second Bragg grating and the top of the narrow strip-shaped waveguide.

Optionally, after etching the narrow-strip waveguide on the surface of the transmission layer on the side opposite to the substrate, the method further includes:

etching a first narrow strip-shaped waveguide segment and a second narrow strip-shaped waveguide segment on the surface of one side, back to the substrate, of the transmission layer; the first narrow-strip waveguide segment has a smaller width than the second narrow-strip waveguide segment, and the first narrow-strip waveguide segment and the second narrow-strip waveguide segment are alternately arranged along the axis of the narrow strip waveguide;

the step of arranging a second electrode on the surface of the narrow strip-shaped waveguide on the side opposite to the substrate comprises the following steps:

and second electrodes are arranged on the surface of the first narrow-strip waveguide segment, which faces away from the substrate, and the surface of the second narrow-strip waveguide segment, which faces away from the substrate.

The invention provides a semiconductor laser, wherein a narrow strip-shaped waveguide is etched on the surface of one side of a transmission layer, which is back to a substrate, a first Bragg grating is arranged at one end along the axis of the narrow strip-shaped waveguide, a second Bragg grating is arranged at the other end of the axis of the narrow strip-shaped waveguide, the refractive index of a convex part in the first Bragg grating is smaller than that of a convex part in the second Bragg grating, and the refractive index of a concave part in the first Bragg grating is smaller than that of a concave part in the second Bragg grating; the reflection spectrum of the first bragg grating overlaps the reflection spectrum of the second bragg grating at a predetermined wavelength.

The refractive index of the first Bragg grating is different from that of the second Bragg grating, but the reflection spectrum of the first Bragg grating is overlapped with that of the second Bragg grating at the preset wavelength, and because the first Bragg grating and the second Bragg grating are respectively arranged at the two ends of the narrow strip-shaped waveguide, the laser output by the semiconductor laser can obtain the reflection spectrum superposition similar to a vernier effect, the ultra-narrow reflection spectrum is realized, the spectral line width of a device is reduced, and the high-power narrow line width laser is realized.

The invention also provides a preparation method of the semiconductor laser, and the prepared semiconductor laser also has the beneficial effects, and is not repeated herein.

Drawings

In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor laser according to an embodiment of the present invention;

FIG. 2 is a schematic front view of the structure of FIG. 1;

fig. 3 is a schematic top view of a semiconductor laser according to an embodiment of the present invention;

fig. 4 is a schematic side view of a semiconductor laser according to an embodiment of the present invention;

fig. 5 is a flowchart of a method for fabricating a semiconductor laser according to an embodiment of the present invention;

fig. 6 is a flowchart of a method for fabricating a semiconductor laser according to an embodiment of the present invention.

In the figure: 1. the waveguide structure comprises a substrate, 2, a transmission layer, 3, a strip-shaped waveguide, 4, a first Bragg grating, 5, a second Bragg grating, 6, a first electrode, 7, a second electrode, 8, a reflection film, 9, an anti-reflection film, 10, an n-type cladding layer, 11, an n-type waveguide layer, 12, an active layer, 13, a p-type waveguide layer, 14, a p-type cladding layer, 15, a cover layer, 16, a first strip-shaped waveguide section and 17, a second strip-shaped waveguide section.

Detailed Description

The core of the invention is to provide a semiconductor laser. Narrow linewidth semiconductor lasers have typically included Distributed Feedback (DFB) lasers, as well as ridge DBR lasers, in the prior art, although great progress has been made in increasing output power and reducing spectral linewidth. However, the preparation of the grating structure of the distributed feedback semiconductor laser (DFB) generally requires secondary epitaxy or electron beam lithography and other technologies, resulting in high chip preparation cost and low yield; the ridge DBR generally adopts a ridge (with the width of 2-5 microns) waveguide structure to inhibit a high-order side mode and reduce the line width of laser, so that the saturated output power of the ridge DBR is low, and narrow-line-width laser with high power cannot be realized.

The invention provides a semiconductor laser, wherein a narrow strip-shaped waveguide is etched on the surface of one side of a transmission layer, which is back to a substrate, a first Bragg grating is arranged at one end along the axis of the narrow strip-shaped waveguide, a second Bragg grating is arranged at the other end of the axis of the narrow strip-shaped waveguide, the refractive index of a convex part in the first Bragg grating is smaller than that of a convex part in the second Bragg grating, and the refractive index of a concave part in the first Bragg grating is smaller than that of a concave part in the second Bragg grating; the reflection spectrum of the first bragg grating overlaps the reflection spectrum of the second bragg grating at a predetermined wavelength.

In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a semiconductor laser according to an embodiment of the present invention; fig. 2 is a schematic front view of the structure of fig. 1.

Referring to fig. 1 and 2, in the embodiment of the present invention, a semiconductor laser includes a substrate 1, a transmission layer 2, a first electrode 6, and a second electrode 7; the transmission layer 2 is positioned on the surface of the substrate 1, a narrow strip waveguide 3 is etched on the surface of one side, back to the substrate 1, of the transmission layer 2, a first Bragg grating 4 is arranged at one end along the axis of the narrow strip waveguide 3, a second Bragg grating 5 is arranged at the other end along the axis of the narrow strip waveguide 3, the refractive index of a convex part in the first Bragg grating 4 is smaller than that of a convex part in the second Bragg grating 5, and the refractive index of a concave part in the first Bragg grating 4 is smaller than that of a concave part in the second Bragg grating 5; the reflection spectrum of the first bragg grating 4 and the reflection spectrum of the second bragg grating 5 are overlapped at a preset wavelength; the first electrode 6 is positioned on the surface of the substrate 1, which faces away from the transmission layer 2, and the second electrode 7 is positioned on the surface of the narrow strip waveguide 3, which faces away from the substrate 1.

The substrate 1 mainly serves as a support, and the transmission layer 2, the first electrode 6 and the second electrode 7 are all required to be sequentially arranged on the surface of the substrate 1 according to a certain sequence. Generally, in the embodiment of the present invention, the substrate 1 needs to be an n-type doped substrate 1. Specific parameters such as thickness and the like relating to the specific dimensions of the substrate 1 can be set according to the actual situation, and are not particularly limited herein.

The transmission layer 2 is located on the surface of the substrate 1, the transmission layer 2 is used for transmitting light, and the transmission layer 2 is a resonant cavity, and the light can oscillate in the ridge transmission layer 2 to generate laser. The specific structure of the transmission layer 2 will be described in detail in the following embodiments of the invention, and will not be described herein again. In the embodiment of the present invention, a narrow strip waveguide 3, a first bragg grating 4 and a second bragg grating 5 are etched on a surface of the transmission layer 2 opposite to the substrate 1.

The narrow strip waveguide 3 is generally ridge-shaped, i.e. the narrow strip waveguide 3 extends generally along the X-axis in the figure, and the narrow strip waveguide 3 is generally etched on the surface of the transmission layer 2. The narrow strip waveguide 3 is mainly used for gain amplification of laser waves so as to ensure that the semiconductor laser interference array can output laser with sufficient power. The narrow strip waveguide 3 generally has two opposite ends along the axis, i.e. first two ends along the X-axis in the figure. The first bragg grating 4 and the second bragg grating 5 are respectively located at two opposite end portions of the strip waveguide 3, that is, the first bragg grating 4 is disposed along one end of the axis of the strip waveguide 3, and the second bragg grating 5 is disposed along the other end of the axis of the strip waveguide 3.

It should be noted that, the bragg gratings are both formed by alternately distributing two portions with different refractive indexes, and the first bragg grating 4 and the second bragg grating 5 are both formed by etching on the surface of the transmission layer 2, wherein the etched portion is air, the non-etched portion is a specific material of the transmission layer 2 itself, and the etched portion and the non-etched portion are alternately distributed to form the first bragg grating 4 and the second bragg grating 5. Specifically, the refractive index of the protrusion of the first bragg grating 4 is smaller than the refractive index of the protrusion of the second bragg grating 5, and the refractive index of the recess of the first bragg grating 4 is smaller than the refractive index of the recess of the second bragg grating 5. The raised portions correspond to the portions that are not etched, and the recessed portions correspond to the portions that are etched. The refractive index of the protrusion in the first bragg grating 4 is smaller than the refractive index of the protrusion in the second bragg grating 5, and the refractive index of the recess in the first bragg grating 4 is smaller than the refractive index of the recess in the second bragg grating 5, so that the refractive index of the first bragg grating 4 is different from the refractive index of the second bragg grating 5, and the high refractive index and the low refractive index of the first bragg grating 4 are both smaller than the high refractive index and the low refractive index of the second bragg grating 5.

It should be noted that the first bragg grating 4 may provide a single-mode laser light, which is transmitted in the narrow strip waveguide 3; at the same time, the second bragg grating 5 may also provide a single-mode laser light, which is transmitted within the strip-shaped waveguide 3. Since the refractive index of the first bragg grating 4 is different from the refractive index of the second bragg grating 5, the central wavelength of the reflection spectrum corresponding to the first bragg grating 4 is also different from the central wavelength of the reflection spectrum corresponding to the second bragg grating 5. However, in the embodiment of the present invention, since the reflection spectrum of the first bragg grating 4 overlaps the reflection spectrum of the second bragg grating 5 at the predetermined wavelength, that is, the reflection spectrum of the first bragg grating 4 partially overlaps the reflection spectrum of the second bragg grating 5, the laser light having the wavelength corresponding to the ultra-narrow line width of the overlapping portion can be generated in the narrow strip waveguide 3 according to the vernier effect.

In the embodiment of the invention, the first electrode 6 is positioned on the surface of the substrate 1, which is opposite to the transmission layer 2, and the second electrode 7 is positioned on the surface of the narrow strip waveguide 3, which is opposite to the substrate 1. That is, the first electrode 6 is also located on the surface of the substrate 1, and is electrically connected to the transmission layer 2 through the substrate 1. And the surface of the narrow strip waveguide 3 facing away from the substrate 1 is provided with a second electrode 7, i.e. the second electrode 7 is usually located on the surface of the transmission layer 2 facing away from the substrate 1. Normally, the first electrode 6 is an n-type electrode, the second electrode 7 is a p-type electrode, and the second electrode 7 does not cover the first bragg grating 4 and the second bragg grating 5.

Specifically, in the embodiment of the present invention, by specific limitations on the structures of the first bragg grating 4 and the second bragg grating 5, the range of the overlapping width between the reflection spectrum of the first bragg grating 4 and the reflection spectrum of the second bragg grating 5 may be 0.2nm to 0.4nm, inclusive. The width of the overlapping of the reflection spectrum of the first bragg grating 4 and the reflection spectrum of the second bragg grating 5 can effectively reduce the line width of the laser light finally output by the semiconductor laser.

Specifically, in the embodiment of the present invention, a difference value between a central reflection wavelength of the reflection spectrum of the first bragg grating 4 and a central reflection wavelength of the reflection spectrum of the second bragg grating 5 ranges from 0.1nm to 0.3nm, inclusive. In the embodiment of the present invention, by specifically limiting the structures of the first bragg grating 4 and the second bragg grating 5, the difference between the central reflection wavelength of the reflection spectrum of the first bragg grating 4 and the central reflection wavelength of the reflection spectrum of the second bragg grating 5 can be limited within the above range, and at this time, in the embodiment of the present invention, the full width at half maximum of the reflection spectrum of the first bragg grating 4 and the full width at half maximum of the reflection spectrum of the second bragg grating 5 are both generally about 0.5nm, so that a better vernier effect can be achieved, and laser light with a target width can be finally obtained.

Specifically, in the embodiment of the present invention, the distance between the top of the protrusion in the first bragg grating 4 and the top of the narrow strip-shaped waveguide 3 is greater than the distance between the top of the protrusion in the second bragg grating 5 and the top of the narrow strip-shaped waveguide 3; the distance between the bottom of the recess in the first bragg grating 4 and the top of the narrow strip-shaped waveguide 3 is greater than the distance between the bottom of the recess in the second bragg grating 5 and the top of the narrow strip-shaped waveguide 3.

That is, in the embodiment of the present invention, the first bragg grating 4 etched on the surface of the transmission layer 2 is located at a position lower than the second bragg grating 5 than the narrow strip waveguide 3. Specifically, the distance between the top of the protrusion in the first bragg grating 4 and the top of the narrow strip-shaped waveguide 3 is greater than the distance between the top of the protrusion in the second bragg grating 5 and the top of the narrow strip-shaped waveguide 3; and the distance between the bottom of the recess in the first bragg grating 4 and the top of the strip-shaped waveguide 3 is greater than the distance between the bottom of the recess in the second bragg grating 5 and the top of the strip-shaped waveguide 3. It should be noted that the narrow stripe waveguide 3 is usually located on the surface of the transmission layer 2, and the upper surface of the narrow stripe waveguide 3 is usually the upper surface of the original transmission layer 2 before etching. Typically, the second bragg grating 5 is generally in the same plane as the strip waveguide 3, and the first bragg grating 4 is generally disposed lower than the strip waveguide 3 and the second bragg grating 5. In the specific setting process, the whole area of the transmission layer 2 where the first bragg grating 4 needs to be set is generally thinned by a certain thickness, and then the first bragg grating 4 is manufactured. In this case, the high and low refractive indexes of the first bragg grating 4 are all lower than those of the second bragg grating 5.

Preferably, in the embodiment of the present invention, the semiconductor laser may further include a reflective film 8 located on the reflective surface of the transmission layer 2; and an anti-reflection film 9 positioned on the light-emitting surface of the transmission layer 2. In the embodiment of the present invention, the transmission layer 2 includes two end surfaces, which are a reflection surface of the transmission layer 2 and a light emitting surface of the transmission layer 2. In the embodiment of the present invention, a reflective film 8 may be disposed on the reflective surface of the transmission layer 2 to prevent the laser light from exiting the semiconductor laser from the reflective surface of the transmission layer 2, and an anti-reflective film 9, i.e., an anti-reflective film, may be disposed on the light exiting surface of the transmission layer 2 to increase the light exiting amount of the semiconductor laser.

In the semiconductor laser provided by the embodiment of the invention, a narrow strip-shaped waveguide 3 is etched on the surface of one side, back to a substrate 1, of a transmission layer 2, a first bragg grating 4 is arranged at one end along the axis of the narrow strip-shaped waveguide 3, a second bragg grating 5 is arranged at the other end of the axis of the narrow strip-shaped waveguide 3, the refractive index of a convex part in the first bragg grating 4 is smaller than that of a convex part in the second bragg grating 5, and the refractive index of a concave part in the first bragg grating 4 is smaller than that of a concave part in the second bragg grating 5; the reflection spectrum of the first bragg grating 4 overlaps the reflection spectrum of the second bragg grating 5 at a predetermined wavelength.

The refractive index of the first bragg grating 4 is different from the refractive index of the second bragg grating 5, but the reflection spectrum of the first bragg grating 4 is overlapped with the reflection spectrum of the second bragg grating 5 at the preset wavelength, and because the first bragg grating 4 and the second bragg grating 5 are respectively arranged at two ends of the narrow strip-shaped waveguide 3, the laser output by the semiconductor laser can obtain the reflection spectrum superposition similar to the vernier effect, the ultra-narrow reflection spectrum is realized, the spectral line width of a device is reduced, and the high-power narrow line width laser is realized.

The detailed structure of a semiconductor laser according to the present invention will be described in detail in the following embodiments of the present invention.

Referring to fig. 3 and 4, fig. 3 is a schematic top view of a semiconductor laser according to an embodiment of the present invention; fig. 4 is a schematic side view of a semiconductor laser according to an embodiment of the present invention.

The present invention is different from the above-described embodiments, and the present invention further specifically limits the structure of the semiconductor laser on the basis of the above-described embodiments. The rest of the contents are already described in detail in the above embodiments of the present invention, and are not described herein again.

Referring to fig. 3 and 4, in the embodiment of the present invention, the substrate 1 is an n-type substrate 1; the transmission layer 2 comprises an n-type cladding layer 10 positioned on the surface of the substrate 1; an n-type waveguide layer 11 positioned on the surface of the n-type cladding layer 10 opposite to the substrate 1; an active layer 12 positioned on the surface of the n-type waveguide layer 11 on the side opposite to the substrate 1; a p-type waveguide layer 13 positioned on the surface of the active layer 12 opposite to the substrate 1; a p-type cladding layer 14 positioned on the surface of the p-type waveguide layer 13 opposite to the substrate 1; and the cover layer 15 is positioned on the surface of the p-type cladding layer 14, which faces away from the substrate 1.

In an embodiment of the present invention, the material system may be GaAs/InGaAs/AlGaAs, with a laser wavelength typically between 780nm and 1064 nm. Of course, the materials and laser wavelengths described above are not limited in embodiments of the present invention. The transmission layer 2 includes an n-type cladding layer 10, an n-type waveguide layer 11, an active layer 12, a p-type waveguide layer 13, a p-type cladding layer 14, and a cap layer 15, which are sequentially provided in the normal direction on the surface of the n-type substrate 1. The refractive index of the n-type cladding layer 10 is usually smaller than that of the n-type waveguide layer 11, and the refractive index of the p-type cladding layer 14 is smaller than that of the p-type waveguide layer 13, so as to form total reflection, thereby ensuring that the laser light is transmitted between the n-type waveguide layer 11 and the p-type waveguide layer 13. Specifically, the active layer 12 may be a single layer or multiple layers of quantum wells, quantum dots, or the like, and serves as a gain region of a semiconductor laser interference array. The gain medium of the active layer 12 may be a quantum well, a quantum dot, a quantum band, a quantum cascade structure, or any combination thereof. For the detailed structure of the active layer 12, reference may be made to the prior art, and the detailed description thereof is omitted.

The cap layer 15 is usually a p-type highly doped cap layer 15, and the cap layer 15 is mainly used for forming ohmic contact between the transmission layer 2 and the second electrode 7, so as to reduce the overall resistance of the semiconductor laser interference array and improve the efficiency. Specifically, in the embodiment of the present invention, the convex top portion of the first bragg grating 4 is located on the p-type cladding layer 14 or the p-type waveguide layer 13, and the concave bottom portion of the first bragg grating 4 is located on the p-type waveguide layer 13; the convex top of the second bragg grating 5 is located in the cover layer 15, and the concave bottom of the second bragg grating 5 is located in the p-type waveguide layer 13.

That is, in the embodiment of the present invention, the upper surface of the second bragg grating 5, that is, the top of the protrusion in the second bragg grating 5 is flush with the upper surface of the narrow stripe-shaped waveguide 3, which is also the upper surface of the cover layer 15; the lower surface of the second bragg grating 5, i.e. the bottom of the recess in the second bragg grating 5, is located in the p-type waveguide layer 13, i.e. the second bragg grating 5 is usually prepared by etching from the cover layer 15 to a shallow position of the waveguide layer.

In the embodiment of the present invention, the upper surface of the first bragg grating 4, i.e. the top of the protrusion of the first bragg grating 4, is specifically located on the p-type cladding layer 14 or the p-type waveguide layer 13, and is spaced from the upper surface of the strip waveguide 3 by a certain distance; the lower surface of the first bragg grating 4, i.e. the bottom of the recess in the first bragg grating 4, is located in the p-type waveguide layer 13, and it is understood that the bottom of the recess in the first bragg grating 4 is located lower than the bottom of the recess in the second bragg grating 5 along the Z-axis direction in the figure. At this time, in the embodiment of the present invention, the entire p-type cladding layer 14 or the p-type waveguide layer 13 is etched in the region of the transmission layer 2 where the first bragg grating 4 needs to be disposed, and then the p-type waveguide layer 13 is etched down along the Z-axis to a deeper position.

It should be noted that, in the embodiment of the present invention, the widths of the first bragg grating 4, the narrow strip-shaped waveguide 3, and the second bragg grating 5, that is, the lengths in the Y-axis direction in the drawing, are generally the same, and the thickness of the narrow strip-shaped waveguide 3, that is, the length of the narrow strip-shaped waveguide 3 in the Z-axis direction in the drawing, is generally greater than the thicknesses of the first bragg grating 4 and the second bragg grating 5. In other words, the etching depth when the narrow strip waveguide 3 is provided is generally larger than the etching depth when the first bragg grating 4 and the second bragg grating 5 are provided. The narrow strip waveguide 3 generally includes a cover layer 15, a p-type cladding layer 14 and a part of the p-type waveguide layer 13 along the Z-axis direction, and the lower surface of the narrow strip waveguide 3 and the lower surface of the p-type waveguide layer 13 generally have a certain distance, which is generally limited specifically, and the distance is generally determined according to the single-mode cutoff condition of the waveguide and needs to be calculated according to the specific epitaxial structure of the transmission layer 2. The distance between the lower surface of the narrow stripe waveguide 3 and the lower surface of the P-type waveguide layer 13 cannot be zero in general, so as to prevent the active layer 12 from being released from stress and the performance of the semiconductor laser from being degraded.

Preferably, in the embodiment of the present invention, the narrow stripe waveguide 3 includes a first narrow-strip waveguide segment 16 and a second narrow-strip waveguide segment 17, the width of the first narrow-strip waveguide segment 16 is smaller than that of the second narrow-strip waveguide segment 17, and the first narrow-strip waveguide segment 16 and the second narrow-strip waveguide segment 17 are alternately arranged along the axis of the narrow stripe waveguide 3; the second electrode 7 is located on a surface of the first narrow strip-shaped waveguide segment 16 facing away from the substrate 1 and a surface of the second narrow strip-shaped waveguide segment 17 facing away from the substrate 1.

The surface of the narrow stripe waveguide 3 facing away from the substrate 1 is typically etched with a first narrow stripe-shaped waveguide segment 16 and a second narrow stripe-shaped waveguide segment 17, wherein the width of the first narrow stripe-shaped waveguide segment 16 will be smaller than the width of the second narrow stripe-shaped waveguide segment 17, and the width of the second narrow stripe-shaped waveguide segment 17 will typically correspond to the width of the narrow stripe-shaped waveguide 3. The first narrow-strip waveguide segments 16 and the second narrow-strip waveguide segments 17 are arranged alternately, wherein the first narrow-strip waveguide segments 16 are generally connected to the middle of the adjacent second narrow-strip waveguide segments 17, i.e. the axis of the first narrow-strip waveguide segments 16 is generally collinear with the axis of the second narrow-strip waveguide segments 17.

It should be noted that the second narrow-strip waveguide section 17 is usually formed at the same time when the first narrow-strip waveguide section 16 is etched on the surface of the narrow-strip waveguide 3. The thickness of the first narrow-strip waveguide segment 16 and the second narrow-strip waveguide segment 17 is usually only the thickness of the cover layer 15, that is, when the first narrow-strip waveguide segment 16 and the second narrow-strip waveguide segment 17 are etched, the cover layer 15 is usually etched only in the above-mentioned structure to form the first narrow-strip waveguide segment 16 and the second narrow-strip waveguide segment 17. Accordingly, the second electrode 7 generally covers only the surfaces of the first narrow strip-shaped waveguide segment 16 and the second narrow strip-shaped waveguide segment 17. The first narrow-strip waveguide section 16 and the second narrow-strip waveguide section 17 can enable the narrow-strip waveguide 3 to suppress a high-order transverse mode while gain-amplifying the single-mode laser light, thereby ensuring single-mode laser oscillation. The first narrow strip waveguide section 16 can be used as a spatial current modulation structure in the narrow strip waveguide 3, and the first narrow strip waveguide section 16 can suppress the generation of high-order transverse modes, so as to ensure that the oscillating light beam in the waveguide is a single-mode light wave.

It should be further noted that in the embodiment of the present invention, the entire width of the narrow strip waveguide 3, i.e., the length in the Y-axis direction in the figure, is between 10 μm and 30 μm, inclusive; typically, the width of the narrow strip waveguide 3 as a whole is typically between 20 μm and 30 μm, inclusive. Accordingly, the width of the second narrow strip-shaped waveguide section 17 is typically between 20 μm and 30 μm, inclusive. Compared with the conventional ridge waveguide with the width of only 3-6 μm, the narrow strip waveguide 3 in the embodiment of the present invention can obtain high power output, and meanwhile, due to the arrangement of the first narrow strip waveguide section 16 and the second narrow strip waveguide section 17, the generation of high-order transverse modes can be suppressed, and the quality of the output laser light of the semiconductor laser can be ensured.

The semiconductor laser provided by the embodiment of the invention specifically provides specific structures of a transmission layer 2, a narrow strip-shaped waveguide 3, a first Bragg grating 4 and a second Bragg grating 5, and can realize high-power narrow-linewidth laser output; by providing the first narrow strip-shaped waveguide section 16 and the second narrow strip-shaped waveguide section 17, generation of a high-order transverse mode can be suppressed to ensure that the oscillating light beam in the waveguide is a single-mode light wave.

The following describes a method for fabricating a semiconductor laser according to the present invention, and the fabrication method described below and the structure of the semiconductor laser described above are referred to correspondingly.

Referring to fig. 5, fig. 5 is a flowchart illustrating a method for fabricating a semiconductor laser according to an embodiment of the present invention.

Referring to fig. 5, in an embodiment of the present invention, a method for manufacturing a semiconductor laser includes:

s101: and epitaxially growing a transmission layer on the surface of the substrate.

The specific structure of the transport layer will be described in detail in the following embodiments of the invention, and will not be described herein again. In this step, the respective film layers are sequentially epitaxially grown on the surface of the substrate by Metal Organic Chemical Vapor Deposition (MOCVD) to finally epitaxially grow the transmission layer provided by the above embodiment of the invention. Of course, in the embodiment of the present invention, the epitaxial growth of the transmission layer may also be implemented by other processes or apparatuses, and the specific process related to the epitaxial growth of the transmission layer is not specifically limited in the embodiment of the present invention.

S102: and etching the narrow strip-shaped waveguide, the first Bragg grating and the second Bragg grating on the surface of one side of the transmission layer, which is back to the substrate.

In the embodiment of the present invention, the first bragg grating is located at one end of the narrow strip waveguide along the axis, the second bragg grating is located at the other end of the narrow strip waveguide along the axis, the refractive index of the protrusion in the first bragg grating is smaller than the refractive index of the protrusion in the second bragg grating, and the refractive index of the recess in the first bragg grating is smaller than the refractive index of the recess in the second bragg grating; the reflection spectrum of the first bragg grating overlaps the reflection spectrum of the second bragg grating at a predetermined wavelength. The detailed structures of the narrow strip waveguide, the first bragg grating and the second bragg grating have been described in detail in the above embodiments of the invention, and are not described herein again.

In this step, the narrow strip waveguide, the first bragg grating and the second bragg grating are etched in the surface of the transmission layer on the side opposite to the substrate, usually by an etching process, usually by using photolithography and plasma etching techniques. The detailed etching process related to the surface structure of the transmission layer will be described in detail in the following embodiments of the invention, and will not be described herein again.

S103: and arranging a first electrode on the surface of the substrate opposite to the transmission layer, and arranging a second electrode on the surface of the narrow strip-shaped waveguide opposite to the substrate to manufacture the semiconductor laser.

In this step, a second electrode, which is usually a p-type electrode, is usually first disposed on the surface of the narrow strip waveguide facing away from the substrate; the substrate is then thinned, after which a first electrode, typically an n-type electrode, is provided on the surface of the substrate facing away from the transmission layer.

After this step, a reflection film is plated on the reflection surface of the transmission layer, and an anti-reflection film, i.e., an anti-reflection film, is plated on the light-emitting surface of the transmission layer, so as to improve the performance of the semiconductor laser. For the specific materials of the reflective film and the anti-reflective film, reference may be made to the prior art, and further description thereof is omitted here.

According to the preparation method of the semiconductor laser, the refractive index of the first Bragg grating is different from that of the second Bragg grating, but the reflection spectrum of the first Bragg grating is overlapped with that of the second Bragg grating at the preset wavelength, and the first Bragg grating and the second Bragg grating are respectively arranged at the two ends of the narrow strip-shaped waveguide, so that the laser output by the semiconductor laser can obtain reflection spectrum superposition similar to a vernier effect, the ultra-narrow reflection spectrum is realized, the spectral line width of a device is reduced, and the high-power narrow line width laser is realized.

The details of the method for fabricating a semiconductor laser according to the present invention will be described in detail in the following embodiments of the present invention.

Referring to fig. 6, fig. 6 is a flowchart illustrating a method for fabricating a semiconductor laser according to an embodiment of the present invention.

Referring to fig. 6, in an embodiment of the present invention, a method for manufacturing a semiconductor laser includes:

s201: and epitaxially growing a transmission layer on the surface of the substrate.

Specifically, this step generally includes: epitaxially growing an n-type cladding layer on the surface of the n-type substrate; epitaxially growing an n-type waveguide layer on the surface of the n-type cladding layer; epitaxially growing an active layer on the surface of the n-type waveguide layer; epitaxially growing a p-type waveguide layer on the surface of the active layer; epitaxially growing a p-type cladding layer on the surface of the p-type waveguide layer; and epitaxially growing a cover layer on the surface of the p-type cladding layer. In this step, the above steps are generally performed sequentially by a Metal Organic Chemical Vapor Deposition (MOCVD) technique, that is, an n-type cladding layer, an n-type waveguide layer, an active layer, a p-type waveguide layer, a p-type cladding layer, and a cap layer are sequentially disposed on the surface of the substrate. The detailed structure of each film layer is described in detail in the above embodiments of the invention, and will not be described herein again.

S202: and etching the area of the transmission layer, which is opposite to the first Bragg grating, on the surface of one side of the substrate to a preset depth.

In this step, in general, i-line lithography and plasma etching techniques are used to etch the region corresponding to the first bragg grating in the surface of the transmission layer on the side opposite to the substrate to a predetermined depth, where the etched position in this step is the position of the upper surface of the first bragg grating, that is, the position of the upper end portion of the protrusion of the first bragg grating. Specifically, the predetermined depth is typically located at the p-type cladding layer or the p-type waveguide layer.

S203: the transmission layer is etched at a predetermined depth to form a first bragg grating.

In this step, photolithography and plasma etching techniques are typically used to continue etching the transmission layer in the region etched in S202 to form the first bragg grating. The etching location in this step to etch the first bragg grating is typically still within the p-type waveguide layer. For the specific structure of the first bragg grating, reference may be made to the above embodiments, and details are not repeated herein. In this step, the p-type waveguide layer is typically etched to a medium depth.

S204: and etching the area of the surface of the transmission layer, which is back to the substrate and corresponds to the second Bragg grating to form the second Bragg grating.

In this step, photolithography and plasma etching techniques are usually used to etch the region of the surface of the transmission layer opposite to the substrate corresponding to the second bragg grating, so as to form the second bragg grating. For the specific structure of the second bragg grating, reference may be made to the above embodiments, and details are not repeated herein. It should be noted that, this step and the above step S203 may be performed simultaneously, that is, the first bragg grating and the second bragg grating may be etched in the transmission layer simultaneously by the photolithography and the plasma etching technology at a time, so as to save the preparation process of the semiconductor laser. In this step, the p-type waveguide layer is typically etched to a shallower position.

S205: and etching a region corresponding to the narrow strip waveguide in the surface of the transmission layer on the side opposite to the substrate to form the narrow strip waveguide.

In the embodiment of the present invention, a distance between a top of a protrusion in the first bragg grating and a top of the narrow strip-shaped waveguide is greater than a distance between a top of a protrusion in the second bragg grating and a top of the narrow strip-shaped waveguide; the distance between the bottom of the recess in the first Bragg grating and the top of the narrow strip-shaped waveguide is greater than the distance between the bottom of the recess in the second Bragg grating and the top of the narrow strip-shaped waveguide.

In this step, photolithography and plasma etching techniques are usually used to etch the region of the transmission layer facing away from the substrate corresponding to the narrow stripe waveguide, so as to form the narrow stripe waveguide. For the specific structure of the narrow strip waveguide, reference may be made to the above-mentioned embodiments of the present invention, and details are not described herein. In this step, the p-type waveguide layer is typically etched to a deep position.

S206: and etching a first narrow strip-shaped waveguide segment and a second narrow strip-shaped waveguide segment on the surface of the transmission layer, which faces away from the substrate.

In an embodiment of the present invention, a width of the first narrow strip-shaped waveguide segment is smaller than a width of the second narrow strip-shaped waveguide segment, and the first narrow strip-shaped waveguide segment and the second narrow strip-shaped waveguide segment are alternately arranged along an axis of the narrow strip waveguide.

The detailed structures of the first narrow-strip waveguide segment and the second narrow-strip waveguide segment have been described in detail in the above embodiments of the present invention, and will not be described herein again. In this step, photolithography and plasma etching techniques are typically used to etch predetermined regions in the surface of the narrow strip waveguide on the side facing away from the substrate to form a first narrow strip waveguide segment and a second narrow strip waveguide segment. In this step, the cap layer is typically etched to form a first narrow strip waveguide segment and a second narrow strip waveguide segment.

S207: and arranging a first electrode on the surface of the substrate, which is back to the transmission layer, and arranging a second electrode on the surface of the first narrow strip-shaped waveguide segment, which is back to the substrate, and the surface of the second narrow strip-shaped waveguide segment, which is back to the substrate, so as to manufacture the semiconductor laser.

Specifically, in this step, the second electrode is disposed on a surface of the first narrow-strip waveguide section facing away from the substrate and a surface of the second narrow-strip waveguide section facing away from the substrate. The rest of this step has already been introduced in S103 in the above embodiment of the present invention, and please refer to the above embodiment of the present invention for details, which will not be described again here.

The embodiment of the invention provides a preparation method of a semiconductor laser, and particularly provides a specific preparation process of a transmission layer 2, a narrow-strip-shaped waveguide 3, a first Bragg grating and a second Bragg grating, so that high-power narrow-linewidth laser output can be realized; by arranging the first narrow-strip waveguide section and the second narrow-strip waveguide section, generation of a high-order transverse mode can be suppressed, so that the oscillating light beam in the waveguide is ensured to be a single-mode light wave.

The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.

Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The semiconductor laser and the method for manufacturing the semiconductor laser provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.