阅读说明：本技术 一种增加GaN Micro-LED颜色转换效率的方法 (Method for increasing GaN Micro-LED color conversion efficiency ) 是由 孙捷 杜在发 郭伟玲 李龙飞 熊访竹 于 2019-09-29 设计创作，主要内容包括：本发明公开了一种增加GaN Micro-LED颜色转换效率的方法,在P型GaN表面刻孔至有源区,使用Ag纳米颗粒和发光量子点进行填充；该方法是将P型台面压印出一个个圆形孔洞图形并将其刻蚀至有源区,在孔洞内填充发光量子点的同时填充金属Ag量子点,实现金属Ag量子点与有源区进行共振,从而实现增加颜色转换效率的功能。本发明减少了有源区的能量损耗,同时金属量子点跟有源区的近距离接触,使得两者之间共振增加,有利于增加有源区的能量提取效率。将两者充分结合,GaN Micro-LED使得颜色转换效率大大增加。(The invention discloses a method for increasing GaN Micro-LED color conversion efficiency, which comprises the steps of carving a hole on the surface of a P-type GaN to an active region, and filling the hole with Ag nano particles and light-emitting quantum dots; the method is characterized in that a P-type table top is stamped to form a circular hole pattern and is etched to an active region, luminescent quantum dots are filled in the holes, and metal Ag quantum dots are filled in the holes, so that the metal Ag quantum dots and the active region are resonated, and the function of increasing the color conversion efficiency is realized. The invention reduces the energy loss of the active region, and simultaneously, the close contact between the metal quantum dots and the active region increases the resonance between the metal quantum dots and the active region, thereby being beneficial to increasing the energy extraction efficiency of the active region. By fully combining the two, the GaN Micro-LED greatly increases the color conversion efficiency.)

1. A method for increasing GaN Micro-LED color conversion efficiency is characterized in that: etching a hole on the surface of the P-type GaN to an active region, and filling the hole with Ag nano particles and a luminescent quantum dot;

the method comprises the following steps:

(1) selecting a GaN epitaxial bare chip, wherein the structure of the GaN epitaxial bare chip comprises a sapphire substrate, an N-type GaN layer, an active layer and a P-type GaN layer;

(2) indium Tin Oxide (ITO) with the surface of 70nm is grown to be used as a transparent conducting layer;

(3) growing 300nm silicon oxide as a hard mask, and making nano-imprint patterns on the surface layer, wherein the patterns are nano-pores with the spacing of 1 mu m;

(4) etching the small hole to the surface of the P-type GaN by utilizing ion coupled etching (ICP);

(5) etching the patterned small holes to the GaN active region by utilizing ICP (inductively coupled plasma); placing the substrate into BOE corrosive liquid to remove the silicon oxide mask layer and the nanoimprint pattern layer;

(6) filling the small hole region with photoresist, growing metal Ni as a hard mask to cover the small hole region, and etching the rest part to the N-type GaN region to form a light-emitting table top;

(7) removing the photoresist, and growing hafnium oxide as an insulating layer to conveniently lead out the p electrode;

(8) and photoetching an electrode pattern to finish sputtering n and p titanium/gold electrodes, and obtaining the stripped electrode by using a lift-off process.

2. The method of claim 1, further comprising masking the entire epitaxial wafer with a photoresist mask by photolithography including spin coating, pre-baking, exposing, developing, and hardening; and manufacturing a metal P electrode and a metal N electrode by adopting an evaporation or sputtering method, wherein the metal layer is Ti/Au, and stripping off the metal except the electrode position by adopting a lift-off process to form a metal P, N electrode.

3. The method of claim 2, further comprising filling the luminescent quantum dots and the Ag quantum dots into the holes by spin coating.

4. The method of claim 1, wherein the ITO transparent conductive layer in step 2 is 70nm thick.

5. The method of claim 1, wherein the nanopore spacing in step 3 is 1 μm, and the diameter of the nanopore is 1 μm; the thickness of the silicon oxide mask layer was 300 nm.

6. The method of claim 1, wherein the etched nanopore in step 4 has a depth of 1.15-1.25 μm.

7. The method of claim 1, wherein the Ni thickness in step 6 is 150nm and the etched mesa height is 1.15-1.25 μm.

8. The method of claim 1, wherein the hafnium oxide insulating layer in step 7 is 15nm thick.

9. The method of claim 1, wherein the electrode thickness in step 8 is 10/150 nm.

Technical Field

The invention belongs to the technical field of LEDs, and particularly relates to a process manufacturing method for increasing GaN Micro-LED color conversion efficiency by filling Ag nano particles and luminous quantum dots.

Background

In recent years, with the continuous development of lighting display technology, higher and more comprehensive requirements are put on the aspects of light emitting performance, brightness, power consumption and the like of a light emitting device. In the context of such large environments, Micro-LEDs have come into operation. Micro-LEDs have their own unique advantages as a new generation of display technology, and their structures can be thinned, arrayed and miniaturized due to the small size of the device (on the order of a single pixel micron). With the size reduction, higher brightness, resolution and color saturation are brought about. While at the same time providing a higher luminous efficiency relative to LCD-based OLEDs.

The Micro-LED is manufactured into a backlight display unit and full-color is realized mainly through two ways: one is to transfer independent three-primary color substrates to the same substrate to realize luminescence, if the Micro-LED has a small size, the transfer process is complicated, a huge transfer technology is needed, and the adverse effects of low yield and the like are possibly caused. Secondly, a layer of light-emitting Quantum Dots (QDs) is coated on a monochromatic light-emitting substrate, and different light colors are generated through excitation of monochromatic light, so that the purpose of generating white light is achieved. Research shows that the Ag nano particles coated on the GaN surface can generate resonance with the active region, so that the color conversion efficiency can be increased.

Most of the current researches mainly aim at increasing resonance by scattering metal quantum dots on the surface, and researches indicate that the distance between the metal quantum dots and an active region influences the intensity of the resonance and further influences the efficiency of color conversion, and the closer the metal quantum dots are to the active region, the more obvious the resonance is. In the invention, the method of digging the hole to fill the quantum dots in the active region is used, so that the distance between the metal quantum dots and the active region is greatly reduced, the resonance between the metal quantum dots and the active region is effectively enhanced, and the color conversion efficiency is greatly improved.

Disclosure of Invention

The invention aims to provide a manufacturing method of an Ags + QDs Micro-LED process with high color conversion efficiency.

The technical scheme adopted by the invention is that the method for manufacturing the Ags + QDs Micro-LED device with high color conversion efficiency comprises the following steps:

step 1: taking an epitaxial structure, wherein the epitaxial structure 1 comprises a sapphire substrate, an N-type gallium nitride layer, an active layer and a P-type gallium nitride layer;

step 2: manufacturing an Indium Tin Oxide (ITO) transparent conductive layer on the surface of the P-type gallium nitride by a sputtering method, wherein the thickness of the ITO transparent conductive layer is 70 nm;

and step 3: growing a layer of silicon dioxide serving as a hard mask on the ITO transparent conducting layer by adopting a Plasma Enhanced Chemical Vapor Deposition (PECVD) method, wherein the thickness of the silicon dioxide is 300 nm;

and 4, step 4: imprinting a periodically arranged small hole pattern on the surface of the silicon dioxide by adopting a nano imprinting method, wherein the size of the small hole is 1 mu m in diameter, and the interval between the patterns is 1 mu m;

and 5: etching the small holes to the surface of the transparent conductive layer ITO by adopting a Reactive Ion Etching (RIE) method;

step 6: a photoetching method of glue homogenizing, prebaking, exposing, developing and film hardening is adopted to manufacture a photoetching mask on the surface of the nano imprinting layer; and etching the part without the photoresist mask to the active layer by using an ion coupled etching (ICP) method. Cleaning the photoresist with acetone, and corroding and removing the silicon dioxide hard mask layer and the nanoimprint pattern layer;

and 7: a photoresist mask is manufactured on the transparent conducting layer by adopting a photoetching method of spin coating, prebaking, exposing, developing and film hardening; etching the part without the photoresist to the N-type gallium nitride table top by using an ICP (inductively coupled plasma) method, and cleaning the photoresist to form an N-type step;

and 8: a photoresist mask is manufactured on the whole epitaxial wafer by adopting a photoetching method of spin coating, prebaking, exposing, developing and film hardening; growing hafnium oxide serving as an insulating layer by using Atomic Layer Deposition (ALD), wherein the thickness of the hafnium oxide is 15nm, and stripping the hafnium oxide outside the position of the insulating layer by adopting a lift-off process;

and step 9: adopting a photoetching method of spin coating, prebaking, exposing, developing and hardening to make a photoresist mask on the whole epitaxial wafer; manufacturing a metal P electrode and a metal N electrode by adopting an evaporation or sputtering method, wherein the metal layer is Ti/Au, and stripping off the metal outside the electrode position by adopting a lift-off process to form a metal P, N electrode;

step 10: and filling the luminescent quantum dots and the Ag quantum dots into the holes by adopting a glue homogenizing method.

At present, most of work related to quantum dots or metal nano-dots is realized by spin coating the quantum dots or the metal nano-dots on the surface of an LED, and the energy extraction and the color conversion efficiency are improved by utilizing the surface plasmon resonance effect and radiation energy transfer of the quantum dots. In the invention, a series of holes are etched on the surface of the P-GaN layer and are made to reach the active region, the luminescent quantum dots and the Ag nano quantum dots are filled into the holes at the same time and are made to be in near zero-distance contact with the active region, so that the luminescent quantum dots and the active region generate a non-radiative energy transfer effect, the energy loss of the active region is reduced, and meanwhile, the metal quantum dots are in near-distance contact with the active region, so that the resonance between the metal quantum dots and the active region is increased, and the energy extraction efficiency of the active region is increased. By fully combining the two, the GaN Micro-LED greatly increases the color conversion efficiency.

Drawings

FIG. 1 is a process flow diagram of the present invention;

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clear and more obvious, the present invention is further described in detail below with reference to the accompanying drawings.

As shown in fig. 1, fig. 1 is a flow chart of a process for increasing color conversion efficiency of GaN Micro-LED by filling Ag nanoparticles and CdSe luminescent quantum dots, according to which nano-sized Ag metal particles and CdSe luminescent quantum dots are filled into holes dug on the GaN surface to realize resonance with quantum wells, so as to increase color conversion efficiency.

Step 1: preparing a GaN bare chip, namely boiling the GaN bare chip by acetone and ethanol respectively, washing the GaN bare chip by deionized water for 30 times, and drying the GaN bare chip by using a nitrogen gun to ensure that no other pollutants exist on the surface of the GaN. Each step of the following experiment was repeated to ensure the cleanliness of the test piece.

Step 2: ITO is grown on a sputtering platform to form a transparent conductive layer, and the thickness of the transparent conductive layer is 70 nm.

And step 3: growing SiO using PECVD₂And making a hard mask layer with the thickness of 300 nm.

And 4, step 4: in SiO₂The surface is made into a nano-imprinting pattern, the pattern is a round hole with the diameter of 1 mu m, and the interval between the holes is 1 mu m.

And 5: SiO hard mask using RIE₂The patterned portion is etched to the ITO surface.

Step 6: and photoetching is carried out, a part of the electrode to be grown is covered, and the area exposed by photoetching development is etched to the quantum well area, wherein the etching depth is about 1.12 mu m.

And 7: removing photoresist and SiO by using acetone and BOE solution respectively₂A hard mask layer.

And 8: ALD growth of HfO₂Covering the side wall of the hole to prevent the Ag nanoparticles from contacting the quantum well region to cause leakage and HfO₂The thickness was 10 nm.

And step 9: an overlay 1 is performed using RIE to etch the N-electrode portion to the N-GaN regions.

Step 10: and (3) performing alignment 2, growing n and p electrodes by using a metal sputtering platform, and performing stripping annealing, wherein the electrode material is Ti/Au, and the thickness of the electrode material is 15/200 nm.

Step 11: and filling the prepared Ag nano particles and CdSe light quantum dots into the holes.

The above description is only for the specific implementation of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.