阅读说明：本技术 Led组件、led显示装置 (LED assembly and LED display device ) 是由 小渕启誉 板井顺一 于 2019-08-01 设计创作，主要内容包括：本发明提供一种LED组件及具备该LED组件的LED显示装置，实现小型化且射出的光束量能长期稳定化。具备具有在厚度方向z上相互朝向相反侧的主面(10A)以及背面(10B)的基板(10)、配置于基板(10)的第一配线(20)以及第二配线(30)、配置于主面(10A)且与第一配线(20)以及第二配线(30)双方导通的LED芯片(40)、覆盖LED芯片(40)的封闭树脂(70)，在基板(10)上含有在厚度方向z上层叠的多个玻璃纤维布(11)、被多个玻璃纤维布(11)浸渍的浸渍树脂(12)，浸渍树脂(12)含有丙烯酸树脂，在封闭树脂(70)中含有硅酮。(The invention provides an LED module and an LED display device with the LED module, which can realize miniaturization and long-term stabilization of the emitted light beam. The LED light source device is provided with a substrate (10) having a main surface (10A) and a back surface (10B) facing opposite sides in a thickness direction z, a first wiring (20) and a second wiring (30) arranged on the substrate (10), an LED chip (40) arranged on the main surface (10A) and conducting with both the first wiring (20) and the second wiring (30), and a sealing resin (70) covering the LED chip (40), wherein the substrate (10) contains a plurality of glass fiber cloths (11) laminated in the thickness direction z, and an impregnating resin (12) impregnated by the plurality of glass fiber cloths (11), the impregnating resin (12) contains acrylic resin, and the sealing resin (70) contains silicone.)

1. An LED assembly, characterized in that,

the disclosed device is provided with:

a substrate having a main surface and a back surface facing opposite sides to each other in a thickness direction;

a first wiring and a second wiring arranged on the substrate;

an LED chip disposed on the main surface and electrically connected to both the first wiring and the second wiring; and

a sealing resin covering the LED chip,

the substrate includes a plurality of glass fiber cloths laminated in the thickness direction and an impregnating resin impregnated in the plurality of glass fiber cloths,

the impregnating resin contains an acrylic resin,

the sealing resin contains silicone.

2. The LED assembly of claim 1,

the substrate has a first side surface facing a first direction orthogonal to the thickness direction and connected to both the main surface and the back surface, and a first recess recessed from the first side surface and reaching the back surface from the main surface,

the first wiring has a first connection portion arranged on the main surface and electrically connected to the LED chip and a first terminal portion connected to the first connection portion,

the first terminal portion is continuous with both the main surface and the first recess.

3. The LED assembly of claim 2,

the substrate has a second side surface facing the opposite side of the first side surface and connected to both the main surface and the back surface, and a second concave portion recessed from the second side surface and reaching the back surface from the main surface,

the second wiring has a mounting portion for mounting the LED chip, a second connection portion electrically connected to the LED chip, and a second terminal portion connected to both the mounting portion and the second connection portion,

the second terminal portion is continuous with both the main surface and the second recess.

4. The LED assembly of claim 3,

the first terminal portion has a first main portion continuous with the main surface and connected to the first connection portion, and a first side portion continuous with the first recess and connected to the first main portion,

further comprising a first insulating layer having a first intermediate portion located between the main surface and the sealing resin in the thickness direction and covering at least a part of the first main portion,

the first insulating layer reaches both ends in a second direction orthogonal to both the thickness direction and the first direction in the main surface.

5. The LED assembly of claim 4,

the second terminal portion has a second main portion continuous with the main surface and connected to both the mounting portion and the second connecting portion, and a second side portion continuous with the second recess portion and connected to the second main portion,

further comprising a second insulating layer having a second intermediate portion located between the main surface and the sealing resin in the thickness direction and covering at least a part of the second main portion,

the second insulating layer reaches both ends of the main surface in the second direction.

6. The LED assembly of claim 5,

the first insulating layer has a first exposed portion connected to the first intermediate portion and exposed from the sealing resin,

the second insulating layer has a second exposed portion connected to the second intermediate portion and exposed from the sealing resin,

the second exposed portion has a shape different from the shape of the first exposed portion when viewed in the thickness direction.

7. The LED assembly of claim 6,

the first exposed portion is a strip extending in the second direction when viewed from the thickness direction,

the second exposed portion has a curved edge along a peripheral edge of the second recess when viewed in the thickness direction.

8. The LED assembly according to claim 6 or 7,

the first insulating layer and the second insulating layer are formed of a protective film.

9. The LED assembly according to any one of claims 6 to 8,

a pair of first cut portions that are located at both ends in the second direction and that are recessed from a pair of angles connecting the main surfaces of the first side surface toward an inside of the first main portion are provided in the first main portion,

the main surface is exposed from the pair of first cut portions.

10. The LED assembly of claim 9,

a pair of second notches are provided in the second main portion, the pair of second notches being located at both ends in the second direction and being recessed from a pair of angles connecting the main surfaces of the second side surfaces toward the inside of the second main portion,

the main surface is exposed from the pair of second cut portions.

11. The LED assembly of claim 10,

the second notch portion has a shape different from the shape of the first notch portion when viewed in the thickness direction.

12. The LED assembly according to claim 10 or 11,

the first terminal portion has a first back portion continuous with the back surface and connected to the first side portion,

the first back portion is provided with a first protrusion which is adjacent to a boundary between the back surface and the first side surface and protrudes in the thickness direction.

13. The LED assembly of claim 12,

the second terminal portion has a second back portion continuous with the back surface and connected to the second side portion,

the second back portion is provided with a second convex portion adjacent to a boundary between the back surface and the second side surface and protruding in the thickness direction.

14. The LED assembly according to any one of claims 6 to 13,

the first connecting portion and the second connecting portion are overlapped with a diagonal line of the main surface when viewed from the thickness direction,

the center of the main surface is located between the first connection portion and the second connection portion when viewed in the thickness direction.

15. The LED assembly of claim 14,

further provided with:

a first wire connected to the LED chip and the first connection portion; and

a second metal wire connected to the LED chip and the second connection portion,

columnar connectors are provided at an end portion of the first wire connected to the first connection portion and an end portion of the second wire connected to the second connection portion, respectively.

16. The LED assembly according to any one of claims 6 to 15,

the sealing resin has a lens portion located at a position apart from the LED chip in the thickness direction,

the lens part is convex in the thickness direction.

17. An LED display device is characterized in that,

the disclosed device is provided with:

an LED assembly according to any one of claims 1 to 16;

a mounting substrate on which the LED module is mounted; and

a housing surrounding the LED module on a side where the LED module is located with respect to the mounting substrate,

a predetermined gap is provided between the mounting board and the housing in the thickness direction,

the thickness of the substrate of the LED module is larger than the length of the gap.

Technical Field

The present invention relates to an LED module and an LED display device including the LED module.

Background

Patent document 1 discloses an example of an LED module. The LED module includes a resin container having a recess formed therein, a pair of lead wires arranged in the resin container such that a part of the lead wires is exposed from a bottom surface of the recess, and an LED chip (semiconductor light emitting element) mounted on one of the pair of lead wires. The LED chip is communicated with a pair of wires through metal wires. A sealing resin for covering the LED chip is disposed in the recess. The sealing resin comprises phosphorus powder and transparent resin. The transparent resin contains silicone.

By using such a sealing resin, the durability of the sealing resin with respect to light emitted from the LED chip is improved. This is caused by the decrease in the content of benzene rings per unit volume of the blocking resin. Therefore, the amount of light beam emitted from the LED module is stable for a long period of time. In recent years, with the demand for downsizing of LED modules, a resin substrate having a relatively small thickness is used instead of the resin container disclosed in patent document 1. The LED chip is mounted on the resin substrate. In the LED module including the resin substrate and the sealing resin, the amount of light flux incident on the resin substrate is increased as the durability of the sealing resin is improved. As a result, the resin substrate deteriorates. If the deterioration of the resin substrate continues, there is a problem that the amount of light beams emitted from the LED module decreases.

Disclosure of Invention

In view of the above circumstances, an object of the present invention is to provide an LED module that is compact and can stabilize the amount of emitted light over a long period of time, and an LED display device including the LED module.

According to a first aspect of the present invention, there is provided an LED module including a substrate having a principal surface and a back surface opposite to each other in a thickness direction, a first wiring and a second wiring arranged on the substrate, an LED chip arranged on the principal surface and electrically connected to both the first wiring and the second wiring, and a sealing resin covering the LED chip, wherein the substrate includes a plurality of glass fiber cloths stacked in the thickness direction and an impregnating resin impregnated with the plurality of glass fiber cloths, the impregnating resin includes an acrylic resin, and the sealing resin includes silicone.

In an aspect of the present invention, it is preferable that the substrate has a first side surface facing a first direction orthogonal to the thickness direction and connected to both the main surface and the back surface, and a first concave portion recessed from the first side surface and reaching the back surface from the main surface, the first wiring includes a first connection portion arranged on the main surface and electrically connected to the LED chip, and a first terminal portion connected to the first connection portion, and the first terminal portion is connected to both the main surface and the concave portion.

In an aspect of the present invention, it is preferable that the substrate has a second side surface facing the opposite side of the first side surface and connected to both the main surface and the back surface, and a second concave portion recessed from the second side surface and reaching the back surface from the main surface, the second wiring has a mounting portion on which the LED chip is mounted, a second connection portion electrically connected to the LED chip, and a second terminal portion connected to both the mounting portion and the connection portion, and the second terminal portion is connected to both the main surface and the second concave portion.

In an aspect of the present invention, it is preferable that the first terminal portion has a first main portion continuous with the main surface and connected to the first connection portion, and a first side portion continuous with the first recess and connected to the first main portion, and further includes a first insulating layer having a first intermediate portion located between the main surface and the sealing resin in the thickness direction and covering at least a part of the first main portion, the first insulating layer reaching both ends in a second direction orthogonal to both the thickness direction and the first direction in the main surface.

In an aspect of the present invention, it is preferable that the second terminal portion has a second main portion continuous with the main surface and connected to both the mounting portion and the second connecting portion, and a second side portion continuous with the second concave portion and connected to the second main portion, and further includes a second insulating layer having a second intermediate portion located between the main surface and the sealing resin in the thickness direction and covering at least a part of the second main portion, the second insulating layer reaching both ends of the main surface in the second direction.

In an aspect of the present invention, it is preferable that the first insulating layer has a first exposed portion connected to the first intermediate portion and exposed from the sealing resin, the second insulating layer has a second exposed portion connected to the second intermediate portion and exposed from the sealing resin, and a shape of the second exposed portion is different from a shape of the first exposed portion as viewed in the thickness direction.

In an aspect of the present invention, it is preferable that the first exposed portion is a band shape extending in the second direction when viewed from the thickness direction, and the second exposed portion has a bent edge along a peripheral edge of the second recessed portion when viewed from the thickness direction.

In an embodiment of the present invention, the first insulating layer and the second insulating layer are preferably formed of a protective film.

In an aspect of the present invention, it is preferable that the first main portion is provided with a pair of first cut portions which are located at both ends in the second direction and which are recessed from a pair of angles of the main surface connected to the first side surface toward the inside of the first main portion, and the main surface is exposed from the pair of first cut portions.

In an aspect of the present invention, it is preferable that the second main portion is provided with a pair of second notches which are located at both ends in the second direction and which are recessed from the pair of main surfaces connected to the second side surface toward the inside of the second main portion, and the main surfaces are exposed from the pair of second notches.

In an aspect of the present invention, it is preferable that the second notch has a shape different from a shape of the first notch when viewed in the thickness direction.

In an aspect of the present invention, it is preferable that the first terminal portion has a first back portion continuous with the back surface and connected to the first side portion, and the first back portion is provided with a first protrusion portion adjacent to a boundary between the back surface and the first side surface and protruding in the thickness direction.

In an aspect of the present invention, it is preferable that the second terminal portion has a second back portion continuous with the back surface and connected to the second side portion, and a second convex portion adjacent to a boundary between the back surface and the second side surface and protruding in the thickness direction is provided in the second back portion.

In an aspect of the present invention, it is preferable that the first connection portion and the second connection portion overlap a diagonal line of the main surface when viewed in the thickness direction, and a center of the main surface is located between the first connection portion and the second connection portion when viewed in the thickness direction.

In an aspect of the present invention, it is preferable that the LED chip further includes a first wire connected to the LED chip and the first connection portion, and a second wire connected to the LED chip and the second connection portion, and columnar connection bodies are provided at an end portion of the first wire connected to the first connection portion and an end portion of the wire connected to the second connection portion, respectively.

In an aspect of the present invention, it is preferable that the sealing resin has a lens portion located at a position apart from the LED chip in the thickness direction, and the lens portion has a convex shape convex in the thickness direction.

According to a second aspect of the present invention, there is provided an LED display device comprising an LED module according to the first aspect of the present invention, a mounting board on which the LED module is mounted, and a case surrounding the LED module on a side of the mounting board where the LED module is located, wherein a predetermined gap is provided between the mounting board and the case in the thickness direction, and a thickness of the substrate of the LED module is larger than a length of the gap.

The effects of the present invention are as follows.

According to the LED module of the present invention, miniaturization can be achieved, and the amount of light flux emitted can be stabilized over a long period of time.

Other features and advantages of the present invention will become more apparent from the following detailed description, which proceeds with reference to the accompanying drawings.

Drawings

Fig. 1 is a top view of an LED assembly according to a first embodiment of the present invention.

Fig. 2 is a top view (through a sealing resin) of the LED module shown in fig. 1.

Fig. 3 is a bottom view of the LED assembly shown in fig. 1.

Fig. 4 is a front view of the LED assembly shown in fig. 1.

Fig. 5 is a left side view of the LED assembly shown in fig. 1.

Fig. 6 is a sectional view taken along line VI-VI of fig. 2.

Fig. 7 is a sectional view taken along line VII-VII of fig. 2.

Fig. 8 is a partially enlarged view of fig. 7 (the vicinity of the first back of the first terminal portion of the first wiring).

Fig. 9 is a partially enlarged view of fig. 7 (the vicinity of the second back portion of the second terminal portion of the second wire).

Fig. 10 is a partially enlarged view of fig. 7 (around the LED chip).

Fig. 11 is a partially enlarged view of fig. 2 (around the first connection portion of the first wiring).

Fig. 12 is a partially enlarged view of fig. 2 (around the second connection portion of the second wiring).

Fig. 13 is a partially enlarged view of fig. 6 (the periphery of the first insulating layer).

Fig. 14 is a partially enlarged view of fig. 6 (around the second insulating layer).

Fig. 15 shows the result of a test of the beam maintenance ratio with respect to the energization time of the LED module shown in fig. 1 and the LED module of the comparative example.

Fig. 16 is a top view of an LED assembly according to a second embodiment of the present invention.

Fig. 17 is a plan view (through a sealing resin) of the LED module shown in fig. 16.

Fig. 18 is a bottom view of the LED assembly shown in fig. 16.

Fig. 19 is a front view of the LED assembly shown in fig. 16.

Fig. 20 is a left side view of the LED assembly shown in fig. 16.

Fig. 21 is a sectional view taken along line XXI-XXI of fig. 17.

Fig. 22 is a sectional view of the LED display device according to the first embodiment of the present invention.

Fig. 23 is a top view of an LED module according to a third embodiment of the present invention.

Fig. 24 is a front view of the LED assembly shown in fig. 23.

Fig. 25 is a left side view of the LED assembly shown in fig. 23.

Fig. 26 is a sectional view taken along line XXVI-XXVI of fig. 23.

Fig. 27 is a sectional view of an LED display device according to a second embodiment of the present invention.

In the drawings, a10, a20, a 30-LED modules, B10, B20-LED display devices, 10-substrates, 10A-main surface, 10B-rear surface, 10C-first side surface, 10D-second side surface, 10E-third side surface, 11-fiberglass cloth, 12-impregnated resin, 131-first recess, 132-second recess, 20-first wiring, 21-first terminal portion, 211-first main portion, 211A-first cut-out portion, 212-first back portion, 212A-first convex portion, 213-first side portion, 23-first connection portion, 231-first opposite edge, 30-second wiring, 31-second terminal portion, 311-second main portion, 311A-second cut-out portion, 312-second back portion, 312A-second convex portion, 313-second side portion, 32-mounting portion, 321-gasket portion, 322-connection portion, 33-second connection portion, 331-second opposite edge portion, 40-second back portion, 312A-second convex portion, 313-second side portion, 32-mounting portion, 32-gasket portion, 321-gasket portion, 322-connection portion, 33-second cone surface portion, 331-second cone portion, 40A-second cone portion, 40A, T52-p-substrate portion, p 21, p-.

Detailed Description

The embodiment for carrying out the present invention (hereinafter referred to as "embodiment") will be described with reference to the drawings.

An LED module a10 according to a first embodiment of the present invention will be described with reference to fig. 1 to 14.

< LED Module A10 >

The LED module a10 includes a substrate 10, a first wire 20, a second wire 30, an LED chip 40, a first wire 51, a second wire 52, a first insulating layer 61, a second insulating layer 62, a polarity mark 69, and a sealing resin 70. The LED module a10 shown in these figures is a surface-mount type structure in which the first wiring 20 and the second wiring 30 are disposed on the substrate 10. Here, fig. 2 makes the sealing resin 70 transparent for easy understanding. In this figure, the outline of the transparent sealing resin 70 is shown by an imaginary line (two-dot chain line).

In the description of the LED module a10, the thickness direction of the substrate 10 will be referred to as "thickness direction z" for convenience. A direction orthogonal to the thickness direction z is referred to as a "first direction x". The first direction x corresponds to the longitudinal direction of the LED module a10 when viewed from the thickness direction z. A direction orthogonal to both the thickness direction z and the first direction x is referred to as a "second direction y". The second direction y corresponds to a short side direction of the LED module a10 when viewed from the thickness direction z.

As shown in fig. 2, 4, 6, and 7, the substrate 10 is provided with first wires 20, second wires 30, and LED chips 40. The substrate 10 has electrical insulation. The substrate 10 includes a plurality of glass fiber cloths 11 laminated in the thickness direction z and an impregnating resin 12 impregnated in the plurality of glass fiber cloths 11. The glass fiber cloth 11 is a cloth obtained by weaving glass fibers. In the example represented by LED assembly a10, the impregnating resin 12 includes an acrylic resin and a Bismaleimide Triazine (BT) resin. The acrylic resin is, for example, polymethyl methacrylate resin. In the example represented by the LED module a10, the plurality of glass cloth 11 is a double-layer structure.

As shown in fig. 2 to 5, the substrate 10 has a main surface 10A, a back surface 10B, a first side surface 10C, a second side surface 10D, a pair of third side surfaces 10E, a first concave portion 131, and a second concave portion 132. The main surface 10A and the back surface 10B face opposite to each other in the thickness direction z. The main surface 10A faces the side on which the LED chip 40 is located. The first side face 10C faces one side of the first direction x. The second side 10D faces the other side of the first direction x. The first side surface 10C and the second side surface 10D are connected to both the main surface 10A and the back surface 10B. The "one side in the first direction x" and the "other side in the first direction x" are also applied in the following description. The pair of third side surfaces 10E face the second direction y and are away from each other. The pair of third side surfaces 10E are connected to both the main surface 10A and the back surface 10B.

As shown in fig. 2 and 6, the first concave portion 131 is recessed from the first side surface 10C toward the inside of the substrate 10. The first concave portion 131 is substantially semicircular as viewed in the thickness direction z. The first recess 131 extends from the main surface 10A to the rear surface 10B. Therefore, the first recess 131 penetrates the substrate 10 in the thickness direction z.

As shown in fig. 2 and 6, the second concave portion 132 is recessed inward of the substrate 10 from the second side surface 10D. The second concave portion 132 is substantially semicircular as viewed from the thickness direction z. The second recess 132 extends from the main surface 10A to the rear surface 10B. Therefore, the second recess 132 penetrates the substrate 10 in the thickness direction z.

As shown in fig. 2 to 7, the first wiring 20 is disposed on the substrate 10. The first wiring 20 is connected to the substrate 10. The first wire 20 constitutes a part of a conductive path between the LED chip 40 and a wiring board on which the LED module a10 is mounted. The first wiring 20 is formed of, for example, a plurality of metal layers. In the example shown in the LED module a10, the plurality of metal layers are metal layers in which a copper (Cu) layer, a nickel (Ni) layer, and a gold (Au) layer are sequentially stacked from the side close to the substrate 10. Therefore, the surface of the first wiring 20 is metal. As shown in fig. 2, the first wiring 20 includes a first terminal portion 21 and a first connection portion 23.

As shown in fig. 2, the first terminal portion 21 is disposed on one side of the substrate 10 in the first direction x. The first terminal portion 21 is a portion for mounting the LED module a10 on the wiring board. As shown in fig. 2, 3, 5, and 6, the first terminal portion 21 has a first main portion 211, a first back portion 212, and a first side portion 213.

As shown in fig. 6 and 7, the first main portion 211 is connected to the main surface 10A of the substrate 10. As shown in fig. 2, the first main portions 211 reach both ends in the second direction y on the main face 10A. In addition, the first main portion 211 includes a portion formed along the peripheral edge of the first concave portion 131 of the substrate 10 as viewed in the thickness direction. As shown in fig. 2, 4, and 5, a pair of first cut portions 211A is provided in the first main portion 211. The pair of first cutout portions 211A are located at both ends of the first main portion 211 in the second direction y. The pair of first cut portions 211A are recessed from a pair of angles connecting the main surface 10A of the first side surface 10C of the substrate 10 toward the inside of the first main portion 211. The first notch portion 211A has a substantially rectangular shape as viewed in the thickness direction z. The main surface 10A is exposed from the pair of first cut portions 211A.

As shown in fig. 6 and 7, the first backside 212 is continuous with the back surface 10B of the substrate 10. As shown in fig. 3, both ends of the first back 212 in the second direction y are located inward of the peripheral edge of the back 10B when viewed in the thickness direction z. In addition, the first back 212 includes a portion formed along the peripheral edge of the first recess 131 of the substrate 10 as viewed in the thickness direction z. As shown in fig. 3 to 7, a pair of first convex portions 212A is provided on the first back surface 212. As shown in fig. 3 and 8, the pair of first protrusions 212A is adjacent to the boundary between the back surface 10B and the first side surface 10C of the substrate 10. The pair of first protrusions 212A protrude toward the side toward which the back surface 10B faces in the thickness direction z.

As shown in fig. 6, the first side portion 213 is continuous with the entirety of the first recess 131 of the substrate 10. Thereby, the first recess 131 is covered by the first side 213. The first side portion 213 is connected to both the first main portion 211 and the first back portion 212.

As shown in fig. 2, the first connection portion 23 is disposed on the main surface 10A of the substrate 10. The first connecting portion 23 is connected to the first main portion 211 of the first terminal portion 21. The first connection portion 23 is a portion for conducting the first wire 20 to the LED chip 40. The first connection portion 23 has a first opposing edge 231. The first facing edge 231 faces a peripheral edge of a pad portion 321 (described later in detail) of the mounting portion 32 (second wiring 30) when viewed in the thickness direction z. A predetermined space is provided between the first opposing edge 231 and the peripheral edge of the gasket portion 321.

As shown in fig. 2 to 7 (except fig. 5), the second wiring 30 is disposed on the substrate 10. The second wiring 30 is connected to the substrate 10. The second wire 30 constitutes a part of a conductive path between the LED chip 40 and the wiring board on which the LED module a10 is mounted, similarly to the first wire 20. The second wiring is formed of, for example, a plurality of metal layers. In the example shown in the LED module a10, the plurality of metal layers are a structure in which a copper layer, a nickel layer, and a gold layer are sequentially stacked from the side close to the substrate 10. Therefore, the surface of the second wiring 30 is gold. As shown in fig. 2, the second wire 30 includes a second terminal portion 31, a mounting portion 32, and a second connecting portion 33.

As shown in fig. 2, the second terminal portions 31 are disposed on the other side of the substrate 10 in the first direction x. The second terminal portion 31 is a portion for mounting the LED module a10 on the wiring board. As shown in fig. 2, 3 and 6, the second terminal portion 31 has a second main portion 311, a second back portion 312 and a second side portion 313.

As shown in fig. 6 and 7, the second main portion 311 is connected to the main surface 10A of the substrate 10. As shown in fig. 2, the second main portions 311 reach both ends in the second direction y in the main face 10A. In addition, the second main portion 311 includes a portion formed along the peripheral edge of the second recess 132 of the substrate 10 as viewed in the thickness direction z. As shown in fig. 2 and 4, the second main portion 311 is provided with a pair of second notch portions 311A. The pair of second cutout portions 311A are located at both ends of the second main portion 311 in the second direction y. The pair of second notch portions 311A are recessed from a pair of corners connected to the main surface 10A of the second side surface 10D of the substrate 10 toward the inside of the second main portion 311. The second notch 311A is substantially semicircular as viewed in the thickness direction z. The term "semicircular shape" refers to a shape obtained by dividing a semicircle into two halves. Therefore, the shape of the second notch portion 311A is different from the shape of the first notch portion 211A when viewed in the thickness direction z. The main surface 10A is exposed from the pair of first cut portions 211A.

As shown in fig. 6 and 7, the second back 312 is connected to the back surface 10B of the substrate 10. As shown in fig. 3, both ends of the second back 312 in the second direction y are located inward of the peripheral edge of the back surface 10B when viewed in the thickness direction z. In addition, the second backside 312 includes a portion formed along the peripheral edge of the second recess 132 of the substrate 10 as viewed in the thickness direction z. As shown in fig. 3 to 7 (except fig. 5), a pair of second protrusions 312A is provided on the second back 312. As shown in fig. 3 and 9, the pair of second protrusions 312A is adjacent to the boundary between the back surface 10B and the second side surface 10D of the substrate 10. The pair of second protrusions 312A protrude toward the side toward which the back surface 10B faces in the thickness direction z.

As shown in fig. 6, the second side portion 313 is connected to the entirety of the second protrusion 132 of the substrate 10. Thereby, the second convex portion 132 is covered by the second side portion 313. The second side portion 313 is connected to both the second main portion 311 and the second back portion 312.

As shown in fig. 2, the mounting portion 32 is disposed on the main surface 10A of the substrate 10. The mounting portion 32 is connected to the second main portion 311 of the second terminal portion 31. The mounting portion 32 is a portion for mounting the LED chip 40 on the second wire 30. The mounting portion 32 includes a gasket portion 321 and a coupling portion 322. The spacer portion 321 has a substantially circular shape overlapping the center C of the main surface 10A when viewed in the thickness direction z. The center C indicates the intersection of two diagonal lines F of the main surface 10A. The connection portion 322 is connected to both the gasket portion 321 and the second main portion 311. The coupling portion 322 is a belt shape extending in the first direction x when viewed from the thickness direction z.

As shown in fig. 2, the second connection portion 33 is disposed on the main surface 10A of the substrate 10. The second connection portion 33 is connected to the second main portion 311 of the second terminal portion 31. The second connection portion 33 is a portion for conducting the second wire 30 on the LED chip 40. The second connecting portion 33 has a second opposite edge 331. The second facing edge 331 faces the peripheral edge of the gasket portion 321 of the mounting portion 32 when viewed in the thickness direction z. A predetermined space is provided between the second opposing edge 331 and the peripheral edge of the gasket portion 321.

As shown in fig. 2, the first connection portion 23 of the first wiring 20 and the second connection portion 33 of the second wiring 30 overlap a diagonal line 10F of the main surface 10A of the substrate 10 when viewed in the thickness direction z. The center C of the main surface 10A is located between the first connection portion 23 and the second connection portion 33 as viewed in the thickness direction z.

As shown in fig. 2, 6, and 7, the LED chip 40 is mounted on the spacer portion 321 of the mounting portion 32 of the second wire 30. The LED chip 40 has a rectangular shape as viewed in the thickness direction z. As shown in fig. 10, the LED chip 40 has a front surface 40A, a back surface 40B, a base material 41, a plurality of semiconductor layers 42, a first electrode 43, and a second electrode 44. The surface 40A faces the side of the main surface 10A of the substrate 10 in the thickness direction z. The back surface 40B faces the opposite side of the surface 40A. Therefore, the back surface 40B faces the gasket portion 321 in the thickness direction z.

As shown in fig. 10, the substrate 41 supports a plurality of semiconductor layers 42, a first electrode 43, and a second electrode 44. The substrate 41 has electrical insulation. The constituent material of the substrate 41 is, for example, sapphire. In the thickness direction z, the surface of the base material 41 facing the gasket portion 321 of the mounting portion 32 corresponds to the back surface 40B.

As shown in fig. 10, a plurality of semiconductor layers 42 are stacked on a substrate 41 in a thickness direction z. The semiconductor layer 42 includes a first buffer layer 421, an n-type semiconductor layer 422, a second buffer layer 423, a light emitting layer 424, a first p-type semiconductor layer 425, and a second p-type semiconductor layer 426. These plural semiconductor layers 42 are each composed of a group III nitride semiconductor material.

The first buffer layer 421 is stacked in contact with the substrate 41. The first buffer layer 421 is composed of, for example, a gallium nitride (GaN) layer containing no dopant.

The n-type semiconductor layer 422 is stacked in contact with the first buffer layer 421. The n-type semiconductor layer 422 is made of, for example, a gallium nitride layer containing an n-type dopant. The n-type dopant is, for example, elemental silicon (Si).

The second buffer layer 423 is stacked in contact with the n-type semiconductor layer 422. The second buffer layer 423 is formed of, for example, a semiconductor layer in which a gallium azide layer is interposed between an indium gallium nitride (InGaN) layer. The semiconductor layer is stacked in plurality. The semiconductor layer contains silicon as an n-type dopant.

The light emitting layer 424 is stacked in contact with the second buffer layer 423. When a predetermined voltage is applied to the LED chip 40, light is emitted from the light emitting layer 424. The light-emitting layer 424 is formed of, for example, a semiconductor layer in which a gallium nitride layer containing an n-type dopant is stacked in indium gallium nitride. The n-type dopant is, for example, elemental silicon. The semiconductor layer is stacked in plurality.

The first p-type semiconductor layer 425 is stacked in contact with the light emitting layer 424. The first p-type semiconductor layer 425 is made of, for example, an aluminum gallium nitride (AlGaN) layer containing a p-type dopant. The p-type dopant is, for example, magnesium (Mg).

The second p-type semiconductor layer 426 is stacked in contact with the first p-type semiconductor layer 425. The second p-type semiconductor layer 426 is made of, for example, a gallium nitride layer containing a p-type dopant. The p-type dopant is, for example, magnesium. The concentration of p-type dopants in the second p-type semiconductor layer 426 is greater than the concentration of p-type dopants in the first p-type semiconductor layer 425. The surface of the second p-type semiconductor layer 426 facing the main surface 10A of the substrate 10 in the thickness direction z corresponds to the surface 40A.

The areas of the first buffer layer 421 and the n-type semiconductor layer 422 are equal to the area of the substrate 41 when viewed in the thickness direction z. In addition, the areas of the second buffer layer 423, the light-emitting layer 424, the first p-type semiconductor layer 425, and the second p-type semiconductor layer 426 are smaller than the area of the substrate 41 when viewed in the thickness direction z. This is because, as shown in fig. 2 and 10, the LED chip 40 is provided with a recess 40C. The recess 40C is recessed from the surface 40A in the thickness direction z and reaches the upper surface of the n-type semiconductor layer 422. The recess 40C has a rectangular shape when viewed in the thickness direction z. The concave portion 40C is connected to three side surfaces of the LED chip 40.

As shown in fig. 10, the first electrode 43 is continuous with the surface 40A. The first electrode 43 is formed of, for example, a metal layer in which a metal is laminated on a titanium (Ti) layer. The first electrode 43 is an anode (positive electrode) of the LED chip 40.

As shown in fig. 10, the second electrode 44 is continuous with the upper surface of the n-type semiconductor layer 422 constituting the recess 40C. The second electrode 44 is formed of, for example, a metal layer in which a metal is laminated on a titanium layer. The second electrode 44 is a cathode (negative electrode) of the LED chip 40.

As shown in fig. 2, 6, 7, and 10, the LED chip 40 is mounted on the pad portion 321 of the mounting portion 32 of the second wire 30 via the bonding layer 49. The bonding layer 49 is interposed between the gasket portion 321 and the back surface 10B. The bonding layer 49 is, for example, a synthetic resin agent containing silicone as a main component.

As shown in fig. 2, the first wire 51 is connected to the first electrode 43 of the LED chip 40 and the first connection portion 23 of the first wire 20. Thereby, the LED chip 40 is electrically connected to the first wire 20. The constituent material of the first wire 51 is, for example, gold. The first wire 51 is formed by wire bonding.

As shown in fig. 11, the first wire 51 has an end portion 511 connected to the first connection portion 23 of the first wiring 20. The end portion 511 has a circular shape as viewed in the thickness direction z. A connecting body 512 is provided on the end portion 511. As shown in fig. 7 and 11, the connecting body 512 has a columnar shape. The connection body 512 is formed by applying ball bonding to a portion of the first wire 51 connected to the first connection portion 23 after the first wire 51 is connected to the first connection portion 23 by wire bonding. The connector 512 has a tongue 512A. The tongue portion 512A protrudes in the direction in which the first wire 51 extends, on the side away from the LED chip 40 (see fig. 2), when viewed in the thickness direction z.

As shown in fig. 2, the second wire 52 is connected to the second electrode 44 of the LED chip 40 and the second connection portion 33 of the second wire 30. Thereby, the LED chip 40 is electrically connected to the second wire 30. The constituent material of the second wire 52 is, for example, gold. The first wire 51 is formed by wire bonding.

As shown in fig. 12, the second wire 52 has an end 521 connected to the second connection portion 33 of the second wiring 30. The end 521 has a circular shape when viewed in the thickness direction z. A connector 522 is provided on the end 521. As shown in fig. 7 and 12, the connecting body 522 has a columnar shape. The connector 522 is formed by performing ball bonding on a portion of the second wire 52 connected to the second connection portion 33 after the second wire 52 is connected to the second connection portion 33 by wire bonding. The connector 522 has a tongue 522A. The tongue portion 522A protrudes in the direction in which the second wire 52 extends, to the side away from the LED chip 40 (see fig. 2), when viewed in the thickness direction z.

As shown in fig. 1, 2, 4, 6, and 7, the first insulating layer 61 covers at least a part of the first main portion 211 of the first terminal portion 21 of the first wire 20. In the example represented by the LED module a10, the first insulating layer 61 covers a part of the first connection portion 23 of the first wiring 20. The first insulating layer 61 reaches both ends in the second direction y in the main surface 10A of the substrate 10. The first insulating layer 61 has electrical insulation. The first insulating layer 61 is composed of a protective film.

As shown in fig. 1, 2, 4, 6, and 7, the first insulating layer 61 has a first intermediate portion 611 and a first exposed portion 612. The first intermediate portion 611 is located between the main surface 10A of the substrate 10 and the sealing resin 70 in the thickness direction z. The first intermediate portion 611 is covered with the sealing resin 70 except for a pair of end surfaces facing the second direction y. The first exposed portion 612 is connected to one side of the first intermediate portion 611 in the first direction x. The first exposed portion 612 is exposed from the sealing resin 70. The first exposed portion 612 is in the form of a strip extending in the second direction y when viewed in the thickness direction z.

As shown in fig. 13, the first intermediate portion 611 has a tapered surface 611A, the tapered surface 611A is inclined at an inclination angle α 1 with respect to the main surface 10A of the substrate 10, the inclination angle α 1 is an acute angle, and therefore, the cross-sectional area of the first intermediate portion 611 with respect to the thickness direction z becomes gradually larger as it goes away from the main surface 10A.

As shown in fig. 13, the first exposed portion 612 has a tapered surface 612A, the tapered surface 612A is inclined at an inclination angle α 2 with respect to the main surface 10A of the substrate 10, and the inclination angle α 2 is an acute angle, and therefore, the cross-sectional area of the first exposed portion 612 with respect to the thickness direction z gradually increases as it goes away from the main surface 10A.

As shown in fig. 1, 2, 4, 6, and 7, the second insulating layer 62 covers at least a portion of the second main portion 311 of the second terminal portion 31 of the second wire 30. In the example shown in the LED module a10, the second insulating layer 62 covers the connection portion 322 of the mounting portion 32 of the second wire 30 and a part of the second connection portion 33 of the second wire 30. The second insulating layer 62 reaches both ends in the second direction y in the main surface 10A of the substrate 10. The second insulating layer 62 has electrical insulation. The second insulating layer 62 is composed of a protective film.

As shown in fig. 1, 2, 4, 6, and 7, the second insulating layer 62 has a second intermediate portion 621 and a second exposed portion 622. The second intermediate portion 621 is interposed between the main surface 10A of the substrate 10 and the sealing resin 70 in the thickness direction z. The second intermediate portion 621 is covered with the sealing resin 70 except for a pair of end surfaces facing the second direction y. The second exposed portion 622 is connected to the other side of the second intermediate portion 621 in the first direction x. The second exposed portion 622 is exposed from the sealing resin 70. As shown in fig. 2, the second exposed portion 622 has a curved edge 622B along the peripheral edge of the second recess 132 of the substrate 10 when viewed in the thickness direction z. Therefore, the shape of the second exposed portion 622 is different from the shape of the first exposed portion 612 of the first insulating layer when viewed in the thickness direction z.

As shown in fig. 14, the second intermediate portion 621 has a tapered surface 621A. the tapered surface 621A is inclined at an inclination angle β 1 with respect to the main surface 10A of the substrate 10. the inclination angle β 1 is an acute angle, and therefore, the cross-sectional area of the second intermediate portion 621 with respect to the thickness direction z becomes gradually larger as it goes away from the main surface 10A.

As shown in fig. 14, the second exposed portion 622 has a tapered surface 622A, the tapered surface 622A is inclined at an inclination angle β 2 with respect to the main surface 10A of the substrate 10, and the inclination angle β 2 is an acute angle, and therefore, the cross-sectional area of the second exposed portion 622 with respect to the thickness direction z gradually increases as it goes away from the main surface 10A.

As shown in fig. 3, the polarity mark 69 is disposed on the rear surface 10B of the substrate 10. The polarity mark 69 is located between the first back 212 of the first terminal portion 21 of the first wire 20 and the second back 312 of the second terminal portion 31 of the second wire 30 in the first direction x. The polarity flag 69 indicates the anode of the LED assembly a 10. In the example represented by LED assembly a10, the triangular shaped portion in polarity label 69 indicates the anode. Thus, the polarity mark 69 indicates that the first back 212 is an anode. The polarity mark 69 is made of, for example, a protective film.

As shown in fig. 1 and 4 to 7, the sealing resin 70 is supported by the substrate 10 and covers the LED chip 40, the first wire 51, and the second wire 52. The sealing resin 70 also covers a part of each of the main surface 10A of the substrate 10, the first wiring 20, the second wiring 30, the first insulating layer 61, and the second insulating layer 62. The sealing resin 70 is made of an epoxy resin containing silicone and having light transmittance. The silicone is composed of a plurality of fine particles, for example. The main component of the epoxy resin is, for example, an alicyclic epoxy resin (cycloaliphatic epoxy resin) containing no benzene ring. The sealing resin 70 may contain a plurality of phosphors (not shown). For example, when the LED chip 40 emits blue light, white light is emitted from the LED module a10 by containing a plurality of yellow phosphors in the sealing resin 70. A pair of end faces of the sealing resin 70 facing the second direction y are the same face as the pair of third side faces 10E of the substrate 10.

Next, the operational effect of the LED module a10 will be described.

The LED module a10 includes a substrate 10 on which the LED chip 40 is mounted with the first and second wires 20 and 30 arranged, and a sealing resin 70 covering the LED chip 40. The substrate 10 includes a plurality of glass fiber cloths 11 laminated in a thickness direction z and an impregnating resin 12 impregnated with the plurality of glass fiber cloths 11. The impregnating resin 12 contains an acrylic resin. The sealing resin 70 contains silicone. Accordingly, the durability of the substrate 10 and the sealing resin 70 is improved with respect to the light emitted from the LED chip 40, and thus the amount of the light flux emitted from the LED module a10 is stable for a long period of time. Further, since the plurality of glass fiber cloths 11 are contained in the substrate 10, even when the thickness of the substrate 10 is made smaller, it is possible to avoid a decrease in the bending strength and the shear strength of the substrate 10. Therefore, the LED module a10 can be downsized and stabilize the amount of emitted light beam for a long period of time.

Fig. 15 shows the results of the tests of the light flux maintenance ratios with respect to the energization time of the LED module a10 and the LED module of the comparative example. The LED module substrate of the comparative example contained bismaleimide triazine resin. The sealing resin 70 of the LED module of the comparative example has the same structure as the sealing resin 70 of the LED module a 10. The test conditions were that the ambient temperature (Ta) was 80 ℃ and the forward current (IF) was 20 mA. As shown in fig. 15, in the LED module a10, the beam maintenance ratio was almost maintained at 100% even when the energization time reached 1000 h. On the other hand, in the LED module of the comparative example, the beam maintenance ratio gradually decreased as the energization time increased, and the beam maintenance ratio was 37% when the energization time reached 1000 h. Thus, the LED module a10 can confirm that the amount of emitted light beam is stable for a long period of time.

The LED module a10 further includes a first insulating layer 61 and a second insulating layer 62. The first insulating layer 61 and the second insulating layer 62 reach both ends in the second direction y on the main surface 10A of the substrate 10. The first insulating layer 61 has a first intermediate portion 611 located between the main surface 10A of the substrate 10 and the sealing resin 70 in the thickness direction z, and a first exposed portion 612 connected to the first intermediate portion 611 and exposed from the sealing resin 70. The second insulating layer 62 includes a second intermediate portion 621 located between the main surface 10A and the sealing resin 70 in the thickness direction z, and a second exposed portion 622 connected to the second intermediate portion 621 and exposed from the sealing resin 70. Thus, when the sealing resin 70 is formed by transfer molding, the first exposed portion 612 and the second exposed portion 622 are pressed by the metal mold, and thus the space between the main surface 10A and the sealing resin 70 is filled with the first intermediate portion 611 and the second intermediate portion 621. Therefore, the bonding strength of the sealing resin 70 to the first insulating layer 61 and the second insulating layer 62 of the substrate 10 can be improved. In addition, when the LED module a10 is mounted, it is possible to reliably avoid solder from entering the main surface 10A covered with the sealing resin 70.

The shape of the second exposed portion 622 of the second insulating layer 62 is different from the shape of the first exposed portion 612 of the first insulating layer 61 when viewed in the thickness direction z. Thus, even after the LED module a10 is mounted on the wiring board, the anode of the LED module a10 can be visually recognized from the outside. The first exposed portion 612 and the second exposed portion 622 can have different shapes from each other by forming the first insulating layer 61 and the second insulating layer 62 from a protective film.

A pair of first cutouts 211A are provided in the first main portion 211 of the first terminal portion 21 of the first wiring 20, which are located at both ends in the second direction y and are recessed from the pair of angles connecting to the main surfaces 10A of the first side surface 10C of the substrate 10 toward the inside of the first main portion 211. The main surface 10A is exposed from the pair of notches 211A. Accordingly, the first side surface 10C and the pair of third side surfaces 10E of the substrate 10 are the same surface, and the area of the end surfaces of the first main portion 211 can be reduced. This helps suppress the generation of metal burrs caused by the cutting of the second wiring 20 during the manufacturing process of the LED module a 10.

A pair of second cutout portions 311A are provided in the second main portion 311 of the second terminal portion 31 of the second wire 30, which are located at both ends in the second direction y and are recessed from the pair of main surfaces 10A connected to the second side surface 10D of the substrate 10 toward the inside of the second main portion 311. The main surface 10A is exposed from the pair of second notches 311A. Accordingly, the second side surface 10D and the pair of third side surfaces 10E of the substrate 10 are the same surface, and the area of the end surfaces of the second main portion 311 can be reduced. This contributes to suppressing the generation of metal burrs caused by the cutting of the second wiring 20 in the manufacturing process of the LED module a 10.

The shape of the pair of first cutouts 211A of the first main portion 211 (the first terminal portion 21 of the first wire 20) is different from the shape of the pair of second cutouts 311A of the second main portion 311 (the second terminal portion 31 of the second wire 30) when viewed in the thickness direction z. Thus, even after the LED module a10 is mounted on the wiring board, the anode of the LED module a10 can be visually recognized from the outside.

The first protruding portion 212A that is adjacent to the boundary between the back surface 10B and the first side surface 10C of the substrate 10 and protrudes in the thickness direction z is provided on the first back portion 212 of the first terminal portion 21 of the first wiring 20. Thus, when the LED module a10 is mounted on the wiring board, since a pitching effect (anchor effect) with respect to the solder can be obtained in the first back 212, the mounting strength of the LED module a10 with respect to the wiring board can be improved.

A second convex portion 312A protruding in the thickness direction z is provided on the second back portion 312 of the second terminal portion 31 of the second wiring, adjacent to the boundary between the back surface 10B and the second side surface 10D of the substrate 10. Thus, when the LED module a10 is mounted on the wiring board, since the throwing effect with respect to the solder can be obtained in the second back 312, the mounting strength of the LED module a10 with respect to the wiring board can be improved.

The LED module a10 further includes a first wire 51 and a second wire 52. Columnar connecting bodies 512 and 522 are provided on an end portion 511 of the first wire 51 connected to the first connection portion 23 of the first wiring 20 and an end portion 521 of the second wire 52 connected to the second connection portion 33 of the second wiring 30, respectively. This can prevent the end portion 511 from being peeled off from the first connection portion 23 in the first wire 51. In addition, in the second wire 52, the end portion 521 can be prevented from being peeled off from the second connection portion 33.

Next, an LED module a20 according to a second embodiment of the present invention and an LED display device B10 according to a first embodiment of the present invention will be described with reference to fig. 16 to 22. In these drawings, the same or similar elements as those of the LED module a10 are denoted by the same reference numerals, and redundant description thereof is omitted.

< LED Module A20 >

The LED module a20 will be described with reference to fig. 16 to 21. The LED module a20 is different from the LED module a10 in the structure of the substrate 10, the first insulating layer 61, the second insulating layer 62, and the polarity mark 69. The structure of the sealing resin 70 of the LED module a20 is the same as that of the LED module a 10. Here, fig. 17 makes the sealing resin 70 transparent for easy understanding. In this figure, the outline of the transparent sealing resin 70 is shown by an imaginary line.

As shown in fig. 19 to 21, the thickness of the substrate 10 is larger than the thickness of the substrate 10 of the LED module a 10. As shown in fig. 21, a plurality of glass fiber cloths 11 laminated in the thickness direction z and an impregnating resin 12 impregnated with the plurality of glass fiber cloths 11 are included on a substrate 10. The impregnating resin 12 contains an acrylic resin. The acrylic resin is, for example, polymethyl methacrylate resin. In the example represented by the LED module a20, the plurality of glass cloth 11 has a four-layer structure.

As shown in fig. 16 and 17, a concave notch is formed in the first exposed portion 612 of the first insulating layer 61 along the peripheral edge of the first concave portion 131 of the substrate 10 when viewed in the thickness direction z. In addition, a rectangular cutout surrounding the peripheral edge of the second recess 132 of the substrate 10 when viewed in the thickness direction z is formed in the second exposed portion 622 of the first insulating layer 61. Therefore, in the LED module a20, the shape of the second exposed portion 622 is different from that of the first exposed portion 612 when viewed in the thickness direction z.

As shown in fig. 18, the polarity mark 69 is disposed on the rear surface 10B of the substrate 10. In the example represented by LED assembly a20, the strip-shaped portion of the polarity label 69 extending in the second direction y indicates the anode. Therefore, the polarity mark 69 indicates that the first back portion 212 of the first terminal portion 21 of the first wiring 20 is the anode.

< LED display B10 >

The LED display device B10 will be described with reference to fig. 22. The LED display device B10 includes an LED module a20, a mounting board 81, and a housing 82. The LED display device B10 shown in fig. 22 is applied to, for example, an instrument panel (instrumentation panel) of a vehicle.

Wiring (not shown) and the like are disposed on the mounting board 81. The LED module a20 is mounted on the mounting board 81 by solder. The housing 82 surrounds the LED module a20 on the side where the LED module a20 is located with respect to the mounting substrate 81. The material of the housing 82 is a synthetic resin such as polypropylene resin. The housing 82 is formed by injection molding. An opening 821 is provided in the housing 82. The opening 821 is located on the opposite side to the side adjacent to the mounting substrate 81, among both ends of the housing 82 in the thickness direction z. The opening 821 penetrates in the thickness direction z. In the LED display device B10, the opening 821 may be configured to be closed by a light-transmitting plate (not shown).

A predetermined gap Δ g is provided between the mounting substrate 81 and the housing 82 in the thickness direction z. The thickness T of the substrate 10 of the LED module a20 is larger than the length of the gap Δ g. The thickness T of the substrate 10 is preferably twice or more the length of the gap Δ g.

Next, the operation and effects of the LED module a20 and the LED display device B10 will be described.

The LED module a20 includes the substrate 10 on which the LED chip 40 is mounted with the first wires 20 and the second wires 30 arranged, and the sealing resin 70 covering the LED chip 40, similarly to the LED module a 10. The substrate 10 includes a plurality of glass fiber cloths 11 laminated in a thickness direction z and an impregnating resin 12 impregnated with the plurality of glass fiber cloths 11. The impregnating resin 12 contains an acrylic resin. The sealing resin 70 contains silicone. Therefore, the LED module a20 can be miniaturized and the amount of emitted light beam can be stabilized for a long period of time.

The LED display device B10 includes an LED module a20, a mounting board 81, and a housing 82. A predetermined gap Δ g is provided between the mounting substrate 81 and the housing 82 in the thickness direction z. The thickness T of the substrate 10 of the LED module a20 is larger than the length of the gap Δ g. This can suppress the amount of light flux emitted from the LED module a20 and leaking from the gap Δ g. Further, if the thickness T of the substrate 10 is 2 times or more the length of the gap Δ g, the amount of light beam leaking from the gap Δ g can be more effectively suppressed, and therefore, it is not necessary to provide a light guide (light guide) above the LED module a20 on the housing 82.

Next, an LED module a30 according to a third embodiment of the present invention and an LED display device B20 according to a second embodiment of the present invention will be described with reference to fig. 23 to 27. In these drawings, the same or similar elements as those of the LED module a10 and the LED display device B10 are denoted by the same reference numerals, and redundant description thereof is omitted.

< LED Module A30 >

The LED module a30 will be described with reference to fig. 23 to 26. The LED module a30 differs from the LED module a20 in the structure of the sealing resin 70. The structure of the substrate 10 of the LED module a30 is the same as that of the LED module a 20.

As shown in fig. 23 to 26, the sealing resin 70 includes a base portion 71 and a lens portion 72. The base 71 is supported by the substrate 10 and covers the LED chip 40, the first wire 51, and the second wire 52. The base 71 also covers a part of each of the main surface 10A of the substrate 10, the first wiring 20, the second wiring 30, the first insulating layer 61, and the second insulating layer 62. The base 71 has a truncated pyramid shape. A pair of end surfaces of the base portion 71 facing the second direction y are the same as the pair of third side surfaces 10E of the base portion 10. The lens portion 72 is separated from the LED chip 40 in the thickness direction z. The lens portion 72 is connected to the base portion 71. The lens portion 72 is convex in the thickness direction z. The sealing resin 70 is made of a light-transmitting epoxy resin containing silicone, similar to the sealing resin 70 of the LED module a 10.

< LED display B20 >

The LED display device B20 will be described with reference to fig. 27. The LED display device B20 is different from the LED display device B10 in that the LED module a30 is provided instead of the LED module a 20.

A predetermined gap Δ g is provided between the mounting substrate 81 and the housing 82 in the thickness direction z. The thickness T of the substrate 10 of the LED module a30 is larger than the length of the gap Δ g. The thickness T of the substrate 10 is preferably 2 times or more the length of the gap Δ g.

Next, the operation and effects of the LED module a30 and the LED display device B20 will be described.

The LED module a30 includes the substrate 10 on which the LED chip 40 is mounted with the first wires 20 and the second wires 30 arranged, and the sealing resin 70 covering the LED chip 40, similarly to the LED module a 10. The substrate 10 includes a plurality of glass fiber cloths 11 laminated in a thickness direction z and an impregnating resin 12 impregnated with the plurality of glass fiber cloths 11. The impregnating resin 12 contains an acrylic resin. The sealing resin 70 contains silicone. Therefore, the LED module a30 can be downsized and stabilize the amount of emitted light beam for a long period of time.

The LED display device B20 includes an LED module a30, a mounting board 81, and a housing 82. A predetermined gap Δ g is provided between the mounting substrate 81 and the housing 82 in the thickness direction z. The thickness T of the substrate 10 of the LED module a30 is larger than the length of the gap Δ g. This can suppress the amount of light flux emitted from the LED module a30 and leaking from the gap Δ g.

The sealing resin 70 has a lens portion 72 separated from the LED chip 40 in the thickness direction z. The lens portion 72 is convex in the thickness direction z. This improves the directivity of the light beam emitted from the LED module a 30. Therefore, in the LED display device B20, the amount of light flux leaking from the gap Δ g can be more effectively suppressed. Therefore, it is not necessary to provide a light guide above the LED module a30 on the housing 82.

The present invention is not limited to the above-described embodiments. The specific structure of each part of the present invention can be variously changed in design.