阅读说明：本技术 激光模块及激光组件 (Laser module and laser assembly ) 是由 刘鸣 王欢 付团伟 于 2019-11-08 设计创作，主要内容包括：本发明实施例提供一种激光模块及激光组件,所述模块包括至少两个激光芯片模组,其中,每个激光芯片模组包括：至少一激光芯片、至少二导电衬底、以及一绝缘衬底,激光芯片的正极面和负极面分别键合于不同的导电衬底的同一端,所述激光芯片模组内不同导电衬底的另一端共同键合于同一绝缘衬底上,相邻激光芯片模组的绝缘衬底之间相互独立。基于本发明实施例提供的激光模块及激光组件,能够大幅度消减了在封装过程中产生的应力,进而有效减小了激光芯片发光面承受的应力,有效降低了激光芯片产生裂纹的可能性。(The embodiment of the invention provides a laser module and a laser component, wherein the module comprises at least two laser chip modules, and each laser chip module comprises: the laser chip module comprises at least one laser chip, at least two conductive substrates and an insulating substrate, wherein the anode surface and the cathode surface of the laser chip are respectively bonded to the same ends of different conductive substrates, the other ends of different conductive substrates in the laser chip module are commonly bonded to the same insulating substrate, and the insulating substrates of adjacent laser chip modules are mutually independent. The laser module and the laser assembly provided by the embodiment of the invention can greatly reduce the stress generated in the packaging process, further effectively reduce the stress borne by the light emitting surface of the laser chip and effectively reduce the possibility of generating cracks in the laser chip.)

1. A laser module, comprising at least two laser chip modules, wherein,

each laser chip module includes: the laser chip comprises at least one laser chip, at least two conductive substrates and an insulating substrate, wherein the anode surface and the cathode surface of the laser chip are respectively bonded at the same end of different conductive substrates;

the other ends of the different conductive substrates in the laser chip modules are bonded on the insulating substrate together, and the insulating substrates of the adjacent laser chip modules are independent.

2. The module of claim 1, wherein a stress relief region for relieving stress is provided between the insulating substrates of adjacent laser chip modules.

3. The module of claim 1, wherein in the laser chip modules at both ends of the module:

the outer edge of the insulating substrate in the at least one end laser chip module is aligned with the outer edge of the conductive substrate; and/or the laser chip module at least one end further comprises: and the auxiliary substrate is used for slowly releasing the stress of the end laser chip module.

4. The module of claim 3, wherein when the laser chip module at least one end further comprises an auxiliary substrate for releasing stress of the end laser chip module,

one end of the auxiliary substrate is aligned with the outer edge of the conductive substrate of the end laser chip module, and a stress release area for slowly releasing stress is arranged between the other end of the auxiliary substrate and the insulating substrate of the end laser chip module.

5. A module according to claim 2 or 4, characterized in that a filling body for slow-release of stress is arranged in the stress-release zone.

6. The module of claim 5, wherein the filler body comprises: rubber, or fiber, or plastic, or polymer adhesive, or metal material.

7. The module of claim 2 or 4, wherein the stress relief region is a gap.

8. The module of claim 2, wherein, in the stacking direction of at least two laser chip modules, both side boundaries of the stress relief region are located in a region corresponding to the thickness of the conductive substrate.

9. A laser module, comprising the module of any one of claims 1 to 8, and a heat sink for dissipating heat of the module, wherein the insulating substrates corresponding to the laser chip modules of the laser module are respectively bonded to the heat sink.

10. The module of claim 9, wherein adjacent laser chip modules have a common conductive substrate therebetween, and a surface of the other end of the common conductive substrate is bonded to both insulating substrates of the adjacent laser chip modules simultaneously.

Technical Field

The invention relates to the field of semiconductor lasers, in particular to a laser module and a laser assembly.

Background

The conduction cooling type semiconductor laser stacked array product has great application advantages due to small bar spacing and high output power and energy density. The structure is that a chip and a conductive substrate are packaged into an array structure, and the array structure and a heat sink are packaged into a semiconductor laser module through an insulating substrate.

At present, the mode of connecting the insulating substrate with the heat sink and the semiconductor laser array structure is mainly an independent insulating substrate structure, that is, the positions of the insulating substrate and the conductive substrate in the array structure are respectively in one-to-one correspondence. In the packaging process, the heat sink is greatly deformed due to temperature change and acts on the insulating substrate, and the light emitting surface of the chip is subjected to large tensile stress due to a gap between the insulating substrate and the conductive substrate, so that the risk of cracks is high.

Disclosure of Invention

In view of the above, one of the main objectives of the embodiments of the present invention is to provide a laser module and a laser assembly, in which a novel laser chip module structure is designed, so that a plurality of conductive substrates in the same module are bonded to the same insulating substrate, the insulating substrates between different modules are independent from each other, and a stress release region is designed between the insulating substrates of different modules, thereby substantially reducing stress generated during a packaging process, further effectively reducing stress borne by a light emitting surface of the laser chip, and effectively reducing the possibility of cracks generated by the laser chip.

The technical scheme of the invention is realized as follows:

the embodiment of the invention provides a laser module, which comprises at least two laser chip modules, wherein each laser chip module comprises: the laser chip comprises at least one laser chip, at least two conductive substrates and an insulating substrate, wherein the anode surface and the cathode surface of the laser chip are respectively bonded at the same end of different conductive substrates; the other ends of the different conductive substrates in the laser chip modules are bonded on the insulating substrate together, and the insulating substrates of the adjacent laser chip modules are independent.

In the above scheme, a stress release region for slowly releasing stress is arranged between the insulating substrates of the adjacent laser chip modules.

In the above scheme, in the laser chip modules at both ends of the module: the outer edge of the insulating substrate in the at least one end laser chip module is aligned with the outer edge of the conductive substrate; and/or the laser chip module at least one end further comprises: and the auxiliary substrate is used for slowly releasing the stress of the end laser chip module.

In the above scheme, when the laser chip module at least at one end further comprises an auxiliary substrate for slowly releasing stress of the end laser chip module, one end of the auxiliary substrate is aligned with the outer edge of the conductive substrate of the end laser chip module, and a stress release area for slowly releasing stress is arranged between the other end of the auxiliary substrate and the insulating substrate of the end laser chip module.

In the above scheme, the stress release region is internally provided with a filling body for slowly releasing stress.

In the above aspect, the filling body includes: rubber, or fiber, or plastic, or polymer adhesive, or metal material.

In the above scheme, the stress release region is a gap.

In the above scheme, in the stacking direction of at least two laser chip modules, the boundaries of both sides of the stress release region are located in the region corresponding to the thickness of the conductive substrate.

The embodiment of the invention also provides a laser assembly, which comprises the module and a heat sink for dissipating heat of the module, wherein the insulating substrates corresponding to the laser chip modules of the laser module are respectively bonded on the heat sink.

In the above scheme, a common conductive substrate is provided between adjacent laser chip modules, and the surface of the other end of the common conductive substrate is simultaneously bonded on two insulating substrates of the adjacent laser chip modules.

The invention has the following beneficial technical effects:

in the packaging process of the device, stress mainly acts on the conductive substrate, and the design of the novel structural relationship among the laser chip, the conductive substrate and the insulating substrate and the design of the stress release area reduce the stress in the whole packaging process, thereby reducing the stress born by the laser chip in the packaging process and effectively solving the problem that the reliability of the product is reduced and even the product fails because the laser chip cracks due to the stress in the existing scheme.

Drawings

FIG. 1 is a schematic structural diagram of a laser module and a laser assembly according to a first embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a second embodiment of a laser module and a laser assembly according to the present invention;

fig. 3 is a schematic structural diagram of a laser module and a laser assembly according to a third embodiment of the invention.

Description of reference numerals: the laser chip module comprises a laser chip 1, a laser chip 11, a laser chip anode face 12, a laser chip cathode face 2, a conductive substrate 2 ', a shared conductive substrate 2', an insulating substrate 3, a stress release area 4, an auxiliary substrate 5, a conductive substrate thickness area d, laser chip modules at two ends a and b respectively, a second laser chip module on the left side c, an insulating substrate corresponding to the laser chip module a 31, an insulating substrate corresponding to the laser chip module c 32 and a heat sink 6.

Detailed Description

The main realization thought of the embodiment of the invention is as follows: at least two conductive substrates in the laser chip module are bonded on the same insulating substrate, the insulating substrates of the adjacent laser chip modules are independent of each other, and a stress release area is arranged between the adjacent insulating substrates (namely the insulating substrates and the conductive substrates are arranged in a staggered mode), so that stress generated in the packaging process can be effectively released, the damage of the stress to the laser chip during packaging is effectively avoided, and the reliability and the service life of the product are greatly improved.

The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

The embodiment of the invention discloses a laser module, which comprises at least two laser chip modules, wherein each laser chip module can comprise: at least one laser chip 1, at least two conductive substrates 2, and an insulating substrate 3; the laser chip module comprises a laser chip 1, a positive electrode face 11 and a negative electrode face 12, wherein the positive electrode face 11 and the negative electrode face 12 of the laser chip 1 are respectively bonded to the same ends of different conductive substrates 2, the other ends of the different conductive substrates 2 in the laser chip module are commonly bonded to the same insulating substrate 3, and specifically, all surfaces or partial surfaces of the other ends of the different conductive substrates 2 are commonly bonded to the same insulating substrate 3.

As can be known from the above, the laser chip module is the smallest component unit of the laser module, and the smallest component unit may include at least one laser chip and at least two conductive substrates inside, but includes an insulating substrate, which is the special design of the invention.

In the embodiment of the present invention, as described in the above paragraph, for the conductive substrate, "one end" refers to an end portion thereof to which the laser chip is bonded, and "the other end" refers to an end portion thereof to which the insulating substrate is bonded.

"the other end surfaces of the different conductive substrates 2 are bonded to the same insulating substrate 3 in common on all or part of the surfaces thereof" means: in a laser chip module, taking two conductive substrates as an example, the whole surface or partial surface of the other end of one conductive substrate and the whole surface or partial surface of the other end of the other conductive substrate are jointly bonded on the same insulating substrate.

For example, the partial surfaces of the other ends of the two conductive substrates are bonded together on the same insulating substrate (for example, the laser chip module located in the middle of fig. 1 to 3), so that a structure in which the conductive substrate and the insulating substrate are arranged in a staggered manner is formed: referring to fig. 2, in the laser chip module a at the end, 2 conductive substrates, i.e., conductive substrates 2 and 2 ', are bonded to the insulating substrate 31, part of the surfaces of the conductive substrates 2 and 2 ' are bonded to the insulating substrate 31, the other part of the surfaces of the conductive substrates 2 and 2 ' are bonded to the insulating substrate 32 of the adjacent laser chip module c, and so on.

Or, taking the laser chip module located at the end as an example, the outer edge of the outer conductive substrate is aligned with the edge of the insulating substrate in the corresponding laser chip module, that is, the entire surface of the other end of the outer conductive substrate and the partial surface of the other conductive substrate in the same laser chip module are bonded to the same insulating substrate, as shown in the laser chip module at the right end in fig. 2 and the laser chip modules at the two ends in fig. 3.

Fig. 1 to 3 show different embodiments of the laser module and assembly according to the invention, respectively, and the following scheme is explained with reference to fig. 1 to 3.

Specifically, as shown in fig. 1 to 3, at least two laser chip modules included in the laser module may be stacked on each other in a horizontal direction to form an array, where an arrow in fig. 1 indicates the horizontal direction (stacking direction of the laser chip modules). Adjacent laser chip modules may have a common conductive substrate 2 (2') therebetween, and the number of different conductive substrates bonded to the same insulating substrate is at least two for each laser chip module.

The following embodiments of the present invention are exemplified by including one laser chip 1 and two conductive substrates 2 (i.e. 2 conductive substrates 2 are bonded to the same insulating substrate 3) in each laser chip module, but this does not constitute a specific limitation on the number of conductive substrates bonded to one insulating substrate and the number of laser chips included in each laser chip module.

Further, the insulating substrates 3 of the adjacent laser chip modules are independent from each other, the design mode can reduce the stress between the adjacent laser chip modules to a certain extent, and on the basis, a stress release area 4 for slowly releasing the stress can be further arranged between the adjacent insulating substrates 3.

In addition, at least one of the laser chip modules (i.e. at least one of the laser chip modules) at both ends of the module further includes: and the auxiliary substrate 5 is used for slowly releasing the stress of the end laser chip module.

Fig. 1 shows a scheme in which the laser chip modules at both ends of the module each include the auxiliary substrate 5, and fig. 2 shows a scheme in which only one end of the laser chip modules at both ends of the module includes the auxiliary substrate 5.

As shown in fig. 1 and fig. 2, one end of the auxiliary substrate 5 is aligned with the outer edge of the conductive substrate 2 of the end laser chip module a, and a stress relief region 4 for slowly releasing stress is provided between the other end of the auxiliary substrate and the insulating substrate 31 of the end laser chip module a.

Specifically, the stress relief region 4 may be a gap; in the embodiment of the present invention, in the stacking direction of at least two laser chip modules, both side boundaries of the stress relief region are located in a region corresponding to the thickness of the conductive substrate, such as a thickness region d of the conductive substrate 2 shown in fig. 1.

Or, a filling body for slowly releasing stress can be further arranged in the stress release region, and the filling body can be an insulating high polymer material with hardness lower than that of the insulating substrate or a metal material which is subjected to surface anodization and has surface insulation and hardness lower than that of the insulating substrate.

Specifically, the filling body includes but is not limited to: rubber, fiber, plastic, polymer adhesive, metal material, etc. The filler may be in contact with the adjacent insulating substrate, and similarly, a gap may be left between the filler and the adjacent insulating substrate again to serve as a stress release region, and the effect and the relation to be satisfied of the gap in this case are substantially the same as those of the gap mentioned above, and details are not repeated here.

Further, in the laser chip modules located at both ends of the module, the outer edge of the insulating substrate of at least one of the laser chip modules (at least one of the laser chip modules) is aligned with the outer edge of the conductive substrate. Specifically, as shown in fig. 2, the outer edge of the insulating substrate corresponding to the laser chip module without the auxiliary substrate 5 is extended outward and directly aligned with the outer edge of the conductive substrate 2; alternatively, as shown in the scheme of fig. 3, the outer edges of the insulating substrates of the laser chip modules at the two ends of the module are aligned with the outer edges of the conductive substrate.

The embodiment of the invention also provides a laser assembly, which comprises the laser module and a heat sink 6 for dissipating heat of the module, wherein the insulating substrates 3 corresponding to the laser chip modules of the laser module are respectively bonded on the heat sink 6.

Preferably, in conjunction with each of the schemes shown in the figures, a common conductive substrate (e.g., conductive substrate 2') is provided between the adjacent laser chip modules, and the surface of the other end of the common conductive substrate is simultaneously bonded on the two insulating substrates of the adjacent laser chip modules; in the solution disclosed in the embodiment of the present invention, the adjacent laser chip modules may not share the conductive substrate, in which case, different conductive substrates between the adjacent laser chip modules may be electrically connected by contact or other methods, and it should be noted that the conductive substrates between the adjacent laser chip modules, whether shared or not, are within the scope of the disclosure and protection of the present invention.

As shown in fig. 2, the laser chip module a at the end of the left side, the second laser chip module at the left side is c, the conductive substrate 2 'is shared by the two laser chip modules, the surface of the other end of the shared conductive substrate 2' is simultaneously bonded on the insulating substrate 31 of the laser chip module a and the insulating substrate 32 of the laser chip module c, and the other laser chip modules are similar to the above, and so on, and redundant description is omitted here.

In the embodiment of the present invention, the material of the conductive substrate 2 includes, but is not limited to: copper tungsten, molybdenum copper, a particle reinforced metal matrix composite, a diamond metal composite, or the like.

The materials of the insulating substrate 3 and the auxiliary substrate 5 include, but are not limited to: aluminum nitride, aluminum oxide, beryllium oxide, silicon carbide, diamond, or the like.

The materials of the heat sink 6 include, but are not limited to: copper, or a metal with coolant channels, or a metal and ceramic composite structure.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.