阅读说明：本技术 一种集成毫米波瓦片式tr组件 (Integrated millimeter wave tile formula TR subassembly ) 是由 郑轶 于 2019-11-08 设计创作，主要内容包括：本发明涉及无线通信设备技术领域,具体涉及一种集成毫米波瓦片式TR组件。包括瓦片式叠层布设的公共输入端口、供电与控制信号端口、控制模块、毫米波电路模块和发射输出端口,毫米波电路模块包括一分二功分器、一分八功分器和一分四功分集成芯片,一分四功分集成芯片内集成有一分四功分器、VM移相器和功率放大电路,毫米波发射信号从公共输入端口接入,并通过一分二功分器、一分八功分器和一分四功分集成芯片功分成六十四路发射信号,控制模块对VM移相器对毫米波发射信号进行幅相调整。本发明可以有效提高TR组件的集成度,具有高集成、低剖面、轻量化、高效率的优点,适应新的系统设备平台对相控阵天线的应用需求。(The invention relates to the technical field of wireless communication equipment, in particular to an integrated millimeter wave tile type TR component. The millimeter wave transmission signal is accessed from the common input port and is divided into sixty-four paths of transmission signals through the one-two power divider, the one-eight power divider and the one-four power dividing integrated chip, and the control module adjusts the amplitude and phase of the millimeter wave transmission signal by the VM phase shifter. The invention can effectively improve the integration level of the TR component, has the advantages of high integration, low profile, light weight and high efficiency, and meets the application requirements of a new system equipment platform on the phased array antenna.)

1. The utility model provides an integrated millimeter wave tile formula TR subassembly which characterized in that: the millimeter wave circuit module comprises a one-to-two power divider, a one-to-eight power divider and a one-to-four power dividing integrated chip, one end of the common input port is used for accessing millimeter wave transmitting signals, the other end of the common input port is connected with the input end of the one-to-two power divider, two output ends of the one-to-two power divider are respectively connected with the one-to-eight power divider, the output end of each one-to-eight power divider is respectively connected with the one-to-four power dividing integrated chip, a one-to-four power divider, a VM phase shifter and a power amplifying circuit are integrated in each one-to-four power dividing integrated chip, VM phase shifters and power amplifying circuits are connected in transmitting channels of four output ends of the one-to-four power divider, and the VM phase shifters are used for carrying out amplitude phase adjustment on the millimeter wave transmitting signals output by the one-to-four power dividers, the power amplifying circuit is used for amplifying the power of millimeter wave transmitting signals after phase adjustment, the output end of the power amplifying circuit is connected with a transmitting output port, millimeter wave transmitting signals accessed by a public input port are divided into sixty-four paths of millimeter wave transmitting signals through a one-to-two power divider, an one-to-eight power divider and a one-to-four power dividing integrated chip and are respectively output through sixty-four transmitting output ports, one end of a power supply and control signal port is used for accessing external power supply and remote measurement and remote control commands, the other end of the power supply and control signal port is respectively connected with a power supply module and a control module and transmits the remote measurement and remote control commands to the control module, the output end of the control module is connected with a VM phase shifter, the control module is used for receiving and processing the remote measurement and remote control commands and controlling the, and the common input port, the power supply and control signal port, the control module, the millimeter wave circuit module, the emission output port and the power supply module are arranged in a layered manner and are vertically interconnected to form a 3D laminated tile type framework.

2. The integrated millimeter wave tile TR assembly of claim 1, wherein: still include structure cavity, apron, wave control daughter board, power supply distribution circuit board, low frequency control circuit board and high frequency circuit board, common input port is integrated on the apron, the power supply is integrated on the wave control daughter board with the control signal port, power module is integrated on power supply distribution circuit board, control module is integrated on low frequency control circuit board, millimeter wave circuit module is integrated on high frequency circuit board, power supply distribution circuit board, low frequency control circuit board and high frequency circuit board equipartition are established in the structure cavity, and the wave control daughter board is connected on the apron, and the apron closes with the sealed lid of structure cavity.

3. The integrated millimeter wave tile TR assembly of claim 2, wherein: the power supply distribution circuit board, low frequency control circuit board and high frequency circuit board are in proper order perpendicularly interconnected and set up in the structure cavity, the power supply distribution circuit board is close to the apron end, the high frequency circuit board is established in the interior bottom of structure cavity, power supply and control signal port on the wave control daughter board have been inserted little rectangular connector, wave control daughter board and power supply distribution circuit board are through passing the perpendicular interconnection of row's needle of apron, little rectangular connector is used for inserting telemetering measurement remote control instruction and external power, external power passes to the power supply distribution circuit board, public input port on the wave control daughter board passes the apron in proper order, electricity distribution circuit board and low frequency control circuit board, and dock with the high frequency.

4. An integrated millimeter wave tile TR assembly as claimed in claim 3, wherein: sixty-four emission output ports which are distributed in an 8 multiplied by 8 mode are arranged on a bottom plate of the structural cavity body, and the emission output ports are in butt joint with a high-frequency circuit board of the structural cavity body.

5. The integrated millimeter wave tile TR assembly of claim 2, wherein: the structural cavity and the cover plate and the wave control daughter board are fixedly connected through bolts.

6. The integrated millimeter wave tile TR assembly of claim 2, wherein: the one-to-four power division integrated chip adopts an SOC chip, and sixteen SOC chips, two one-to-eight power dividers and one-to-two power divider are integrated on the high-frequency circuit board.

7. The integrated millimeter wave tile TR assembly of claim 6, wherein: and two output ends of the one-to-two power divider are respectively connected with a driving amplification chip for driving and amplifying the millimeter wave transmitting signal output by the one-to-two power divider.

8. The integrated millimeter wave tile TR assembly of claim 6, wherein: the control module comprises DAC digital-to-analog conversion chips, four DAC digital-to-analog conversion chips are integrated on the low-frequency control circuit board, and each DAC digital-to-analog conversion chip correspondingly controls sixteen VM phase shifters in four SOC chips.

9. The integrated millimeter wave tile TR assembly of claim 6, wherein: the sixteen SOC chips can respectively select different power levels, so that millimeter wave transmitting signals with different powers are output by corresponding transmitting output ports.

10. The integrated millimeter wave tile TR assembly of claim 1, wherein: and the common input port and the emission output port both adopt coaxial connectors.

Technical Field

The invention relates to the technical field of wireless communication equipment, in particular to an integrated millimeter wave tile type TR component.

Background

With the development of millimeter wave phased array antenna technology, the application of the millimeter wave phased array antenna in communication and data transmission system equipment is gradually popularized, the flexible and convenient electronic beam scanning system replaces the traditional system combining fixed beam antenna and mechanical scanning, and the application requirements of high speed, high precision and high reliability are met. However, the platform carrier and the application scenario thereof have been integrated, complicated, and diversified with the environment, and new and severe requirements such as low profile, miniaturization, light weight, and low power consumption are provided for the function, performance, and platform adaptability of the loaded phased array antenna. Because the wavelength of the millimeter wave frequency band is small, in order to meet the application requirement, the distance between the channels is limited, meanwhile, the influence of parasitic parameters on the millimeter wave circuit is great, and the realization of performance indexes depends on the processing and manufacturing process capability to a great extent. The precision processing and micro-assembling process is an essential link for developing millimeter wave devices and components. As a TR component of a core component of the phased array antenna, if the existing mature brick type integration mode is adopted, circuit layout is longitudinally realized along the transmission direction of signals, the components are transversely combined and assembled into a array surface, and enough longitudinal space is needed to carry out layout and connection of the components, so that a larger thickness size is introduced, and the phased array antenna is larger in size; meanwhile, the longitudinal layout assembly mode enables the engineering realization of the TR component to depend on a metal cavity and a peripheral structure, and larger weight is introduced; in addition, along the longitudinal layout form of the signal transmission direction, the components in the assembly are single in function and distributed in layout, and although the performance stability design and the wiring design are facilitated, the integration level is low, the number of the used components is large, and the low-cost and batch manufacturing is not facilitated. Therefore, the existing brick type TR assembly has the defects of large size, heavy weight, low integration level, low efficiency, high cost and the like, so that the brick type TR assembly cannot meet the application requirements of a new generation of system equipment platform on the phased array antenna.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides an integrated millimeter wave tile type TR component, which can effectively improve the integration level of the TR component when being applied, has the advantages of high integration, low profile, light weight and high efficiency, and meets the application requirements of a new system equipment platform on a phased array antenna.

The technical scheme adopted by the invention is as follows:

an integrated millimeter wave tile type TR component comprises a common input port, a power supply and control signal port, a control module, a millimeter wave circuit module, a transmission output port and a power supply module, wherein the millimeter wave circuit module comprises a one-to-two power divider, an one-to-eight power divider and a one-to-four power dividing integrated chip, one end of the common input port is used for accessing millimeter wave transmission signals, the other end of the common input port is connected with the input end of the one-to-two power divider, two output ends of the one-to-two power divider are respectively connected with the one-to-eight power divider, the output end of each one-to-eight power divider is respectively connected with the one-to-four power dividing integrated chip, a one-to-four power divider, a VM phase shifter and a power amplification circuit are integrated in each one-to-four power dividing integrated chip, the VM phase shifters and the power amplification circuits are connected in transmission channels of four output ends of the one-to-four power, the power amplifying circuit is used for amplifying power of millimeter wave transmitting signals after phase adjustment, the output end of the power amplifying circuit is connected with a transmitting output port, millimeter wave transmitting signals accessed by a public input port are divided into sixty-four paths of millimeter wave transmitting signals through a one-to-two power divider, an one-to-eight power divider and a one-to-four power dividing integrated chip and are respectively output through sixty-four transmitting output ports, one end of a power supply and control signal port is used for accessing external power supply and remote measuring and remote control commands, the other end of the power supply and control signal port is respectively connected with a power supply module and a control module and transmits the remote measuring and remote control commands to the control module, the output end of the control module is connected with a VM phase shifter, the control module is used for receiving and processing the remote measuring and remote controlling the VM phase shifter to adjust amplitude and phase of the millimeter wave transmitting, the common input port, the power supply and control signal port, the control module, the millimeter wave circuit module, the emission output port and the power supply module are arranged in a layered mode and are vertically interconnected to form a 3D laminated tile type framework.

The preferred as above-mentioned technical scheme still includes structure cavity, apron, wave control daughter board, power supply distribution circuit board, low frequency control circuit board and high frequency circuit board, common input port is integrated on the apron, power supply and control signal port are integrated on the wave control daughter board, power module is integrated on power supply distribution circuit board, control module is integrated on low frequency control circuit board, millimeter wave circuit module is integrated on high frequency circuit board, power supply distribution circuit board, low frequency control circuit board and high frequency circuit board equipartition are established in the structure cavity, and the wave control daughter board is connected on the apron, and apron and the sealed lid of structure cavity close.

Preferably, the power supply distribution circuit board, the low-frequency control circuit board and the high-frequency circuit board are sequentially and vertically interconnected and arranged in the structural cavity, the power supply distribution circuit board is close to the cover board end, the high-frequency circuit board is arranged at the inner bottom end of the structural cavity, a micro rectangular connector is inserted into a power supply and control signal port on the wave control sub-board, the wave control sub-board and the power supply distribution circuit board are vertically interconnected through a pin header penetrating through the cover board, the micro rectangular connector is used for accessing a remote measurement remote control command and an external power supply, the external power supply is transmitted to the power supply distribution circuit board, and a common input port on the wave control sub-board sequentially penetrates through the cover board, the electric.

Preferably, sixty-four emission output ports distributed 8 × 8 are arranged on the bottom plate of the structural cavity, and the emission output ports are in butt joint with the high-frequency circuit board of the structural cavity.

Preferably, the structural cavity and the cover plate and the wave control sub-plate are fixedly connected through bolts.

Preferably, the one-to-four power division integrated chip adopts an SOC chip, and sixteen SOC chips, two one-to-eight power dividers, and one-to-two power divider are integrated on the high-frequency circuit board.

Preferably, the two output ends of the one-to-two power divider are respectively connected with a driving amplifier chip for driving and amplifying the millimeter wave transmitting signal output by the one-to-two power divider.

Preferably, the control module includes a DAC digital-to-analog conversion chip, four DAC digital-to-analog conversion chips are integrated on the low-frequency control circuit board, and each DAC digital-to-analog conversion chip correspondingly controls sixteen VM phase shifters in four SOC chips.

Preferably, as for the above technical solution, the sixteen SOC chips may respectively select different power levels, so that the corresponding transmission output ports output millimeter wave transmission signals with different powers.

Preferably, the common input port and the emission output port both use coaxial connectors.

The invention has the beneficial effects that:

when the millimeter wave tile type transmission device is applied, a millimeter wave transmission signal enters the millimeter wave tile type transmission assembly through the common input port and is divided into two paths of signals through the one-to-two power divider; the two paths of signals are distributed to sixteen one-to-four power division integrated chips with four channels integrated through one-to-eight power dividers respectively; in each one-to-four power division integrated chip, signals are divided into four transmitting channels after being divided into four power divisions; the phase and amplitude are configured in each channel through a VM phase shifter, and then the signals are amplified by a final-stage power amplifying circuit and output to an externally connected antenna unit through a transmitting output port, through the structural design of the signal channel, the application requirements of a TR component on high speed, high precision and high reliability can be met, and the millimeter wave tile type TR component of sixty-four standard transmitting channels can be conveniently and efficiently integrated, the integration level can be effectively improved, meanwhile, through respectively laying a common input port, a power supply and control signal port, a power supply module, a control module, a millimeter wave circuit module and a transmitting output port on a cover plate, a wave control daughter board, a power supply distribution circuit board, a low-frequency control circuit board, a high-frequency circuit board and a structural cavity in a layered manner, and through vertical interconnection, a 3D laminated tile type framework is realized, and the longitudinal size and the weight, the integration level of the components is greatly improved, the batch production cost can be greatly saved due to the standardized framework, and the application requirements of a new generation of system equipment platform on the phased array antenna can be well met.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic block diagram of a signal transmission architecture of the present invention;

FIG. 2 is an exploded view of the integrated structure of the present invention;

FIG. 3 is a schematic view of a wave control daughter board connection structure;

FIG. 4 is a schematic diagram of an arrangement structure of a transmitting output port;

fig. 5 is a schematic diagram of an array layout of TR module extension applications in embodiment 3.

In the figure: 1. a structural cavity; 2. a cover plate; 3. a power supply distribution circuit board; 4. a low frequency control circuit board; 5. a high-frequency circuit board; 6. a wave control daughter board; 7. an SOC chip; 8. a DAC digital-to-analog conversion chip; 9. arranging needles; 10. a micro rectangular connector; 11. a common input port; 12. and transmitting the output port.

Detailed Description

The invention is further described with reference to the following figures and specific embodiments. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.

It should be understood that the terms first, second, etc. are used merely for distinguishing between descriptions and are not intended to indicate or imply relative importance. Although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments of the present invention.

It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, B exists alone, and A and B exist at the same time, and the term "/and" is used herein to describe another association object relationship, which means that two relationships may exist, for example, A/and B, may mean: a alone, and both a and B alone, and further, the character "/" in this document generally means that the former and latter associated objects are in an "or" relationship.

It is to be understood that in the description of the present invention, the terms "upper", "vertical", "inside", "outside", and the like, refer to an orientation or positional relationship that is conventionally used for placing the product of the present invention, or that is conventionally understood by those skilled in the art, and are used merely for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present invention.

It will be understood that when an element is referred to as being "connected," "connected," or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly adjacent" or "directly coupled" to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between … …" versus "directly between … …", "adjacent" versus "directly adjacent", etc.).

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and/or groups thereof.

It should also be noted that, in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed substantially concurrently, or the figures may sometimes be executed in the reverse order, depending upon the functionality/acts involved.

In the following description, specific details are provided to facilitate a thorough understanding of example embodiments. However, it will be understood by those of ordinary skill in the art that the example embodiments may be practiced without these specific details. For example, systems may be shown in block diagrams in order not to obscure the examples in unnecessary detail. In other instances, well-known processes, structures and techniques may be shown without unnecessary detail in order to avoid obscuring example embodiments.