阅读说明：本技术 发光装置 (Light emitting device ) 是由 名田智一 于 2018-03-15 设计创作，主要内容包括：具备由一个以上的LED器件构成的第一LED器件阵列和第二LED器件阵列,第一LED器件阵列和第二LED器件阵列串联连接,至少一个LED器件阵列与具有电阻和二极管的旁路电路并联连接,与旁路电路并联连接的LED器件阵列的阈值电压大于二极管的阈值电压,第一LED器件阵列的发光所产生的发光颜色与第二LED器件阵列的发光所产生的发光颜色不同。(Have the first LED component array and the second LED component array being made of more than one LED component, first LED component array and the second LED component array are connected in series, at least one LED component array is connected in parallel with the bypass circuit with resistance and diode, the threshold voltage for the LED component array being connected in parallel with bypass circuit is greater than the threshold voltage of diode, and the generated luminescent color that shines of the first LED component array is different from the generated luminescent color that shines of the second LED component array.)

1. a kind of light emitting device, which is characterized in that

Have the first LED component array and the second LED component array being made of more than one LED component,

The first LED component array and the second LED component array are connected in series,

At least one described LED component array is connected in parallel with the bypass circuit with resistance and diode,

The threshold voltage for the LED component array being connected in parallel with the bypass circuit is greater than the threshold value electricity of the diode Pressure,

The generated luminescent color that shines of the first LED component array is produced with the luminous of the second LED component array Raw luminescent color is different.

2. light emitting device according to claim 1, which is characterized in that the first LED component array, the 2nd LED Device array and the bypass circuit are formed on single substrate.

3. light emitting device according to claim 1, which is characterized in that shining for the first LED component array is produced The luminescent color and the shining of the second LED component array caused by the difference of colour temperature of the luminescent color be 1000K or more.

4. light emitting device according to claim 1, which is characterized in that the diode is Zener diode.

5. light emitting device according to claim 1, which is characterized in that each LED component array carries out luminous hair Light region is formed as the more than two symmetry axis for having through the centre of luminescence when looking down.

Technical field

The present invention relates to light emitting device and lighting device, relates more particularly to using LED and luminescent color is according to input Electric current and the light emitting device and lighting device changed.

Background technique

Relative to previous light source, the electric power applied is directly changed into using the light emitting device of light emitting diode (LED) Light, therefore luminous efficiency is very high, in recent years, for many lighting devices.

In previous light source, especially incandescent lamp, halogen lamp etc. according to the reduction of input electric power, the white light of sending Colour temperature is lower, and jaundice and rubescent feeling increase, and people feel that the variation of this color is comfortably natural.Further, incandescent lamp, The light emitting source of halogen lamp be it is single, in the light emitting device using LED, also require the single hair of preferred luminescent color variation Light source.

On the other hand, it is characterized in that, is usually shown relative to input electric power constant using the light emitting device of LED Luminescent color.Therefore, in order to adjust luminescent color in the light emitting device for having used LED, it usually needs with independent circuit Driving issues the LED of different luminescent color, it is commonly known have control respectively by using processor etc. with luminescent color not The current value of the circuit of same LED, thus the method for integrally obtaining desired luminescent color as light emitting device.

But the method that the LED for issuing different luminescent colors is driven using independent circuit is had the disadvantages that, is needed Will to processor input signal, the current value of multiple circuits must be controlled according to desired luminescent color, must detect Required luminescent color and application feedback control etc. become complicated as lighting system, cost is got higher.Further, only in order to constitute Vertical circuit is generally made of more than two light emitting sources.

Therefore, as disclosed in Japanese Unexamined Patent Publication 2015-201614 bulletin (patent document 1), proposing has list The light emitting device of chip on board (Chip-on-board, COB) type of one illumination region, only by adjusting to the defeated of light emitting device The size for entering electric current can be such that the luminescent color of the illumination region changes, and provide color change same as halogen lamp.

In the light emitting device documented by patent document 1, in single illumination region, by different according to threshold voltage LED component array forms light emitting region, resistance is connected in series on the lower LED component array of threshold voltage, by LED component battle array Column are connected in parallel respectively, to realize the variation of luminescent color corresponding with the size of electric current.For example, if will have threshold value electric The colour temperature for pressing the light emitting region of lower LED component array to be issued is set as 2000K, will have the higher LED device of threshold voltage The colour temperature that the light emitting region of part array is issued is set as 3000K, then light emitting device is generated according to light modulation such as previous incandescent lamp Color change luminescent color preferred like that variation.

Summary of the invention

Problems to be solved by the invention

However, in the light emitting device documented by patent document 1, due to needing to make the LED for the light emitting region for having different Device array be connected in parallel in illumination region therefore for example, three series connection shorter LED component arrays below in the case where, It is shorter on the series connection direction of LED component array as the shape of illumination region, it is longer on direction in parallel, accordingly, it is difficult to make work The desired circular illumination region for COB, and the series connection difference of LED component array is restricted, thus more excellent in the presence of being difficult to carry out The problem of design of the luminescent color variation of choosing.In addition, in order to improve the driving voltage of light emitting device, it is necessary to make to be connected in parallel The serial number of LED component array becomes more together, but is difficult to form longer LED component battle array in parallel in limited mounting area Column.Therefore, the range for the driving voltage that can actually design as light emitting device is restricted.

Further, due to needing to be connected in parallel the LED component array for the light emitting region for having different in illumination region, because This is difficult to as single light source close to original desired point light source, such as is difficult to realize the lesser surface installation of light-emitting area Type.

In addition, needing the threshold voltage difference between LED component array to refer to change luminescent color, low current is generated The driving voltage in region and rated current region is poor, therefore, it is necessary to using it is corresponding with wider output voltage range can power transformation Galvanic electricity source, obtainable power supply is restricted on the market, or as making the main original of the corresponding increased costs of power supply Cause, on this basis, in exporting lower region, the driving voltage of light emitting device is further decreased, thus becomes unable to answer The continuous output of variable current power supply is reduced, so that extinguishing, therefore becomes a unstable original of light output when adjusting dim light Cause.

It is poor in order to reduce low current region and the driving voltage in rated current region, if reducing the threshold between LED component array Threshold voltage is poor, then must connect lower resistance in the LED component array of low voltage side, the function of the limitation electric current of resistance by Damage, in the rated current region of light emitting device, to high-voltage side LED component array electric current relative to low voltage side The ratio of the electric current of LED component array also becomes smaller, therefore the variation of desired luminescent color becomes difficult to achieve originally.

The present invention is to complete in view of the above problems, it is intended that a kind of light emitting device is provided, in luminescent color In the light emitting device changed according to the size of input current, driving voltage can be set in wider range, it can be into one Step reduces the area of illumination region, and low current region and the voltage difference in rated current region are smaller.

The means solved the problems, such as

To achieve the goals above, light emitting device of the invention is characterized in that, is had by more than one LED component structure At the first LED component array and the second LED component array, the first LED component array and the second LED component array series connection connect It connects, at least one LED component array is connected in parallel with the bypass circuit with resistance and diode, is connected in parallel with bypass circuit LED component array threshold voltage be greater than diode threshold voltage, the first LED component array shine caused by shine Color is different from the generated luminescent color that shines of the second LED component array.

In a mode of light emitting device of the invention, which is characterized in that the first LED component array, the second LED component Array and bypass circuit are formed on single substrate.

In a mode of light emitting device of the invention, which is characterized in that shining for the first LED component array is produced Luminescent color and the second LED component array shine caused by luminescent color colour temperature difference be 1000K or more.

One mode of light emitting device of the invention is characterized in that diode is Zener diode.

In a mode of light emitting device of the invention, which is characterized in that each LED component array carries out luminous hair Light region is formed as the more than two symmetry axis for having through the centre of luminescence when looking down.

In addition, threshold voltage refers to relative to the forward voltage applied to diodes such as LED and electric current starts to steeply rise Voltage, the threshold voltage of LED component array refers to the total of the threshold voltage of the LED component of arranged in series.In general, being more than threshold Threshold voltage, electric current start to flow, and thus LED component starts to shine.In addition, in the case where the connection of multiple Diode series, it is other The threshold voltage of the diode of road circuit becomes the total of respective threshold voltage.In addition, the Zener diode of Opposite direction connection Breakdown voltage also facilitates the threshold voltage of bypass circuit as the voltage that electric current steeply rises.

Invention effect

In accordance with the invention it is possible to provide a kind of light emitting device, become with luminescent color according to the size of input current In the light emitting device for the single illumination region changed, driving voltage can be set in wider range, hair can be further decreased The area in light portion, low current region and the voltage difference in rated current region are smaller.

Detailed description of the invention

Fig. 1 is the wiring diagram of light emitting device involved in first embodiment of the invention.

Fig. 2 is the top view of Fig. 1.

Fig. 3 is the wiring diagram of light emitting device involved in the variation of first embodiment of the invention.

Fig. 4 is the wiring diagram of the light emitting device of the prior art.

Fig. 5 is the top view of Fig. 4.

Fig. 6 is the wiring diagram of light emitting device involved in second embodiment of the present invention.

Fig. 7 is the top view of Fig. 6.

Fig. 8 is the wiring diagram of light emitting device involved in third embodiment of the present invention.

Fig. 9 is the top view of Fig. 8.

Figure 10 is the wiring diagram of light emitting device involved in the 4th embodiment of the invention.

Figure 11 is the top view of Figure 10.

Figure 12 is the A-A cross-sectional view of the light emitting device of Figure 10.

Figure 13 is the wiring diagram of light emitting device involved in the 5th embodiment of the invention.

Figure 14 is the wiring diagram of light emitting device involved in the variation of the 5th embodiment of the invention.

Figure 15 is the relationship of the lumen fraction for the light for indicating that light emitting device of the invention issues and the colour temperature of luminescent color Chart.

Figure 16 is the figure for indicating the relationship of the driving voltage of light emitting device of input current and the present invention and the prior art Table.

Specific embodiment

Hereinafter, being illustrated using attached drawing to light emitting device of the invention.In addition, in attached drawing of the invention, it is identical Appended drawing reference indicates same section or considerable part.Further in the following description, for identical title, symbol, principle It is upper to indicate identical or homogeneity component, and appropriate detailed description will be omitted.In addition, in order to attached drawing sharpening and simplification and suitably become More length, width, thickness, depth equidimension relationship, are not offered as actual size relationship.

(first embodiment)

As shown in the wiring diagram of the light emitting device 100 of Fig. 1, light emitting device 100 is COB type, is formed on substrate 1 single Illumination region 2, the inside of illumination region 2 configured with LED component L1a~L1d electrical connection made of LED component array L1 and LED component L2a and L2b electrical connection made of LED component array L2, LED component array L1, L2 electrode pad (land) 41, It is connected in series between 42 by wiring 51.The bypass circuit 8 and LED component be made of resistance 6, Zener diode 7 and wiring 52 Array L1 is connected in parallel.

As shown in the top view of the light emitting device 100 of Fig. 2, illumination region 2 has resin dam 3 in periphery, by by translucency tree The light emitting region 21 comprising LED component array L1 and the light emitting region 22 comprising LED component array L2 of rouge covering are constituted, and are shone Region 21 and light emitting region 22 issue different luminescent colors.By in illumination region 2, there are light emitting regions 21,22, Neng Gouzuo Change luminescent color for single light source.

In addition, so-called single light source is the luminaire for referring to design as single light source, the hair of illumination region 2 Light region 21,22 must not necessarily contact with each other.In addition, light emitting region 21 can also in a manner of surrounding light emitting region 22 shape At.Further, as shown in the variation of Fig. 3, LED component array L1, L2 linearly to connect, as described above, light emitting region 21, 22 form relative to each LED component array, the shape of illumination region can also become rectangle, as filament (filament) that The threadiness of sample.

The breakdown voltage of the Zener diode 7 of bypass circuit 8 is than the LED component array L1 that is connected in parallel with bypass circuit 8 Threshold voltage it is low, in low current region drive light emitting device 100 when, input current without flow through LED component array L1, but LED component array L2 is flowed to by bypass circuit 8.Therefore, in low current region, only light emitting region 22 is sent out in illumination region 2 Light, light emitting device 100 issue the luminescent color of light emitting region 22.

If keeping electric current bigger than low current region, due to the resistance of bypass circuit 8, the driving voltage of bypass circuit 8 rises, If being more than the threshold voltage of LED component array L1, electric current begins to flow to LED component array L1, light emitting region 21 also with shine Region 22 shines together.If further increasing electric current, the current ratio of LED component array L1 is flowed through relative to bypass circuit 8 It gets higher, therefore the luminescent color of light emitting device 100 is closer to the luminescent color of light emitting region 21.

The luminescent color of luminous light emitting region 21 based on LED component array L1 and hair based on LED component array L2 The case where luminescent color of the light emitting region 22 of light is white light is suitable for lighting use, by differing the colour temperature of luminescent color 1000K or more can be realized the light emitting device for carrying out apparent color temperature change.It is further preferred that by making light emitting region 22 Luminescent color is the colour temperature lower than the luminescent color of light emitting region 21, and the luminescent color for carrying out selfluminous device can be made because of electric current It reduces and changes to warmer light.

For example, if the luminescent color of light emitting region 22 being set as colour temperature 2000K, sets the luminescent color of light emitting region 21 For colour temperature 3000K, then light emitting device 100 is shone in low current region by the luminescent color of light emitting region 22, in specified electricity It flows region to shine by the secondary colour of light emitting region 21,22, closer to colour temperature 3000K, therefore can be realized corresponding with light modulation Ground carries out the light emitting device of color change as previous incandescent lamp.

In addition, since the luminous intensity of light emitting region 22 is got higher according to electric current, in order to make shining for light emitting device Color in rated current region be colour temperature 3000k, the luminescent color of light emitting region 21 in terms of colour temperature it is preferable to use 4000K with On high color temperature, by make luminescent color colour temperature differ 2000K or more, can obtain because of the different spectrum of each luminescent color It is overlapped and the light of the high-quality of color reprodubility with higher.

(substrate)

Carry out the light output of selfluminous device to effectively become the light from LED component, substrate 1 is preferably light reflection The higher material of rate, thermal diffusivity, uses ceramic substrate, aluminum substrate etc..

By carrying required whole LED components and component on substrate 1, it is capable of providing the COB type being easily processed Light emitting device.

In addition, making to improve the production efficiency of the formation of wiring, LED component and component installation etc. to carrying COB's The contact area of metal portion maximizes the thermal diffusivity so that it is guaranteed that COB, and substrate 1 is preferably that upper and lower surface is all flat.

(electrode pad, wiring)

Electrode pad 41,42, wiring 51,52 are formed as pattern by silk-screen printing etc. on substrate 1.In addition, wiring 51, 52 a part is also possible to metal wire, between LED component, the connection of LED component and wiring pattern.Especially LED component Between wiring pattern is not set on substrate 1, and be routed with metal wire, thus, it is possible to efficiently use LED component mounting surface The high reflectance of substrate improves the light output of light emitting device.

(LED component)

LED component can out of InGaN system, GaAlAs system, GaP system etc., as expected luminescent color and suitably select. As general illumination use and in the case where use, in blue region, (wavelength is 430nm or more 480nm or less for LED component use Region) or violet region (wavelength be 385nm or more and the region below 430nm) there are the InGaN systems of peak emission wavelength LED component, some or all of light is converted to the color of other visible light regions using fluorophor, preferably issue white Light.It is further preferred that for the reasons such as luminous efficiency, acquired, acquisition cost, it is preferable to use the blue led device of InGaN system Part.

In addition, LED component array L1, L2 can also be formed by different types of LED component respectively, for example, it can be, LED component array L1 is that blue LED devices, the LED component array L2 such as InGaN system are made of the red LEDs device such as GaAlAs system. It further, can also include different types of LED component in LED component array L1, L2, for example, it can be LED components Array L1 is by the combination of the red LEDs device such as the blue LED devices such as InGaN system and GaAlAs system, the InGaN system of different wave length The combination of LED component is constituted.

LED component has anode electrode pad and cathode electrode pad, via metal wire and other LED components, base Wiring pattern electrical connection on plate.Alternatively, being also possible to LED component overleaf has electrode, with the wiring pattern electricity on substrate Connection.

LED component array L1, L2 of series connection may each be the cathode side of light emitting device 100, be also possible to anode-side. In addition, LED component array L1, L2 are also possible to be connected in parallel to the structure of multiple LED component arrays respectively, cope with luminous The high current of device 100.

Current-voltage characteristic can also be adjusted by other electronic components such as connection diode on LED component array L1, Start luminous current value to adjust LED component array L1 in light emitting device 100.In the case where connecting other component, The threshold voltage of LED component array becomes the value after merging the threshold voltage of LED component with the threshold voltage of other component.

(resin dam)

Resin dam 3 is the resin for stopping the translucent resin of 2 inside of illumination region, preferably transparent, white etc. difficulty With light absorbing material.

(translucent resin and fluorophor)

LED component is covered by translucent resin, is selectively contained in translucent resin according to desired luminescent color Fluorophor.As long as there is no limit for resin of the translucent resin with translucency.For example, it is preferable to be the silicone with heat resistance Resin etc..In addition, translucent resin can also be used for each light emitting region has different thixotropic resins.

In light emitting region 21,22, a part of the primary light radiated from LED component is converted to by fluorophor in visible light Light with spectral component.Preferably, a part of the light from blue LED device is converted to by fluorophor has green extremely The light of red spectral component sets the blending ratio of the fluorophor in each light emitting region 21,22 to become desired light Characteristic.

In addition, in the luminescent color that the luminescent colors such as blue, green, red from LED component are used as to light emitting region In the case where, fluorophor can not also be contained in translucent resin.

In addition, if due to the respective LED component of LED component array L1, L2 type difference etc., LED component array L1 It is different with the luminescent color of LED component array L2, even if the light emitting region then in illumination region 2 is whole by uniform translucent resin Covering, the feelings that the luminescent color of illumination region 2 also can be luminous in LED component array L1 situation about shining and LED component array L2 It is different under condition.That is, the light emitting region 21,22 in illumination region 2 may not necessarily be also distinguished in appearance.

The translucency that a part of LED component array can also be formed by fluorophor identical with other LED component arrays Resin covering.

Light emitting region 21,22 also can have the multiple sub- light emitting regions for being respectively provided with different luminescent colors, for example, hair Light region 21 can also be made of multiple sub- light emitting regions of the blending ratio with different fluorophor.In addition, sub- luminous zone Domain can not also contact with each other each other.

(Zener diode)

Voltage is maintained some even if lower galvanic areas according to the characteristic of breakdown voltage by Zener diode 7 Certain value, therefore the voltage of light emitting device 100 is able to maintain that more than certain value even if low current region.

Zener diode 7 is the general designation of the diode with the function that voltage is maintained to some certain value, includes quilt The referred to as diode etc. of Transient Voltage Suppressor (TVS) diode.

It, can also be by the general diode such as rectifier diode in positive direction for the purpose of desired voltage characteristic is obtained On be further added in bypass circuit 8 and connect in series.Using light emitting diode, it is necessary to consider to luminous The influence of the luminescent color of device.In addition, without using zener diodes, by using multiple one in the positive direction As diode, can also obtain desired voltage characteristic, but according to Zener diode, it will be able to than using multiple two poles The case where pipe, few device count obtained desired voltage characteristic, therefore preferably.

By using with positive voltage temperature characteristic and with breakdown voltage higher than 5.1V characteristic Zener diode, In rated current region, due to light emitting device overall temperature rise, the voltage of Zener diode 7 is got higher, and inhibition passes through side The rising of the electric current of road circuit 8, thus, it is possible to improve the luminous efficiency of light emitting device 100.It is therefore preferred that Zener diode 7 It is mounted on substrate identical with LED component and resistance 6, and is thermally connected.

Zener diode 7 may be mounted in the resin to form illumination region 2, not need mounting portion in the outside of illumination region 2, So as to realize the miniaturization of substrate 1.If Zener diode 7 is the device shape of unencapsulatedization, it is easy to pass through wiring diagram In case chip engagement or metal wire and be installed in illumination region 2.

(resistance)

Resistance 6 is resistance component or printed resistor etc..Other than resistance component, inductor, temperature-sensitive electricity also can be used Resistance, diode etc. have the electric component of other resistance, and more than two components can also be applied in combination.

Preferably, by using the thermistor with positive temperature characterisitic in resistance 6, because of the hair in rated current region The resistance value of electro-optical device overall temperature rise, thermistor is got higher, thus inhibit the electric current by bypass circuit 8, thus, it is possible to Enough improve the luminous efficiency of light emitting device entirety.Preferably, thermistor has higher than room temperature and than the reality under rated current Border uses the temperature temperature characterisitic that resistance value steeply rises at a temperature of low.

The color change of the luminous electric current and light emitting device 100 of the split beginning light emitting region 21 of the resistance value of resistance 6 Characteristic impacts, it is therefore desirable to precision, such as preferably there is 20% error precision below.

In addition, then by laser trimming etc., can accurately adjust resistance if it is the printed resistor being printed on substrate Value, therefore preferably.Further, the terminal that can measure the resistance value of resistance 6 is preferably set on substrate 1.

Resistance 6 can also be similarly mounted in the resin to form illumination region 2 with Zener diode 7, in the outer of illumination region 2 Side does not need mounting portion, so as to realize the miniaturization of substrate 1.

(bypass circuit)

Preferably, bypass circuit 8 is formed on the same substrate for being equipped with LED component array L1.

Multiple LED component arrays for being respectively provided with bypass circuit can also be connected in series in illumination region 2, have each The different luminescent color of LED component array, for luminous movement of electric current etc., so as to more meticulously control light emitting device The variation of 100 luminescent color.

In addition, whole LED component arrays in illumination region 2 can also be connected in parallel from different bypass circuits respectively.

(comparative example)

Fig. 4 is the wiring diagram of the light emitting device 200 of the prior art shown in patent document 1, is implemented in order to obtain with first The identical color change of mode and driving voltage, six concatenated LED component array L3 and four concatenated LED component array L4 It is connected in parallel between electrode pad 241,242 by wiring 251,252 respectively.Resistance is connected on LED component array L4 206, change the driving voltage of the circuit of wiring 252 by current value, the size of the electric current thus shunted to wiring 251,252 It changes.The luminescent color of the light emitting region 221,222 for being each configured with LED component array L3, L4 in illumination region 202 is not Together, the whole luminescent color of illumination region 202 changes according to the size of the input current of light emitting device 200.

In the light emitting device 100 of present embodiment, can be realized LED component number at least is six, in contrast, sending out LED component number needs up to ten in electro-optical device 200.That is, in accordance with the invention it is possible to reduce the number of components of LED component, it can Further decrease light-emitting surface.

In addition, the electric current in low current region of light emitting device 200 flows only through four concatenated LED component array L4, therefore Driving voltage in low current region in rated current region electric current flow through the driving of six concatenated LED component array L3 Voltage is compared, the low amount of two concatenated LED components.In order in the identical state of current value for making luminescent color start variation The lower threshold voltage difference for reducing LED component array needs an additional LED component of connecting on LED component array L4, reduces electricity The resistance value of resistance 206, but in this case, the electric current that LED component array L4 is flowed through in rated current region becomes much larger, stream The electric current for crossing LED component array L3 becomes smaller, and therefore, it is difficult to change the luminescent color of the entirety of illumination region 202 fully.

(second embodiment)

As shown in the wiring diagram of the light emitting device 300 of Fig. 6, single illumination region 302 is formed on substrate 301, is being shone The inside in portion 302 is configured with the array L5 being made of LED component L5a to L5c and the array being made of LED component L6a to L6c L6, LED component array L5, L6 are connected in parallel between electrode pad 341,342 by wiring 351.It is same with first embodiment Sample, LED component L5a, L6a respectively with the bypass circuit that has resistance 306a and Zener diode 307a on wiring 352a 308a is connected in parallel, and LED component L5c, L6c is similarly connected in parallel with bypass circuit 308c.

In the present embodiment, since the LED component for being connected in parallel to bypass circuit 308a, 308c is unitary series of operations, Therefore Zener diode 307a, 307c of bypass circuit do not need high voltage, general diode forward can also be connected to come It uses.

As shown in the top view of figure 7, illumination region 302 has resin dam 303 in periphery, by point covered by translucent resin Not Bao Han LED component L5a and L6a, L5b and L6b, L5c and L6c light emitting region 321,322,323 formed, each light emitting region Issue specific luminescent color.

If become according to the LED component array with the relationship of bypass circuit 308a, 308c observation light emitting device 300 The structure that three groups of LED components L5a and L6a, L5b and L6b, L5c and the L6c being connected in parallel respectively are connected in series.Even if in inside LED component array be unitary series of operations in the case where, light emitting region 321,323 also can by bypass circuit 308a, 308c come Shining relative to input current is controlled, even if also can be realized in the case where light emitting device requires lower driving voltage Luminescent color changes according to the size of input current.In addition, being held due to that can be constituted with less LED component number Easily reduce the area of illumination region 302.

LED component array L5 is connected with L6 in two modes in parallel, but the number in parallel of LED component array can be according to hair The load current value of electro-optical device 300 and suitably change, for example, being set as a LED device if the rated current of light emitting device is smaller Part array, in addition, can be realized and electricity for example, be set as three or more LED component array in parallel etc. if rated current is larger The optimization that flow valuve designs accordingly.

By keeping the luminescent color of light emitting region 321,323 identical, make the knot of LED component and bypass circuit 308a, 308c Structure is identical, and identical variations in light is presented in 321,323 pairs of light emitting region electric current.It is further preferred that light emitting region 321,323 is being sent out It is asymmetrically formed in light portion 302, is in symmetrical luminescent color relative to two symmetry axis by the centre of luminescence when looking down Thus pattern carrys out the irregular colour of the emergent light of selfluminous device 300 more easily by inhibition such as optical components.

(comparative example)

According to the prior art, as light emitting device, in order to luminescent color identical with present embodiment variation and Luminescent color pattern needs the light emitting region being made of at least three LED component arrays in parallel in illumination region.Adjacent is each A light emitting region is different luminescent color, thus needed as unit of each LED component array than LED component array width more Wide light emitting region.Therefore, as shown in fig. 6, in the illumination region face that LED component array can only be configured in two modes in parallel In the case where product, it is difficult to realize in the prior art.

Further, in the prior art, in order to carry out the high current of light emitting device, usually in low-voltage and high voltage The number in parallel of chip must all be increased in LED component array, but in the present invention, the number in parallel of LED component array is due to entirety Current value and be optimised, so being limited the area of illumination region be easy reply high current.

(third embodiment)

As shown in the wiring diagram of the light emitting device 400 of Fig. 8, single illumination region 402 is formed on substrate 401, is being shone The inside in portion 402 is configured with LED component array L7, L8, L9, L10, and LED component array L7, L10 are respectively with the LED of identical quantity Devices in series number is connected in parallel, and LED component array L8, L9 are connected in parallel respectively with the LED component serial number of identical quantity, LED Device array L7, L10 and LED component array L8, L9 are electrically connected in series between electrode pad 441,442.With the first embodiment party Formula similarly, is connected in parallel on LED component array L7, L10 and has resistance 406 and Zener diode 407 in wiring 452 Bypass circuit 408.

As shown in the top view of Fig. 9, illumination region 402 has resin dam 403 in periphery, by the packet covered by translucent resin The light emitting region 421 of the L7 of array containing LED component, the light emitting region 422 comprising LED component array L8, L9 include LED component battle array The light emitting region 423 for arranging L10 is formed, and each light emitting region issues specific luminescent color respectively.

Preferably, light emitting region 421,423 is asymmetrically formed in illumination region 402 relative to the centre of luminescence, is issued identical Luminescent color, luminescent color pattern under thus overlooking is symmetrical in line relative to two symmetry axis by the centre of luminescence, leads to The irregular colour for crossing the emergent light that the inhibition such as optical component carry out selfluminous device 400 becomes easier to.Light emitting region 421,423 is logical It crosses and shares bypass circuit 408, become easy and be respectively relative to electric current and show identical variations in light.

By the way that the LED component configuration of LED component array L8, L9 in the immediate vicinity of illumination region 402, are come from light emitting region In 422 light, carrying out shining for the center of self-luminescent part 402 becomes leading, the luminous reduction from peripheral part, therefore is able to suppress Irregular colour caused by visual confirmation direction from laterally when light emitting device 400.

By increasing the LED component serial number of each LED component array, the driving voltage of light emitting device 400 can be improved.

(comparative example)

In the prior art, the LED component array of the different light emitting region of luminescent color needs to be connected in parallel respectively, therefore In order to improve the driving voltage of light emitting device, it is necessary to the serial number for increasing each LED component array, in the face of limited illumination region In product, the driving voltage that can be designed as light emitting device is limited.On the other hand, in the present invention, different light emitting region LED component array is connected in series respectively, therefore, it is easier to the driving electricity of light emitting device is improved in the area of limited illumination region Pressure.

(the 4th embodiment)

As shown in the wiring diagram of Figure 10, light emitting device 500 has mounting portion inside the packaging part 511 of surface installing type 512, it is configured with LED component L11a, L11b in mounting portion 512, wiring 552, resistance 506, diode 517, which are formed, is directed to LED device The bypass circuit 508 of part L11a.

In addition, the mounting area of surface installing type is generally limited relatively narrow, therefore can also be by LED component L11a, two Any of pole pipe 517, resistance 506 overlap the to each other installation, reduce required mounting area.Wiring 551,552 is by installing The wiring pattern or metal wire in face are formed, but the mounting area of surface installing type is generally limited relatively narrow, therefore it is preferable to use Metal wire.

Diode 517 on bypass circuit 508 can be the breakdown voltage Zener lower than the threshold voltage of LED component L11a Diode.

LED component L11a, L11b is also possible to multiple LED components are connected in series respectively and the LED component array that constitutes.Or Multiple LED components can also be connected in parallel and constitute by person.

The packaging part 511 of surface installing type uses resin, ceramics as material, overleaf has electrode terminal, passes through gold Belong to frame, metal throuth hole etc. to connect with the wiring electrode pad 513,514 being arranged in mounting portion.

As shown in the top view of Figure 11, mounting portion by translucent resin cover and form illumination region 502, illumination region 502 by The light emitting region 521,522 for issuing different luminescent colors is constituted.From packaging part 511 shine become from light emitting region 521, 522 secondary colour.

If using LED component L11a, L11b of different luminescent colors, even if merely with identical translucent resin It is sealed, also can obtain the size according to input current and issues the light emitting device 500 of different luminescent colors.In the feelings Under condition, the translucent resin that illumination region 502 can also be formed integrally by same fluorophor is sealed.

In addition, even if using identical luminescent color LED component L11a, L11b, can also pass through using fluorophor form Different translucent resin covers each LED component, issues different luminescent colors obtaining the size according to input current Light emitting device 500.By between LED component L11a, L11b be arranged partition wall, to a LED component using thixotropy compared with High translucent resin etc., carries out the resin seal that the range in mounting portion 512 limits, and has different shine so as to be formed The light emitting region of color.As shown in the A-A cross-sectional view of Figure 12, it also can be used and have adjusted fluorophor composition with lower as colour temperature Luminescent color translucent resin 523, one LED component L11b is carried out with the height in resin seal face lower than packaging part Sealing, then using fluorophor composition is had adjusted with become 524 pairs of entirety of translucent resin of the higher luminescent color of colour temperature into Row sealing.

(the 5th embodiment)

As shown in the wiring diagram of the light emitting device 600 of Figure 13, in the substrate with electrode pad 641,642 and wiring pattern LED encapsulation piece P1a~P1d is electrically connected in series respectively on 601, P2a~P2e is installed, formation LED encapsulation piece battle array Arrange P1, P2.The bypass circuit 608 for having resistance 600 and Zener diode 607 is connected in parallel in LED encapsulation piece array P1. By connecting multiple LED encapsulation pieces, internal LED component is also connected, and each LED encapsulation piece array becomes LED in terms of electricity Device array.

LED encapsulation piece P1a~P1d, P2a~P2e are installed on single substrate, are preferably configured with distance close to each other, Single light emitting source is consequently formed.LED encapsulation piece is preferably the surface of single light emitting source easy to form, small-sized and high output Mount type, chip scale package.

LED encapsulation piece array P1 and LED encapsulation piece array P2 issue different luminescent colors respectively, thus with reality before Mode is applied likewise by the resistance 606 and Zener diode 607 for properly selecting bypass circuit 608, is able to carry out based on electricity The luminescent color of the light emitting device 600 of the size of stream changes.

The LED encapsulation piece for belonging to same LED encapsulation piece array is preferably made of the LED encapsulation piece of identical luminescent color, is held It is easy to get to desired luminescent color.

As shown in the variation of Figure 14, the LED encapsulation piece for belonging to different LED encapsulation piece arrays is mutually adjacent, and each hair Light color pattern is symmetrically configured from the centre of luminescence, and thus as single light source, colour mixture is improved, therefore preferably.

The present invention is not limited to above-mentioned embodiments, and various changes can be carried out in the range shown in claim More, embodiment this hair will be also contained in obtained from disclosed technological means is appropriately combined respectively in various embodiments In bright technical scope.