Sintering clamp and sintering method for high-power micro-channel structure bar laser

文档序号:1784344 发布日期:2019-12-06 浏览:25次 中文

阅读说明:本技术 一种大功率微通道结构巴条激光器烧结夹具及其烧结方法 (Sintering clamp and sintering method for high-power micro-channel structure bar laser ) 是由 姚爽 孙素娟 开北超 夏伟 徐现刚 于 2018-05-28 设计创作,主要内容包括:本发明涉及一种大功率微通道结构巴条激光器烧结夹具及其烧结方法,属于半导体激光器制造领域,该烧结夹具包括定位底座、热沉压块和巴条压块,所述定位底座包括第一面和第二面,所述第一面用于放置热沉压块,所述第二面用于放置巴条压块,所述第一面和第二面上均设置有朝向定位底座内部的斜坡,所述第一面的斜坡和第二面的斜坡相互垂直;所述第一面上设置有用于对所述热沉压块限位的热沉压块宽限位槽,所述第二面上设置有用于对所述巴条压块限位的巴条压块宽限位槽,所述巴条压块与所述巴条接触面与所述巴条上表面尺寸对应。本发明不仅可以减少甚至避免“smile”现象的发生,而且提高了巴条烧结的一致性和稳定性。(The invention relates to a sintering clamp of a high-power microchannel structure bar laser and a sintering method thereof, belonging to the field of semiconductor laser manufacturing, wherein the sintering clamp comprises a positioning base, a heat sink pressing block and a bar pressing block, the positioning base comprises a first surface and a second surface, the first surface is used for placing the heat sink pressing block, the second surface is used for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, and the slope of the first surface is vertical to the slope of the second surface; the bar pressing block width limiting groove is used for limiting the bar pressing block, and the bar pressing block contact surface correspond to the upper surface of the bar in size. The method can reduce or even avoid smile phenomenon, and improve the consistency and stability of bar sintering.)

1. a sintering clamp for a high-power micro-channel structure bar laser is characterized by comprising a positioning base, a heat sink pressing block and a bar pressing block, wherein the positioning base comprises a first surface and a second surface, the first surface is used for placing the heat sink pressing block, the second surface is used for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, and the slope of the first surface is perpendicular to the slope of the second surface;

The bar pressing block width limiting groove is used for limiting the bar pressing block, and the bar pressing block and the bar contact surface correspond to the upper surface of the bar in size.

2. the sintering fixture for the high-power micro-channel structure bar laser of claim 1, wherein the width of the contact surface of the heat sink pressing block and the heat sink corresponds to the width of the heat sink, a first cylindrical rod is arranged on the bottom surface of the heat sink pressing block, a narrow heat sink pressing block limiting groove matched with the first cylindrical rod is arranged in the wide heat sink pressing block limiting groove, and the narrow heat sink pressing block limiting groove is a long circular hole.

3. The sintering fixture for the high-power micro-channel structure bar laser device as claimed in claim 1, wherein the bar pressing block is a cuboid, a trapezoidal pressing block corresponding to the upper surface of the bar is arranged below the cuboid, and a protruding strip matched with the wide limiting groove of the bar pressing block is arranged in the middle of the bottom surface of the bar pressing block.

4. the sintering fixture for the high-power micro-channel structure bar laser as claimed in claim 3, wherein the bar pressing block is provided with second cylindrical rods on both sides of the bottom surface, narrow limiting grooves for the bar pressing block to be matched with the second cylindrical rods are provided on both sides of the wide limiting groove of the bar pressing block on the second surface, and the narrow limiting grooves for the bar pressing block are slotted holes.

5. The sintering fixture of high-power microchannel structure bar laser as claimed in claim 1, wherein the positioning base is L-shaped, the included angle between the slope of the first surface and the horizontal plane is 30 °, and the included angle between the slope of the second surface and the horizontal plane is 60 °.

6. The sintering fixture for the high-power micro-channel structure bar laser device as claimed in claim 1, wherein a heat sink limiting groove for limiting the heat sink is disposed on the first surface, and the width of the heat sink limiting groove is adapted to the width of the heat sink.

7. the sintering fixture for high-power micro-channel structure bar laser of claim 1, wherein the positioning base is made of stainless steel or aluminum material, and the heat sink pressing block and the bar pressing block are made of stainless steel material.

8. The sintering fixture for bar lasers with high power and microchannel structures as claimed in claim 1, wherein the surface of the bar pressing block contacting with the N-face of the bar is polished.

9. the sintering method of the sintering fixture for the high-power micro-channel structure bar laser device as claimed in any one of claims 1 to 8, comprising the following steps:

Step 1: pushing an indium evaporation end against the surface of the bar pressing block wide limiting groove, placing the heat sink pressing block in the heat sink pressing block wide limiting groove, and enabling the heat sink pressing block to slide downwards along the heat sink pressing block wide limiting groove until the indium evaporation end abuts against the tail end of the heat sink to position the heat sink;

Step 2: placing the bar at a heat sink indium evaporation position, adjusting the bar to be positioned in the middle of a heat sink indium evaporation surface under a microscope, and enabling a light emitting surface of the bar to be close to the surface of a bar pressing block width limiting groove;

And step 3: placing a bar pressing block in a bar pressing block width limiting groove, wherein the bar pressing block slides downwards along the bar pressing block width limiting groove until the bar pressing block presses the N surface of the bar;

And 4, step 4: and placing the whole fixture in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.

10. The sintering method of the sintering fixture of the bar laser with the high-power microchannel structure according to claim 9, wherein in the step 1, the microchannel after indium evaporation is firstly heat-deposited and placed in a heat sink limiting groove of a positioning base, and then the end of the indium evaporation is propped against the surface of a bar pressing block width limiting groove;

in the step 1, a first cylindrical rod of a heat sink pressing block is inserted into a narrow limiting groove of the heat sink pressing block, and the heat sink pressing block slides downwards along a wide limiting groove of the heat sink pressing block until the first cylindrical rod abuts against the tail end of a heat sink to position the heat sink;

In the step 3, the second cylindrical rod of the bar pressing block is inserted into the narrow limiting groove of the bar pressing block, and the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until pressing the N surface of the bar.

Technical Field

The invention relates to a sintering clamp and a sintering method for a high-power micro-channel structure bar laser, and belongs to the field of semiconductor laser manufacturing.

Background

With the great improvement of the material epitaxy technology and the laser packaging technology, high-power laser diode devices and array devices are rapidly developed at home and abroad, become the main direction of the application and expansion of the current laser industry, have the advantages of small volume, high efficiency, low cost and the like, and are widely applied to the technical fields of laser medical treatment, industrial processing, military weapons, solid lasers, fiber laser pumping and the like. The output optical power, the photoelectric conversion efficiency and the reliability are three main parameters for measuring the performance of the laser, and the most important factor for limiting the development of the three is heat, which determines the output optical power of the laser, the photoelectric conversion efficiency and the reliability. Besides the properties of the semiconductor laser, the packaging quality of the laser is also a key factor influencing heat dissipation, and the welding between the laser and the heat sink is required to have the characteristics of firmness, no cavity, good heat conductivity, fatigue resistance, low heat resistance and the like. Therefore, the process and method of sintering a semiconductor laser onto a heat sink is one of the key technologies for high power semiconductor laser applications.

at present, most of packages of high-power microchannel bar lasers are sintered in reflow soldering equipment by using a sintering clamp, for example, in a bar chip sintering clamp of a high-power laser disclosed in Chinese patent document CN205282874U, five spring probes are used for applying pressure to the bar, and a thread and an adjustable bolt are arranged for adjusting the torque, but no reference standard exists in the process of adjusting balance to improve the smile effect, the torque of the five probes needs to be continuously adjusted, and the operation process is complex; in addition, the consistency of the bar sintering is difficult to guarantee, and the sintering yield may be influenced.

The bar sintering clamp proposed by "a sintering clamp of micro-channel semiconductor laser and sintering method thereof" disclosed in chinese patent document CN105244756A includes a positioning base and an adjustable cover plate, pressure is applied to the bar by adjusting a pressing block in the adjustable cover plate through a screw, the size of the pressing block is equal to the size of the bar, so as to ensure that the applied pressure is uniform, but it is difficult to ensure consistency of each pressing through the way of adjusting the pressure through the screw, i.e. repeatability of bar sintering is relatively low, unless quantitative pressing is performed through adjusting the screw by a torque screwdriver.

disclosure of Invention

the invention provides a sintering clamp of a high-power micro-channel structure bar laser and a sintering method thereof, which can reduce or even avoid smile phenomenon and improve the consistency and stability of bar sintering.

The invention adopts the following technical scheme:

on one hand, the invention provides a sintering clamp of a high-power micro-channel structure bar laser, which comprises a positioning base, a heat sink pressing block and a bar pressing block, wherein:

the positioning base comprises a first surface for placing the heat sink pressing block and a second surface for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, the slopes of the first surface and the slopes of the second surface are mutually perpendicular, namely, the included angle between the slopes of the first surface and the slopes of the second surface is 90 degrees, the heat sink pressing block and the bar pressing block can be prevented from sliding in the pressure applying process, and the protruding amount of the bar light-emitting surface relative to the front end of the heat sink can be strictly controlled;

Be provided with on the first face be used for right the spacing wide spacing groove of heat sink briquetting, heat sink briquetting can slide in the wide spacing groove of heat sink briquetting and realize compressing tightly heat sink, be equipped with on the second face and be used for the spacing wide spacing groove of bar briquetting to bar briquetting, bar briquetting can slide in the wide spacing inslot of bar briquetting and realize compressing tightly the bar, when the sintering needs bigger pressure, can increase the weight of heat sink briquetting and bar briquetting and increase the pressure of exerting pressure, for exerting pressure evenly, bar briquetting and bar contact surface, with bar upper surface size corresponds.

according to the invention, preferably, in order to ensure that the heat sink pressing block applies pressure to the heat sink uniformly, the width of the contact surface between the heat sink pressing block and the heat sink corresponds to the width of the heat sink, the width of the heat sink pressing block is adapted to the width limiting groove of the heat sink pressing block, and the heat sink can be accurately positioned through two sides of the width limiting groove of the heat sink pressing block; the bottom surface of heat sink briquetting is provided with first cylinder pole, heat sink briquetting wide spacing inslot set up with the narrow spacing groove of heat sink briquetting of first cylinder pole matched with, the narrow spacing groove of heat sink briquetting is the slotted hole, and the diameter of first cylinder pole is preferred to be equivalent with the width of the narrow spacing groove of heat sink briquetting, and the two phase-match is spacing to heat sink briquetting, and first cylinder pole can slide in the narrow spacing inslot of heat sink briquetting and realize spacing to heat sink briquetting, carries on spacingly through the both sides of the wide spacing groove of heat sink briquetting and the first cylinder pole of heat sink briquetting to heat sink briquetting, guarantees that the gravity of heat sink briquetting evenly exerts on heat sink, realizes the accurate positioning to heat sink.

According to the invention, the batten pressing block is a cuboid, the trapezoidal pressing block with the size corresponding to the upper surface of the batten is arranged below the cuboid, so that the pressing is uniform, the middle part of the bottom surface of the batten pressing block is provided with the convex strip matched with the wide limiting groove of the batten pressing block, and the convex strip can slide in the wide limiting groove of the batten pressing block, so that the positioning is more accurate.

furthermore, two sides of the bottom surface of the bar pressing block are respectively provided with a second cylindrical rod, two sides of the bar pressing block wide limiting groove on the second surface are respectively provided with a bar pressing block narrow limiting groove used for being matched with the second cylindrical rods, the bar pressing block narrow limiting grooves are long round holes, the second cylindrical rods are preferably two symmetrically distributed rods, the diameters of the second cylindrical rods are preferably equal to the width of the bar pressing block narrow limiting groove, the bar pressing blocks are limited by matching the bar pressing block narrow limiting grooves and the bar pressing block narrow limiting grooves, the bar pressing block wide limiting groove and the bar pressing block narrow limiting groove are designed according to the sizes of the bar pressing block and the second cylindrical rods, the bar pressing block is placed on the upper surface of the front end of the heat sink under a microscope, the bar is adjusted to be in the middle position of the heat sink, the bar light-emitting surface is in close contact with the bar pressing block wide limiting groove surface, the bar pressing block is limited by the bar pressing block wide limiting groove and the bar narrow limiting groove, and the gravity of the bar pressing block is ensured to, the accurate positioning of the bars is realized.

Furthermore, the positioning base is L-shaped, the included angle between the slope of the first surface and the horizontal plane is 30 degrees, the included angle between the slope of the second surface and the horizontal plane is 60 degrees, and the 30-degree angle of the first surface provides a force parallel to the first surface downwards and vertical to the second surface for the heat sink so as to ensure that the heat sink is in close contact with the second surface; the 60 angle of the second face provides a vertical downward force on the bar to ensure adequate compression.

preferably, the first surface is provided with a heat sink limiting groove for limiting the heat sink, the heat sink limiting groove is positioned at the front end of the wide limiting groove of the heat sink pressing block, the heat sink is placed in the heat sink limiting groove, the front end of the heat sink pressing block is tightly attached to the wide limiting groove of the bar pressing block, the heat sink pressing block is placed in the wide limiting groove of the heat sink pressing block, meanwhile, the first cylindrical rod of the heat sink pressing block is inserted into the narrow limiting groove of the heat sink pressing block, the heat sink pressing block slides downwards along the wide limiting groove of the heat sink pressing block until the heat sink pressing block is contacted with the heat; the bar is placed on the upper surface of the front end of the heat sink, the light emitting surface of the bar is tightly attached to the wide limiting groove of the bar pressing block, the bar pressing block is placed in the wide limiting groove of the bar pressing block, meanwhile, the second cylindrical rod is inserted into the narrow limiting groove of the bar pressing block, the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until contacting with the upper surface of the bar, the bar is pressed by the gravity of the bar pressing block, and good contact between the bar and the heat sink is guaranteed.

the width of the heat sink limiting groove is matched with that of the heat sink, the heat sink limiting groove is designed according to the size of the heat sink, the heat sink is placed in the heat sink limiting groove under a microscope, the front end of the heat sink is adjusted to be in close contact with the surface of the wide limiting groove of the bar pressing block, and the heat sink is accurately limited through two sides of the heat sink limiting groove.

preferably, the positioning base is made of stainless steel or aluminum material, and the heat sink pressing block and the batten pressing block are made of stainless steel material.

Preferably, the size of the contact surface of the bar pressing block and the N surface of the bar is equal to that of the bar, so that the pressing uniformity of the bar pressing block is ensured, and the surface of the bar pressing block, which is in contact with the N surface of the bar, is polished, so that the contact tightness of the bar pressing block and the surface of the bar pressing block is ensured.

in another aspect, the invention provides a sintering method of the sintering fixture for the bar laser with the high-power micro-channel structure, which includes:

step 1: the indium evaporation end is propped against the surface of a bar pressing block wide limiting groove, the heat sink pressing block is placed in the heat sink pressing block wide limiting groove, and the heat sink pressing block slides downwards along the heat sink pressing block wide limiting groove until the heat sink pressing block is propped against the tail end of the heat sink to position the heat sink;

step 2: placing the bar at a heat sink indium evaporation position, adjusting the bar to be positioned in the middle of a heat sink indium evaporation surface under a microscope, and enabling a light emitting surface of the bar to be close to the surface of a bar pressing block width limiting groove;

And step 3: placing a bar pressing block in a bar width limiting groove, wherein the bar pressing block slides downwards along the bar pressing block width limiting groove until the bar pressing block presses the N surface of the bar;

And 4, step 4: and placing the whole fixture in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.

Further, in the step 1, the microchannel after indium evaporation is firstly placed in a heat sink limiting groove of the positioning base in a heat sink manner, and then the indium evaporation end is propped against the surface of the wide limiting groove of the bar pressing block;

In the step 1, a first cylindrical rod of a heat sink pressing block is inserted into a narrow limiting groove of the heat sink pressing block, and the heat sink pressing block slides downwards along a wide limiting groove of the heat sink pressing block until the first cylindrical rod abuts against the tail end of a heat sink to position the heat sink;

In the step 3, the second cylindrical rod of the bar pressing block is inserted into the narrow limiting groove of the bar pressing block, and the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until pressing the N surface of the bar.

The invention has the beneficial effects that:

1) In the sintering clamp of the high-power micro-channel structure bar laser, the slope of the first surface and the slope of the second surface of the positioning base are perpendicular to each other, so that the sliding of the heat sink pressing block and the bar pressing block in the pressure applying process can be avoided, and the protruding amount of the bar light-emitting surface relative to the front end of the heat sink can be strictly controlled.

2) the sintering clamp for the high-power micro-channel structure batten laser has the advantages of simple structure, low cost, simplicity and convenience in operation and high reliability, the slope and the plurality of limiting grooves of the first surface and the second surface of the positioning base are used for limiting the heat sink pressing block and the batten pressing block, the heat sink can be accurately positioned through the limited heat sink pressing block, the limited batten pressing block can be accurately aligned to the N surface of the batten and evenly applies pressure to the batten through self gravity, and the consistency, uniformity and stability of the applied pressure are guaranteed.

3) In the sintering process, the limiting grooves designed according to the sizes of the bars and the heat sink are used for limiting each part, the heat sink pressing block and the bars pressing block are used for respectively positioning and pressing the heat sink and the bars by using the gravity of the heat sink pressing block and the bars pressing block during sintering, the pressing pressure can be adjusted by adjusting the weight of the bars pressing block during sintering, the contact surface of the bars pressing block and the bars corresponds to the size of the upper surface of the bars, the pressing is uniform, the consistency and the accuracy are ensured, the efficiency is improved, and the method is suitable for batch production.

4) the clamp can accurately position the heat sink and the bars, and the bar pressing block provides uniform pressure for sintering, so that sintering stress caused by uneven stress is avoided, and the smile phenomenon is reduced or even avoided.

5) The sintering fixture of the high-power micro-channel structure bar laser is matched with a packaging process, the packaging overall qualification rate is more than 98%, and sintering cavities are greatly reduced.

drawings

FIG. 1 is a schematic diagram of the overall structure of a high-power micro-channel structure bar laser sintering fixture of the present invention;

FIG. 2 is a side view of FIG. 1;

FIG. 3 is a schematic structural view of the positioning base in FIG. 1;

FIG. 4 is a schematic structural view of the heat-sinking compact of FIG. 1;

FIG. 5 is a schematic view of the structure of the barnacle compact of FIG. 1;

Wherein: 1-positioning base, 2-heat sink pressing block, 3-bar pressing block, 301-trapezoidal pressing block, 4-heat sink, 5-bar, 6-heat sink limiting groove, 7-heat sink pressing block wide limiting groove, 8-heat sink pressing block narrow limiting groove, 9-bar pressing block wide limiting groove, 901-convex strip, 10-bar pressing block narrow limiting groove, 11-first cylindrical rod and 12-second cylindrical rod.

the specific implementation mode is as follows:

in order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific examples, but not limited thereto, and the present invention is not described in detail and is in accordance with the conventional techniques in the art.

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