阅读说明：本技术 一种led芯片倒膜装置 (LED chip film-pouring device ) 是由 李勇强 张晓娜 张向鹏 冯慧敏 于 2021-08-11 设计创作，主要内容包括：本发明涉及一种LED芯片倒膜装置,包括底板(1),底板(1)上固定载盘(15)且其内设置升降电机(2),载盘(15)吸附有第二承载膜(14),第二承载膜(14)上方设盖板(3),盖板(3)上方设支架,支架内设水平转轴(5)和垂直转轴(4),水平转轴(5)一端连接水平转轴电机(11)且两端分别与一根垂直转轴(4)相连,垂直转轴(4)与升降电机(2)相连,水平转轴(5)上设有刮刀模组(10)和滚轮模组(17),滚轮模组(17)与盖板(3)之间放置第一承载膜(13),盖板(3)中间区域镂空,支架上方设有压盘(8)和压膜气缸(9)。其能够减少LED芯片倒膜过程中的人为操作,提升制程良率。(The invention relates to an LED chip film pouring device which comprises a bottom plate (1), wherein a carrying disc (15) is fixed on the bottom plate (1), a lifting motor (2) is arranged in the carrying disc (15), a second carrying film (14) is adsorbed on the carrying disc (15), a cover plate (3) is arranged above the second carrying film (14), a support is arranged above the cover plate (3), a horizontal rotating shaft (5) and a vertical rotating shaft (4) are arranged in the support, one end of the horizontal rotating shaft (5) is connected with a horizontal rotating shaft motor (11), two ends of the horizontal rotating shaft motor are respectively connected with one vertical rotating shaft (4), the vertical rotating shaft (4) is connected with the lifting motor (2), a scraper module (10) and a roller module (17) are arranged on the horizontal rotating shaft (5), a first carrying film (13) is arranged between the roller module (17) and the cover plate (3), the middle area of the cover plate (3) is hollowed, and a pressure plate (8) and a film pressing cylinder (9) are arranged above the support. The manual operation in the LED chip film-pouring process can be reduced, and the process yield is improved.)

1. A film pouring device for an LED chip comprises a bottom plate (1) and is characterized in that a carrying disc (15) is fixed on the bottom plate (1), a lifting motor (2) is arranged in the bottom plate (1), a vacuum hole for adsorbing a second carrying film (14) is formed in the upper surface of the carrying disc (15), a cover plate (3) is arranged above the second carrying film (14), a support is arranged above the cover plate (3), a horizontal rotating shaft (5) and a vertical rotating shaft (4) are arranged in the support, one end of the horizontal rotating shaft (5) is connected with a horizontal rotating shaft motor (11), two ends of the horizontal rotating shaft (5) are respectively connected with the upper end of the vertical rotating shaft (4), the lower end of the vertical rotating shaft (4) is connected with the lifting motor (2), a scraper module (10) and a roller module (17) are arranged on the horizontal rotating shaft (5), gyro wheel module (17) with first carrier film (13) have been placed between apron (3), first carrier film (13) with second carrier film (14) relative placement just be stained with a plurality of LED chips on first carrier film (13), apron (3) middle zone fretwork makes a plurality of LED chips on first carrier film (13) can with second carrier film (14) bonding, the support top is provided with pressure disk (8) and press mold cylinder (9), pressure disk (8) and press mold cylinder (9) are used for with the adhesion in a plurality of LED chip pressfittings on first carrier film (13) are in on second carrier film (14).

2. The LED chip film pouring device according to claim 1, wherein the support comprises a horizontal slide rail (6) and a vertical slide rail (20), the horizontal slide rail (6) is parallel to the horizontal rotating shaft (5), the vertical slide rail (20) is parallel to the vertical rotating shaft (4), the horizontal slide rail (6) and the horizontal rotating shaft (5) can slide up and down along the vertical slide rail (20) under the driving of the vertical rotating shaft (4), the scraper module (10) and the roller module (17) are arranged on the horizontal slide rail (6), and the scraper module (10) and the roller module (17) can slide left and right along the horizontal slide rail (6) under the driving of the horizontal rotating shaft (5).

3. The LED chip film-rewinding device according to claim 2, characterized in that said scraper module (10) and said roller module (17) are connected by a connecting rod (19) in between.

4. The LED chip film-pouring device according to claim 1, wherein a concave area is arranged in the middle area of the bottom plate (1) and the carrier disc (15) is fixed in the concave area, the length and width of the concave area of the bottom plate (1) are larger than the length and width of the carrier disc (15), and the depth of the concave area is consistent with the thickness of the carrier disc (15).

5. The LED chip film-pouring device according to claim 4, characterized in that a heating device is arranged in the carrier disc (15).

6. The LED chip film-pouring device according to claim 1, wherein the lifting motor (2) and the horizontal rotating shaft motor (11) are forward and reverse rotating synchronous motors and are uniformly controlled by the speed control module.

7. The LED chip film-rewinding device according to claim 1, wherein said film-pressing cylinder (9) is connected to a back plate (7) through a support column, said back plate (7) is connected to said base plate (1), and said film-pressing cylinder (9) is adhered to a platen (8).

8. The LED chip film-rewinding device according to claim 1, wherein the thickness of the cover plate (3) is less than or equal to the thickness of the second carrier film (14) and the cover plate (3) is made of an alloy plate.

9. The LED chip film-rewinding device according to claim 1, characterized in that the hollowed-out area of said cover sheet (3) is larger than the area of said first carrier film (13) to which said plurality of LED chips are adhered.

10. The LED chip film-falling device according to claim 9, wherein the hollowed-out area of the cover plate (3) is square or circular.

Technical Field

The invention belongs to the technical field of LED chip manufacturing, relates to an auxiliary device used in an LED chip preparation process, and particularly relates to an LED chip film pouring device.

Background

A Light Emitting Diode (LED) is a semiconductor Diode that can convert electrical energy into Light energy. The light emitting diode epitaxial wafer is a basic structure of a light emitting diode chip, and can be applied from light emitting diode epitaxial wafer preparation, chip preparation to finished light emitting diode finished products, and at least needs to be subjected to processes of scribing, splitting, sorting, film reversing, packaging and the like.

In the LED chip manufacturing process, after scribing, splitting and sorting, a plurality of LED chips with the same interval and obtained by scribing, splitting and sorting the LED epitaxial wafer can be obtained on the first bearing film, in order to meet the requirement of downstream packaging, the film is required to be inverted, and the LED chips on the first bearing film are inverted on the second bearing film.

In the existing film pouring process, the film pouring operation is usually performed manually by a person. In the process of manual film-pouring operation, because the operation method and tools are not used properly, the whole number of the LED chips cannot be poured, and the plurality of the LED chips left on the first bearing film can be directly scrapped, so that the preparation yield of the LED chips is influenced, and waste is caused.

In view of the above technical defects in the prior art, it is urgently needed to develop an LED chip film-inverting device.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides an LED chip film-pouring device which can overcome the defects in the background art and improve the preparation yield of LED chips.

In order to achieve the above purpose, the invention provides the following technical scheme:

a film pouring device for LED chips comprises a bottom plate, and is characterized in that a carrying disc is fixed on the bottom plate, a lifting motor is arranged in the bottom plate, a vacuum hole for adsorbing a second carrying film is formed in the upper surface of the carrying disc, a cover plate is arranged above the second carrying film, a support is arranged above the cover plate, a horizontal rotating shaft and a vertical rotating shaft are arranged in the support, a horizontal rotating shaft motor is connected to one end of the horizontal rotating shaft, two ends of the horizontal rotating shaft are respectively connected with the upper ends of the vertical rotating shafts, the lower end of the vertical rotating shaft is connected with the lifting motor, a scraper module and a roller module are arranged on the horizontal rotating shaft, a first carrying film is arranged between the roller module and the cover plate, the first carrying film and the second carrying film are oppositely arranged, and a plurality of LED chips are adhered on the first carrying film, the cover plate middle area hollow-out enables a plurality of LED chips on the first bearing film to be bonded with the second bearing film, a pressure plate and a film pressing cylinder are arranged above the support, and the pressure plate and the film pressing cylinder are used for pressing the LED chips on the first bearing film on the second bearing film.

Preferably, wherein, the support includes horizontal slide rail and perpendicular slide rail, horizontal slide rail with horizontal pivot parallel arrangement, perpendicular slide rail with perpendicular pivot parallel arrangement just horizontal slide rail with horizontal pivot can be in the drive of perpendicular pivot is in down along perpendicular slide rail slides from top to bottom, scraper module and gyro wheel module set up on the horizontal slide rail just scraper module and gyro wheel module can be in the drive of horizontal pivot is in down along horizontal slide rail side-to-side slip.

Preferably, the scraper module and the roller module are connected by a connecting rod in the middle.

Preferably, a recessed area is formed in the middle area of the bottom plate, the carrying tray is fixed in the recessed area, the length and the width of the recessed area of the bottom plate are greater than those of the carrying tray, and the depth of the recessed area is consistent with the thickness of the carrying tray.

Preferably, a heating device is arranged in the carrying disc.

Preferably, the lifting motor and the horizontal rotating shaft motor are both positive and negative rotation synchronous motors and are controlled by the speed control module in a unified manner.

Preferably, the film pressing cylinder is connected with a back plate through a support column, the back plate is connected with the bottom plate, and the film pressing cylinder is adhered with the pressing plate.

Preferably, the thickness of the cover plate is less than or equal to that of the second carrier film, and the cover plate is made of an alloy plate.

Preferably, the hollowed-out area of the cover plate is larger than the area of the first carrier film to which the plurality of LED chips are adhered.

Preferably, the hollow area of the cover plate is square or circular.

Compared with the prior art, the LED chip film-pouring device has one or more of the following beneficial technical effects:

1. the film is poured by using a mechanical structure, so that the film pouring process is solidified, manual operation is reduced, the use efficiency is improved, and the purpose of improving the process yield is achieved.

2. The whole process is carried out automatically, the automation degree is high, and the labor intensity and the labor cost are reduced.

3. The device has simple structure, convenient realization and convenient popularization and application.

Drawings

Fig. 1 is a schematic front view of an LED chip film-inverting device according to the present invention.

Fig. 2 is a schematic front view of a support, a scraper module and a roller module of the LED chip film-rewinding device of the present invention.

Fig. 3 is a schematic top view of a support, a scraper module and a roller module of the LED chip film-rewinding device of the present invention.

Fig. 4 is a schematic top view of a bottom plate of the LED chip flip-chip device according to the present invention.

Fig. 5 is a schematic top view of the cover plate of the LED chip film-pouring device of the present invention.

Fig. 6 is a schematic top view of another cover plate of the LED chip flip-chip device according to the present invention.

Fig. 7 is a schematic top view of a carrier tray of the LED chip film-inverting apparatus of the present invention.

Detailed Description

The present invention is further described with reference to the following drawings and examples, which are not intended to limit the scope of the present invention.

The invention relates to a film pouring device for an LED chip, which adopts a mechanical mechanism to carry out a film pouring process, can reduce manual operation and improve the use efficiency so as to achieve the aim of improving the process yield, and figure 1 shows a schematic front view structure diagram of the film pouring device for the LED chip. As shown in fig. 1, the LED chip flip-chip device of the present invention includes a base plate 1.

The bottom plate 1 is the foundation of the whole LED chip film-pouring device and plays a supporting role. Wherein, the back plate 7 can be connected to the back side of the bottom plate 1.

In the present invention, a controller, for example, a CPU, etc., may be disposed in the bottom plate 1, so as to realize automatic control of the whole LED film pouring device.

And, the front side of the base plate 1 may be provided with a start switch 21, a temperature control switch 22, a squeeze film time control switch 23, a power switch 18, a lifting switch 24 and a vacuum switch 12 connected to the controller.

As shown in fig. 1 and 2, a boat 15 is fixed to the base plate 1. For example, the boat 15 may be detachably connected to the base plate 1 by screws or the like, thereby fixing the boat 15 to the base plate 1. This makes the boat 15 easy to replace.

And, a lifting motor 2 is arranged in the bottom plate 1. Preferably, four lifting motors 2 are arranged in the bottom plate 1, and the four lifting motors 2 are located at four corners of the bottom plate 1.

Preferably, the central region of the base plate 1 is provided with a recessed region and the boat 15 is fixed in the recessed region.

Preferably, the length and width of the recessed area of the bottom plate 1 are greater than the length and width of the boat 15, and the depth is approximately equal to the thickness of the boat 15. Still preferably, the length-width ratio of the concave area is within 1mm larger than the length-width of the carrier disc 15. And the thickness of the carrier plate 15 is slightly larger than the depth of the recessed area, so that the upper surface of the carrier plate 15 is positioned above the upper surface of the bottom plate 1, and thus, the second carrier film 14 is conveniently carried. And, in this way, it is more advantageous to fix the boat 15.

Wherein, a second carrier film 14 is absorbed on the upper surface of the carrier tray 15.

Preferably, as shown in fig. 7, the carrier plate 15 is provided with a plurality of vacuum holes. The vacuum holes are connected with a vacuum pumping device, and vacuum pumping can be performed through the vacuum pumping device, so that the second carrier film 14 can be conveniently adsorbed on the carrier disc 15.

And, preferably, a heating device is provided in the carrier plate 15. The second carrier film 14 attached to the carrier tray 15 can be heated by the heating device, so that the viscosity of the second carrier film 14 can be enhanced, and the attachment of the LED chip is facilitated.

A cover plate 3 is arranged above the second bearing film 14. The middle area of the cover plate 3 is hollow. The hollow area of the cover plate 3 can be any figure. Preferably, as shown in fig. 5 and 6, the hollowed-out area of the cover plate 3 may be square or circular.

And, a first carrier film 13 is arranged on the cover plate 3. The first carrier film 13 and the second carrier film 14 are disposed opposite to each other, and a plurality of LED chips are adhered to the first carrier film 13. Through the hollow-out area of the cover plate 3, the plurality of LED chips on the first carrier film 13 can be bonded with the second carrier film 14, so that the plurality of LED chips on the first carrier film 13 are inversely coated on the second carrier film 14.

Preferably, the hollowed-out area of the cover plate 3 is larger than the area of the first carrier film 13 to which the plurality of LED chips are adhered, so as to ensure that the plurality of LED chips on the first carrier film 13 can be completely filmed onto the second carrier film 14.

More preferably, the thickness of the cover plate 3 is equal to or less than the thickness of the second carrier film 14, for example, the thickness of the cover plate 3 is 0.01mm to 0.1mm less than the thickness of the second carrier film 14. More preferably, the cover plate 3 is made of an alloy plate and has high flexibility. In this way, it is facilitated to make the plurality of LED chips on the first carrier film 13 adhere to the second carrier film 14.

A bracket is arranged above the cover plate 3. Preferably, the support comprises a horizontal slide rail 6 and a vertical slide rail 20. For example, the support comprises two horizontal sliding rails 6 and four vertical sliding rails 20.

And a horizontal rotating shaft 5 and a vertical rotating shaft 4 are arranged in the bracket. For example, two horizontal rotating shafts 5 and four vertical rotating shafts 4 are arranged in the bracket.

One end of each horizontal rotating shaft 5 is connected with a horizontal rotating shaft motor 11, and two ends of each horizontal rotating shaft 5 are respectively connected with the upper end of one vertical rotating shaft 4. The lower end of each vertical rotating shaft 4 is connected with one lifting motor 2.

Meanwhile, the horizontal sliding rails 6 are arranged in parallel with the horizontal rotating shafts 5, that is, one horizontal sliding rail 6 is arranged in parallel beside one horizontal rotating shaft 5. The vertical slide rail 20 is arranged in parallel with the vertical rotating shaft 4. That is, one of the vertical slide rails 20 is disposed in parallel beside one of the vertical rotating shafts 4.

As shown in fig. 5 and 6, the cover plate 3 is provided with a through hole for the vertical slide rail 20 and the vertical rotation shaft 4 to pass through, and the cover plate 3 can be connected to the vertical slide rail 20 so that the cover plate 3 can move up and down along the vertical slide rail 20.

As shown in fig. 4, the vertical slide rail 20 and the vertical rotary shaft 4 are connected to the base plate 1 after passing through the cover plate 3. Wherein the lower end of the vertical slide rail 20 is connected to the top surface of the base plate 1. The lower end of the vertical rotating shaft 4 is connected with the lifting motor 2.

And the horizontal rotating shaft 5 and the horizontal sliding rail 6 are provided with a scraper module 10 and a roller module 17. For example, the horizontal rotating shaft 6 is a rolling screw and two horizontal nuts are arranged on the rolling screw. And two horizontal sliding blocks are arranged on the horizontal sliding rail 6. The doctor blade module 10 and the roller module 17 are both connected to a horizontal nut and a horizontal slide. Therefore, under the driving of the horizontal rotating shaft motor 11, the horizontal rotating shaft 5 can rotate, so as to drive the horizontal nut to move left and right, and further enable the scraper module 10 and the roller module 17 to slide left and right along the horizontal sliding rail 6 through the horizontal sliding block under the driving of the horizontal nut.

Preferably, the doctor blade module 10 and the roller module 17 are connected in between by a connecting rod 19. In this way, the doctor blade module 10 and the roller module 17 are made integral so that their movements are synchronized.

Meanwhile, each vertical rotating shaft 4 can be provided with a vertical nut. A vertical slider may be disposed on each of the vertical sliding rails 20. And two ends of the horizontal sliding rail 6 and the horizontal rotating shaft 5 are respectively connected with one vertical nut and one vertical sliding block. Therefore, under the driving of the lifting motor 2, the vertical rotating shaft 4 can rotate, so as to drive the vertical nut to move up and down, and further the horizontal rotating shaft 5 and the horizontal sliding rail 6 can be driven by the vertical nut to slide up and down along the vertical sliding rail 20 through the vertical sliding block.

In this way, the doctor blade module 10 and the roller module 17 are enabled to move up, down, left, and right relative to the first carrier film 13.

Preferably, the lifting motor 2 and the horizontal rotating shaft motor 11 are both positive and negative rotation synchronous motors and are controlled by the speed control module in a unified manner. The speed control module may be coupled to the controller. In this way, it is convenient to control the rotation direction and speed of the lift motor 2 and the horizontal rotation shaft motor 11.

Wherein, the roller module 17 is provided with a roller. Preferably, the roller is made of a high-viscosity silica gel material, so that the first carrier film 13 can be adhered to the roller by using the viscosity of the roller, and the first carrier film 13 after the film pouring can be recovered by using the rotation of the roller.

More preferably, the height position of the roller module 17 can be adjusted, so that it is more convenient to recover the first carrier film 13 after the film pouring.

In addition, preferably, a rotating motor 16 is provided on the roller module 17. The rotating motor 16 can drive the roller to rotate, so that the roller can recover the first carrier film 13 after the film pouring is finished.

And a scraper is arranged on the scraper module 10. Preferably, the scraper is made of hard silica gel, and the thickness of the front end of the scraper is larger than the thickness of the LED chip within 30 microns. And a 10mm distance is reserved between the roller and the scraper. Therefore, the first carrier film 13 after being recovered can be prevented from influencing the action of the roller.

More preferably, the scrapers of the doctor blade module 10 can be adjusted in height and angle, so as to facilitate better scraping of the first carrier film 13.

And a pressure plate 8 and a film pressing cylinder 9 are arranged above the support. For example, the squeeze film cylinder 9 is connected to the back plate 7 through a support column. And, the lamination cylinder 9 and the platen 8 are bonded together by an adhesive. In this way, the platen 8 and the lamination cylinder 9 can press the plurality of LED chips adhered to the first carrier film 13 onto the second carrier film 14.

Preferably, the pressure plate 8 is bonded together with the soft silicon glue by using an alloy steel plate, so that the LED chips are protected from being damaged by external force, and the LED chips on the first carrier film 13 and the second carrier film 14 are bonded in a complete contact manner.

When the LED chip film pouring device is used for film pouring, the power switch 18 is turned on, the temperature of the carrier disc 15 is firstly set through the temperature control switch 22, and the temperature of the carrier disc 15 is increased to 50-60 ℃ through the heating device in the carrier disc 15, so that the viscosity of the second carrier film 14 is favorably enhanced.

Then, the lift switch 24 is pressed to activate the lift motor 2, thereby lifting the support and the cover plate 3, and then, the second carrier film 14 is placed on the carrier tray 15.

Then, the vacuum switch 12 is turned on, and the vacuum-pumping device is activated to suck the second carrier film 14 onto the carrier tray 15.

The cover 3 can then be lowered manually. And after the cover plate 3 is put down, the first carrier film 13 is manually placed, and the LED chip area on the first carrier film 13 is made to coincide with the hollow area of the cover plate 3. At this time, the roller module 17 and the doctor blade module 10 are both at the point B in fig. 1 (where the point B vertical position is the right side of the blade tray 15).

Then, the start switch 21 is pressed, the film pressing time control switch 23 sets the pressing time, and at this time, the film pressing cylinder 9 presses the pressure plate 8 downwards to be attached to the back surface of the first carrier film 13 for 10s (set by the film pressing time control switch 23) and then lifts. And, at this time, the horizontal spindle motor 11 rotates to move the scraper module 10 and the roller module 17 from point B (initial point) to point a (where the point a vertical position is the left edge of the carrier tray 15) in fig. 1, so as to scrape the first carrier film 13 flat by the scraper, thereby facilitating the bonding of the plurality of LED chips on the first carrier film 13 to the second carrier film 14.

When the scraper module 10 and the roller module 17 move to the point A, the horizontal rotating shaft motor 11 stops, and the lifting motor 2 starts to work to lower the support. At this time, the roller module 17 is pressed down to adhere the first carrier film 13 and the doctor module 10 is pressed down to be in contact with the first carrier film 13. Due to the contact and the angle of the doctor blade module 10 and the first carrier film 13, the LED chip is pressed on the second carrier film 14 during the transfer process.

When the horizontal rotating shaft motor 11 starts to rotate reversely to drive the movable scraper module 10 to move and the rotating motor 16 drives the roller of the roller module 17 to rotate, the roller module 17 tears up and recovers the first carrier film 13. At this time, the LED chip has been transferred to the second carrier film 14, and the scraper module 10 and the roller module 17 move to point a in fig. 1, and then the horizontal spindle motor 11 stops operating. At this time, the lifting motor 2 works to lift the bracket and the cover plate 3 and take down the second carrier film 14 by pressing the lifting switch 24. Thus, the whole film pouring process is completed.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and do not limit the protection scope of the present invention. Those skilled in the art can make modifications or equivalent substitutions to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.