阅读说明：本技术 一种Mini-LED器件的制作方法 (Manufacturing method of Mini-LED device ) 是由 李星 孙明 庄文荣 于 2021-08-30 设计创作，主要内容包括：本发明涉及LED封装技术领域,尤其涉及一种Mini-LED器件的制作方法。包括以下步骤：S1：将LED芯片转移固定于基板上；S2：将固定于基板上的LED芯片通过模压工艺制成的封装层进行封装,完成LED芯片封装；S3：将完成LED芯片封装的基板放置在载板的切割胶体上；S4：将基板进行切割,然后移除切割胶体与载板,分割成单颗Mini-LED器件。从而,本发明提供的Mini-LED器件的制作方法,在基板与载板之间粘有切割胶体,进行基板切割时,能够有效固定分割后得到的单颗LED器件,解决了切割时的芯片飞溅问题,且保持胶体的完整性,分割时胶体可一次性与多颗芯片分离,提高了安全性和实用性。(The invention relates to the technical field of LED packaging, in particular to a manufacturing method of a Mini-LED device. The method comprises the following steps: s1: transferring and fixing the LED chip on the substrate; s2: packaging the LED chip fixed on the substrate by a packaging layer manufactured by a mould pressing process to finish the packaging of the LED chip; s3: placing the substrate subjected to the LED chip packaging on a cutting colloid of the carrier plate; s4: and cutting the substrate, removing the cutting colloid and the carrier plate, and dividing into single Mini-LED devices. Therefore, according to the manufacturing method of the Mini-LED device, provided by the invention, the cutting colloid is adhered between the substrate and the carrier plate, when the substrate is cut, the single LED device obtained after cutting can be effectively fixed, the problem of chip splashing during cutting is solved, the integrity of the colloid is kept, the colloid can be separated from a plurality of chips at one time during cutting, and the safety and the practicability are improved.)

1. A method for manufacturing a Mini-LED device is characterized by comprising the following steps:

s1: transferring and fixing the LED chip on the substrate;

s2: packaging the LED chip fixed on the substrate by a packaging layer manufactured by a mould pressing process to finish the packaging of the LED chip;

s3: placing the substrate subjected to the LED chip packaging on a cutting colloid of the carrier plate;

s4: and cutting the substrate, removing the cutting colloid and the carrier plate, and dividing into single Mini-LED devices.

2. The method of fabricating a Mini-LED device according to claim 1, wherein the LED chip is a forward-mounted red Mini-LED, a flip-chip green Mini-LED, or a flip-chip blue Mini-LED; the front-mounted red light Mini-LED is transferred and fixed on the substrate in a die bonder transfer and reflow soldering mode; the inverted green light Mini-LED or the inverted blue light Mini-LED is fixed on the substrate in a thimble transfer and laser welding mode.

3. The method for manufacturing a Mini-LED device according to claim 1, wherein the step of placing the substrate on which the LED chip is packaged on the cutting colloid of the carrier comprises:

and placing the substrate on a cutting colloid adhered to the upper surface of the carrier plate, covering the cutting colloid on the upper surface of the carrier plate and the bottom of the substrate through pressing, and curing.

4. The method for manufacturing a Mini-LED device according to claim 1, wherein the steps of cutting the substrate, removing the cutting colloid and the carrier plate, and dividing into individual Mini-LED devices are as follows:

the substrate is cut by using a water jet, the cutting path is arranged on the outer side of the periphery of the LED chip, the substrate penetrates through the middle part of the cutting colloid during cutting, the cutting colloid is not cut off, the middle part of the cutting colloid is between one third and one half of the thickness of the cutting colloid, then the top of each single Mini-LED device is pasted with the transfer film, the cutting colloid is irradiated from the back by using UV light, the cutting colloid is debonded, and a plurality of single Mini-LED devices fixed on the transfer film are formed after the cutting colloid and the carrier plate are removed.

5. The method of claim 1, wherein the encapsulation layer is a heat curable resin material, and the heat curable resin material is one or more of scattering powder, diffusion powder, dispersant, melanin, and the like.

6. The method of fabricating a Mini-LED device as set forth in claim 4, wherein the transfer film is a blue film.

7. The method of claim 1, wherein the carrier is made of glass, silicon steel or a tension film.

8. The method for manufacturing a Mini-LED device according to claim 1, wherein the cutting colloid is made of high temperature glue, UV glue or pyrolytic glue.

9. The method of making a Mini-LED device of claim 1, wherein the single Mini-LED device is a single color device.

Technical Field

The invention relates to the technical field of LED packaging, in particular to a manufacturing method of a Mini-LED device.

Background

With the development of LED (Light Emitting Diode) devices, the application environments of LEDs are increasing, and the market demand for LEDs is also increasing. The LED display screen on the market is formed by arranging a plurality of patch type forward-mounted or flip-chip packaged LED device matrixes, and each forward-mounted or flip-chip packaged LED device is used as a display pixel.

In the method for manufacturing the LED device in the prior art, when the chip is manufactured into the device, the forward-mounted or inverted LED chip needs to be packaged firstly and then cut. However, in the prior art, the substrate is often subjected to direct splitting and cutting to manufacture the chip device unit, but the chip device is easily damaged during cutting due to insufficient flatness of the substrate or the bottom plate, so that the yield of the chip device is greatly reduced.

Disclosure of Invention

The invention aims to provide a method for manufacturing a Mini-LED device, which aims to solve the technical problems that in the prior art, a substrate is often subjected to direct splitting cutting to manufacture a chip device unit, the chip device is easily damaged during cutting, the yield of the chip device is greatly reduced, and the like.

The invention provides a method for manufacturing a Mini-LED device, which comprises the following steps:

s1: transferring and fixing the LED chip on the substrate;

s2: packaging the LED chip fixed on the substrate by a packaging layer manufactured by a mould pressing process to finish the packaging of the LED chip;

s3: placing the substrate subjected to the LED chip packaging on a cutting colloid of the carrier plate;

s4: and cutting the substrate, removing the cutting colloid and the carrier plate, and dividing into single Mini-LED devices.

Further, the LED chip is a forward-mounted red light Mini-LED, a flip green light Mini-LED or a flip blue light Mini-LED; the front-mounted red light Mini-LED is transferred and fixed on the substrate in a die bonder transfer and reflow soldering mode; the inverted green light Mini-LED or the inverted blue light Mini-LED is fixed on the substrate in a thimble transfer and laser welding mode.

Further, the placing of the substrate on which the LED chip is packaged on the cutting colloid of the carrier specifically includes:

and placing the substrate on a cutting colloid adhered to the upper surface of the carrier plate, covering the cutting colloid on the upper surface of the carrier plate and the bottom of the substrate through pressing, and curing.

Further, the cutting of the substrate, the removal of the cutting colloid and the carrier plate, and the division into the single Mini-LED devices specifically include:

the substrate is cut by using a water jet, the cutting path is arranged on the outer side of the periphery of the LED chip, the substrate penetrates through the middle part of the cutting colloid during cutting, the cutting colloid is not cut off, the middle part of the cutting colloid is between one third and one half of the thickness of the cutting colloid, then the top of each single Mini-LED device is pasted with the transfer film, the cutting colloid is irradiated from the back by using UV light, the cutting colloid is debonded, and a plurality of single Mini-LED devices fixed on the transfer film are formed after the cutting colloid and the carrier plate are removed.

Further, the packaging layer is a thermosetting resin material, and the thermosetting resin material is one or more of scattering powder, diffusion powder, a dispersing agent, melanin and the like.

Further, the transfer film is a blue film.

Furthermore, the material of carrier plate is glass, silicon steel or tensioning membrane.

Further, the cutting colloid is made of high-temperature glue, UV glue or pyrolytic glue.

Further, the single Mini-LED device is a single color device.

According to the manufacturing method of the Mini-LED device, provided by the invention, the cutting colloid is adhered between the substrate and the carrier plate, when the substrate is cut, the single Mini-LED device obtained after cutting can be effectively fixed, the problem of chip splashing during cutting is solved, the integrity of the colloid is kept, the colloid can be separated from a plurality of chips at one time during cutting, and the safety and the practicability are improved.

Drawings

Fig. 1 is a schematic view of the whole manufacturing process of the method for manufacturing a Mini-LED device according to the embodiment of the present invention.

Fig. 2 is a schematic view of the whole manufacturing flow of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.

Fig. 3 is a schematic diagram of cutting a substrate pressed on a carrier according to the method for manufacturing a Mini-LED device provided in the embodiment of the present invention.

Fig. 4 is a schematic diagram of the transfer film attached to the top of a single Mini-LED device after the dicing of fig. 3 is performed to the middle of the dicing gel.

Fig. 5 is a schematic diagram of fig. 4 with the cutting gel and carrier plate further removed.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

Referring to fig. 1 to 5, in an embodiment of the invention, a method for manufacturing a Mini-LED device is provided,

the method comprises the following steps:

s1: transferring and fixing the LED chip 1 on the substrate 2;

s2: packaging the LED chip 1 fixed on the substrate 2 by a packaging layer 5 manufactured by a mould pressing process to finish the packaging of the LED chip;

s3: placing the substrate 2 with the LED chip packaged on the cutting colloid 4 of the carrier plate 3;

s4: and cutting the substrate 2, removing the cutting colloid 4 and the carrier plate 3, and dividing into single Mini-LED devices 6.

In the embodiment of the invention, the LED chip 1 is a forward-mounted red light Mini-LED, a flip green light Mini-LED or a flip blue light Mini-LED; the front-mounted red light Mini-LED is transferred and fixed on the substrate in a die bonder transfer and reflow soldering mode; the inverted green light Mini-LED or the inverted blue light Mini-LED is fixed on the substrate in a thimble transfer and laser welding mode.

In the embodiment of the present invention, the placing of the substrate 2 on which the LED chip is packaged on the cutting colloid 4 of the carrier 3 specifically includes:

the substrate 2 is placed on the cutting colloid 4 adhered on the upper surface of the carrier plate 3, the cutting colloid 4 is covered on the upper surface of the carrier plate 3 and the bottom of the substrate 2 through pressing, and the curing is carried out.

In the embodiment of the present invention, the cutting of the substrate 2 molded on the carrier 3, then removing the cutting colloid 4 and the carrier 3, and dividing into single Mini-LED devices 6 specifically include:

cutting the substrate by using a water jet cutter, wherein the cutting path is arranged on the outer side of the periphery of the LED chip, and penetrates through the substrate to the middle part of the cutting colloid without cutting off the cutting colloid 4 when cutting, wherein the middle part of the cutting colloid 4 is between one third and one half of the thickness of the cutting colloid 4, so as to ensure that an independent single Mini-LED device 6 is obtained, and the device is ensured to be fixed in the cutting process, so that splashing, offset and the like in the cutting process are avoided; and then, a transfer film 7 is pasted on the top of the single Mini-LED device, the cutting colloid 4 is irradiated from the back by UV light, the cutting colloid 4 is debonded, the adhesive force of the debonding colloid 4 is far smaller than that of the transfer film 7, and a plurality of single Mini-LED devices 6 fixed on the transfer film 7 are formed after the cutting colloid 4 and the carrier plate 3 are removed.

In the embodiment of the present invention, the encapsulation layer 5 is a heat-curable resin material, and the heat-curable resin material is one or more combinations of scattering powder, diffusion powder, dispersant, melanin, and the like.

In the present embodiment, the transfer film 7 is a blue film.

In the embodiment of the present invention, the material of the carrier plate 3 is glass, silicon steel or a tension film.

In the embodiment of the invention, the material of the cutting colloid 4 is high-temperature glue, UV glue or pyrolytic glue, and the embodiment adopts the high-temperature glue, and the material after lamination can be solidified after being pasted with glass, so that the problem of baking deformation can be solved, and the carrier plate can be individually separated subsequently. The high-temperature glue adopted in the embodiment can also adopt alternative UV glue, the material after the die pressing can be solidified after being pasted with glass, the problem of baking deformation can be solved, and the single piece can be separated on the carrier plate subsequently. The viscosity of the alternative pyrolytic gel is automatically degraded after die pressing, the base material and the support plate are peeled off, and then post curing is carried out; the molding parameters were: the temperature of the upper die is 95-120 ℃, the temperature of the lower die is 90-115 ℃, the pressing pressure is 45t, and the curing time is 100-300 s.

In the embodiment of the present invention, the single Mini-LED device 6 is a single color device, and the single Mini-LED device may also be an all-in-one package device.

In the embodiment of the invention, the manufacturing method of the Mini-LED device provided by the invention has the advantages that the substrate is placed on the cutting colloid adhered to the upper surface of the carrier plate for mould pressing, and when the substrate is cut after mould pressing, the single Mini-LED device obtained after cutting can be effectively fixed, the problem of chip splashing during cutting is solved, the integrity of the colloid is kept, the colloid can be separated from a plurality of chips at one time during cutting, and the safety and the practicability are improved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.