阅读说明：本技术 显示面板及其制备方法和绑定结构及其制备方法 (Display panel and manufacturing method thereof, and binding structure and manufacturing method thereof ) 是由 赵金阳 李冬泽 于 2021-09-10 设计创作，主要内容包括：本申请公开了一种显示面板及其制备方法和绑定结构及其制备方法,显示面板包括衬底、第一本体电极、第一导电电极、第二本体电极和发光器件,第一本体电极设置于衬底上,第一导电电极设置于第一本体电极上,第二本体电极设置于衬底上,第二本体电极与第一本体电极相对设置,发光器件包括第一引脚和与第一引脚相对设置的第二引脚,第一引脚设置在第一导电电极与第一本体电极之间,且第一引脚与第一本体电极以及第一导电电极接触；第二引脚设置在第二本体电极上,且第二引脚与第二本体电极接触。通过第一导电电极将发光器件绑定在第一本体电极上,提高了发光器件与第一本体电极之间的接触,进而提高显示面板的性能。(The application discloses a display panel and a preparation method thereof, a binding structure and a preparation method thereof, wherein the display panel comprises a substrate, a first body electrode, a first conductive electrode, a second body electrode and a luminescent device, the first body electrode is arranged on the substrate, the first conductive electrode is arranged on the first body electrode, the second body electrode is arranged on the substrate, the second body electrode is arranged opposite to the first body electrode, the luminescent device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged between the first conductive electrode and the first body electrode, and the first pin is contacted with the first body electrode and the first conductive electrode; the second pin is arranged on the second body electrode and is in contact with the second body electrode. The light emitting device is bound on the first body electrode through the first conductive electrode, so that the contact between the light emitting device and the first body electrode is improved, and the performance of the display panel is further improved.)

1. A display panel, comprising:

a substrate;

a first body electrode disposed on the substrate;

a first conductive electrode disposed on the first body electrode;

a second body electrode disposed on the substrate, the second body electrode being disposed opposite the first body electrode; and

a light emitting device including a first pin and a second pin disposed opposite to the first pin, the first pin being disposed between the first conductive electrode and the first body electrode, and the first pin being in contact with the first body electrode and the first conductive electrode; the second pin is disposed on the second body electrode, and the second pin is in contact with the second body electrode.

2. The display panel of claim 1, further comprising a second conductive electrode disposed on the second body electrode, wherein a second pin of the light emitting device is disposed between the second body electrode and the second conductive electrode, and wherein the second pin is in contact with the second body electrode and the second conductive electrode.

3. The display panel according to claim 2, wherein the first body electrode includes a first electrode portion and a second electrode portion connected to the first electrode portion, wherein the first conductive electrode is disposed on the second electrode portion, wherein the second body electrode includes a third electrode portion and a fourth electrode portion connected to the third electrode portion, wherein the second conductive electrode is disposed on the fourth electrode portion, wherein the first electrode portion is disposed opposite to the third electrode portion, wherein the second electrode portion and the fourth electrode portion are disposed between the first electrode portion and the third electrode portion, wherein the first lead is disposed between the second electrode portion and the first conductive electrode, and wherein the second lead is disposed between the fourth electrode portion and the second conductive electrode.

4. The display panel according to claim 2, wherein the first conductive electrode comprises at least two first conductive patterns, every two adjacent first conductive patterns are arranged at intervals, and the first conductive patterns are connected with the first pins; the second conductive electrode comprises at least two second conductive patterns, every two adjacent second conductive patterns are arranged at intervals, and the second conductive patterns are connected with the second pins.

5. The display panel according to claim 4, wherein the first conductive electrode further comprises a third conductive pattern, the third conductive pattern is located between two adjacent first conductive patterns, and the width of each first conductive pattern is greater than that of each third conductive pattern; the second conductive electrode further comprises a fourth conductive pattern, the fourth conductive pattern is positioned between two adjacent second conductive patterns, and the width of each second conductive pattern is larger than that of each fourth conductive pattern.

6. The display panel according to claim 4, wherein the first body electrode and the second body electrode each include a plurality of electrode portions disposed at intervals, the first conductive pattern is disposed on the electrode portion of the first body electrode, the second body electrode includes a plurality of third electrode portions and a plurality of fourth electrode portions disposed at intervals from the third electrode portions, the second conductive pattern is disposed on the electrode portion of the second body electrode, and the electrode portion of the first body electrode is disposed opposite to the electrode portion of the second body electrode.

7. The display panel of claim 2, wherein the first conductive electrode and the second conductive electrode are both conductive films, and wherein the conductive films comprise conductive nanomaterials.

8. A method for manufacturing a display panel, comprising:

providing a substrate;

forming a first body electrode and a second body electrode on the substrate;

providing a light-emitting device, wherein the light-emitting device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode;

depositing a material of a conductive electrode on the first body electrode, the second body electrode and the light emitting device, wherein the conductive electrode material contains a conductive nanomaterial; and

and applying voltage to the first body electrode and the second body electrode to form a first electric field, wherein the conductive nano material forms a first conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is in contact with the first body electrode and the first conductive electrode.

9. The method for manufacturing a display panel according to claim 8, wherein the first body electrode and the second body electrode are located on a first plane, the applying a voltage to the first body electrode and the second body electrode forms a first conductive electrode from a material of the conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is in contact with the first body electrode and the first conductive electrode, and the method comprises:

and applying voltage to the first body electrode and the second body electrode to form a second electric field, wherein the conductive nano material forms a second conductive electrode, the second conductive electrode covers the second pin and the second body electrode, and the directions of the first electric field and the second electric field are opposite.

10. The method for manufacturing a display panel according to claim 8, wherein the applying a voltage to the first body electrode and the second body electrode, the material of the conductive electrode forming a first conductive electrode, the first conductive electrode covering the first pin and the first body electrode, and the first pin contacting the first body electrode and the first conductive electrode comprises:

providing a pair of electrodes, wherein the orthographic projection of the pair of electrodes on the substrate covers the orthographic projection of the first body electrode and the orthographic projection of the second body electrode on the substrate, the first body electrode and the second body electrode are positioned on a first plane, the pair of electrodes are positioned on a second plane, and the first plane and the second plane are oppositely arranged;

and applying voltage to the first body electrode, the second body electrode and the counter electrode to form a third electric field, wherein the conductive nano material forms a first conductive electrode and a second conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the second conductive electrode covers the second pin and the second body electrode.

11. The method for manufacturing a display panel according to claim 8, wherein applying a voltage to the first body electrode, the second body electrode, and the counter electrode to form a third electric field, wherein the conductive nanomaterial forms a first conductive electrode and a second conductive electrode, the first conductive electrode covers the first lead and the first body electrode, and the second conductive electrode covers the second lead and the second body electrode, and the method comprises:

providing an additional electrode and a sacrificial electrode, wherein the additional electrode and the sacrificial electrode are positioned on a second plane and are arranged at intervals;

and applying voltages to the first body electrode, the second body electrode, the additional electrode and the sacrificial electrode to form a third electric field, wherein the conductive nano-material forms a first conductive electrode and a second conductive electrode, an orthographic projection of the additional electrode on the substrate covers an orthographic projection of the first conductive electrode on the substrate, and an orthographic projection of the sacrificial electrode on the substrate covers an orthographic projection of the second conductive electrode on the substrate.

12. A binding structure, comprising:

a substrate;

a first body electrode disposed on the substrate;

a first conductive electrode disposed on the first body electrode;

a second body electrode disposed on the substrate, the second body electrode being disposed opposite the first body electrode; and

the element to be bound comprises a first pin and a second pin, wherein the second pin is opposite to the first pin, the first pin is arranged between the first conductive electrode and the first body electrode, the first pin is arranged on the first conductive electrode and is in contact with the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode.

13. A method for preparing a binding structure, comprising:

providing a substrate;

forming a first body electrode and a second body electrode on the substrate;

providing an element to be bound, wherein the element to be bound comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode;

depositing materials of conductive electrodes on the first body electrode, the second body electrode and the element to be bound, wherein the conductive electrode materials contain conductive nano materials; and

and applying voltage to the first body electrode and the second body electrode to form a first electric field, wherein the conductive nano material forms a first conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is arranged on the first conductive electrode and is in contact with the first body electrode.

Technical Field

The application relates to the technical field of display, in particular to a display panel and a preparation method thereof, and a binding structure and a preparation method thereof.

Background

The patterned electrode is used as an essential important unit in the field of optoelectronic devices, and is widely applied to various optoelectronic devices such as touch screens, sensors, solar cells, light emitting diodes, thin film transistors and the like. At the present stage, an element to be bonded is generally transferred onto a patterned electrode, such as a micro-nano light emitting diode or a micro light emitting diode device, and in the process of transferring the micro-nano light emitting diode or the micro light emitting diode device, the micro-nano light emitting diode or the micro light emitting diode device is in poor contact with the patterned electrode, so that the micro-nano light emitting diode or the micro light emitting diode device cannot be lighted, and then the display effect of the device is affected, and further the performance of the device is affected.

Disclosure of Invention

The embodiment of the application provides a display panel, a preparation method thereof, a binding structure and a preparation method thereof, and aims to solve the problem of poor contact between a light-emitting device and a patterned electrode in the prior art.

The application provides a display panel, including:

a substrate;

a first body electrode disposed on the substrate;

a first conductive electrode disposed on the first body electrode;

a second body electrode disposed on the substrate, the second body electrode being disposed opposite the first body electrode; and

a light emitting device including a first pin and a second pin disposed opposite to the first pin, the first pin being disposed between the first conductive electrode and the first body electrode, and the first pin being in contact with the first body electrode and the first conductive electrode; the second pin is disposed on the second body electrode, and the second pin is in contact with the second body electrode.

Optionally, in some embodiments of the present application, the display panel further includes a second conductive electrode disposed on the second body electrode, the second pin of the light emitting device is disposed between the second body electrode and the second conductive electrode, and the second pin is in contact with the second body electrode and the second conductive electrode.

Optionally, in some embodiments of the present application, the first body electrode includes a first electrode portion and a second electrode portion connected to the first electrode portion, the first conductive electrode is disposed on the second electrode portion, the second body electrode includes a third electrode portion and a fourth electrode portion connected to the third electrode portion, the second conductive electrode is disposed on the fourth electrode portion, the first electrode portion is disposed opposite to the third electrode portion, the second electrode portion and the fourth electrode portion are disposed between the first electrode portion and the third electrode portion, the first pin is disposed between the second electrode portion and the first conductive electrode, and the second pin is disposed between the fourth electrode portion and the second conductive electrode.

Optionally, in some embodiments of the present application, the first conductive electrode includes at least two first conductive patterns, every two adjacent first conductive patterns are disposed at an interval, and the first conductive patterns are connected to the first pins; the second conductive electrode comprises at least two second conductive patterns, every two adjacent second conductive patterns are arranged at intervals, and the second conductive patterns are connected with the second pins.

Optionally, in some embodiments of the present application, the first conductive electrode further includes a third conductive pattern, the third conductive pattern is located between two adjacent first conductive patterns, and a width of the first conductive pattern is greater than a width of the third conductive pattern; the second conductive electrode further comprises a fourth conductive pattern, the fourth conductive pattern is positioned between two adjacent second conductive patterns, and the width of each second conductive pattern is larger than that of each fourth conductive pattern.

Optionally, in some embodiments of the present application, each of the first body electrode and the second body electrode includes a plurality of electrode portions disposed at intervals, the first conductive pattern is disposed on the electrode portion of the first body electrode, the second body electrode includes a plurality of third electrode portions and a plurality of fourth electrode portions disposed at intervals from the third electrode portions, the second conductive pattern is disposed on the electrode portion of the second body electrode, and the electrode portion of the first body electrode and the electrode portion of the second body electrode are disposed opposite to each other.

Optionally, in some embodiments of the present application, the first conductive electrode and the second conductive electrode are both conductive thin films, and the conductive thin films include conductive nanomaterials.

Correspondingly, the application also provides a preparation method of the display panel, which comprises the following steps:

providing a substrate;

forming a first body electrode and a second body electrode on the substrate;

providing a light-emitting device, wherein the light-emitting device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode;

depositing a material of a conductive electrode on the first body electrode, the second body electrode and the light emitting device, wherein the conductive electrode material contains a conductive nanomaterial; and

and applying voltage to the first body electrode and the second body electrode to form a first electric field, wherein the conductive nano material forms a first conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is in contact with the first body electrode and the first conductive electrode.

Optionally, in some embodiments of the present application, the first body electrode and the second body electrode are located on a first plane, the applying the voltage to the first body electrode and the second body electrode, the material of the conductive electrode forming a first conductive electrode, the first conductive electrode covering the first pin and the first body electrode, and the first pin contacting the first body electrode and the first conductive electrode includes:

and applying voltage to the first body electrode and the second body electrode to form a second electric field, wherein the conductive nano material forms a second conductive electrode, the second conductive electrode covers the second pin and the second body electrode, and the directions of the first electric field and the second electric field are opposite.

Optionally, in some embodiments of the present application, the applying the voltage to the first body electrode and the second body electrode, the material of the conductive electrode forming a first conductive electrode, the first conductive electrode covering the first pin and the first body electrode, and the first pin contacting the first body electrode and the first conductive electrode includes:

providing a pair of electrodes, wherein the orthographic projection of the pair of electrodes on the substrate covers the orthographic projection of the first body electrode and the orthographic projection of the second body electrode on the substrate, the first body electrode and the second body electrode are positioned on a first plane, the pair of electrodes are positioned on a second plane, and the first plane and the second plane are oppositely arranged;

and applying voltage to the first body electrode, the second body electrode and the counter electrode to form a third electric field, wherein the conductive nano material forms a first conductive electrode and a second conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the second conductive electrode covers the second pin and the second body electrode.

Optionally, in some embodiments of the present application, applying a voltage to the first body electrode, the second body electrode, and the counter electrode to form a third electric field, the conductive nanomaterial forming a first conductive electrode and a second conductive electrode, the first conductive electrode covering the first pin and the first body electrode, and the second conductive electrode covering the second pin and the second body electrode includes:

providing an additional electrode and a sacrificial electrode, wherein the additional electrode and the sacrificial electrode are positioned on a second plane and are arranged at intervals;

and applying voltages to the first body electrode, the second body electrode, the additional electrode and the sacrificial electrode to form a third electric field, wherein the conductive nano-material forms a first conductive electrode and a second conductive electrode, an orthographic projection of the additional electrode on the substrate covers an orthographic projection of the first conductive electrode on the substrate, and an orthographic projection of the sacrificial electrode on the substrate covers an orthographic projection of the second conductive electrode on the substrate.

Correspondingly, the present application further provides a binding structure, including:

a substrate;

a first body electrode disposed on the substrate;

a first conductive electrode disposed on the first body electrode;

a second body electrode disposed on the substrate, the second body electrode being disposed opposite the first body electrode; and

the element to be bound comprises a first pin and a second pin, wherein the second pin is opposite to the first pin, the first pin is arranged between the first conductive electrode and the first body electrode, the first pin is arranged on the first conductive electrode and is in contact with the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode.

Correspondingly, the application also provides a preparation method of the binding structure, which comprises the following steps:

providing a substrate;

forming a first body electrode and a second body electrode on the substrate;

providing an element to be bound, wherein the element to be bound comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode;

depositing materials of conductive electrodes on the first body electrode, the second body electrode and the element to be bound, wherein the conductive electrode materials contain conductive nano materials; and

and applying voltage to the first body electrode and the second body electrode to form a first electric field, wherein the conductive nano material forms a first conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is arranged on the first conductive electrode and is in contact with the first body electrode.

The display panel comprises a substrate, a first body electrode, a first conductive electrode, a second body electrode and a light-emitting device, wherein the first body electrode is arranged on the substrate, the first conductive electrode is arranged on the first body electrode, the second body electrode is arranged on the substrate, the second body electrode is arranged opposite to the first body electrode, the light-emitting device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged between the first conductive electrode and the first body electrode, the first pin is arranged on the first conductive electrode and is in contact with the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode. The light emitting device is bound on the first body electrode through the first conductive electrode, so that the contact between the light emitting device and the first body electrode is improved, and the performance of the display panel is further improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural view of the display panel provided in fig. 1 along line AB.

Fig. 3 is a schematic plan view of a second display panel according to an embodiment of the present disclosure.

Fig. 4 is a schematic plan view of a third display panel according to an embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a fourth planar structure of a display panel provided in the embodiment of the present application.

Fig. 6 is a flowchart of a method for manufacturing a display panel provided in embodiment 1 of the present application.

Fig. 7 is a structural flow chart of a method for manufacturing a display panel provided in embodiment 1 of the present application.

Fig. 8 is a structural flow chart of a method for manufacturing a display panel provided in embodiment 2 of the present application.

Fig. 9 is a structural flow chart of a method for manufacturing a display panel provided in embodiment 3 of the present application.

Fig. 10 is a structure flow chart of a method for preparing a binding structure according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device. In the present application, the "reaction" may be a chemical reaction or a physical reaction.

The embodiment of the application provides a display panel, a preparation method of the display panel, a binding structure and a preparation method of the binding structure. The following are detailed below.

The present application provides a display panel. The display panel includes a substrate, a first body electrode, a first conductive electrode, a second body electrode, and a light emitting device. The first body electrode is disposed on the substrate, and the first conductive electrode is disposed on the first body electrode. The second body electrode is disposed on the substrate. The second body electrode is disposed opposite to the first body electrode. The light emitting device includes a first lead and a second lead disposed opposite to the first lead. The first pin is arranged between the first conductive electrode and the first body electrode, and the first pin is arranged on the first conductive electrode and is in contact with the first body electrode. The second pin is arranged on the second body electrode and is in contact with the second body electrode.

This application binds luminescent device on first body electrode through first electrically conductive electrode, has improved the contact of luminescent device with first body electrode, and then improves display panel's performance.

The display panel provided by the present application is explained in detail by specific embodiments below.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic plan view illustrating a first planar structure of a display panel according to an embodiment of the present disclosure. Fig. 2 is a schematic structural view of the display panel provided in fig. 1 along line AB.

The substrate 100 is a rigid substrate or a flexible substrate. The rigid substrate may be glass. The flexible substrate may be formed of a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP).

The first body electrode 200 is disposed on the substrate 100. The first body electrode 200 includes a first electrode portion 210 and a second electrode portion 220 connected to the first electrode portion 210. The first conductive electrode 300 is disposed on the second electrode portion 220. The orthographic projection of the first conductive electrode 300 on the substrate 100 completely covers the orthographic projection of the second electrode part 220 on the substrate 100, and the edges coincide. The light emitting device 500 includes a first lead 510 and a second lead 520 disposed opposite to the first lead 510. The first lead 510 is disposed between the second electrode part 220 and the first conductive electrode 300, and the first lead 510 is disposed between the first conductive electrode 300 and the first body electrode 200. The second lead 520 is disposed on the second body electrode 400, and the second lead 520 contacts the second body electrode 400. The light emitting device 500 may be a micro light emitting diode or a micro-nano light emitting diode.

In one embodiment, the first electrode portion 210 and the second electrode portion 220 are perpendicular to each other.

In one embodiment, the first body electrode 200 further includes a first connection portion 230. The first connection portion 230 is connected to the first electrode portion 210 and the second electrode portion 220, and both the first connection portion 230 and the second electrode portion 220 are perpendicular to the first electrode portion 210.

In the present application, the first conductive electrode 300 covers the first pin 510 and the second electrode part 220 of the light emitting device 500, and the first pin 510 contacts the first conductive electrode 300 and the first body electrode 200, so that the contact performance between the first pin 510 and the second electrode part 220 is improved, the light emitting device 500 is prevented from being unlit, the light emitting effect and stability of the display panel 10 are improved, and the performance of the display panel 10 is improved.

In one embodiment, the second body electrode 400 includes a third electrode portion 410 and a fourth electrode portion 420 connected to the third electrode portion 410. The second conductive electrode 600 is disposed on the fourth electrode part 420. The orthographic projection of the second conductive electrode 600 on the substrate 100 completely covers the orthographic projection of the fourth electrode part 420 on the substrate 100, and the edges coincide. The orthographic projection edge of the second conductive electrode 600 on the substrate 100 and the orthographic projection of the fourth electrode part 420 on the substrate 100. The first electrode portion 210 is disposed opposite the third electrode portion 410. The second electrode portion 220 and the fourth electrode portion 420 are disposed between the first electrode portion 210 and the third electrode portion 410. The second pin 520 is disposed between the fourth electrode portion 420 and the second conductive electrode 600, and the second pin 520 contacts the fourth electrode portion 420 and the second conductive electrode 600.

In one embodiment, the third electrode portion 410 and the fourth electrode portion 420 are perpendicular to each other.

In an embodiment, the second body electrode 400 further includes a second connection portion 430. The second connection portion 430 is connected to the third electrode portion 410 and the fourth electrode portion 420, and the second connection portion 430 and the third electrode portion 410 are perpendicular to the fourth electrode portion 420. That is, the first body electrode 200 and the second body electrode 400 are interdigital electrodes.

In this application, the second conductive electrode 600 covers the second pin 520 and the second body electrode 400, so as to improve the conductivity between the light emitting device 500 and the first body electrode 200 and the second body electrode 400, and further improve the display effect of the display panel 10, thereby improving the performance of the display panel 10.

In one embodiment, the first conductive electrode 300 and the second conductive electrode 600 are both conductive films. The material of the conductive film is a conductive nano material. The conductive nano material comprises one or a combination of more of gold, silver, copper, iron, aluminum, polyaniline, polypyrrole, carbon nano tube and graphene.

In an embodiment, the material of the first and second body electrodes 200 and 400 is the same as the material of the first and second conductive electrodes 300 and 600, i.e., conductive nanomaterial.

In the present application, the first conductive electrode 300 and the second conductive electrode 600 are formed by using the conductive nano material, so that the first conductive electrode 300 and the second conductive electrode 600 can be formed by using an electrodeposition method subsequently, the process is simple, and the solvent and the ultraviolet light in the process flow are not easy to damage the stability of the light emitting device 500 and improve the precision, thereby improving the performance of the display panel 10.

In one embodiment, the vertical cross-sectional thickness H of the first conductive electrode 300 and the second conductive electrode 600 are each 10 nanometers to 50 micrometers. Specifically, the vertical cross-sectional thickness H of the first conductive electrode 300 and the second conductive electrode 600 may be 10 nanometers, 100 nanometers, 500 nanometers, 900 nanometers, 1 micrometer, 10 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, or the like.

In the present application, the vertical sectional thickness H of the first conductive electrode 300 and the second conductive electrode 600 is set to 10 nm to 50 μm, which improves the conductivity between the light emitting device 500 and the first body electrode 200 and the second body electrode 400, and further improves the display effect of the display panel 10, and further improves the performance of the display panel 10, and reduces the cost.

In one embodiment, the distance between the first body electrode 200 provided with the first conductive electrode 300 and the second body electrode 400 provided with the second conductive electrode 600 is less than 100 nm. Specifically, the distance between the first body electrode 200 provided with the first conductive electrode 300 and the second body electrode 400 provided with the second conductive electrode 600 may be less than 10 nm, 50 nm, 70 nm, 80 nm, 90 nm, or the like. In the present application, the distance between the first body electrode 200 provided with the first conductive electrode 300 and the second body electrode 400 provided with the second conductive electrode 600 is set to be less than 100 nm, so as to ensure the film forming quality, and avoid that the first conductive electrode 300 and the second conductive electrode 600 cannot be formed due to too weak electric field intensity when the first conductive electrode 300 and the second conductive electrode 600 are formed by an electrodeposition method because the distance between the first body electrode 200 and the second body electrode 400 is too far, and the film thickness is not uniform, thereby improving the performance of the display panel 10.

Referring to fig. 3, fig. 3 is a schematic plan view of a display panel 10 according to an embodiment of the present disclosure. It should be noted that the second structure is different from the first structure in that:

the orthographic projection of the first conductive electrode 300 on the substrate 100 does not completely cover the orthographic projection of the second electrode portion 220 on the substrate 100, and the edges coincide. The orthographic projection of the second conductive electrode 600 on the substrate 100 does not completely cover the orthographic projection of the fourth electrode part 420 on the substrate 100, and the edges coincide. The first conductive electrode 300 includes at least two first conductive patterns 310. Every two adjacent first conductive patterns 310 are disposed at intervals. The first conductive pattern 310 is disposed on the second electrode portion 220. The first lead 510 is disposed between the first conductive pattern 310 and the second electrode part 220, and the first lead 510 is in contact with the first conductive pattern 310 and the second electrode part 220. An orthogonal projection of the first conductive pattern 310 on the substrate 100 is located within an orthogonal projection of the second electrode portion 220 on the substrate 100. The second conductive electrode 600 includes at least two second conductive patterns 610. Every two adjacent second conductive patterns 610 are arranged at intervals. An orthogonal projection of the second conductive pattern 610 on the substrate 100 is located within an orthogonal projection of the fourth electrode part 420 on the substrate 100. The second conductive pattern 610 is disposed on the fourth electrode part 420. The second lead 520 is disposed between the second conductive pattern 610 and the fourth electrode part 420, and the second lead 520 is in contact with the second conductive pattern 610 and the fourth electrode part 420.

In the present application, every two adjacent first conductive patterns 310 are disposed at intervals, and every two adjacent second conductive patterns 610 are disposed at intervals, so that material waste is avoided, and further cost is reduced, and a pixel light emitting area formed by the light emitting device 500 and other structures is increased, and further a display effect of the display panel 10 is improved, and further performance of the display panel 10 is improved.

Referring to fig. 4, fig. 4 is a schematic view illustrating a third plane structure of a display panel according to an embodiment of the present disclosure. It should be noted that the third structure is different from the second structure in that:

specifically, the first conductive electrode 300 further includes a third conductive pattern 320. The third conductive pattern 320 is positioned between two adjacent first conductive patterns 310. Width d of the first conductive pattern 310₁Is greater than the width d of the third conductive pattern 320₂. The second conductive electrode 600 further includes a fourth conductive pattern 620. The fourth conductive pattern 620 is positioned between adjacent two of the second conductive patterns 610. Width d of the second conductive pattern 610₃Is greater than the width d of the fourth conductive pattern 620₄. The first conductive pattern 310 is disposed opposite to the second conductive pattern 610 or the fourth conductive pattern 620.

In the present application, the first conductive electrode 300 is composed of the first conductive pattern 310 and the third conductive pattern 320, and the second conductive electrode 600 is composed of the second conductive pattern 610 and the fourth conductive pattern 620, and the width d of the first conductive pattern 310 is set₁Is disposed to be greater than the width d of the third conductive pattern 320₂Width d of the second conductive pattern 610₃Is disposed to be greater than the width d of the fourth conductive pattern 620₄The light-emitting area of the pixel formed by the light-emitting device 500 and other structures is prevented from being blocked, so that the aperture opening ratio of the pixel is improved, the display effect of the display panel 10 is improved, the performance of the display panel 10 is improved, and the cost is reduced.

Referring to fig. 5, fig. 5 is a schematic diagram of a fourth plane structure of the display panel 10 according to the embodiment of the present application. It should be noted that the fourth structure is different from the first structure in that:

the first body electrode 200 and the second body electrode 400 each include a plurality of electrode portions 230 arranged at intervals. The first conductive electrode 300 includes at least two first conductive patterns 310. The electrode portion 210 of the first body electrode 200 is provided with first conductive patterns 310, and every two adjacent first conductive patterns 310 are disposed at intervals. The second conductive electrode 600 includes at least two second conductive patterns 610. The second conductive patterns 610 are disposed on the electrode portion 230 of the second body electrode 400, and every two adjacent second conductive patterns 610 are disposed at intervals. The electrode portion 210 of the first body electrode 200 is disposed opposite to the electrode portion 210 of the second body electrode 400. The first lead 510 is disposed between a first conductive pattern 310 and the electrode portion 230 of the first body electrode 200. The second lead 520 is disposed between a second conductive pattern 610 and the electrode portion 230 of the second body electrode 400.

The present application provides a display panel 10, the display panel 10 includes a substrate 100, a first body electrode 200, a first conductive electrode 300, a second body electrode 400 and a light emitting device 500, the first body electrode 200 is disposed on the substrate 100, the first conductive electrode 300 is disposed on the first body electrode 200, the second body electrode 400 is disposed on the substrate 100, the second body electrode 400 is disposed opposite to the first body electrode 200, the light emitting device 500 includes a first pin 510 and a second pin 520 disposed opposite to the first pin 510, the first pin 510 is disposed between the first conductive electrode 300 and the first body electrode 200, the first pin 510 contacts with the first conductive electrode 300 and the first body electrode 200, and the second pin 520 is disposed on the second body electrode 400. The light emitting device 500 is bound to the first body electrode 200 through the first conductive electrode 300, and the contact of the light emitting device 500 with the first body electrode 200 is improved, thereby improving the performance of the display panel 10.

Referring to fig. 6 and 7, fig. 6 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure. Fig. 7 is a structural flow chart of a method for manufacturing a display panel according to an embodiment of the present application. The method comprises the following steps:

b11, providing a substrate.

And B12, forming a first body electrode and a second body electrode on the substrate.

And B13, providing a light-emitting device, wherein the light-emitting device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is contacted with the second body electrode.

B14, disposing conductive nanomaterials on the first body electrode, the second body electrode, and the light emitting device.

And B15, applying voltage to the first body electrode and the second body electrode to form a first electric field, forming a first conductive electrode by the conductive nano material, covering the first pin and the first body electrode with the first conductive electrode, and contacting the first pin with the first conductive electrode and the first body electrode.

The following describes the method for manufacturing the display panel provided in this embodiment in detail. It should be noted that, in this embodiment, only the method for manufacturing the display panel described in the foregoing first embodiment is taken as an example for description, but the invention is not limited thereto.

Example 1:

please continue to refer to fig. 1, fig. 6 and fig. 7. The manufacturing method of the display panel 10 includes:

b11, providing a substrate.

And B12, forming a first body electrode and a second body electrode on the substrate.

The first body electrode 200 includes a first electrode portion 210, a second electrode portion 220, and a first connection portion 230 connected to the first electrode portion 210 and the second electrode portion 220. The first connection portion 230 and the second electrode portion 220 are perpendicular to the first electrode portion 210.

The second body electrode 400 includes a third electrode portion 410, a fourth electrode portion 420, and a second connection portion 430 connected to the third electrode portion 410 and the fourth electrode portion 420. The second connection portion 430 and the third electrode portion 410 are perpendicular to the fourth electrode portion 420. The second electrode portion 220 and the fourth electrode portion 420 are located between the first electrode portion 210 and the third electrode portion 410. That is, the first body electrode 200 and the second body electrode 400 are interdigital electrodes.

And B13, providing a light-emitting device, wherein the light-emitting device comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode.

Specifically, the first lead 510 is disposed on the second electrode portion 220. The second lead 520 is disposed on the fourth electrode portion 420.

B14, disposing conductive nanomaterials on the first body electrode, the second body electrode, and the light emitting device.

A solution containing a conductive nanomaterial is dropped on the first body electrode 200, the second body electrode 400, and the light emitting device 500, or the first body electrode 200, the second body electrode 400, and the light emitting device 500 are inserted into the solution containing a conductive nanomaterial. The concentration of the solution containing the conductive nanomaterial is 1 mg per ml to 200 mg per ml. Specifically, the concentration of the solution containing the conductive nanomaterial may be 1 mg per ml, 20 mg per ml, 50 mg per ml, 80 mg per ml, 150 mg per ml, 180 mg per ml, or 200 mg per ml, or the like. In this example, the concentration of the solution containing the conductive nanomaterial is 25 milligrams per milliliter. The conductive nano material comprises one or a combination of more of gold, silver, copper, iron, aluminum, polyaniline, polypyrrole, carbon nano tube and graphene.

And B15, applying voltage to the first body electrode and the second body electrode to form a first electric field, forming a first conductive electrode by the conductive nano material, covering the first pin and the first body electrode with the first conductive electrode, and contacting the first pin with the first body electrode and the first conductive electrode.

Specifically, the first body electrode 200 and the second body electrode 400 are located on the first plane 21, the negative electrode of the dc power supply device is connected to the first body electrode 200, the positive electrode of the dc power supply device is connected to the second body electrode 400, a voltage is applied to the first body electrode 200 and the second body electrode 400 to form a first electric field, the first electric field is a horizontal electric field, the conductive nanomaterial forms the first conductive electrode 300, and the first conductive electrode 300 covers the first pin 510 and the second electrode part 220. Then, the positive electrode of the dc power supply device is connected to the first body electrode 200, the negative electrode of the dc power supply device is connected to the second body electrode 400, a voltage is applied to the first body electrode 200 and the second body electrode 400 to form a second electric field, the conductive nanomaterial forms a second conductive electrode 600, the second conductive electrode 600 covers the second pin 520 and the fourth electrode part 420, and the first electric field and the second electric field have opposite directions of movement.

Wherein the voltage applied twice is more than 0 volt and less than 1000 volts. The time for applying the voltage twice is 1 second to 100 seconds. Specifically, the voltage applied twice may be 0.01 volt, 10 volts, 80 volts, 200 volts, 355 volts, 600 volts, 800 volts, 1000 volts, or the like. The time for applying the voltage twice may be 1 second, 20 seconds, 50 seconds, 80 seconds, 90 seconds, 100 seconds, or the like. In this example, the voltage applied twice was 30 volts, and the time for applying the voltage twice was 70 seconds. The electric field intensity of the first electric field and the second electric field is greater than 0V/um and less than 50V/um. Specifically, the electric field intensity of the first electric field and the second electric field is 0.5V/um, 5V/um, 10V/um, 20V/um, 30V/um, 45V/um or 50V/um, etc. In the present embodiment, the electric field strength of the first electric field and the second electric field is 35V/um.

The vertical cross-sectional thicknesses H of the first conductive electrode 300 and the second conductive electrode 600 are each 10 nm to 50 μm. Specifically, the vertical cross-sectional thickness H of the first conductive electrode 300 and the second conductive electrode 600 may be 10 nanometers, 100 nanometers, 500 nanometers, 900 nanometers, 1 micrometer, 10 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, or the like. In this embodiment, the vertical cross-sectional thickness H of the first conductive electrode 300 and the second conductive electrode 600 is 5 μm.

In the present application, the concentration of the solution containing the conductive nano material is set to be 1 mg per ml to 200 mg per ml, the applied voltage is set to be greater than 0V and less than 1000V, the time of the applied voltage is set to be 1 s to 100 s, the electric field strength of the first electric field and the electric field strength of the second electric field are both set to be greater than 0V/um and less than 50V/um, so that the vertical section thickness H of the first conductive electrode 300 and the second conductive electrode 600 is 10 nm to 50 μm, the conductivity of the first conductive electrode 300 and the second conductive electrode 600 is improved, the display effect of the display panel 10 is improved, and the cost is reduced.

In an embodiment, after step B15, the method further includes:

the formed first and second conductive electrodes 300 and 600 are annealed to remove organic components therein, so as to improve the electrical conductivity of the first and second conductive electrodes 300 and 600.

The application provides a preparation method of a display panel 10, an electric field is constructed through an existing first body electrode 200 and a second body electrode 400, the electric field is utilized to drive charged conductive nano materials to move and gather on a second electrode part 220 and a fourth electrode part 420 with opposite electric properties, so that a first conductive electrode 300 arranged on the second electrode part 220 and a second conductive electrode 600 arranged on the fourth electrode part 420 are prepared, and a light-emitting device 500 is welded on the first body electrode 200 and the second body electrode 400, so that the conduction between the light-emitting device 500 and the first body electrode 200 and the second body electrode 400 is improved, the stability of the display panel 10 is not damaged, the display effect of the display panel 10 is improved, and the performance of the display panel 10 is improved.

Example 2:

referring to fig. 1 and 8, fig. 8 is a structural flow chart of a method for manufacturing a display panel according to embodiment 2 of the present application. Example 2 differs from example 1 in that:

providing a pair of base plates 700, wherein the pair of base plates 700 comprises a base 710 and a counter electrode 720 arranged on the base 710, the orthographic projection of the counter electrode 720 on the substrate 100 covers the orthographic projection of the first body electrode 200 and the second body electrode 400 on the substrate 100, the first body electrode 200 and the second body electrode 400 are positioned on a first plane 21, the counter electrode 720 is positioned on a second plane 22, and the first plane 21 and the second plane 22 are arranged oppositely.

Then, the positive electrode of the dc power supply device is connected to the first body electrode 200 and the second body electrode 400, the negative electrode of the dc power supply device is connected to the counter electrode 720, a third electric field is formed by applying a voltage to the first body electrode 200, the second body electrode 400, and the counter electrode 720, the third electric field is a vertical electric field, the conductive nanomaterial forms the first conductive electrode 300 and the second conductive electrode 600, the first conductive electrode 300 covers the first pin 510 and the second electrode portion 220, and the second conductive electrode 600 covers the second pin 520 and the fourth electrode portion 420. The applied voltage in the "third electric field formed by applying a voltage to the first body electrode 200, the second body electrode 400, and the counter electrode 720" is the same as the applied voltage in the "first electric field formed by applying a voltage to the first body electrode 200 and the second body electrode 400", and the time for applying a voltage in the "third electric field formed by applying a voltage to the first body electrode 200, the second body electrode 400, and the counter electrode 720" is the same as the time for applying a voltage in the "first electric field formed by applying a voltage to the first body electrode 200 and the second body electrode 400". Other steps are the same as embodiment 1 and are not described herein.

Example 3:

referring to fig. 2 and 9, fig. 9 is a structural flow chart of a method for manufacturing a display panel according to embodiment 3 of the present application. Example 3 differs from example 1 in that:

a pair of substrates 700 is provided, the pair of substrates 700 includes a base 710, an additional electrode 730 and a sacrificial electrode 740, the additional electrode 730 and the sacrificial electrode 740 are disposed on the base 710 at the same layer, the additional electrode 730 and the sacrificial electrode 740 are disposed at an interval, and the additional electrode 730 and the sacrificial electrode 740 are disposed on a second plane.

Then, the positive electrode of the dc power supply device is connected to the first body electrode 200 and the second body electrode 400, and the negative electrode of the dc power supply device is connected to the additional electrode 730 and the sacrificial electrode 740; then, applying voltages to the first body electrode 200, the second body electrode 400, the additional electrode 730 and the sacrificial electrode 740 to form a third electric field, wherein the third electric field is a vertical electric field, and the conductive nanomaterial forms the first conductive electrode 300 and the second conductive electrode 600; the first conductive electrode 300 includes at least two first conductive patterns 310, every two adjacent first conductive patterns 310 are disposed at intervals, and the first conductive patterns 310 are disposed on the second electrode part 220; the second conductive electrode 600 includes at least two second conductive patterns 610, every two adjacent second conductive patterns 610 are disposed at intervals, and the second conductive patterns 610 are disposed on the fourth electrode part 420. The applied voltage in "applying a voltage to the first body electrode 200, the second body electrode 400, the additional electrode 730, and the sacrificial electrode 740 to form the third electric field" is the same as the applied voltage in "applying a voltage to the first body electrode 200 and the second body electrode 400 to form the first electric field", and the time of applying a voltage to the first body electrode 200, the second body electrode 400, the additional electrode 730, and the sacrificial electrode 740 to form the third electric field "is the same as the time of applying a voltage to the first body electrode 200 and the second body electrode 400 to form the first electric field".

Wherein, the orthographic projection of the additional electrode 730 on the substrate 100 covers the orthographic projection of the first conductive electrode 300 on the substrate 100, the orthographic projection of the sacrificial electrode 740 on the substrate 100 covers the orthographic projection of the second conductive electrode 600 on the substrate 100, the orthographic projection of the first conductive pattern 310 on the substrate 100 is positioned within the orthographic projection of the second electrode part 220 on the substrate 100, and the orthographic projection of the second conductive pattern 610 on the substrate 100 is positioned within the orthographic projection of the fourth electrode part 420 on the substrate 100.

The steps are the same as those in example 1 and are not described in detail here.

Example 4:

please continue to refer to fig. 1. Example 4 differs from example 1 in that: the direct current power supply equipment is changed into alternating current power supply equipment. The direction of the electric field formed by the ac power supply device changes periodically. Other steps are the same as embodiment 1 and are not described herein.

The application provides a preparation method of a display panel 10, an electric field is constructed through an existing first body electrode 200 and a second body electrode 400, the electric field is utilized to drive charged conductive nano materials to move and gather on a second electrode part 220 and a fourth electrode part 420 with opposite electric properties, so that a first conductive electrode 300 arranged on the second electrode part 220 and a second conductive electrode 600 arranged on the fourth electrode part 420 are prepared, and a light-emitting device 500 is welded on the first body electrode 200 and the second body electrode 400, so that the conduction between the light-emitting device 500 and the first body electrode 200 and the second body electrode 400 is improved, the stability of the display panel 10 is not damaged, the display effect of the display panel 10 is improved, and the performance of the display panel 10 is improved.

The application also provides a binding structure. The binding structure includes a substrate, a first body electrode, a first conductive electrode, a second body electrode, and an element to be bound. The first body electrode is arranged on the substrate, the first conductive electrode is arranged on the first body electrode, the second body electrode is arranged on the substrate, the second body electrode is arranged opposite to the first body electrode, the element to be bound comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged between the first conductive electrode and the first body electrode, and the second pin is arranged on the second body electrode.

The binding structure can meet the binding requirements of devices such as a micro light-emitting diode, a micro-nano light-emitting diode, a sensor, a solar cell, a logic circuit, a field effect transistor or circuit repair and the like.

The application provides a binding structure, binding structure includes the substrate, first body electrode, first conductive electrode, second body electrode and treats the binding element, first body electrode sets up on the substrate, first conductive electrode sets up on first body electrode, second body electrode sets up on the substrate, second body electrode sets up with first body electrode is relative, treat that the binding element includes first pin and the second pin that sets up with first pin is relative, first pin sets up between first conductive electrode and first body electrode, the second pin sets up on second body electrode. The element to be bound is bound on the first body electrode through the first conductive electrode, so that the contact between the element to be bound and the first body electrode is improved, and the performance of the binding structure is improved.

Referring to fig. 10, fig. 10 is a structural flowchart of a method for preparing a binding structure according to an embodiment of the present application. The application also provides a preparation method of the binding structure, which comprises the following steps:

b11, providing a substrate.

And B12, forming a first body electrode and a second body electrode on the substrate.

And B13, providing a to-be-bonded element, wherein the to-be-bonded element comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode.

B14, disposing conductive nanomaterials on the first body electrode, the second body electrode, and the light emitting device.

And B15, applying voltage to the first body electrode and the second body electrode to form a first electric field, forming a first conductive electrode by the conductive nano material, covering the first pin and the first body electrode with the first conductive electrode, and contacting the first pin with the first body electrode and the first conductive electrode.

The binding structure can meet the binding requirements of devices such as micro light-emitting diodes, micro-nano light-emitting diodes, sensor devices, solar cells, logic circuits, field effect transistors or circuit repair.

The application provides a preparation method of a binding structure, which comprises the following steps: providing a substrate; forming a first body electrode and a second body electrode on a substrate; providing a to-be-bonded element, wherein the to-be-bonded element comprises a first pin and a second pin arranged opposite to the first pin, the first pin is arranged on the first body electrode, the second pin is arranged on the second body electrode, and the second pin is in contact with the second body electrode; disposing a conductive nanomaterial on the first body electrode, the second body electrode, and the light emitting device; and applying voltage to the first body electrode and the second body electrode to form a first electric field, wherein the conductive nano material forms a first conductive electrode, the first conductive electrode covers the first pin and the first body electrode, and the first pin is in contact with the first body electrode and the first conductive electrode. The element to be bound is bound on the first body electrode through the first conductive electrode, so that the contact between the element to be bound and the first body electrode is improved, and the performance of the binding structure is improved.

The present application provides a display panel and a method of manufacturing the same, a bonding structure and a method of manufacturing the same, the display panel 10 includes a substrate 100, a first body electrode 200, a first conductive electrode 300, a second body electrode 400 and a light emitting device 500, the first body electrode 200 is disposed on the substrate 100, the first conductive electrode 300 is disposed on the first body electrode 200, the second body electrode 400 is disposed on the substrate 100, the second body electrode 400 is disposed opposite to the first body electrode 200, the light emitting device 500 includes a first pin 510 and a second pin 520 disposed opposite to the first pin 510, the first pin 510 is disposed between the first conductive electrode 300 and the first body electrode 200, and the first lead 510 and the first conductive electrode 300 are in contact with the first body electrode 200, the second lead 520 is disposed on the second body electrode 400, and the second lead 520 is disposed in contact with the second body electrode 400. The light emitting device 500 is bound to the first body electrode 200 through the first conductive electrode 300, and the contact of the light emitting device 500 with the first body electrode 200 is improved, thereby improving the performance of the display panel 10.

The display panel and the manufacturing method thereof, the binding structure and the manufacturing method thereof provided by the embodiment of the present application are introduced in detail above, and a specific example is applied in the present application to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.