阅读说明：本技术 一种人眼安全型小尺寸vcsel封装结构及其制造方法 (Human eye safety type small-size VCSEL packaging structure and manufacturing method thereof ) 是由 李彬亭 梁盼 刘琦 于 2020-05-27 设计创作，主要内容包括：本发明涉及一种人眼安全型小尺寸VCSEL封装结构及其制造方法,该VCSEL封装结构中,反射镜B设置在VCSEL芯片的一侧；反射镜B的第二反射面与载板之间成一定夹角；反射镜A的顶部固定在盖板上,反射镜A的顶部开设有凹槽；监控芯片设置在盖板上,且监控芯片位于凹槽的内部；反射镜A的第二反射面与第一反射面相互平行,第一反射面与第二反射面之间形成VCSEL芯片发射光的光路通道。本发明通过两个45°反射镜,将VCSEL出光方向调整为与载板垂直,方便消费电子中的装配使用；监控芯片位于反射镜凹腔内部,且两个反射镜错位排布大大降低了产品尺寸,适应了消费电子对产品尺寸微型化的要求。(The invention relates to an eye-safe small-size VCSEL packaging structure and a manufacturing method thereof, wherein in the VCSEL packaging structure, a reflector B is arranged on one side of a VCSEL chip; a certain included angle is formed between the second reflecting surface of the reflector B and the carrier plate; the top of the reflector A is fixed on the cover plate, and a groove is formed in the top of the reflector A; the monitoring chip is arranged on the cover plate and is positioned in the groove; the second reflecting surface of the reflector A is parallel to the first reflecting surface, and a light path channel for emitting light of the VCSEL chip is formed between the first reflecting surface and the second reflecting surface. According to the invention, the light-emitting direction of the VCSEL is adjusted to be vertical to the carrier plate through the two 45-degree reflectors, so that the assembly and the use in consumer electronics are facilitated; the monitoring chip is positioned in the reflector cavity, and the two reflectors are arranged in a staggered manner, so that the product size is greatly reduced, and the requirement of consumer electronics on product size miniaturization is met.)

1. The human eye safety type small-size VCSEL packaging structure is characterized by comprising a VCSEL chip, a monitoring chip, a reflector B, a reflector A, a diffraction lens, a carrier plate, a supporting frame and a cover plate;

the support plate is surrounded with a support frame, a cover plate is arranged on the support frame, and the support plate, the support frame and the cover plate are surrounded into a VCSEL packaging cavity;

in the VCSEL packaging cavity, a VCSEL chip and a reflector B are arranged on the carrier plate, and the reflector B is arranged on one side of the VCSEL chip; the side surface of the reflector B close to the VCSEL chip is a second reflecting surface, and a certain included angle is formed between the second reflecting surface and the carrier plate;

the top of the reflector A is fixed on the cover plate, and the reflector A is arranged above the VCSEL chip;

the top of the reflector A is provided with a groove; the monitoring chip is arranged on the cover plate and is positioned in the groove;

the side surface of the reflector A close to the VCSEL chip is a first reflecting surface, the second reflecting surface is parallel to the first reflecting surface, and a light path channel for emitting light by the VCSEL chip is formed between the first reflecting surface and the second reflecting surface;

the cover plate is also provided with a light outlet hole, and a diffraction lens is arranged on the light outlet hole;

the monitoring chip is connected with the control circuit, and the control circuit is connected with the VCSEL chip;

the emitting light of the VCSEL chip is incident to the reflector A, and a part of the emitting light is reflected to the second reflecting surface of the reflector B through the first reflecting surface of the reflector A, and is output to the outside of the VCSEL packaging cavity through the diffraction lens and the light outlet after being reflected by the second reflecting surface; the other part of the emitted light of the VCSEL chip reaches the monitoring chip through the reflector A, when the light sensing current I of the monitoring chip exceeds the set light sensing current Imax, the control circuit is triggered, and the control circuit emits a control signal to cut off the power supply of the VCSEL chip.

2. The VCSEL package structure of claim 1, wherein the second reflecting surface forms an angle of 45 ° with the carrier.

3. The structure of claim 1, wherein the wavelength range of the VCSEL chip output is 850-980 nm.

4. The VCSEL packaging structure of claim 1, wherein the surface of the first reflecting surface is coated with a 850-980nm high-reflectivity film, and the reflectivity of the 850-980nm high-reflectivity film is 85-89%.

5. The VCSEL packaging structure of claim 1, wherein the second reflecting surface is coated with a 850-980nm high-reflectivity film, and the reflectivity of the 850-980nm high-reflectivity film is not less than 98%.

6. The package structure of claim 1, wherein the monitor chip is located above the VCSEL chip, and the deviation between the centerline of the monitor chip and the centerline of the VCSEL chip is ± 25 μm.

7. The VCSEL packaging structure of claim 1, wherein an electrode of the monitoring chip is connected with an electrode provided on the cover plate, and the electrode provided on the cover plate corresponds to a conductive metal pillar provided on the top of the support frame.

8. The structure of claim 1, wherein the carrier is made of an aluminum oxide substrate or an aluminum nitride substrate.

9. A method of manufacturing an eye-safe small-size VCSEL packaging structure according to any of claims 1-8, comprising the steps of:

(1) bonding the VCSEL chip on the carrier plate;

(2) bonding a reflector B on a carrier plate, and enabling a second reflecting surface of the reflector B to form a certain angle with the carrier plate;

(3) connecting the electrode of the VCSEL chip with the electrode of the carrier plate through an automatic wire welding machine;

(4) bonding a prefabricated support frame on the support plate;

(5) bonding the monitoring chip on a cover plate, and baking and curing;

(6) by self-runningElectrode of monitoring chip of dynamic wire bonding machine andcover plateThe electrodes of (a) are connected;

(7) fixing the reflector A on the cover plate, so that the monitoring chip is positioned in a groove formed in the top of the reflector A, and a first reflecting surface of a first reflector of the reflector A is parallel to a second reflecting surface of a first reflector of the reflector B;

(8) bonding the diffraction lens to the light outlet hole on the cover plate;

(9) and (4) inversely buckling the semi-finished product output in the step (8) on the carrier plate obtained in the step (4) through an adhesive to form the human eye-safe VCSEL monomer.

Technical Field

The invention relates to an eye-safe small-size VCSEL packaging structure and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging.

Background

The 3D face recognition function obtains successful application in the consumption electronic smart mobile phone, and 3D face recognition will have explosive development in the coming years, mainly has two kinds of technologies of 3D structure light and TOF on 3D face recognition implementation, and whichever technology all needs VCSEL (vertical surface emitting laser), but owing to need to project the laser beam to the face, the safety problem of people's eye becomes especially important.

Conventional VCSEL laser module, it is bulky, the assembly is difficult for realizing the automation, and chinese patent document CN209561862U discloses a vertical cavity surface emitting laser packaging structure, and this structure includes the base plate, pastes in base plate one side surface's VCSEL chip and cover and locates the packaging support in the VCSEL chip outside, the base plate is aluminium nitride ceramic substrate, and aluminium nitride ceramic substrate surface still shaping has the metal level is formed with the circuit, and the VCSEL chip passes through nanometer silver glue layer and pastes in aluminium nitride ceramic substrate's surface and through binding line and circuit conduction connection, still assembles the diffusion piece that just goes out the plain noodles with the laser beam that launches the VCSEL chip to the VCSEL chip on the packaging support. The vertical cavity surface emitting laser packaging structure provided by the patent has the advantages that a VCSEL laser chip and a diffraction lens are installed in a right-to-right mode, the output power of the laser chip cannot be monitored, and potential safety hazards of human eyes exist.

Chinese patent document CN208384176U discloses an optical transmission assembly and device with backlight monitoring, which includes a VCSEL chip, a lens base and an exit focusing lens, and further includes: the backlight monitoring device comprises a semi-reflecting and semi-transmitting mirror and a backlight monitoring chip, wherein the semi-reflecting and semi-transmitting mirror comprises an incident collimating lens and a backlight reflector, emergent light of a VCSEL chip passes through the semi-reflecting and semi-transmitting mirror to form a reflecting light path and a transmitting light path, the backlight reflector and the backlight monitoring chip are arranged on the reflecting light path, and the incident collimating lens, a lens substrate and an emergent focusing lens are arranged on the transmitting light path. However, the light-emitting direction of the structure is the side surface of the device, and the requirements of consumer electronics on the light-emitting direction and the thickness of the product are not met.

Disclosure of Invention

Aiming at the defects of the prior art, the invention discloses an eye-safe small-size VCSEL packaging structure, wherein the light emitting direction of a packaging body and the light emitting direction of a VCSEL are in the same direction by arranging two reflectors, so that the requirements that consumer electronics generally adopt surface mounting and the light emitting direction is vertical to a mounting surface are met; the monitoring chip is positioned inside the reflector, and the reflector is arranged in a staggered manner, so that the size of the packaging body is greatly reduced.

The invention also discloses a manufacturing method of the human eye safety type small-size VCSEL packaging structure.

The technical scheme of the invention is as follows:

a human eye safety type small-size VCSEL packaging structure comprises a VCSEL chip, a monitoring chip, a reflector B, a reflector A, a diffraction lens, a carrier plate, a supporting frame and a cover plate;

the support plate is surrounded with a support frame, a cover plate is arranged on the support frame, and the support plate, the support frame and the cover plate are surrounded into a VCSEL packaging cavity;

in the VCSEL packaging cavity, a VCSEL chip and a reflector B are arranged on the carrier plate, and the reflector B is arranged on one side of the VCSEL chip; the side surface of the reflector B close to the VCSEL chip is a second reflecting surface, and a certain included angle is formed between the second reflecting surface and the carrier plate;

the top of the reflector A is fixed on the cover plate, and the reflector A is arranged above the VCSEL chip;

the top of the reflector A is provided with a groove; the monitoring chip is arranged on the cover plate and is positioned in the groove;

the side surface of the reflector A close to the VCSEL chip is a first reflecting surface, the second reflecting surface is parallel to the first reflecting surface, and a light path channel for emitting light by the VCSEL chip is formed between the first reflecting surface and the second reflecting surface;

the cover plate is also provided with a light outlet hole, and a diffraction lens is arranged on the light outlet hole;

the monitoring chip is connected with the control circuit, and the control circuit is connected with the VCSEL chip;

the emitting light of the VCSEL chip is incident to the reflector A, and a part of the emitting light is reflected to the second reflecting surface of the reflector B through the first reflecting surface of the reflector A, and is output to the outside of the VCSEL packaging cavity through the diffraction lens and the light outlet after being reflected by the second reflecting surface; the other part of the emitted light of the VCSEL chip reaches the monitoring chip through the reflector A, when the light sensing current I of the monitoring chip exceeds the set light sensing current Imax, the control circuit is triggered, and the control circuit emits a control signal to cut off the power supply of the VCSEL chip.

In the invention, the light-emitting direction of the packaging body and the light-emitting direction of the VCSEL are in the same direction due to the existence of the two reflectors, so that the requirements that consumer electronics generally adopt surface mounting and the light-emitting direction is vertical to a mounting surface are met; the monitoring chip is located inside the reflector, and the reflector is arranged in a staggered mode, so that the size of the packaging body is greatly reduced, and the intelligent mobile phone and the tablet personal computer can be conveniently applied.

According to the invention, an included angle of 45 degrees is formed between the second reflecting surface and the carrier plate. The advantage of this design is to ensure that the laser light exits the second reflective surface in the same direction as the laser light is directed to the first reflective surface and is directed perpendicularly to the diffractive optic.

Preferably, according to the invention, the wavelength range of the output of the VCSEL chip is 850-980 nm.

According to the invention, preferably, the surface of the first reflecting surface is coated with a 850-980nm high-reflectivity film by evaporation, and the reflectivity of the 850-980nm high-reflectivity film is 85-89%.

According to the invention, the preferable second reflecting surface is coated with a 850-980nm high-reflection film by evaporation, and the reflectivity of the 850-980nm high-reflection film is more than or equal to 98%.

According to the invention, the monitoring chip is preferably located above the VCSEL chip, and the center line of the monitoring chip deviates from the center line of the VCSEL chip by ± 25 μm.

According to the invention, preferably, the electrode of the monitoring chip is connected with the electrode arranged on the cover plate, and the electrode arranged on the cover plate corresponds to the position of the conductive metal column arranged on the top of the supporting frame. Conducting positive and negative leads of the monitoring chip to electrodes on the carrier plate; and all the electrodes connected with the external circuit are ensured to be arranged at the bottom of the carrier plate.

According to the invention, the carrier plate is preferably made of an alumina substrate or an aluminum nitride substrate.

The manufacturing method of the human eye safety type VCSEL packaging structure comprises the following steps:

(1) bonding the VCSEL chip on the carrier plate;

(2) bonding a reflector B on a carrier plate, and enabling a second reflecting surface of the reflector B to form a certain angle with the carrier plate;

(3) connecting the electrode of the VCSEL chip with the electrode of the carrier plate through an automatic wire welding machine;

(4) bonding a prefabricated support frame on the support plate;

(5) bonding the monitoring chip on a cover plate, and baking and curing;

(6) connecting the electrode of the monitoring chip with the electrode of the cover plate through an automatic wire welding machine;

(7) fixing the reflector A on the cover plate, so that the monitoring chip is positioned in a groove formed in the top of the reflector A, and a first reflecting surface of a first reflector of the reflector A is parallel to a second reflecting surface of a first reflector of the reflector B;

(8) bonding the diffraction lens to the light outlet hole on the cover plate;

(9) and (4) inversely buckling the semi-finished product output in the step (8) on the carrier plate obtained in the step (4) through an adhesive to form the human eye-safe VCSEL monomer.

The invention has the beneficial effects that:

1. according to the VCSEL packaging structure provided by the invention, the light emitting direction of the VCSEL is adjusted to be vertical to the carrier plate through the two 45-degree reflectors, so that the assembly and the use in consumer electronics are facilitated; the monitoring chip is positioned in the reflector cavity, and the two reflectors are arranged in a staggered manner, so that the product size is greatly reduced, and the requirement of consumer electronics on product size miniaturization is met.

2. The detection chip is arranged on the top of the light emitting area of the VCSEL laser chip, so that the purpose of detecting the light emitting power of the laser in real time is achieved, and the problem that human eyes are damaged due to the fact that the light emitting power of the VCSEL exceeds a design value and is caused by circuit faults, module faults and the like in the using process is solved.

3. The whole product is manufactured in the manufacturing and packaging process, and finally, the assembled whole product is cut to form a single body, so that the packaging method is suitable for batch production.

Drawings

FIG. 1 is a cross-sectional view of a VCSEL package structure provided in the present invention;

1. VCSEL chip, 2, gold thread A, 3, speculum A, 4, gold thread B, 5, control chip, 6, apron, 7, diffraction lens, 8, carriage, 9, speculum B, 10, support plate, 11, first plane of reflection, 12, second plane of reflection.

Detailed Description

The invention is further described below, but not limited thereto, with reference to the following examples and the accompanying drawings.

Example 1

An eye-safe small-sized VCSEL packaging structure is shown in FIG. 1, and comprises a VCSEL chip 1, a monitoring chip 5, a reflector B9, a reflector A3, a diffraction lens 7, a carrier plate 10, a supporting frame 8 and a cover plate 6;

the wavelength range of the output of the VCSEL chip 1 is 850-980 nm.

The carrier 10 is made of an aluminum oxide substrate or an aluminum nitride substrate.

A support frame 8 is arranged on the support plate 10 in a surrounding manner, a cover plate 6 is arranged on the support frame 8, and the support plate 10, the support frame 8 and the cover plate 6 are jointly arranged in a surrounding manner to form a VCSEL packaging cavity;

in the VCSEL package cavity, the VCSEL chip 1 and the reflector B9 are both disposed on the carrier board 10, and the reflector B9 is disposed on one side of the VCSEL chip 1; the side surface of the reflector B9 close to the VCSEL chip 1 is a second reflecting surface 12, and a certain included angle is formed between the second reflecting surface 12 and the carrier plate 10;

in this embodiment, the second reflective surface 12 and the carrier 10 form an included angle of 45 °. The advantage of this design is to ensure that the laser light exits the second reflective surface 12 in the same direction as the laser light is directed to the first reflective surface 11 and is directed perpendicularly to the diffractive optic 7.

The surface of the second reflecting surface 12 is coated with a 850-980nm high-reflection film by evaporation, and the reflectivity of the 850-980nm high-reflection film is more than or equal to 98%.

The top of the reflector A3 is fixed on the cover plate 6, and the top of the reflector A3 is provided with a groove;

the monitoring chip 5 is arranged on the cover plate 6, and the monitoring chip 5 is positioned in the groove; the monitoring chip 5 is located above the VCSEL chip 1, and the center line of the monitoring chip 5 deviates from the center line of the VCSEL chip 1 by ± 25 μm.

The side surface of the reflector a3 close to the VCSEL chip 1 is a first reflecting surface 11, the second reflecting surface 12 is parallel to the first reflecting surface 11, and an optical path channel for light emitted by the VCSEL chip 1 is formed between the first reflecting surface 11 and the second reflecting surface 12;

the surface of the first reflecting surface 11 is coated with a 850-980nm high-reflectivity film by evaporation, and the reflectivity of the 850-980nm high-reflectivity film is 85% -89%.

The cover plate 6 is also provided with a light outlet, and the light outlet is provided with a diffraction lens 7;

the monitoring chip 5 is connected with the control circuit, and the control circuit is connected with the VCSEL chip 1;

the emitted light of the VCSEL chip 1 is incident on the reflector A3, a part of the emitted light is reflected to the second reflecting surface 12 of the reflector B9 through the first reflecting surface 11 of the reflector A3, and is output to the outside of the VCSEL packaging cavity through the diffraction lens 7 and the light exit hole after being reflected by the second reflecting surface 12; the other part of the emitted light of the VCSEL chip 1 reaches the monitoring chip 5 through the reflector A3, when the light sensing current I of the monitoring chip 5 exceeds the set light sensing current Imax, the control circuit is triggered, the control circuit emits a control signal to cut off the power supply of the VCSEL chip 1, and the purpose of protecting the safety of human eyes is achieved.

The electrode welding wire of the monitoring chip 5 is connected with the electrode arranged on the cover plate 6 through wiring, and the electrode arranged on the cover plate 6 corresponds to the position of the conductive metal column arranged on the top of the supporting frame 8. Conducting the positive and negative leads of the monitoring chip 5 to the electrodes on the carrier plate 10; all electrodes connected to the external circuit are ensured to be on the bottom of the carrier plate 10.

In the invention, the light-emitting direction of the packaging body and the light-emitting direction of the VCSEL are in the same direction due to the existence of the two reflectors, so that the requirements that consumer electronics generally adopt surface mounting and the light-emitting direction is vertical to a mounting surface are met; the monitoring chip 5 is located inside the reflector, and the reflector is arranged in a staggered mode, so that the size of the packaging body is greatly reduced, and the application in smart phones and tablet computers is facilitated.

Example 2

Embodiment 1 provides a method for manufacturing a VCSEL package with a small size and safety for human eyes, including the steps of:

(1) adhering the VCSEL chip 1 to a designed position through silver paste on the carrier plate 10, and baking and curing;

(2) the reflector B9 is bonded to the carrier plate 10 through glue and photocured, a 45-degree reflecting surface exists on the surface of the reflector B9, and the reflecting surface is coated with a high-reflectivity film in an evaporation mode to increase reflectivity;

(3) the electrode of the VCSEL chip 1 is connected with the electrode of the carrier plate 10 through a gold wire A2 by an automatic wire bonding machine;

(4) bonding the prefabricated support frame 8 on the support plate 10;

(5) bonding the monitoring chip 5 on the cover plate 6, and baking and curing;

(6) the electrode of the monitoring chip 5 is connected with the electrode of the cover plate 6 through a gold wire B4 by an automatic wire bonding machine;

(7) fixing the reflector A3 on the cover plate 6, so that the monitoring chip 5 is positioned in a groove formed in the top of the reflector A3, and the first reflecting surface 11 of the first reflector of the reflector A3 is parallel to the second reflecting surface 12 of the first reflector of the reflector B9;

(8) the diffraction lens 7 is adhered to the light-emitting hole of the cover plate 6 through an adhesive;

(9) and (4) inversely buckling the semi-finished product output in the step (8) on the carrier plate 10 obtained in the step (4) through an adhesive to form the human eye-safe VCSEL monomer.