阅读说明：本技术 光接收模组、飞行时间装置及电子设备 (Optical receiving module, time-of-flight device and electronic equipment ) 是由 王华林 于 2021-01-19 设计创作，主要内容包括：本申请公开了一种光接收模组、飞行时间装置及电子设备。光接收模组包括像素阵列、电路阵列和微透镜阵列。像素阵列包括多个像素单元。电路阵列包括多个电路单元。多个像素单元和多个电路单元相互间隔设置。像素阵列与电路阵列位于同一平面。微透镜阵列包括多个微透镜。微透镜阵列覆盖像素阵列和电路阵列。每个微透镜覆盖的像素单元的面积大于电路单元的面积。外界光线能够经过微透镜汇聚到像素单元以产生电信号。上述光接收模组、飞行时间装置及电子设备,每个微透镜覆盖的像素单元的面积大于电路单元的面积,外界光线经过微透镜能够更多地汇聚到像素单元,从而提高飞行时间装置的能量利用率,降低电子设备的功耗。(The application discloses optical receiving module, time of flight device and electronic equipment. The light receiving module comprises a pixel array, a circuit array and a micro lens array. The pixel array includes a plurality of pixel units. The circuit array includes a plurality of circuit cells. The plurality of pixel units and the plurality of circuit units are disposed to be spaced apart from each other. The pixel array and the circuit array are located on the same plane. The microlens array includes a plurality of microlenses. The microlens array covers the pixel array and the circuit array. The area of the pixel unit covered by each micro lens is larger than that of the circuit unit. The external light can be converged to the pixel unit through the micro lens to generate an electric signal. According to the light receiving module, the time-of-flight device and the electronic equipment, the area of the pixel unit covered by each micro lens is larger than that of the circuit unit, and external light can be converged to the pixel unit more through the micro lens, so that the energy utilization rate of the time-of-flight device is improved, and the power consumption of the electronic equipment is reduced.)

1. An optical receiving module, comprising:

a pixel array including a plurality of pixel units;

the circuit array comprises a plurality of circuit units, a plurality of pixel units and a plurality of circuit units are arranged at intervals, and the pixel array and the circuit array are positioned on the same plane;

the micro-lens array comprises a plurality of micro-lenses, the micro-lens array covers the pixel array and the circuit array, the area of the pixel unit covered by each micro-lens is larger than that of the circuit unit, and outside light can be converged to the pixel unit through the micro-lenses to generate an electric signal.

2. The light receiving module of claim 1, wherein the number of the pixel units and the number of the circuit units are the same, and each of the circuit units is electrically connected to an adjacent one of the pixel units to process an electrical signal generated by the adjacent one of the pixel units.

3. The light receiving module of claim 2, wherein the circuit unit processes the electrical signal generated by the adjacent one of the pixel units by at least one of transferring, amplifying, reading and resetting photo-generated charges.

4. The light-receiving module as claimed in claim 1, wherein each of the pixel units has the same shape and size, each of the circuit units has the same shape and size, each of the microlenses has the same shape and size, the area of the pixel unit is larger than that of the circuit unit, and the area of the microlens is larger than that of the pixel unit.

5. The optical transceiver module as claimed in claim 4, wherein the pixel unit has a regular octagonal structure, the circuit unit has a square structure, the microlens has a square structure, the regular octagonal structure of the pixel unit has a side length equal to that of the square structure of the circuit unit, and the side length of the square structure of the microlens is equal to a distance between any two parallel sides of the regular octagonal structure of the pixel unit.

6. The optical transceiver module as claimed in claim 4, wherein the pixel unit has a circular structure, the circuit unit has a square structure, and the microlens has a square structure, wherein the side length of the square structure of the circuit unit does not exceed the diameter of the circular structure of the pixel unit, and the side length of the square structure of the microlens is equal to the diameter of the circular structure of the pixel unit.

7. The light-receiving module according to claim 5 or 6, wherein the side of the square structure of the circuit unit and the side of the square structure of the microlens form an angle of 45 degrees or 135 degrees.

8. The light-receiving module as claimed in claim 1, wherein the number of the pixel units is the same as that of the microlenses, and each microlens covers one pixel unit to converge the external light to the pixel unit.

9. A time-of-flight apparatus, comprising:

the light emission module is used for emitting the modulated near infrared light;

the light-receiving module set of any one of claims 1-8, configured to receive the near-infrared light reflected by an object.

10. An electronic device, characterized in that it comprises a time-of-flight apparatus as claimed in claim 9 and a housing for fixing the time-of-flight apparatus.

Technical Field

The application relates to the technical field of sensors, in particular to a light receiving module, a flight time device and electronic equipment.

Background

Generally, a Time of Flight (TOF) sensor includes a light emitting module and a receiving module, the light emitting module emits modulated near-infrared light, the modulated near-infrared light is reflected after being irradiated on an object, and the receiving module receives a reflected light signal and calculates a distance between the object and the object to be photographed by calculating a Time difference or a phase difference between light emission and reflection, so as to form depth information. In the related art, the energy utilization rate of the TOF sensor is low, and when the electronic device is configured with the TOF sensor, in order to ensure that a sufficient reflection signal is received, the power of the light emitting module needs to be increased or the operating time of the light emitting module needs to be prolonged, so that the power consumption of the electronic device is high.

Disclosure of Invention

The embodiment of the application provides a light receiving module, a flight time device and an electronic device.

The light receiving module of the embodiment of the application comprises a pixel array, a circuit array and a micro lens array. The pixel array includes a plurality of pixel units. The circuit array includes a plurality of circuit cells. The plurality of pixel units and the plurality of circuit units are arranged at intervals. The pixel array and the circuit array are located on the same plane. The microlens array includes a plurality of microlenses. The microlens array covers the pixel array and the circuit array. The area of the pixel unit covered by each micro lens is larger than that of the circuit unit. The external light can be converged to the pixel unit through the micro lens to generate an electric signal.

The time-of-flight device of the embodiment of the application comprises the light emitting module and the light receiving module. The light emitting module is used for emitting the modulated near infrared light. The light receiving module is used for receiving the near infrared light reflected by the object.

The electronic equipment of the embodiment of the application comprises the time-of-flight device and the shell, wherein the shell is used for fixing the time-of-flight device.

According to the light receiving module, the time-of-flight device and the electronic equipment, the area of the pixel unit covered by each micro lens is larger than that of the circuit unit, and external light can be converged to the pixel unit more through the micro lens, so that the energy utilization rate of the time-of-flight device is improved, and the power consumption of the electronic equipment is reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic arrangement diagram of a part of a pixel array and a circuit array and a microlens array of a light receiving module according to an embodiment of the present application;

FIG. 2 is a schematic partial cross-sectional view taken along line II-II of FIG. 1;

fig. 3 is a schematic layout diagram of a part of a pixel array and a circuit array and a microlens array of the light receiving module according to the embodiment of the present application;

FIG. 4 is a schematic view of a time-of-flight device according to an embodiment of the present application;

fig. 5 is a schematic diagram of an electronic device according to an embodiment of the present application.

Description of the main element symbols:

electronic device 1000, time-of-flight apparatus 100, light-receiving module 10, pixel array 12, pixel unit 122, circuit array 14, circuit unit 142, microlens array 16, microlens 162, light-emitting module 20, housing 200, and method of manufacturing the same,

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1 and 2, a light receiving module 10 according to an embodiment of the present disclosure includes a pixel array 12, a circuit array 14, and a microlens array 16. The pixel array 12 includes a plurality of pixel cells 122. The circuit array 14 includes a plurality of circuit units 142. The plurality of pixel units 122 and the plurality of circuit units 142 are disposed to be spaced apart from each other. The pixel array 12 is in the same plane as the circuit array 14. The microlens array 16 includes a plurality of microlenses 162. The microlens array 16 covers the pixel array 12 and the circuit array 14. Each microlens 162 covers an area of the pixel unit 122 larger than an area of the circuit unit 142. The external light can be converged to the pixel unit 122 through the micro lens 162 to generate an electrical signal.

In the light receiving module 10, the area of the pixel unit 122 covered by each microlens 162 is larger than the area of the circuit unit 142, and the external light can be more converged to the pixel unit 122 through the microlens 162, so that the energy utilization rate of the time-of-flight device is improved, and the power consumption of the electronic device is reduced.

In the related art, the pixel array and the circuit array are separately arranged on the chip substrate, and the area of the chip substrate occupied by the pixel array and the circuit array is large, so that the light receiving module is large and is not suitable for miniaturized electronic equipment such as smart phones. In the light receiving module 10 of the embodiment of the present application, the plurality of pixel units 122 and the plurality of circuit units 142 are disposed at intervals, and the pixel units 122 and the circuit units 142 are compactly arranged on the chip substrate, so that the area of the chip substrate can be effectively utilized, and the size of the light receiving module 10 can be reduced, thereby being suitable for miniaturized electronic devices such as smart phones.

Specifically, the optical receiving module 10 can be used for a time-of-flight device. In some embodiments, the light receiving module 10 includes a front-illuminated TOF receiving chip, the pixel array 12 and the circuit array 14 are disposed on a chip substrate, and the pixel array 12 and the circuit array 14 are substantially located on the same plane. Referring to fig. 2, in some embodiments, the light receiving module 10 further includes a light shielding member 18, the light shielding member 18 is disposed between the pixel unit 122 and the micro lens 162, an area of the light shielding member 18 is smaller than an area of the pixel unit 122, and an area of the light shielding member 18 is smaller than an area of the micro lens 162, so that when the micro lens 162 converges the external light onto the pixel unit 122, interference between adjacent light beams is reduced. The ambient light may include reflected modulated near infrared light and ambient light. After the pixel unit 122 acquires the external light, it may generate an electrical signal corresponding to the modulated near-infrared light, so as to convert the optical signal into an electrical signal. The circuit unit 142 can process and transmit the electrical signal generated by the pixel unit 122.

Further, referring to fig. 1, each pixel unit 122 is adjacent to four circuit units 142, each circuit unit 142 is adjacent to four pixel units 122, and the pixel units 122 and the circuit units 142 are disposed at intervals. It can be understood that the pixel unit 122 and the circuit unit 142 are disposed at an interval, which can reduce crosstalk between the pixel units 122, and improve performance of the pixel units 122, thereby improving effective resolution. In addition, the pixel unit 122 and the circuit unit 142 are disposed at an interval from each other, which is also beneficial to the design and arrangement of the circuit unit 142. Each microlens 162 is adjacent to four microlenses 162, and the plurality of microlenses 162 are arranged compactly. The microlens array 16 is located above the plane of the pixel array 12 and the circuit array 14, so that the microlens array 16 can cover the pixel array 12 and the circuit array 14.

In some embodiments, the number of pixel units 122 and circuit units 142 is the same, and each circuit unit 142 is electrically connected to an adjacent pixel unit 122 to process the electrical signal generated by the adjacent pixel unit 122.

Thus, the circuit units 142 correspond to the pixel units 122 one to one, which is beneficial to improving the processing efficiency of the electrical signals. It is understood that the circuit structure in each circuit unit 142 is the same, when the number of the pixel units 122 is the same as that of the circuit units 142, one circuit unit 142 is responsible for processing the electrical signals generated by one pixel unit 122, and a plurality of circuit units 142 simultaneously process the electrical signals generated by a plurality of pixel units 122, thereby improving the electrical signal readout and transfer efficiency.

Specifically, the circuit unit 142 may include a digital circuit and/or an analog circuit. When external light is irradiated to the pixel unit 122, an electrical signal is generated inside the pixel unit 122, and the digital circuit and/or the analog circuit can process the electrical signal generated by the pixel unit 122 and output the processed electrical signal.

Referring to fig. 1, in an example, the pixel array 12 includes 5 rows and 7 columns, the circuit array 14 also includes 5 rows and 7 columns, the pixel units 122 and the circuit units 142 are arranged at intervals, the number of the pixel units 122 and the number of the circuit units 142 are 18, and each circuit unit 142 is electrically connected to one pixel unit 122 on the left side of the pixel array 12 in the odd-numbered rows of the circuit array 14; in even rows of the pixel array 12 and the circuit array 14, each circuit unit 142 is electrically connected to one pixel unit 122 on the right side thereof.

In some embodiments, the way in which circuit unit 142 processes the electrical signal generated by an adjacent one of pixel units 122 includes at least one of photo-generated charge transfer, amplification, readout, and reset.

In this manner, the electrical signals generated by the pixel cells 122 can be processed and analyzed by other electronic components. It can be understood that the pixel unit 122 generates a weak electrical signal according to external light, and the circuit unit 142 is required to process the weak electrical signal into a general electrical signal, so as to ensure normal operation of other electronic components.

Specifically, the circuit unit 142 may include at least one of an analog circuit, an ADC amplifying circuit, a readout circuit, and a reset circuit. Analog circuitry may be used to transfer photo-generated charge transfer. The ADC amplification circuit may be used to amplify the photo-generated charge amplification. The readout circuitry may be used to readout the photo-generated charge. The reset circuit may be used to reset the photo-generated charge.

In one example, the way in which the circuit unit 142 processes the electrical signal generated by the adjacent one of the pixel units 122 includes all of the photo-generated charge transfer, amplification, readout, and reset, i.e., the circuit unit 142 is used to transfer, amplify, readout, and reset the photo-generated charge in the adjacent one of the pixels.

In some embodiments, each pixel unit 122 has the same shape and size, each circuit unit 142 has the same shape and size, each microlens 162 has the same shape and size, the area of the pixel unit 122 is larger than the area of the circuit unit 142, and the area of the microlens 162 is larger than the area of the pixel unit 122.

So, be favorable to arranging a plurality of pixel unit 122, a plurality of circuit unit 142 and a plurality of microlens 162, under the same condition of chip substrate area, the pixel unit 122 of this application is bigger with circuit unit 142's area ratio, and light receiving module 10 can acquire more external light, can improve the energy utilization of time of flight device.

Specifically, pixel cells 122 and circuit cells 142 may be disposed on a chip substrate, the shape and size of each pixel cell 122 mapped onto the chip substrate are substantially the same, the shape and size of each circuit cell 142 mapped onto the chip substrate are substantially the same, the shape and size of each microlens 162 mapped onto the chip substrate are substantially the same, the area of pixel cell 122 mapped onto the chip substrate is larger than the area of circuit cell 142 mapped onto the chip substrate, and the area of microlens 162 mapped onto the chip substrate is larger than the area of pixel cell 122 mapped onto the chip substrate. The shapes of the pixel unit 122, the circuit unit 142 and the microlens 162 may be the same, or different, and are not limited herein, for example, the pixel unit 122, the circuit unit 142 and the microlens 162 may all be square structures, or the pixel unit 122 may be a circular structure, and the circuit unit 142 and the microlens 162 may be square structures.

It should be noted that substantially the same means the same within an error tolerance. It is understood that in a mass production manufacturing process, there may be some errors in the shape or size of the plurality of pixel units 122, some errors in the shape or size of the plurality of circuit units 142, and some errors in the shape or size of the plurality of microlenses 162, but the errors are controlled within an allowable range.

Referring to fig. 1, in some embodiments, the pixel unit 122 has a regular octagonal structure, the circuit unit 142 has a square structure, and the microlens 162 has a square structure, wherein a side length of the regular octagonal structure of the pixel unit 122 is the same as a side length of the square structure of the circuit unit 142, and a side length of the square structure of the microlens 162 is equal to a distance between any two parallel sides of the regular octagonal structure of the pixel unit 122.

Thus, the pixel unit 122 and the circuit unit 142 are arranged more compactly, and the utilization rate of the chip substrate area is improved. Meanwhile, the area of the pixel unit 122 covered by the microlens 162 is larger than the area of the circuit unit 142, and the microlens 162 can maximally converge the external light to the pixel unit 122.

In one example, the pixel unit 122 is mapped to the chip substrate in a regular octagonal structure, the side length of the regular octagonal structure is 3 μm, the distance between any two parallel sides of the regular octagonal structure is about 7.24 μm, and the area of the regular octagonal structure is about 43.46 μm². The circuit units 142 are mapped on the chip substrate to form a square structure, the side length of the square structure is 3 mu m, and the area of the square structure is 9 mu m². Microlens 162 mapped onto chip substrateThe side length of the square structure is 7.24 mu m, and the area of the square structure is 52.42 mu m²。

Referring to fig. 3, in some embodiments, the pixel unit 122 has a circular structure, the circuit unit 142 has a square structure, and the microlens 162 has a square structure, wherein the side length of the square structure of the circuit unit 142 does not exceed the diameter of the circular structure of the pixel unit 122, and the side length of the square structure of the microlens 162 is equal to the diameter of the circular structure of the pixel unit 122.

In this manner, the pixel unit 122 is more easily registered with the microlens array 16, and the uniformity of the charge well and the electric field distribution inside the pixel unit 122 are more easily made uniform. Meanwhile, the area of the pixel unit 122 covered by the microlens 162 is larger than the area of the circuit unit 142, and the microlens 162 can sufficiently converge the external light to the pixel unit 122.

In one example, pixel cells 122 are mapped onto the chip substrate in a circular configuration having a diameter of 7.24 μm and a circular area of about 41.17 μm². The circuit units 142 are mapped on the chip substrate to form a square structure, the side length of the square structure is 3 mu m, and the area of the square structure is 9 mu m². The micro lens 162 is mapped on the chip substrate to form a square structure, the side length of the square structure is 7.24 mu m, and the area of the square structure is 52.42 mu m²。

It should be noted that the specific numerical values mentioned above are only for illustrating the implementation of the present application in detail and should not be construed as limiting the present application. In other examples or embodiments or examples, other values may be selected according to the application and are not specifically limited herein.

In one example, the light receiving module 10 includes a front-illuminated D-TOF SPAD chip, and the pixel unit 122 and the circuit unit 142 are disposed on a chip substrate. The pixel unit 122 is a Single Photon Avalanche Diode (SPAD), and since the pixel unit 122 is in a circular structure, it is convenient to nest a guard ring around the SPAD photosensitive area. Therefore, the scheme is particularly suitable for the pixel structure design of the front-illuminated D-TOF SPAD chip.

In some embodiments, the side of the square structure of the circuit unit 142 forms an angle of 45 degrees or 135 degrees with the side of the square structure of the microlens 162.

Thus, the micro lens 162 is staggered from the circuit unit 142, and the micro lens 162 can better cover the pixel unit 122, so that the pixel unit 122 can obtain more external light.

In one example, the sides of the square structure of the circuit unit 142 and the sides of the square structure of the microlens 162 form an angle of 45 degrees or 135 degrees, that is, the pixel array 12 and the microlens array 16 are arranged with a 45-degree offset. As shown in fig. 2, the cross-sectional view of the pixel unit 122 and the microlens 162 is a cross-sectional view, and the light beam converging action of the microlens 162 can converge 100% of the light beam to the photosensitive area of the pixel unit 122, so that the pixel unit 122 can obtain more external light, and the energy utilization rate of the time-of-flight device is effectively improved.

In some embodiments, the number of the pixel units 122 is the same as that of the microlenses 162, and each microlens 162 covers one pixel unit 122 to converge the external light to the pixel unit 122.

Thus, each pixel unit 122 fully acquires the external light, and the energy utilization rate of the time-of-flight device is greatly improved.

In other embodiments, the number of the microlenses 162 can be 4 times the number of the pixel units 122, every four microlenses 162 cover one pixel unit 122 to converge the external light to the pixel unit 122, and the area of the pixel unit 122 covered by each microlens 162 is also larger than the area of the circuit unit 142.

Referring to fig. 4, a time-of-flight apparatus 100 according to an embodiment of the present disclosure includes a light-emitting module 20 and a light-receiving module 10 according to the above-mentioned embodiment. The light emitting module 20 is used for emitting the modulated near infrared light. The light receiving module 10 is used for receiving the near infrared light reflected by the object.

In the time-of-flight apparatus 100, the area of the pixel unit 122 covered by each microlens 162 is larger than the area of the circuit unit 142, and the external light can be more converged to the pixel unit 122 through the microlens 162, so that the energy utilization rate of the time-of-flight apparatus 100 is improved, and the power consumption of the electronic device is reduced.

Specifically, in some embodiments, time-of-flight device 100 further includes a processing module (not shown). The processing module is electrically connected to the light receiving module 10. The processing module is used for calculating the distance between the object and the time-of-flight device 100 after the light receiving module 10 receives the near infrared light reflected by the object, so as to obtain the depth data.

In one example, the pixel array 12 is designed in a 640 x 240 staggered arrangement, and the TOF image of 640 x 240 needs to be up-sampled in order to further improve the pixel resolution to VGA (640 x 480). First, the electrical signal generated by the pixel unit 122 goes through a readout circuit, digital-to-analog conversion, etc. to generate an original Raw map with 640 × 240 resolution. Then, the Raw map is demosaiced to obtain a 640 × 480 resolution Raw map (like a checkerboard) in which the interleaved pixels have no valid data. And then, carrying out camera calibration and depth image processing to obtain depth data. Finally, pixel up-sampling is carried out, for example, interpolation algorithm and the like are carried out on the value of the checkerboard invalid pixel area, and a depth image with VGA resolution is obtained.

It should be noted that the above explanation of the embodiment and the advantageous effects of the light receiving module 10 is also applicable to the electronic device used in the time-of-flight apparatus 100 and the following embodiments, and is not detailed herein to avoid redundancy.

Referring to fig. 5, an electronic device 1000 according to an embodiment of the present disclosure includes the time-of-flight apparatus 100 according to the above embodiment and a housing 200, where the housing 200 is used for fixing the time-of-flight apparatus 100.

In the electronic device 1000, the area of the pixel unit 122 covered by each microlens 162 is larger than the area of the circuit unit 142, and the external light can be more converged to the pixel unit 122 through the microlens 162, so that the energy utilization rate of the time-of-flight apparatus 100 is improved, and the power consumption of the electronic device 1000 is reduced.

Specifically, in some embodiments, the time-of-flight device 100 is disposed inside a housing 200, the housing 200 being provided with a light transmissive region to enable the time-of-flight device 100 to emit modulated near infrared light to the outside and to receive near infrared light reflected by objects. In other embodiments, the time-of-flight device 100 can also be disposed on the surface of the housing 200, and the time-of-flight device 100 can directly emit the modulated near-infrared light to the outside and receive the near-infrared light reflected by the object.

It should be noted that in the embodiment shown in fig. 5, the electronic device 1000 is a smart phone, and in other embodiments, the electronic device 1000 may be a digital camera, a tablet computer, a smart watch, or other terminal device equipped with the time-of-flight apparatus 100, which is not limited herein.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.