阅读说明：本技术 一种小型化大功率芯片及其封装工艺 (Miniaturized high-power chip and packaging process thereof ) 是由 芮建保 潘昊 韦春雷 于 2021-03-22 设计创作，主要内容包括：本发明公开了一种小型化大功率芯片,包括安装座以及固定连接在安装座上的芯片模块,其特征在于,所述芯片模块包括若干组连接于安装座上热沉和固定连接在热沉上的芯片组,所述芯片组包括若干组正负极串联连接的芯片单元,所述芯片单元包括基座和固定连接在基座上的芯片本体,所述芯片本体通过基座固定连接在热沉上,所述芯片组的外侧边缘处的正负极两端分别固定连接有正极导电片和负极导电片,所述热沉可拆卸连接在安装座上,本发明还公开了一种小型化大功率芯片的封装工艺,本发明具有结构合理,便于安装和拆卸,提升检修效率的优点。(The invention discloses a miniaturized high-power chip, which comprises a mounting seat and a chip module fixedly connected on the mounting seat, and is characterized in that the chip module comprises a plurality of groups of heat sinks connected on the mounting seat and chip groups fixedly connected on the heat sinks, each chip group comprises a plurality of groups of chip units with positive electrodes and negative electrodes connected in series, each chip unit comprises a base and a chip body fixedly connected on the base, each chip body is fixedly connected on the heat sink through the base, positive and negative electrodes at the outer edge of each chip group are respectively and fixedly connected with a positive electrode conducting strip and a negative electrode conducting strip, and each heat sink is detachably connected on the mounting seat.)

1. The utility model provides a miniaturized high-power chip, includes mount pad (1) and chip module (2) of fixed connection on mount pad (1), its characterized in that, chip module (2) include a plurality of groups connect on mount pad (1) heat sink (3) and the chipset of fixed connection on heat sink (3), the chipset includes positive negative pole series connection's of a plurality of groups chip unit (4), chip unit (4) include base (5) and chip body (6) of fixed connection on base (5), chip body (6) are through base (5) fixed connection on heat sink (3), the positive negative pole both ends of outside edge of chipset are fixedly connected with anodal conducting strip (7) and negative pole conducting strip (8) respectively, heat sink (3) can be dismantled and connect on mount pad (1).

2. A miniaturized high power chip according to claim 1, characterized in that: the heat sink is characterized in that an insulating block (9) is fixedly connected between the base (5) and the heat sink (3), the base (5) is welded on the heat sink (3) through the insulating block (9), and the insulating block (9) is an insulating ceramic block.

3. A miniaturized high power chip according to claim 1, characterized in that: the heat sink (3) is in threaded connection with the mounting base (1) through a screw (12).

4. A miniaturized high power chip according to claim 1, characterized in that: and two ends of the heat sink (3) are respectively provided with an electric leading electrode (10) which is respectively connected with the positive conducting strip (7) and the negative conducting strip (8) in a welding way.

5. A miniaturized high-power chip according to claim 3 or 4, characterized in that: the electricity leading electrode (10) is fixedly connected to the heat sink (3) through a screw (12).

6. A miniaturized high power chip according to claim 5, characterized in that: an insulating gasket (13) is arranged between the screw (12) and the electricity leading electrode (10).

7. A miniaturized high power chip according to claim 6, characterized in that: and two ends of the heat sink (3) are provided with placing grooves (14) for placing the electricity leading electrodes (10) and the insulating gaskets (13).

8. A packaging process of a miniaturized high-power chip is characterized in that: comprises that

S1, welding and connecting the chip unit (4) and the base (5);

s2, stacking a plurality of groups of welded and connected chip units (4) and the positive and negative electrodes of the base (5) in series to form a chip group, and welding the chip group on the heat sink (3);

s3, respectively welding the positive conductive sheet (7) and the negative conductive sheet (8) at the two ends of the chip set;

s4, placing a plurality of groups of chip groups and heat sinks (3) together to form a chip module (2), and connecting the chip groups and the heat sinks (3) to the mounting base (1) through screws (12) on the heat sinks respectively.

9. The packaging process of the miniaturized high-power chip as claimed in claim 8, wherein: in the step S2, the chip set is welded to the insulating block (9) first, and then the insulating block (9) is welded to the heat sink (3).

10. The packaging process of the miniaturized high-power chip as claimed in claim 8, wherein: in the step S3, two ends of the heat sink (3) are further respectively and fixedly connected with an electric lead electrode (10), and the positive conductive sheet (7) and the negative conductive sheet (8) are respectively welded on the electric lead electrode (10).

Technical Field

The invention belongs to the technical field of chip packaging, and particularly relates to a miniaturized high-power chip and a packaging process thereof.

Background

The semiconductor pumped solid laser is a new laser which is developed internationally fastest in recent years and has wide application, and the semiconductor laser which outputs fixed wavelength replaces a traditional krypton lamp or xenon lamp to pump a laser crystal, so that the semiconductor pumped solid laser is brand-new in development and is called as a second-generation laser. The laser is also a second-generation novel solid laser with low power consumption, reliable performance, long service life and good output beam quality, and has unique application prospect in high-tech fields such as space communication, optical fiber communication, atmospheric research, environmental science, medical instruments, optical image processing, laser printers and the like.

In prior art, often weld a plurality of chipsets together earlier and constitute the chip module, then with chip module lug weld on heat sink, in case some one of them chipset breaks down, owing to be wholly be welded connection, so need all dismantle all chip units get off, could overhaul, the step is too loaded down with trivial details, influences maintenance efficiency.

Therefore, in view of the above technical problems, it is necessary to provide a miniaturized high-power chip and a packaging process thereof.

Disclosure of Invention

The invention aims to provide a miniaturized high-power chip and a packaging process thereof, which are used for solving the problems in the prior art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a miniaturized high-power chip, includes mount pad and the chip module of fixed connection on the mount pad, the chip module includes that a plurality of group connect on the mount pad heat sink with the chipset of fixed connection on heat sink, the chipset includes the positive negative pole series connection's of a plurality of groups chip unit, the chip unit includes base and the chip body of fixed connection on the base, the chip body passes through base fixed connection on heat sink, the positive negative pole both ends of the outside edge of chipset are positive conducting strip and negative pole conducting strip of fixedly connected with respectively, heat sink demountable connection is on the mount pad.

As a preferred technical scheme of the invention, an insulating block is fixedly connected between the base and the heat sink, the base is welded on the heat sink through the insulating block, and the insulating block is an insulating ceramic block.

As a preferred technical solution of the present invention, the heat sink is screwed to the mounting base by screws.

As a preferred technical scheme of the invention, two ends of the heat sink are respectively provided with an electricity leading electrode and are respectively connected with the positive conducting strip and the negative conducting strip in a welding way.

As a preferred technical solution of the present invention, the electricity-leading electrode is fixedly connected to the heat sink by a screw.

As a preferred technical solution of the present invention, an insulating spacer is disposed between the screw and the lead electrode.

As a preferable technical scheme of the invention, the two ends of the heat sink are provided with placing grooves for placing the electricity leading electrodes and the insulating gaskets.

A process for packaging miniaturized high-power chip comprises

S1, welding and connecting the chip unit and the base;

s2, stacking a plurality of groups of the chip units connected in a welding manner and the positive and negative electrodes of the base in series to form a chip group, and welding the chip group on the heat sink;

s3, respectively welding the positive conducting strip and the negative conducting strip at the two ends of the chip set;

s4, placing several groups of chip groups and heat sinks together to form a chip module, and connecting the chip groups and the heat sinks to the mounting base through screws and threads on the respective heat sinks to form a preferable technical scheme of the invention, wherein in S2, the chip groups are firstly welded on the insulating blocks, and then the insulating blocks are welded on the heat sinks.

As a preferred technical solution of the present invention, in S3, two ends of the heat sink are further respectively and fixedly connected with an electric lead electrode, and the positive conductive sheet and the negative conductive sheet are respectively welded on the electric lead electrodes.

Compared with the prior art, the invention has the beneficial effects that: constitute the chip module on respective heat sink through many group's chip group welding, and pass heat sink threaded connection on the mount pad through the screw, thereby in case chip module's somewhere finds the trouble, only need with the chipset of trouble department and the screw of heat sink department unscrew, alright dismantle the trouble department, and change new chipset and heat sink, the installation of screwing of reuse screw, thereby reach the effect of quick maintenance, it is rational in infrastructure to have, be convenient for installation and dismantlement, promote maintenance efficiency's advantage.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

FIG. 2 is a schematic diagram of a connection structure between a chip set and a heat sink according to an embodiment of the present application;

FIG. 3 is an enlarged view at A in FIG. 2;

fig. 4 is a schematic flow chart of a packaging process according to an embodiment of the present application.

In the figure: 1. a mounting seat; 2. a chip module; 3. a heat sink; 4. a chip unit; 5. a base; 6. a chip body; 7. a positive electrode conductive sheet; 8. a negative electrode conductive sheet; 9. an insulating block; 10. a charging electrode; 11. welding flux; 12. a screw; 13. an insulating spacer; 14. and (6) placing the groove.

Detailed Description

The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.

As shown in fig. 1-3, a miniaturized high-power chip, including mount pad 1 and chip module 2 of fixed connection on mount pad 1, chip module 2 includes a plurality of group connection heat sink 3 and the chipset of fixed connection on heat sink 3 on mount pad 1, the chipset includes the positive negative pole series connection's of a plurality of groups chip unit 4, chip unit 4 includes base 5 and chip body 6 of fixed connection on base 5, chip body 6 passes through base 5 fixed connection on heat sink 3, the positive negative pole both ends of the outside edge of chipset are fixedly connected with anodal conducting strip 7 and negative pole conducting strip 8 respectively, heat sink 3 demountable connection is on mount pad 1.

Preferably, the heat sink 3 is screwed on the mounting base 1 by screws 12, and the screws 12 have the effect of facilitating mounting and dismounting.

Wherein, fixedly connected with collets 9 between base 5 and the heat sink 3, base 5 passes through collets 9 welding on heat sink 3, play the effect of isolating current on chip unit 4 on base 5 and heat sink 3 through collets 9 and come, collets 9 are insulating ceramic block, utilize insulating ceramic's good insulating properties, this insulating ceramic block still has good heat conductivity simultaneously, has also played the radiating effect to chip unit 4.

The two ends of the heat sink 3 are respectively provided with an electric leading electrode 10, and the electric leading electrodes are respectively connected with the anode conducting strip 7 and the cathode conducting strip 8 in a welding mode, the electric leading electrodes 10 and the conducting electrodes adopt a mode of secondary welding of a welding flux 11, so that the stress on soldering lugs can be released, and the reliability of the module is improved.

The leading electrode 10 is fixedly connected to the heat sink 3 through a screw 12, and one end of the screw 12 sequentially penetrates through the leading electrode 10 and the heat sink 3 and is in threaded connection with the mounting base 1, so that the effect of fixedly connecting the leading electrode 10 to the heat sink 3 is achieved.

An insulating gasket 13 is arranged between the screw 12 and the electricity leading electrode 10, and the insulating gasket 13 plays a role of organizing the current on the electricity leading electrode 10 to pass through the screw 12 and also plays a role of protecting the electricity leading electrode 10 when the screw 12 is screwed.

Wherein, the two ends of the heat sink 3 are provided with the placing grooves 14 for placing the electricity leading electrode 10 and the insulating gasket 13, which has the effect of limiting the positions of the electricity leading electrode 10 and the insulating gasket 13.

As shown in FIG. 4, a process for packaging a miniaturized high-power chip comprises

S1, soldering the chip unit 4 and the base 5;

s2, stacking a plurality of groups of welded chip units 4 and bases 5 in series to form a chip group, and welding the chip group on the heat sink 3;

s3, respectively welding the positive conducting strip 7 and the negative conducting strip 8 at the two ends of the chip set;

s4, several groups of chip groups and heat sinks 3 are put together to form a chip module 2, and screwed on the mounting base 1 by screws 12 on the respective heat sinks 3.

In order to achieve the insulating effect, in S2, the chipset is first soldered to the insulating block 9, and then the insulating block 9 is soldered to the heat sink 3, so as to achieve the effect of soldering the chipset to the heat sink 3.

In order to release the stress at the welding position and increase the reliability of the chip module 2, in S3, two ends of the heat sink 3 are further fixedly connected with an electric lead electrode 10 through screws 12, respectively, and the positive conductive sheet 7 and the negative conductive sheet 8 are welded on one electric lead electrode 10, respectively.

In conclusion, the beneficial effects of the invention are as follows: constitute chip module 2 on respective heat sink 3 through many group's chip group welding, and pass heat sink 3 threaded connection on mount pad 1 through screw 12, thereby in case chip module 2's somewhere finds the trouble, only need with the chipset of trouble department and the screw 12 of heat sink 3 department unscrew, alright dismantle the trouble department, and change new chipset and heat sink 3, reuse screw 12 screws the installation, thereby reach the effect of quick maintenance, and is rational in infrastructure, be convenient for installation and dismantlement, promote the advantage of maintenance efficiency.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.