阅读说明：本技术 Pdlc膜加工设备及其加工方法 (PDLC film processing equipment and processing method thereof ) 是由 吴永隆 李炳宏 何文斌 孙瑞 于 2020-12-11 设计创作，主要内容包括：本发明提供了一种PDLC膜加工设备及其加工方法,涉及电极加工设备技术领域,该PDLC膜加工设备包括加工平台、移料机构、激光清洗机构、激光切割机构以及控制单元,移料机构、激光清洗机构以及激光切割机构均与控制单元电连接；加工平台沿第一方向至少设有上料工位、清洗工位以及切割工位；移料机构用于带动PDLC膜运动,并将PDLC膜向清洗工位或切割工位输送；激光清洗机构用于对清洗工位上的PDLC膜按照设定路径进行激光清洗加工；激光切割机构用于对激光清洗加工后的PDLC膜按照设定路径进行激光切割加工。解决了现有技术中存在的PDLC膜的加工过程中,人工参与较多的技术问题。(The invention provides a PDLC film processing device and a processing method thereof, and relates to the technical field of electrode processing devices, wherein the PDLC film processing device comprises a processing platform, a material moving mechanism, a laser cleaning mechanism, a laser cutting mechanism and a control unit, wherein the material moving mechanism, the laser cleaning mechanism and the laser cutting mechanism are electrically connected with the control unit; the processing platform is at least provided with a feeding station, a cleaning station and a cutting station along a first direction; the material moving mechanism is used for driving the PDLC film to move and conveying the PDLC film to a cleaning station or a cutting station; the laser cleaning mechanism is used for carrying out laser cleaning processing on the PDLC film on the cleaning station according to a set path; the laser cutting mechanism is used for carrying out laser cutting processing on the PDLC film subjected to the laser cleaning processing according to a set path. The technical problem that in the processing process of the PDLC film in the prior art, more manual participation is achieved is solved.)

1. A PDLC film processing apparatus, comprising: the device comprises a processing platform, a material moving mechanism, a laser cleaning mechanism, a laser cutting mechanism and a control unit, wherein the material moving mechanism, the laser cleaning mechanism and the laser cutting mechanism are all electrically connected with the control unit;

the processing platform is at least provided with a feeding station (10), a cleaning station (20) and a cutting station (30) along a first direction;

the material moving mechanism is used for driving the PDLC film to move and conveying the PDLC film to the cleaning station (20) or the cutting station (30);

the laser cleaning mechanism is used for carrying out laser cleaning processing on the PDLC film on the cleaning station (20) according to a set path;

the laser cutting mechanism is used for carrying out laser cutting processing on the PDLC film subjected to laser cleaning processing according to a set path.

2. The PDLC film processing equipment according to claim 1, wherein said feeding station (10), said cleaning station (20) and said cutting station (30) are provided with a positioning structure for positioning PDLC film.

3. The PDLC film processing apparatus of claim 2, wherein said positioning structure comprises a fixed block (410) and a positioning block (420);

the fixed block (410) is fixedly arranged on the processing platform; the positions of the positioning block (420) and the processing platform are adjustable;

a positioning space for positioning the PDLC film is formed between the fixed block (410) and the positioning block (420).

4. The PDLC film processing equipment according to claim 2, wherein said processing platform is further provided with a blanking station along a first direction, said blanking station is located at a side of said cutting station (30) away from said cleaning station (20);

the material moving mechanism can convey the PDLC film subjected to laser cutting to the blanking station.

5. The PDLC film processing device according to claim 1, wherein said material moving mechanism comprises a suction assembly (110) and a three-dimensional driving module driving said suction assembly (110) to move in XYZ direction.

6. The PDLC film processing apparatus of claim 5, wherein said three-dimensional drive module comprises a gantry X-axis (121), a gantry Y-axis (122), and a gantry Z-axis (123);

the two groups of portal frames Y-axis (122) are arranged in parallel, and the portal frame X-axis (121) is erected between the two groups of portal frame Y-axis (122);

the gantry Z axis (123) is erected on the gantry X axis (121);

the suction assembly (110) is fixedly connected to the output end of the gantry Z shaft (123).

7. The PDLC film processing equipment according to claim 1, wherein said laser cleaning mechanism comprises a galvanometer laser (210), a laser cutting positioning mechanism and a first XY module (220) for driving said galvanometer laser (210) to move in XY directions.

8. The PDLC film processing apparatus of claim 7, wherein said laser cutting mechanism comprises a Co2 laser (310), a laser cleaning positioning mechanism and a second XY module (320) driving said Co2 laser (310) to move in XY directions.

9. The PDLC film processing apparatus of claim 8, wherein said laser cutting positioning mechanism and said laser cleaning positioning mechanism each comprise a CCD automatic positioning module.

10. A processing method using the PDLC film processing apparatus of any one of claims 1 to 9, comprising the steps of:

placing a PDLC film at a feeding station (10);

transferring the PDLC film of the feeding station (10) to a cleaning station (20);

carrying out laser cleaning processing on the PDLC film of the cleaning station (20) according to a set path;

the PDLC film after laser cleaning processing is transferred to a cutting station (30);

and carrying out laser cutting processing on the PDLC film of the cutting station (30) according to a set path.

Technical Field

The invention relates to the technical field of electrode processing equipment, in particular to PDLC film processing equipment and a processing method thereof.

Background

Polymer Dispersed Liquid Crystal (PDLC) is a new photoelectric film material, namely, Liquid Crystal is Dispersed in a Polymer, and Liquid Crystal droplets formed by polymerization reaction under a certain condition are uniformly Dispersed in a continuous Polymer matrix. Due to the optical anisotropy and the dielectric anisotropy of liquid crystal molecules, the PDLC becomes a composite material with electro-optic response characteristics.

At present, PDLC films in the market are mostly produced by complete manual production process and equipment, or are produced by manual splicing after being processed by semi-automatic equipment, and the processing process method has the advantages of low product yield, low production yield and high labor cost.

Disclosure of Invention

The invention aims to provide PDLC film processing equipment and a processing method thereof, so as to solve the technical problem that much manual participation exists in the processing process of a PDLC film in the prior art.

In a first aspect, the present invention provides a PDLC film processing apparatus comprising: the device comprises a processing platform, a material moving mechanism, a laser cleaning mechanism, a laser cutting mechanism and a control unit, wherein the material moving mechanism, the laser cleaning mechanism and the laser cutting mechanism are all electrically connected with the control unit;

the processing platform is at least provided with a feeding station, a cleaning station and a cutting station along a first direction;

the material moving mechanism is used for driving the PDLC film to move and conveying the PDLC film to the cleaning station or the cutting station;

the laser cleaning mechanism is used for carrying out laser cleaning processing on the PDLC film on the cleaning station according to a set path;

the laser cutting mechanism is used for carrying out laser cutting processing on the PDLC film subjected to laser cleaning processing according to a set path.

Furthermore, the feeding station, the cleaning station and the cutting station are provided with positioning structures for positioning the PDLC film.

Furthermore, the positioning structure comprises a fixed block and a positioning block;

the fixed block is fixedly arranged on the processing platform; the positions of the positioning block and the processing platform are adjustable;

and a positioning space for positioning the PDLC film is formed between the fixed block and the positioning block.

Furthermore, a blanking station is further arranged on the processing platform along the first direction, and the blanking station is positioned on one side, away from the cleaning station, of the cutting station;

the material moving mechanism can convey the PDLC film subjected to laser cutting to the blanking station.

Further, the material moving mechanism comprises a suction assembly and a three-dimensional driving module for driving the suction assembly to move in the XYZ direction.

Further, the first direction is a Y direction.

Furthermore, the three-dimensional driving module comprises a portal frame X shaft, a portal frame Y shaft and a portal frame Z shaft;

the portal frame Y shafts are arranged in two groups and are arranged in parallel, and the portal frame X shaft is erected between the two groups of portal frame Y shafts;

the portal frame Z shaft is erected on the portal frame X shaft;

the suction assembly is fixedly connected to the output end of the Z shaft of the portal frame.

Furthermore, laser wiper mechanism includes galvanometer laser machine, laser cutting positioning mechanism and drives galvanometer laser machine is the first XY module of XY orientation upper movement.

Further, laser cutting mechanism includes Co2 laser machine, laser cleaning positioning mechanism and drives the second XY module of Co2 laser machine motion in XY direction.

Furthermore, the laser cutting positioning mechanism and the laser cleaning positioning mechanism both comprise CCD automatic positioning modules.

Has the advantages that:

according to the PDLC film processing equipment provided by the invention, under the action of the control unit, the control unit can control the movement of the material moving mechanism, the PDLC film at the feeding station is conveyed to the cleaning station, and the laser cleaning mechanism is used for carrying out laser cleaning processing on the PDLC film on the cleaning station according to a set path; similarly, the PDLC film at the cleaning station may be conveyed to a cutting station, and the PDLC film after laser cleaning may be subjected to laser cutting according to a predetermined path by a laser cutting mechanism, thereby obtaining a processed PDLC film.

By the PDLC film processing equipment, the PDLC film can be processed, the participation of workers in the processing process can be reduced, the automation degree is high, the production efficiency is improved, and the labor cost is reduced.

In a second aspect, the present invention provides a processing method using the PDLC film processing apparatus according to any one of the preceding embodiments, including the steps of:

placing a PDLC film on a feeding station;

transferring the PDLC film of the feeding station to a cleaning station;

carrying out laser cleaning processing on the PDLC film of the cleaning station according to a set path;

transferring the PDLC film subjected to laser cleaning processing to a cutting station;

and carrying out laser cutting processing on the PDLC film at the cutting station according to a set path.

Has the advantages that:

the PDLC film processing method provided by the invention adopts the PDLC film processing equipment, wherein the technical advantages and effects achieved by the PDLC film processing method also comprise the technical advantages and effects achieved by the PDLC film processing equipment, and are not repeated herein.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a PDLC film processing apparatus according to an embodiment of the present invention;

fig. 2 is a top view of a PDLC film processing apparatus according to an embodiment of the present invention;

fig. 3 is a front view of a PDLC film processing apparatus according to an embodiment of the present invention.

Icon:

10-a feeding station; 20-a cleaning station; 30-a cutting station;

110-a suction assembly; 121-gantry X axis; 122-gantry Y-axis; 123-gantry Z axis;

210-galvanometer laser; 220-a first XY module;

310-Co2 laser machine; 320-a second XY module;

410-fixed block; 420-positioning block.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

The embodiment provides a PDLC film processing device, as shown in fig. 1 to 3, the PDLC film processing device includes a processing platform, a material moving mechanism, a laser cleaning mechanism, a laser cutting mechanism and a control unit, wherein the material moving mechanism, the laser cleaning mechanism and the laser cutting mechanism are electrically connected to the control unit; the processing platform is at least provided with a feeding station 10, a cleaning station 20 and a cutting station 30 along a first direction; the material moving mechanism is used for driving the PDLC film to move and conveying the PDLC film to the cleaning station 20 or the cutting station 30; the laser cleaning mechanism is used for carrying out laser cleaning processing on the PDLC film on the cleaning station 20 according to a set path; the laser cutting mechanism is used for carrying out laser cutting processing on the PDLC film subjected to the laser cleaning processing according to a set path.

In the PDLC film processing apparatus provided in this embodiment, under the action of the control unit, the control unit may control the material moving mechanism to move, so as to transport the PDLC film at the feeding station 10 to the cleaning station 20, and perform laser cleaning processing on the PDLC film at the cleaning station 20 according to a set path through the laser cleaning mechanism; similarly, the PDLC film at the cleaning station 20 may be conveyed to the cutting station 30, and the PDLC film after the laser cleaning process may be laser-cut according to a predetermined path by the laser cutting mechanism, thereby obtaining a processed PDLC film.

By the PDLC film processing equipment, the PDLC film can be processed, the participation of workers in the processing process can be reduced, the automation degree is high, the production efficiency is improved, and the labor cost is reduced.

It should be noted that the PDLC film processing apparatus of this embodiment is suitable for a processing process of performing laser cleaning processing on a PDLC film first and then performing laser cutting processing, and the processing process is different from an existing processing process, so that a person skilled in the art cannot easily think that the PDLC film processing apparatus of this embodiment is used for processing a PDLC film.

It should be further noted that, in the process of performing laser cleaning processing on the PDLC film, for the PDLC film sequentially including the first PET layer, the first conductive layer, the liquid crystal layer, the second conductive layer, and the second PET layer from top to bottom, it is necessary to pass laser through the first PET layer and the first conductive layer in sequence according to a set path and activate the liquid crystal layer, where the set path can be set reasonably according to the needs of a customer. Further, in the process of performing laser cutting processing on the PDLC film, it is necessary to perform laser cutting on the first PET layer and the first conductive layer according to a predetermined path, separate the cut first PET layer and the first conductive layer from the liquid crystal layer, and clean the activated liquid crystal layer to expose the second conductive layer and form a corresponding electrode for the PDLC film. Similarly, the setting path can be set appropriately according to the needs of the customer.

Further, the feeding station 10, the cleaning station 20 and the cutting station 30 are provided with positioning structures for positioning the PDLC film, so as to ensure the accuracy of laser processing.

In one embodiment of the present application, as shown in fig. 2, the positioning structure includes a fixing block 410 and a positioning block 420; the fixed block 410 is fixedly arranged on the processing platform; the positions of the positioning block 420 and the processing platform are adjustable; a positioning space for positioning the PDLC film is formed between the fixing block 410 and the positioning block 420.

It should be noted that the positioning structure can perform initial positioning on the PDLC film.

In the actual processing process, the corresponding positioning structures of the feeding station 10, the cleaning station 20 and the cutting station 30 are respectively adjusted according to the size of the PDLC film, so that the PDLC film with the set size can be adapted; after the adjustment is completed, when the PDLC film is transferred to the cleaning station 20 or the cutting station 30 through the material transfer mechanism, the direct positioning can be realized.

Further, the processing platform is further provided with a blanking station (not shown in the drawing) along the first direction, and the blanking station is positioned on one side of the cutting station 30 away from the cleaning station 20; the material moving mechanism can convey the PDLC film subjected to laser cutting to a material unloading station.

In this embodiment, the material moving mechanism includes the suction assembly 110 and a three-dimensional driving module for driving the suction assembly 110 to move in XYZ directions.

Wherein the first direction is the Y direction.

Specifically, as shown in fig. 1, the three-dimensional driving module includes a gantry X-axis 121, a gantry Y-axis 122, and a gantry Z-axis 123; the portal frames Y-axis 122 are arranged in two groups and are arranged in parallel, and the portal frame X-axis 121 is erected between the two groups of portal frame Y-axis 122; the gantry Z shaft 123 is erected on the gantry X shaft 121; the suction assembly 110 is fixedly connected to the output end of the gantry Z-axis 123.

In this embodiment, as shown in fig. 1 and fig. 2, the laser cleaning mechanism includes a galvanometer laser 210, a laser cutting positioning mechanism, and a first XY module 220 for driving the galvanometer laser 210 to move in XY directions.

Specifically, the first XY module 220 includes two sets of first X-direction modules and two sets of first Y-direction modules, wherein the first Y-direction modules are arranged in parallel, and the first X-direction modules are erected between the two sets of first Y-direction modules.

In this embodiment, the laser cutting mechanism includes a Co2 laser 310, a laser cleaning and positioning mechanism, and a second XY module 320 for driving the Co2 laser 310 to move in the XY direction.

Specifically, the second XY module 320 includes two sets of second X-direction modules and two sets of second Y-direction modules, wherein the second Y-direction modules are arranged in parallel, and the second X-direction modules are erected between the two sets of second Y-direction modules.

The laser cutting positioning mechanism and the laser cleaning positioning mechanism both comprise a CCD automatic positioning module, and the CCD automatic positioning module can be used for visual positioning, path monitoring and size positioning.

It should be noted that the CCD automatic positioning module can adopt the prior art.

The embodiment also provides a processing method using the PDLC film processing apparatus, which includes the following steps:

placing a PDLC film at a feeding station 10;

the PDLC film of the feeding station 10 is transferred to a cleaning station 20;

performing laser cleaning processing on the PDLC film of the cleaning station 20 according to a set path;

the PDLC film after laser cleaning processing is transferred to a cutting station 30;

the PDLC film at the cutting station 30 is laser cut along a predetermined path.

The PDLC film processing method provided in this embodiment adopts the PDLC film processing apparatus, where the technical advantages and effects achieved by the PDLC film processing method also include the technical advantages and effects achieved by the PDLC film processing apparatus, and are not described herein again.

In addition to the above steps, the PDLC film processing method further includes transferring the laser-cut processed product to a blanking station.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.