阅读说明：本技术 一种半导体激光器的封装结构 (Packaging structure of semiconductor laser ) 是由 戴冰 关彥齐 于广滨 廖新胜 于 2020-06-23 设计创作，主要内容包括：本发明公开了一种半导体激光器的封装结构,包括连接板、封装结构本体、宏观通道冷却液、转动杆、电力元件和安装片,所述连接板的表面开设有容纳槽,且容纳槽的内部左侧焊接固定有复位弹簧,并且容纳槽的内部设置有卡合板,所述连接板的上表面中部设置有封装结构本体,所述封装结构本体的内部下层设置有宏观通道冷却液,所述连接槽的内部焊接固定有固定杆,所述封装结构本体的中层左侧表面设置有过滤网,所述连通槽的上表面活动连接有电力元件。该半导体激光器的封装结构,设置有宏观通道冷却液、固定杆、转动杆、过滤网、电力元件、支撑杆、传动带、转动轴、支撑盘和安装片,可以提高整个装置的散热效果。(The invention discloses a packaging structure of a semiconductor laser, which comprises a connecting plate, a packaging structure body, macroscopic channel cooling liquid, a rotating rod, an electric power element and a mounting piece, wherein the surface of the connecting plate is provided with a containing groove, the left side inside the containing groove is fixedly welded with a return spring, a clamping plate is arranged inside the containing groove, the middle part of the upper surface of the connecting plate is provided with the packaging structure body, the lower layer inside the packaging structure body is provided with the macroscopic channel cooling liquid, the inside of the connecting groove is fixedly welded with a fixing rod, the left side surface of the middle layer of the packaging structure body is provided with a filter screen, and the upper surface of the communicating groove is movably connected with the electric power. This semiconductor laser's packaging structure is provided with macroscopic view passageway coolant liquid, dead lever, dwang, filter screen, electric power component, bracing piece, drive belt, axis of rotation, supporting disk and installation piece, can improve whole device's radiating effect.)

1. The utility model provides a semiconductor laser's packaging structure, includes connecting plate (1), packaging structure body (5), macroscopic channel coolant liquid (8), dwang (10), electric power component (12) and installation piece (17), its characterized in that: the surface of the connecting plate (1) is provided with a containing groove (2), the left side of the inside of the containing groove (2) is fixedly welded with a reset spring (3), the inside of the containing groove (2) is provided with a clamping plate (4), the middle part of the upper surface of the connecting plate (1) is provided with an encapsulation structure body (5), the middle part of the middle layer of the inside of the encapsulation structure body (5) is provided with a communicating groove (6), the edge of the middle layer of the inside of the encapsulation structure body (5) is provided with a connecting groove (7), the lower layer of the inside of the encapsulation structure body (5) is provided with macroscopic channel cooling liquid (8), the inside of the connecting groove (7) is fixedly welded with a fixing rod (9), the tail end of the fixing rod (9) is provided with a rotating rod (10), the left side surface of the middle layer of the encapsulation structure body (5) is provided, the packaging structure comprises a packaging structure body (5), wherein a support rod (13) is fixed on the upper surface of the lower layer of the packaging structure body (5) in a welding mode, a rotating shaft (15) is arranged on the rear side surface of the support rod (13), a support disc (16) is fixed on the outer surface of the rotating shaft (15) in a welding mode, and an installation piece (17) is fixed on the outer surface of the support disc (16) through bolts.

2. A package structure of a semiconductor laser as claimed in claim 1, wherein: the volume of the middle part of the communication groove (6) is equal to that of the power element (12), and the opening diameters of the left end and the right end of the communication groove (6) are smaller than the width of the middle part of the communication groove.

3. A package structure of a semiconductor laser as claimed in claim 1, wherein: the rotating structure is composed of the rotating rod (10) and the fixing rod (9), and two groups of rotating structures are symmetrically arranged on the vertical central axis of the packaging structure body (5).

4. A package structure of a semiconductor laser as claimed in claim 1, wherein: the filter screen (11) and the packaging structure body (5) form a detachable structure, and the filter screen (11) corresponds to the rotating rod (10) one by one.

5. A package structure of a semiconductor laser as claimed in claim 1, wherein: rotating shaft (15) and bracing piece (13) constitute revolution mechanic, and rotating shaft (15) pass through drive belt (14) and constitute integrated structure with dwang (10).

6. A package structure of a semiconductor laser as claimed in claim 1, wherein: the mounting piece (17) is inclined, the mounting piece (17) is fixed on the outer surface of the supporting disc (16) through bolts with equal angles, the clamping plate (4) forms an elastic structure with the connecting plate (1) through the reset spring (3), the clamping plate (4) forms a sliding structure with the connecting plate (1) through the accommodating groove (2), and the right side surface of the clamping plate (4) is inclined.

7. A package structure of a semiconductor laser as claimed in claim 1, wherein: the working principle of the packaging structure is as follows: when the packaging structure of the semiconductor laser is used, when the packaging structure body (5) needs to be installed, the packaging structure body (5) is placed above the clamping plate (4), then the packaging structure body (5) is pressed downwards, then the clamping plate (4) slides in the accommodating groove (2), so that the reset spring (3) is compressed, under the effect that the reset spring (3) restores to deform, the clamping plate (4) can tightly fix the packaging structure body (5), the installation and fixing efficiency of the packaging structure body (5) is improved, when a large amount of heat is generated during the work of the power element (12), heat is exchanged when the macroscopic channel cooling liquid (8) flows, because the installation sheet (17) is inclined, and the installation sheet (17) is fixed on the outer surface of the support sheet (16) through bolts with equal angles, the flow of the macroscopic channel cooling liquid (8) enables the installation sheet (17) to drive the support sheet (16) and the rotating shaft (15) to be located on the support sheet (16) and the rotating shaft (15) The supporting rod (13) rotates, so that the driving belt (14) drives the rotating rod (10) to rotate, the fan on the rotating rod (10) starts to suck air, and because the opening diameters of the left end and the right end of the communicating groove (6) are smaller than the width of the middle part of the communicating groove, heat generated by the electric power element (12) is transmitted to the outside of the packaging structure body (5) through the communicating groove (6) in an accelerating mode, the heat dissipation effect of the whole device is improved, the whole device can work more safely, and the semiconductor laser packaging structure works based on the working principle.

Technical Field

The invention relates to the technical field of semiconductor lasers, in particular to a packaging structure of a semiconductor laser.

Background

With the development of science and technology, people research laser more and more deeply, a semiconductor laser is invented, the application range is wider and wider due to the excellent performance of the semiconductor laser, and the quality of the semiconductor laser is good or bad, wherein an important part is the packaging structure of the semiconductor laser.

The existing packaging structures of some semiconductor lasers;

firstly, the heat dissipation effect is not good, the packaging structure of some existing semiconductor lasers cools the packaging structure through the flowing of microscopic or macroscopic channel cooling liquid, and the whole device is electrified in the operation process, so that the cooling liquid in the channel is easy to ionize impurities, the cooling channel of the whole device is easy to block, the heat dissipation of the whole device is influenced, and meanwhile, the heat dissipation is only carried out through the cooling liquid, the heat dissipation means is single, and the heat dissipation effect is not good when the whole device works;

secondly, be not convenient for the installation fixed, current some semiconductor laser's packaging structure when the installation, need aim at the screw on the connecting plate with packaging structure, then use the bolt to screw up, the installation fixed time that leads to whole device is longer to the staff of not being convenient for carries out fixed mounting to the packaging structure body.

We propose a package structure of a semiconductor laser in order to solve the problems proposed in the above.

Disclosure of Invention

The present invention is directed to a package structure of a semiconductor laser, so as to solve the problems of the prior art that the package structure of the semiconductor laser in the market has a poor heat dissipation effect and is inconvenient to mount and fix.

In order to achieve the purpose, the invention provides the following technical scheme: a packaging structure of a semiconductor laser comprises a connecting plate, a packaging structure body, macroscopic channel cooling liquid, a rotating rod, an electric element and a mounting plate, wherein a containing groove is formed in the surface of the connecting plate, a reset spring is fixedly welded on the left side inside the containing groove, a clamping plate is arranged inside the containing groove, the packaging structure body is arranged in the middle of the upper surface of the connecting plate, a communicating groove is formed in the middle of the middle layer inside the packaging structure body, a connecting groove is formed in the edge of the middle layer inside the packaging structure body, the macroscopic channel cooling liquid is arranged on the lower layer inside the packaging structure body, a fixing rod is fixedly welded inside the connecting groove, the rotating rod is arranged at the tail end of the fixing rod, a filter screen is arranged on the left side surface of the middle layer of the packaging structure body, the electric element is movably connected with the upper surface of the communicating groove, and the rear side surface of the supporting rod is provided with a rotating shaft, the outer surface of the rotating shaft is fixedly welded with a supporting disk, and an installation sheet is fixed on the outer surface of the supporting disk through bolts.

Preferably, the volume of the middle part of the communication groove is equal to the volume of the power element, and the opening diameters of the left end and the right end of the communication groove are smaller than the width of the middle part of the communication groove.

Preferably, the rotating rod and the fixing rod form a rotating structure, and the rotating structure is symmetrically provided with two groups about a vertical central axis of the packaging structure body.

Preferably, the filter screen and the packaging structure body form a detachable structure, and the filter screen and the rotating rod correspond to each other one by one.

Preferably, the rotating structure is composed of the rotating shaft and the supporting rod, and the rotating shaft and the rotating rod form an integrated structure through a transmission belt.

Preferably, the mounting plate is inclined, the mounting plate is fixed on the outer surface of the support plate through bolts with equal angles, the clamping plate and the connecting plate form an elastic structure through a return spring, the clamping plate and the connecting plate form a sliding structure through an accommodating groove, and the right side surface of the clamping plate is inclined.

Compared with the prior art, the invention has the beneficial effects that:

the packaging structure of the semiconductor laser is provided with a clamping plate, a containing groove and a reset spring, when the packaging structure body needs to be installed, the packaging structure body is placed above the clamping plate, then the packaging structure body is pressed downwards, then the clamping plate slides in the containing groove, so that the reset spring is compressed, and then the clamping plate can tightly fix the packaging structure body under the action of the reset spring restoring deformation, so that the installation and fixation efficiency of the packaging structure body is improved, and meanwhile, the workload of workers is reduced;

two, this semiconductor laser's packaging structure is provided with macroscopic channel coolant liquid, the dead lever, the dwang, the filter screen, electric power component, the bracing piece, the drive belt, the axis of rotation, supporting disk and installation piece, when electric power component work produced a large amount of heats, macroscopic channel coolant liquid flows exchanges the heat, the flow of coolant liquid makes the installation piece drive supporting disk and axis of rotation rotate on the bracing piece simultaneously, thereby make the drive belt drive the dwang and rotate, the breathing in of fan on the dwang under, the heat that makes electric power component produce is transmitted the packaging structure originally externally with higher speed through the intercommunication groove, then the radiating effect of whole device has been improved, can make the safer work of whole device.

Drawings

FIG. 1 is a schematic cross-sectional structural view of the present invention;

FIG. 2 is a schematic top view of the mounting plate of the present invention;

FIG. 3 is a schematic view of the structure of FIG. 1 at A according to the present invention;

FIG. 4 is a schematic view of the structure of FIG. 1 at B according to the present invention;

fig. 5 is a schematic view of a connecting structure of a rotating shaft, a supporting disk and a mounting plate in the present invention.

In the figure: 1. a connecting plate; 2. accommodating grooves; 3. a return spring; 4. a clamping plate; 5. a package structure body; 6. a communicating groove; 7. connecting grooves; 8. a macro-channel coolant; 9. fixing the rod; 10. rotating the rod; 11. a filter screen; 12. a power element; 13. a support bar; 14. a transmission belt; 15. a rotating shaft; 16. a support disc; 17. and (7) mounting the sheet.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a packaging structure of a semiconductor laser comprises a connecting plate 1, a containing groove 2, a reset spring 3, a clamping plate 4, a packaging structure body 5, a communicating groove 6, a connecting groove 7, macroscopic channel cooling liquid 8, a fixed rod 9, a rotating rod 10, a filter screen 11, an electric element 12, a supporting rod 13, a driving belt 14, a rotating shaft 15, a supporting plate 16 and a mounting sheet 17, wherein the surface of the connecting plate 1 is provided with the containing groove 2, the left side of the inside of the containing groove 2 is welded and fixed with the reset spring 3, the inside of the containing groove 2 is provided with the clamping plate 4, the middle part of the upper surface of the connecting plate 1 is provided with the packaging structure body 5, the middle part of the middle layer of the inside of the packaging structure body 5 is provided with the communicating groove 6, the edge of the middle layer of the inside of the packaging structure body 5 is provided with the connecting groove 7, and dead lever 9 end is provided with dwang 10, and packaging structure body 5's middle level left surface is provided with filter screen 11, and the upper surface swing joint of intercommunication groove 6 has electric power component 12, and the inside upper surface welded fastening of lower floor of packaging structure body 5 has bracing piece 13, and the rear side surface of bracing piece 13 is provided with axis of rotation 15, and the surface welded fastening of axis of rotation 15 has supporting disk 16, and the surface bolted fastening of supporting disk 16 has mounting plate 17.

The volume of the middle part of the communicating groove 6 is equal to that of the power element 12, and the opening diameters of the left end and the right end of the communicating groove 6 are smaller than the width of the middle part of the communicating groove, so that heat can pass through the communicating groove 6 at an accelerated speed, and the heat dissipation effect of the whole device can be better.

The rotating rod 10 and the fixing rod 9 form a rotating structure, and the rotating structure is symmetrically provided with two groups about a vertical central axis of the packaging structure body 5, so that heat can be dissipated actively, and the safety of the whole device during operation is protected.

The filter screen 11 and the packaging structure body 5 form a detachable structure, and the filter screen 11 and the rotating rod 10 are in one-to-one correspondence, so that interference of dust to the packaging structure body 5 can be reduced.

The rotation axis 15 and the support rod 13 form a rotation structure, and the rotation axis 15 and the rotation rod 10 form an integrated structure through the transmission belt 14, which can drive the rotation rod 10 to rotate, so that the whole device does not need to consume too much energy when actively dissipating heat.

The installation piece 17 is the slope form, and the equal angle bolt fastening of installation piece 17 is at the surface of supporting disk 16, and the block board 4 passes through reset spring 3 and constitutes elastic construction with connecting plate 1, and the block board 4 passes through holding tank 2 and constitutes sliding construction with connecting plate 1 to the right side surface of block board 4 is the slope form, can make packaging structure body 5 can be quick fixed to the installation effectiveness of whole device has been improved.

The working principle is as follows: when the packaging structure of the semiconductor laser is used, firstly, as shown in fig. 1 and 3, when the packaging structure body 5 needs to be installed, the packaging structure body 5 is placed above the clamping plate 4, then the packaging structure body 5 is pressed downwards, and then the clamping plate 4 slides in the accommodating groove 2, so that the return spring 3 is compressed, and further the clamping plate 4 can tightly fix the packaging structure body 5 under the action of the return spring 3 recovering deformation, so that the installation and fixation efficiency of the packaging structure body 5 is improved, and the workload of workers is reduced;

according to fig. 1-2 and fig. 4-5, when the power element 12 generates a large amount of heat during operation, the macroscopic channel cooling liquid 8 flows to exchange heat, because the mounting plate 17 is inclined, and the mounting plate 17 is bolted on the outer surface of the supporting plate 16 at equal angles, so that the flow of the macroscopic channel cooling liquid 8 causes the mounting plate 17 to drive the supporting plate 16 and the rotating shaft 15 to rotate on the supporting rod 13, so that the driving belt 14 drives the rotating rod 10 to rotate, and the fan starts to suck air on the rotating rod 10, because the opening diameters of the left end and the right end of the communication groove 6 are smaller than the width of the middle part, the heat generated by the power element 12 is accelerated and transmitted to the outside of the package structure body 5 through the communication groove 6, thereby improving the heat dissipation effect of the whole device, enabling the whole device to operate more safely, which is the operating principle of the package structure of the semiconductor laser, and those not described in detail in this specification are well within the skill of those in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.