Method for manufacturing continuous sheet for circuit board production and continuous sheet for circuit board production manufactured thereby
阅读说明：本技术 用于电路板生产的连续片的制造方法以及由其制造的用于电路板生产的连续片 (Method for manufacturing continuous sheet for circuit board production and continuous sheet for circuit board production manufactured thereby ) 是由 吴亨锡 郑光熙 金哲永 金志协 于 2019-10-01 设计创作，主要内容包括：本发明涉及具有改善的机械特性并且满足优异的耐化学性的用于电路板生产的连续片的制造方法,以及由其制造的用于电路板生产的连续片。更具体地,根据本发明,通过使用增强膜和施加有导电性的粘合基底将至少两个或更多个片型金属层合体连接,可以在没有压带机的情况下在辊对辊连续过程中提供卷轴型层合体,并且提供了具有优异的耐化学性和生产率以及增强的机械特性的用于电路板生产的连续片的制造方法以及由其制造的用于电路板生产的连续片。(The present invention relates to a method for manufacturing a continuous sheet for circuit board production having improved mechanical properties and satisfying excellent chemical resistance, and a continuous sheet for circuit board production manufactured thereby. More specifically, according to the present invention, by connecting at least two or more sheet-type metal laminates using a reinforcing film and an adhesive substrate applied with conductivity, it is possible to provide a reel-type laminate in a roll-to-roll continuous process without a belt press, and to provide a method for manufacturing a continuous sheet for circuit board production having excellent chemical resistance and productivity and enhanced mechanical properties, and a continuous sheet for circuit board production manufactured thereby.)
1. A method of manufacturing a continuous sheet for circuit board production, comprising the steps of:
in a state where at least two or more sheet-type metal laminated bodies are arranged in parallel and contacted in the direction of the metal foil,
the adhesive substrate is wound one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other.
2. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein
The step of winding the adhesive substrate by one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate comprises
A step of winding one type of the adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate body for 1.5 turns to 2.5 turns.
3. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein
The step of winding the adhesive substrate by one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate comprises
A step of winding the first adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate by 0.5 to 1.5 turns; and
a step of winding a second adhesive substrate for 0.5 to 1.5 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate after the first adhesive substrate.
4. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein
The adhesive substrate comprises at least one of:
1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or
2) A conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
5. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein
The conductor layer has a thickness of 7 to 35 μm, and includes a Cu foil, a SUS foil, or an aluminum foil.
6. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein
The reinforcing film layer has a thickness of 5 μm to 25 μm and comprises one or more polymer resins selected from the group consisting of: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, and polyphenylene sulfide.
7. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein
The adhesive layer has a thickness of 1 μm to 10 μm, and is formed using a varnish including an adhesive resin and a conductive powder in a weight ratio of 1:0.005 to 1: 0.015.
8. The manufacturing method of a continuous sheet for circuit board production according to claim 7, wherein
The conductive powder includes one or more selected from copper, aluminum, nickel, silver, and iron.
9. The manufacturing method of a continuous sheet for circuit board production according to claim 7, wherein
The binder resin includes one or more selected from the group consisting of: polyimide-based resins, epoxy-based resins, acrylic-based resins, phenoxy-based resins, and polyisocyanate-based resins having a weight average molecular weight of 33000g/mol to 38000 g/mol.
10. The manufacturing method of a continuous sheet for circuit board production according to claim 1,
further comprising the step of forming a metal layer on an outermost portion of the adhesive substrate.
11. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein
The sheet-type metal laminate is manufactured by a method comprising:
a step of producing a prepreg by impregnating the fabric base into a thermosetting resin varnish and then semi-curing it,
a step of laminating one or more of the prepregs, and
a step of laminating a metal foil on one or both sides of the prepreg, followed by heating and pressing.
12. The manufacturing method of a continuous sheet for circuit board production according to claim 1,
further comprising the step of winding at least two or more sheet-type metal laminates connected by the adhesive substrate in a horizontal direction via a guiding means.
13. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein
Prior to the step of winding the adhesive substrate one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate,
the method comprises the following steps:
a step of providing the adhesive substrate;
a step of providing at least two or more sheet-type metal laminates cut into a predetermined size; and
a step of horizontally and parallelly placing at least two or more sheet-type metal laminates so as to be in contact with each other.
14. A continuous sheet for circuit board production, wherein
At least two or more sheet-type metal laminated bodies are arranged in parallel and in contact in the direction of the metal foil, and
the continuous sheet is formed by winding the adhesive substrate for one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other.
15. The continuous sheet for circuit board production as claimed in claim 14, wherein
Two or more adhesive base layers are formed on the upper surface and the lower surface of the sheet-type metal laminate.
Technical Field
Cross Reference to Related Applications
This application claims priority or benefit to korean patent application No. 10-2018-0118512, filed on 4.10.2018 from the korean intellectual property office, the disclosure of which is incorporated herein by reference in its entirety.
The present invention relates to a method of manufacturing a continuous sheet for circuit board production and a continuous sheet for circuit board production manufactured thereby, and more particularly, to a method of manufacturing a continuous sheet for circuit board production and a continuous sheet for circuit board production manufactured thereby, which have improved running properties and excellent chemical resistance and mechanical properties relative to a conventional copper foil lamination process applied only to a sheet type, by providing a copper clad laminate (hereinafter, CCL) for manufacturing a roll-to-roll (hereinafter, RTR) process and an adhesive substrate required for manufacturing a roll CLL.
Background
A metal laminate such as a conventional copper clad laminate (hereinafter, referred to as CCL) used for circuit board production is generally manufactured by the following two methods.
The first is a method of manufacturing a chip-type CCL using impregnation and pressing. In addition, the second method is a method of manufacturing a CCL in a reel type using a belt press.
The first method has a problem in that it is not a continuous process during the manufacture of a Printed Circuit Board (PCB), and thus productivity is reduced.
In addition, although the reel-type CCL manufactured by the second method requires a belt press, there is a disadvantage in that the initial input cost is high for installing the belt press.
Therefore, it is required to develop a new method capable of manufacturing a metal laminate for circuit board production in an inexpensive manner while ensuring productivity and basic mechanical characteristics.
Disclosure of Invention
Technical problem
An object of the present invention is to provide a manufacturing method of a continuous sheet for circuit board production, which can provide a reel-type end product through a roll-to-roll continuous process even without a belt press by connecting at least two or more sheet-type metal laminates using a conductive adhesive substrate and then moving them.
Another object of the present invention is to provide a roll-type CCL for circuit board production, obtained according to the above-mentioned method, having improved mechanical properties as well as excellent chemical resistance and productivity.
Technical scheme
In one aspect of the present invention, there is provided a method of manufacturing a continuous sheet for circuit board production, the method comprising the steps of: the adhesive substrate is wound one or more turns along the periphery of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other in a state where at least two or more sheet-type metal laminated bodies are arranged in parallel and in contact in the direction of the metal foil.
In another aspect of the present invention, there is provided a continuous sheet for circuit board production, wherein at least two or more sheet-type metal laminated bodies are arranged in parallel and in contact in the direction of metal foil, and the continuous sheet is formed of a substrate wound by one or more turns along the periphery of the adhesion surfaces of the sheet-type metal laminated bodies adjacent to each other.
Hereinafter, a method of manufacturing a continuous sheet for circuit board production according to a specific embodiment of the present invention, and a continuous sheet for circuit board production manufactured thereby will be described in more detail.
Unless otherwise indicated throughout this specification, the technical terms used herein are used only to describe specific embodiments and are not intended to limit the present invention.
The singular is intended to include the plural unless the context clearly dictates otherwise.
The terms "comprises" or "comprising," as used herein, specify the presence of stated features, regions, integers, steps, actions, elements, and/or components, but do not preclude the presence or addition of different specified features, regions, integers, steps, actions, elements, components, and/or groups thereof.
Terms including ordinals such as "first," "second," etc., are used for the purpose of distinguishing one component from another, and are not limited by the ordinal number. For example, a first component could be termed a second component, or, similarly, a second component could be termed a first component, without departing from the scope of the present invention.
As used herein, the weight average molecular weight refers to a weight average molecular weight in terms of polystyrene measured by a GPC method. In measuring the weight average molecular weight in terms of polystyrene measured by the GPC method, a detector and an analytical column such as a known analytical apparatus and a differential refractive index detector may be used, and the usual temperature conditions, solvents and flow rates may be used. Specific examples of the measurement conditions are as follows: using a Waters PL-GPC220 instrument equipped with Polymer Laboratories PLgel MIX-B,300mm column, the evaluation temperature was 160 ℃, 1,2, 4-trichlorobenzene was used as a solvent at a flow rate of 1 mL/min, samples were prepared at a concentration of 10mg/10mL and then supplied in an amount of 200. mu.L, and the value of Mw could be determined using a calibration curve formed from polystyrene standards. Polystyrene standards have a molecular weight of 2000/10000/30000/70000/200000/700000/2000000/4000000/10000000 of 9.
In the present specification, the term "circle" refers to a unit that counts the number of times of rotating around the circumference of the surface of the object and returning to a predetermined position with the shortest distance. For example, one turn means to rotate around the circumference from a point on the object surface and return to the predetermined position once by the shortest distance, 0.5 turn means to rotate half of the circumference from a point on the object surface, and 1.5 turn means to rotate around the circumference from a point on the object surface, pass through the starting point, and further rotate only half of the circumference.
In a more specific example, when the object has a rectangular parallelepiped shape, 0.5 turns from the edge of the lower surface and one side surface means that starting from the edge of the lower surface and one side surface, passing through the lower surface and rotating and turning upward to the edge of the other side surface and the upper surface. The 1.5-turn from the edge of the lower surface and the one side surface means that starting with the edge of the lower surface and the one side surface as a starting point, the lower surface, the other side surface, the upper surface, and the one side surface are rotated and rotated, pass through the starting point, and then pass through the lower surface again and are rotated and rotated up to the edge of the other side surface and the upper surface.
In particular, in the present specification, when the object has a rectangular parallelepiped shape, 0.25 turns from the edge of the lower surface and one side surface means that starting from the edge of the lower surface and one side surface, passing through the lower surface and rotating and turning upward to the edge of the other side surface and the lower surface. The 0.75 turn from the edge of the lower surface and the one side surface means that starting from the edge of the lower surface and the one side surface, passing through the lower surface and the other side surface, and rotating and turning upward to the edge of the one side surface and the upper surface.
In this specification, "°" means a unit of angle. In this specification, the angle means a degree in which a straight line connecting the starting point from the center of gravity of the object and a straight line connecting the arrival point from the center of gravity of the object have a gap. Specifically, a value obtained by equally dividing the circumference of a circle into 360 parts from the center of the circle is represented by 1 °. For example, when the object has a rectangular parallelepiped shape, the center of gravity means an intersection of two diagonal lines having the longest distance.
The present invention relates to the manufacture of a roll-type CCL for use in a roll-to-roll (hereinafter RTR) process and the manufacture of an adhesive substrate required for the manufacture of the roll-type CCL. Specifically, according to the present invention, there is provided a method of manufacturing a roll CCL for circuit board production, which has excellent operational performance with respect to a general sheet CCL process, and has excellent chemical resistance and mechanical properties such that no crack occurs during a circuit generating process.
Further, the present invention provides a method of manufacturing a continuous sheet for reel-type circuit board production using a continuous roll-to-roll process even in the case of using a belt press as in the prior art. For this reason, the present invention includes a process of connecting existing sheet-type metal laminates by using an adhesive substrate imparted with electrical conductivity and containing a reinforcing film. In other words, the present invention uses the sheet type CCL, but connects them with an adhesive film to be applied to a roll-to-roll process.
Thus, the present invention can solve the problem of breakage during operation in a roll-to-roll process and improve the mechanical properties of the final product.
Next, the production of an adhesive substrate for an adhesive sheet-type CCL, a method for producing a continuous sheet for circuit board production using the adhesive substrate, and a continuous sheet for circuit board production produced therefrom will be described below.
Method for manufacturing continuous sheet for circuit board production
According to one embodiment of the present invention, there may be provided a method of manufacturing a continuous sheet for circuit board production, the method comprising the steps of: the adhesive substrate is wound one or more turns along the periphery of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other in a state where at least two or more sheet-type metal laminated bodies are arranged in parallel and in contact in the direction of the metal foil.
As a result of further continuing studies, the present inventors have found a structure in which: which can effectively prevent liquid penetration at the edge of an adhesive surface, which may occur in a wet step of a PCB process in a manufacturing method of a continuous sheet for circuit board production, and thus it has been found through experiments that a manufacturing method of a roll-type CCL for circuit board production having excellent chemical resistance and mechanical properties can be provided. The present invention has been completed based on these findings.
Specifically, the step of winding the adhesive substrate one or more times along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may include the step of winding one type of adhesive substrate 1.5 to 2.5 times along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate.
Further, the step of winding the adhesive substrate by one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may include the step of winding the first adhesive substrate by 0.5 to 1.5 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate; and a step of winding the second adhesive substrate for 0.5 to 1.5 turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other after the first adhesive substrate.
Further, a step of providing an adhesive substrate may be included before the step of winding the adhesive substrate one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other; a step of providing at least two or more sheet-type metal laminates cut into a predetermined size; and a step of horizontally and parallelly placing at least two or more sheet-type metal laminates so as to be in contact with each other.
Hereinafter, a manufacturing method of a continuous sheet produced from a circuit board according to the present invention will be described in detail for each step.
Bonding sheet-type metal laminate using bonding substrate
The manufacturing method of the continuous sheet for circuit board production according to the present invention may include the steps of: the adhesive substrate is wound one or more turns along the periphery of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other in a state where at least two or more sheet-type metal laminated bodies are arranged in parallel and in contact in the direction of the metal foil.
Specifically, since the sheet-type metal laminate has a rectangular parallelepiped shape, the step of winding the adhesive substrate one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may mean a step of winding the sheet-type metal laminate while folding the adhesive substrate at the edge portion of the sheet-type metal laminate.
In the above method, the step of winding the adhesive substrate one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other means a step of starting with the edge of the lower surface and one side surface of the sheet-type metal laminate as a starting point, turning around the periphery while rotating toward the surface of the lower surface, and winding up to the starting point.
According to an embodiment of the present invention, the step of winding the adhesive substrate for one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may include the step of winding one type of adhesive substrate for 1.5 to 2.5 turns or 1.75 to 2.25 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate.
The step of winding one type of adhesive substrate 1.5 to 2.5 turns or 1.75 to 2.25 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may include the step of winding one type of adhesive substrate 540 ° to 900 °, or 630 ° to 810 ° along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate.
Further, the step of winding one type of the adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate of 1.5 to 2.5 turns or 1.75 to 2.25 turns means a step of winding one type of the adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate, starting with the edge of the lower surface and one side surface of the sheet-type metal laminate as a starting point, turning and winding around the periphery while rotating toward the lower surface.
That is, the step of winding one type of the adhesive substrate along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other for 1.5 turns to 2.5 turns may mean the steps of: starting with the edge of the lower surface and one side surface of the sheet-type metal laminate as a starting point, rotating around the periphery while rotating toward the lower surface, passing the starting point, setting the edge of the upper surface and the other side surface as an arrival point, and starting with the edge of the lower surface and one side surface as a starting point, rotating around the periphery while rotating toward the lower surface, passing the starting point twice, and then winding up again to the arrival point of the edge of the upper surface and the other side surface.
In addition, the step of winding one type of the adhesive substrate along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other for 1.75 turns to 2.25 turns may mean the steps of: starting with the edge of the lower surface and one side surface of the sheet-type metal laminate as a starting point, rotating around the periphery while rotating toward the lower surface, passing the starting point, setting the edge of the upper surface and one side surface as an arrival point, and starting with the edge of the lower surface and one side surface as a starting point, rotating around the periphery while rotating toward the surface of the lower surface, passing the starting point twice, and winding up to an arrival point that is the edge of the lower surface and the other side surface.
According to an embodiment of the present invention, the step of winding the adhesive substrate for one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other may comprise the steps of: a step of winding the first adhesive substrate along the periphery of the adhesive surfaces of the sheet-type metal laminates adjacent to each other for 0.5 to 1.5 turns or 0.75 to 1.25 turns; and a step of winding the second adhesive substrate for 0.5 to 1.5 turns or 0.75 to 1.25 turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other after the first adhesive substrate.
A step of winding the first adhesive substrate along the periphery of the adhesive surfaces of the sheet-type metal laminates adjacent to each other for 0.5 to 1.5 turns or 0.75 to 1.25 turns; and after the first adhesive substrate, the step of winding the second adhesive substrate 0.5 to 1.5 turns or 0.75 to 1.25 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may mean the step of winding the first adhesive substrate at 180 ° to 540 °, or 270 ° to 450 ° along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate; and a step of winding, after the first adhesive substrate, a second adhesive substrate at 180 ° to 540 °, or 270 ° to 450 ° along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other.
The step of winding the first adhesive substrate 0.5 to 1.5 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may mean a step of winding the first adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate, starting with the edge of the lower surface and one side surface of the sheet-type metal laminate as a starting point, and turning around the periphery while rotating toward the surface of the lower surface.
The step of winding the first adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate of 0.5 to 1.5 turns may mean a step of winding the first adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate, starting with the edges of the lower surface and one side surface of the sheet-type metal laminate as starting points, rotating around the periphery while rotating toward the lower surface, setting the edges of the upper surface and the other side surface as arrival points, and starting with the edges of the lower surface and one side surface as starting points, rotating around the periphery while rotating toward the lower surface, passing through the starting points, and then winding up to the arrival points which are the edges of the upper surface and the other side surface.
On the other hand, after the step of winding the first adhesive substrate for 0.5 to 1.5 turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other, a step of cutting the non-adhesive portion of the first adhesive substrate may be further included.
In the step of winding the second adhesive substrate along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other for 0.5 to 1.5 turns after the first adhesive substrate, winding the second adhesive substrate after the first adhesive substrate means starting with the cut surface of the first adhesive substrate as a starting point at the step of cutting the non-adhesive portion of the first adhesive substrate and adhering the second adhesive substrate.
The method of manufacturing a continuous sheet for circuit board production according to the present invention may further include the step of forming a metal layer on the outermost portion of the adhesive substrate.
In the method of applying the metal layer, after the application of the adhesive substrate is completed, a method of winding the metal layer having a predetermined thickness and width on the entire outer surface of the adhesive substrate may be applied.
Also, optionally, in the steps of manufacturing the first adhesive substrate and the second adhesive substrate, a method of laminating a metal layer having a predetermined thickness and width on the outermost layer may be performed. As an example, after further including a metal layer in the outermost layer of the second part of the first adhesive substrate, it may be used for adhesion. Further, after including the metal layer in the entire outermost surface layer of the second adhesive substrate, it may be used for adhesion.
The metal layer may include one or more selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), and iron (Fe). Further, the thickness of the metal layer may be 0.1 μm to 50 μm.
Further, the method of manufacturing a continuous sheet for circuit board production according to the present invention may further include the steps of: at least two or more sheet-type metal laminated bodies connected by the adhesive substrate are wound in a horizontal direction via a guide device.
After the adhesive substrate is provided by the above-described method, when the adhesive substrate is applied to both sides of a portion in which at least two or more sheet-type metal laminates are in contact, they can be easily adhered. Since the thus-bonded material can be wound using a guide, a continuous sheet for circuit board production having excellent mechanical properties and chemical resistance can be easily provided.
As an example, fig. 3 shows an example in which an adhesive substrate is applied to a sheet-type metal laminate. As shown in fig. 3, at least two or more sheet-
At this time, since at least two or more sheet-
Further, as shown in fig. 3, when undergoing the above-described process, at least two or more sheet-
Further, the bonding portions of the at least two or more sheet-type metal laminated bodies may perform bonding between the sheet-type metal laminated body and the bonding substrate via heating by applying a pressing device to the bonding substrate.
For example, a final continuous sheet for circuit board production may be provided by: the sheet-type metal laminate is cut on a flattening device and placed in parallel, an adhesive substrate is applied to both side surfaces of the sheet-type metal laminate, the sheet-type metal laminate and the adhesive substrate are pressed by using a press to make a long film form, and then the film is wound.
In the present invention, the step of winding the adhesive substrate by one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other may include a temporary adhesion step and a main adhesion step. By the temporary bonding step and the main bonding step, high bonding force between the bonding substrate and the sheet-type metal laminate can be ensured.
That is, the step of winding the adhesive substrate one or more times along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate may include a step of winding the adhesive substrate along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate, a step of temporarily adhering the adhesive substrate, and a step of mainly adhering the adhesive substrate, and the order and the number of repetitions of these steps are not limited.
Specifically, in the temporary bonding step, application of 0.1kgf/cm may be used2To 10kgf/cm2And more preferably, the pressing may be performed in a high temperature state. Specifically, the pressing in the temporary bonding step may be performed at 100 ℃ to 150 ℃, 100 ℃ to 130 ℃, or 100 ℃ to 120 ℃.
Specifically, for example, the temporary bonding step includes a step of disposing a bonding substrate on one side of a portion in which the sheet-type metal laminate is in contact; and a step of pressing the sheet-type metal laminate in a direction in which the substrates are bonded. The step of arranging the adhesive substrate on one side of the portion in which the sheet-type metal laminated bodies are in contact may be carried out as part of the step of winding the adhesive substrate along the periphery of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other. That is, when the adhesive substrate is wound along the periphery of one side of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other, the adhesive substrate may be arranged on one surface of the portion where the sheet-type metal laminated bodies are in contact.
More specifically, in the step of winding the adhesive substrate along the periphery of the adhesive surface of the sheet-type metal laminated bodies adjacent to each other, the above adhesive substrate may be arranged on the lower surface of the portion where the sheet-type metal laminated bodies are in contact. After the temporary bonding on the lower surface of the sheet-type metal laminate, additional temporary bonding may be performed on the upper surface of the sheet-type metal laminate or optionally on the side surface while continuously winding the remaining unbonded bonding substrate along the periphery of the surface of the sheet-type metal laminate.
By this process, the adhesive substrate of the present invention can be wound around the entire surface of the portion in which at least two or more sheet-type metal laminates are in contact, thereby performing temporary adhesion.
When only one type of adhesive substrate is used, the temporary bonding step may include the steps of: one type of adhesive substrate is positioned to the lower surface of the portion where the sheet-type metal laminated bodies are in contact, then pressed at the lower surface of the sheet-type metal laminated body, wound one turn along the periphery of all the adhesive surfaces of the sheet-type metal laminated bodies adjacent to each other, then pressed at the upper surface, further wound one turn, and pressed again at the lower surface and the upper surface.
As a specific example, a first adhesive substrate is vertically placed on a temporary adhesive heating line, and then a CCL cut to 340mm × 1030mm (or 1250mm) with an insulating layer thickness of 100 μm is moved parallel to the temporary adhesive heating line to a width of 5mm so that an adhesive surface between the CCLs is placed on an adhesive layer of the first adhesive substrate and then fixed. Then, an opening portion of one end of the first adhesive substrate is cut parallel to the CCL surface.
At a temperature of 110 ℃ and 2kgf/cm2Temporarily bonding the lower surface of the CCL and the first bonding substrate for 2.5 seconds to 5 seconds under the pressure of (1). Then, along all the bonding surfaces between the CCLs (with the lower part of the CCL bonding surface->Side surface->Upper part->Order of sides) wraps the unbonded remaining first adhesive substrate around one turn and temporarily bonds the CCL upper surface and the first adhesive substrate in the same manner.
Subsequently, when the first adhesive substrate is further wound around on the first adhesive substrate along the periphery of all adhesive surfaces between the CCLs (in the order of lower- > side- > upper- > side of the CCL adhesive surfaces), the first adhesive substrate is temporarily adhered at the lower surface of the CCL in the same manner, and even at the upper surface of the CCL in the same manner. Then, the opening portion of the first adhesive substrate was cut parallel to the CCL surface.
Alternatively, when two types of adhesive substrates are used, the temporary bonding step may include the steps of: the first adhesive substrate is positioned to the lower surface of the portion where the sheet-type metal laminate is in contact, then pressed at the lower surface of the sheet-type metal laminate, wound 0.5 to 1.5 turns along the periphery of all the adhesive surfaces of the sheet-type metal laminate adjacent to each other, then pressed at the upper surface, then cut, further wound again, wound again on the first adhesive substrate, and then pressed again at the lower surface portion and the upper surface portion.
As a specific example, a first adhesive substrate is vertically placed on a temporary adhesive heating line, and then a CCL cut to 340mm × 1030mm (or 1250mm) with an insulating layer thickness of 100 μm is moved parallel to the temporary adhesive heating line to a width of 5mm so that an adhesive surface between the CCLs is placed on an adhesive layer of the first adhesive substrate and then fixed. Then, an opening portion at one end of the first adhesive substrate is cut parallel to the CCL surface.
At a temperature of 110 ℃ and 2kgf/cm2Temporarily bonding the lower surface of the CCL and the first bonding substrate for 2.5 seconds to 5 seconds under the pressure of (1). Then, along all the bonding surfaces between the CCLs (with the lower part of the CCL bonding surface->Side surface->Upper part->Order of sides) wraps the unbonded remaining first adhesive substrate 0.9 turns and temporarily bonds the CCL upper surface and the first adhesive substrate in the same manner. The first adhesive substrate is then cut at the side surfaces of the CCL.
Subsequently, when the second adhesive substrate is further wound one turn on the first adhesive substrate along the periphery of the adhesive surfaces between the CCLs (in the order of lower- > side- > upper- > side of the CCL adhesive surfaces), the second adhesive substrate is temporarily adhered at the lower surface of the CCL in the same manner, and even at the upper surface of the CCL in the same manner. Then, the opening portion of the second adhesive substrate was cut parallel to the CCL surface.
Further, the main bonding step is a step in which at least two or more sheet-type metal laminates are completely bonded to the bonding portions by secondary pressing of the bonding portions to which the bonding substrate is applied. The main bonding step may include the steps of: in this step, the adhesive substrate is pressed at a higher pressure and temperature range than in the temporary bonding step so that the adhesive substrate secondarily bonds the entire surface of the portion where the laminated body is in contact.
In the temporary bonding and the main bonding, a press equipped with a heating device may be used as the pressing device, and the configuration thereof is not particularly limited. For example, the pressing device may use a vacuum hot press or a general hot press. Further, in the present invention, the pressing may include a pressure condition of a process of manufacturing a final continuous sheet for a circuit board in the step of bonding the entire surface of the portion in which the sheet-type metal laminated body is in contact with the adhesive substrate.
The main adhesion step may be performed at a temperature of 180 ℃ to 220 ℃ and 3.5kgf/cm2To 12.5kgf/cm2Pressure and 3 minutesTo a pressing time of 5 minutes. When the pressing temperature in the main bonding is lower than 160 ℃, there is a problem that the bonding force is lowered due to non-curing. Further, when the pressing temperature is higher than 200 ℃, there is a problem that the periphery of the bonded portion is contaminated by the flow of the adhesive. Further, when the pressing pressure is less than 0.5kgf/cm2When the pressing pressure is more than 13kgf/cm, there is a problem of non-adhesion2However, there are the following problems: the thickness of the adhesive layer is reduced due to excessive flow of the adhesive, and cracks occur during winding due to the reduction in the thickness of the adhesive layer. Further, when the pressing time is less than 1 minute, there is a problem of peeling due to non-adhesion, and when the pressing time is more than 10 minutes, there is a problem that the adhesive is excessively cured and the CCL copper foil around the adhesion portion is damaged.
As described above, since the step of winding the adhesive substrate for one or more turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate body includes the step of winding one type of adhesive substrate for 1.5 to 2.5 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate body, or includes the step of winding the first adhesive substrate for 0.5 to 1.5 turns along the periphery of the adhesive surface of the mutually adjacent sheet-type metal laminate body; and a step of winding the second adhesive substrate for 0.5 to 1.5 turns along the periphery of the adhesive surface of the sheet-type metal laminated body adjacent to each other after the first adhesive substrate, and thus it is possible to provide a manufacturing method of a continuous sheet for circuit board production on which an adhesive substrate including at least two adhesive substrate layers is formed on the sheet-type metal laminated body.
According to the manufacturing method of the present invention, at least two or more sheet-type metal laminated bodies can be provided as a continuous sheet for circuit board production having excellent waterproof characteristics. In addition, the final product of the present invention can improve all functions such as conductivity, mechanical properties, chemical resistance and productivity.
When at least two or more sheet-type metal laminates are bonded by the bonding substrate in this manner, the metal laminates are joined as shown in fig. 3. Then, after the metal laminate connected in this manner is moved in a horizontal direction and wound, it may be collected as a CCL for a roll type circuit board, as shown in fig. 3.
As described above, since the present invention selectively uses an adhesive substrate having a specific configuration for at least two or more sheet metal laminates, a continuous sheet for circuit board production in the form of a reel-type CCL can be manufactured.
To this end, the present invention is characterized by using an adhesive substrate, but distributing a certain amount of conductive metal powder on a reinforcing film layer or an adhesive layer in the adhesive substrate. Since the adhesive substrate obtained by this method has uniform plating characteristics, no breakage occurs when applied to a roll-to-roll process of a winder, and thus excellent mechanical characteristics as well as excellent chemical resistance can be ensured.
In particular, in the present invention, the problems of the sheet-type metal laminate and the general roll-type metal laminate can be improved.
That is, since the present invention applies an adhesive substrate to at least two or more sheet-type metal laminates provided by impregnation and pressing, a roll-to-roll continuous process can be performed and the disadvantages of the existing sheet-type metal laminates can be solved.
Further, the present invention does not need to be equipped with a belt press as used in the past when manufacturing a roll type metal laminate, and therefore can reduce the production cost.
Provision of an adhesive substrate
According to one embodiment of the present invention, the manufacturing method of a continuous sheet for circuit board production may include, before the step of winding the adhesive substrate one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other, the steps of: a step of providing an adhesive substrate; a step of providing at least two or more sheet-type metal laminates cut into a predetermined size; and a step of horizontally and parallelly placing at least two or more sheet-type metal laminates so as to be in contact with each other.
According to the step of providing an adhesive substrate, an adhesive substrate required for manufacturing a roll-type CCL may be provided.
The adhesive substrate according to an embodiment of the present invention may include at least one of: 1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or 2) a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
In particular, according to the first embodiment, the adhesive substrate may be one type of adhesive substrate, which is any one of the following: 1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or 2) a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
Further, according to the second embodiment, the adhesive substrate may be two types of adhesive substrates consisting of a first adhesive substrate and a second adhesive substrate, the first adhesive substrate being either one of: 1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or 2) a conductor adhesive base comprising a conductor layer and an adhesive layer coated on at least one surface of the conductor layer, and the second adhesive base is any one of: 1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or 2) a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
Specifically, according to the second embodiment, the first adhesive substrate may be a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer, and the second adhesive substrate may be a reinforced adhesive substrate including a reinforcing film layer and an adhesive layer coated on at least one surface of the reinforcing film layer.
Alternatively, according to the second embodiment, the first adhesive substrate may be a reinforced adhesive substrate including a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer, and the second adhesive substrate may be a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
In the adhesive substrate of the above embodiment, the reinforcing film layer and the conductor layer may each be those manufactured by the same method.
Also, in the reinforced adhesive substrate, the reinforcing film layer or the conductor layer may include one or more layers. The conductor adhesive substrate may also include one or more reinforcing film layers or conductor layers. In addition, a conductor layer may be further included on the reinforcing film included in the reinforcing adhesive substrate or the conductor adhesive substrate. In addition, a reinforcing film may be further included on the conductor layer included in the reinforcing adhesive substrate or the conductor adhesive substrate.
According to a preferred embodiment of the present invention, the first adhesive substrate may have i) a structure of a reinforcing film layer and an adhesive layer, ii) a structure of a conductor layer and an adhesive layer, or iii) a structure of a reinforcing film, a conductor layer and an adhesive layer. More specifically, the first adhesive substrate may have i) a structure of a Pi film and an adhesive layer, ii) a structure of a Cu foil and an adhesive layer, or iii) a structure of a Pi film, a Cu foil and an adhesive layer.
Further, the second adhesive substrate may have i) a structure of a conductor layer and an adhesive layer, ii) a structure of a reinforcing film layer and an adhesive layer, or iii) a structure of a reinforcing film, a conductor layer, and an adhesive layer. More specifically, the second adhesive substrate may have i) a structure of a Cu foil and an adhesive layer, ii) a structure of a Pi film and an adhesive layer, or iii) a structure of a Cu foil, a Pi film, and an adhesive layer.
Further, third to fourth adhesive substrates may be included in addition to the first and second adhesive substrates, the third to fourth adhesive substrates including at least one of: 1) a reinforced adhesive substrate comprising a reinforced film layer and an adhesive layer coated on at least one surface of the reinforced film layer; or 2) a conductor adhesive substrate including a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
The conductor layer according to an embodiment of the present invention has a thickness of 7 μm to 35 μm, and may include Cu foil, SUS foil, or aluminum foil.
The reinforcement film layer according to an embodiment of the present invention has a thickness of 5 to 25 μm, and may include one or more polymer resins selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, and polyphenylene sulfide.
The adhesive layer according to an embodiment of the present invention has a thickness of 1 μm to 10 μm or 8 μm to 10 μm, and may be an adhesive layer formed using a varnish including an adhesive resin and a conductive powder in a weight ratio of 1:0.005 to 1: 0.015.
The step of providing an adhesive substrate according to the present invention may include a step of preparing a reinforcing film layer or a conductor layer, the step of producing the adhesive substrate by coating a varnish including an adhesive resin and a conductive powder on an inner surface of the reinforcing film layer or the conductor layer to form an adhesive layer.
Preferred examples of the method of producing the first adhesive substrate and the second adhesive substrate are as follows.
First, a varnish containing a binder resin and a conductive powder is mixed with stirring to produce a conductive varnish.
Subsequently, the prepared conductive varnish was coated on a reinforcing film and a conductor layer having a predetermined thickness at a thickness of 7 μm to 10 μm, respectively, and then cut into a predetermined width (7mm to 15mm) to make a tape form, thereby producing a first adhesive substrate and a second adhesive substrate. As a coating method, a comma coater or a nip coater (nip coater) may be used.
The conductive powder may be one or more selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), and iron (Fe). This specific conductive powder of the present invention imparts an effect of energization between the bonded portions.
On the other hand, as the conductive powder for imparting conductivity to the reinforcing film or the adhesive layer, it is preferable to use a conductive powder having a particle size of 2.0 μm to 8.5 μm (D50), 9.5 μm or less (D90).
The binder resin has a weight average molecular weight of 33000g/mol to 38000g/mol, and may include one or more selected from the group consisting of: polyimide-based resins, epoxy-based resins, acrylic-based resins, phenoxy-based resins, and polyisocyanate-based resins.
The adhesive substrate may be applied in a vertical direction to a portion in which the sheet-type metal laminates are in contact, based on the horizontal direction of the sheet-type metal laminates. Specifically, as the adhesive substrate, the above-described first adhesive substrate and second adhesive substrate may be used such that portions in which the sheet-type metal laminate is in contact are joined.
Specifically, since a waterproof function must be accompanied in bonding the sheet-type metal laminate together with the first adhesive substrate, an outer layer exposed to the outside from the first adhesive substrate should also be included to wind the conductor layer. Therefore, the first adhesive substrate and the second adhesive substrate may be included by winding one or more turns along at least the periphery of the surface of the sheet-type metal laminate.
In a preferred embodiment, the first adhesive substrate is applied primarily by the following process: the portion to be contacted with the sheet-type metal laminate is wound by one turn along the periphery of the surface of the sheet-type metal laminate based on the transverse direction in which at least two or more sheet-type metal laminates are arranged in parallel in the direction of the metal foil. Further, the second adhesive substrate is applied by the following process: after the first adhesive substrate, the surface of the first adhesive substrate is wound around along a circumference of the surface of the first adhesive substrate.
Alternatively, when the first adhesive substrate is wound one turn or less along the periphery of the surface of the sheet-type metal laminate, one surface of the adhesive portion of the sheet-type metal laminate not wound by the first adhesive substrate and the surface of the first adhesive substrate may be wound by the second adhesive substrate.
Although the bonding portions of at least two or more sheet-type metal laminates are connected in this manner, they may be completely sealed without surface exposure to the outside to provide an excellent waterproof function. Further, a conductive layer may be formed on the upper surface of the second adhesive substrate, thereby providing an effect of passing electricity between the adhesive portions.
On the other hand, the width of the adhesive substrate for connecting at least two or more sheet-type metal laminates is preferably from 3mm to 20mm, or from 4mm to 15mm, or from 5mm to 10 mm. Most preferably, the width of the adhesive substrate may be 5mm to 10 mm.
Further, the thickness of the adhesive substrate may be 7 μm to 25 μm.
The adhesive substrate according to the present invention may form an adhesive substrate layer on the surface of the sheet-type metal laminate. Specifically, the adhesive substrate according to the present invention may form two or more adhesive substrate layers on the upper surface and the lower surface of the sheet-type metal laminate.
In the present invention, the adhesive base layer means each adhesive base included in a multilayer structure in which two or more adhesive bases, which are laminates having an adhesive layer coated on a reinforcing film layer or a conductor layer, are laminated.
The adhesive base layer formed on the sheet-type metal laminate may be implemented according to a specific manufacturing method according to the present invention.
Provision of sheet-type metal laminate
According to an embodiment of the present invention, the manufacturing method of a continuous sheet for circuit board production according to the present invention may include, before the step of winding the adhesive substrate for one or more turns along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other, a step of providing the adhesive substrate; a step of providing at least two or more sheet-type metal laminates cut into a predetermined size; and a step of horizontally and parallelly placing at least two or more sheet-type metal laminates so as to be in contact with each other.
At least two or more sheet-type metal laminates cut to predetermined dimensions may be provided by conventional dipping and pressing methods.
The step of providing at least two or more sheet-type metal laminates cut into a predetermined size may include the step of impregnating the fabric substrate into a thermosetting resin varnish, and then semi-curing it to produce a prepreg; a step of laminating one or more prepregs; and a step of laminating a metal foil on one or both surfaces of the prepreg, followed by heating and pressing.
That is, the sheet-type metal laminate according to one embodiment of the present invention can be manufactured by a method including the steps of: a step of producing a prepreg by impregnating a fabric substrate into a thermosetting resin varnish and then semi-curing it, a step of laminating one or more prepregs, and a step of laminating a metal foil on one side or both sides of the prepreg, followed by heating and pressing.
The thermosetting resin varnish may be a thermosetting resin composition containing a binder resin such as an epoxy resin and a filler.
In addition, the thermosetting resin composition may further include one or more additives selected from the group consisting of: solvent, curing accelerator, flame retardant, lubricant, dispersant, plasticizer and silane coupling agent. Since the types and contents of the binder resin, the filler, and the additive may be used according to a method well known in the art, a detailed description thereof will be omitted.
The type of the fabric substrate is not particularly limited, but a glass fabric substrate may be used; a synthetic fabric substrate made of a woven or nonwoven fabric; and a paper substrate having as a main component craft paper, cotton linter paper or a mixed paper of cotton linter pulp and craft pulp, the synthetic fabric substrate having as main components: polyamide-based resin fibers such as polyamide resin fibers, aramid resin fibers, and the like; polyester-based resin fibers such as polyester resin fibers, aromatic polyester resin fibers, or wholly aromatic polyester resin fibers; a polyimide resin fiber; or fluororesin fibers, etc. Among them, a glass fiber substrate can be preferably used. The glass fiber substrate can improve the strength of the prepreg and reduce the water absorption and coefficient of thermal expansion of the prepreg.
The glass substrate may be selected from glass substrates used as materials for various printed circuit boards. Examples thereof may include glass fabrics such as E glass, D glass, S glass, T glass, NE glass, and L glass, but the present invention is not limited thereto. The glass substrate material may be selected according to need, desired purpose or property. The glass substrate is typically in the form of a woven fabric, a non-woven fabric, a roving, a chopped strand mat, or a surfacing mat. The thickness of the glass substrate is not particularly limited, but a glass substrate having a thickness of about 0.01mm to 0.3mm, or the like may be used. Among these materials, a glass fiber material may be more preferable in terms of strength and water absorption characteristics.
Further, in the present invention, a method for producing the prepreg is not particularly limited, and the prepreg can be produced by a method well known in the art. For example, as a method for producing a prepreg, a dipping method, a coating method using various coaters, a spraying method, and the like can be used.
In the case of the impregnation method, the prepreg may be prepared by preparing a varnish and then impregnating the fabric substrate with the varnish.
The metal thin film may be one or more selected from copper (Cu), iron (Fe), nickel (Ni), titanium (Ti), aluminum (Al), silver (Ag), gold (Au), and an alloy of two or more thereof. The thickness of the metal thin film may be 0.1 μm to 50 μm.
According to a preferred embodiment, the metal foil used in the present invention may be a copper foil or an aluminum foil, and those having a thickness of about 2 μm to 200 μm may be used, but those having a thickness of about 2 μm to 35 μm are preferred. Preferably, the metal foil is a copper foil. Further, the metal foil according to the present invention is a composite foil having a three-layer structure having nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead or lead-tin alloy as an intermediate layer on either side between a 0.5 μm to 15 μm copper layer and a 10 μm to 300 μm copper layer, or a composite foil having a two-layer structure including an aluminum foil and a copper foil.
One or more metal laminates comprising the thus produced prepreg are laminated to provide a sheet-type metal laminate.
Continuous sheet for circuit board production
According to another embodiment of the present invention, there may be provided a manufacturing method of a continuous sheet for circuit board production, in which at least two or more sheet-type metal laminated bodies are arranged in parallel and contacted in a direction of a metal foil, and the continuous sheet is formed of an adhesive substrate wound by one or more turns along a periphery of an adhesive surface of the sheet-type metal laminated bodies adjacent to each other.
The continuous sheet for circuit board production may form an adhesive base layer on the surface of the sheet-type metal laminate by the adhesive base wound along the periphery of the adhesive surface of the sheet-type metal laminate adjacent to each other. Specifically, the continuous sheet for circuit board production according to the present invention may be a continuous sheet for circuit board production in which at least two adhesive substrate layers are formed on the upper surface and the lower surface of the sheet-type metal laminate.
In the present invention, the adhesive base layer means each adhesive base included in a multilayer structure in which two or more adhesive bases, which are laminates having an adhesive layer coated on a reinforcing film layer or a conductor layer, are laminated.
The adhesive base layer formed on the sheet-type metal laminate may be implemented according to a specific manufacturing method according to the present invention.
Specifically, when one type of adhesive substrate is used, two or more adhesive substrate layers made of one type of adhesive substrate may be formed on the surface of the sheet-type metal laminate.
Further, when two types of adhesive substrates are used, two or more adhesive substrate layers made of the two types of adhesive substrates may be formed on the surface of the sheet-type metal laminate.
In the adhesive substrate applied to the continuous sheet for circuit board production of the present invention, the resistance value of the adhesive layer may be 0.1 ohm (Ω) to 0.5 ohm.
The adhesive substrate may have a width of 3mm to 20mm, or 4mm to 15mm, or 5mm to 10mm, and a total thickness of 7 μm to 25 μm, with respect to a direction in which two or more sheet-type metal laminates are arranged.
In each adhesive layer, the adhesive resin and the conductive powder are preferably contained in a weight ratio of 1:0.005 to 1: 0.015.
Also, the reinforcing film layer may be manufactured in a thickness of 5 to 50 μm, and as a material thereof, one or more selected from polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, and polyphenylene sulfide may be used.
The conductor layer is a thin film capable of conducting electricity, and may be formed to a thickness of 7 μm to 35 μm or 10 μm to 15 μm. The material of the conductor layer may include Cu foil, SUS foil, or aluminum foil.
The adhesive substrate may be wound around a portion in which the mutually adjacent sheet-type metal laminates are in contact.
As described above, the adhesive substrates may be the first adhesive substrate and the second adhesive substrate that allow the upper and lower portions of the adhesive portion of the sheet-type metal laminate to be joined and wound.
The first adhesive substrate is formed by winding 0.5 to 1.5 turns along the periphery of the surface of the sheet-type metal laminate to wind the upper and lower portions of the adhesive portion of the sheet-type metal laminate, and may include a conductor layer and an adhesive layer coated on at least one surface of the conductor layer.
The second adhesive substrate is formed by winding 0.5 to 1.5 turns along the periphery of the surface of the first adhesive substrate, which is wound around the upper and lower portions of the adhesive portion of the sheet-type metal laminate, and may include a reinforcing film layer and an adhesive layer coated on at least one surface of the reinforcing film layer.
The at least two or more sheet-type metal laminates used in one embodiment may include a polymer resin layer and a metal thin film as described above.
Therefore, both sides of the adhered portion of the sheet-type metal laminated body adjacent to each other include the metal layer of the sheet-type metal laminated body.
Specifically, a thermosetting polymer resin layer may be included on one or both sides of the metal thin film.
The thermosetting polymer resin layer may contain a general-purpose thermosetting resin for producing a copper-clad laminate, and the type thereof is not particularly limited. For example, the thermosetting resin may include one or more selected from the group consisting of: polyimide-based resins, epoxy-based resins, acrylic-based resins, phenoxy-based resins, and polyisocyanate-based resins having a weight average molecular weight of 33000g/mol to 38000 g/mol.
The thickness of the polymer resin layer may be in the range of 0.1 μm to 100 μm, or 1 μm to 50 μm.
The metal thin film may be one or more selected from copper, iron, nickel, titanium, aluminum, silver, gold, and alloys of two or more thereof. The thickness of the metal thin film may be 0.1 μm to 50 μm.
Further, the at least two or more sheet-type metal laminate of the present invention may include one metal thin film, and may include two metal thin films facing each other as needed. When two metal films are included in the sheet-type metal laminate, the polymer resin layer may be located between the two metal films facing each other.
Further, the above-mentioned at least two or more sheet-type metal laminates may further include a polymer resin layer formed on at least one surface of the polymer resin layer. In this case, the polymer resin layer may have substantially the same or different thickness as the included polymer resin layer, and may have a thickness in a range of 0.1 μm to 100 μm, or 1 μm to 50 μm.
Further, according to an embodiment of the present invention, a configuration may be included in which a metal layer is additionally wound around the outermost surface of the adhesive substrate. Therefore, the outermost portion of the adhesive substrate applied to the adhesive portion of the sheet-type metal laminate may further include a metal layer.
The metal layer may include one or more selected from copper, aluminum, nickel, silver (Ag), and iron. Further, the thickness of the metal layer may be 0.1 μm to 50 μm.
The adhesive substrate may have a width of 3mm to 20mm, or 4mm to 15mm, or 5mm to 10mm, and a total thickness of 7 μm to 25 μm, with respect to a direction in which two or more sheet-type metal laminates are arranged.
Also, the thickness of the adhesive layer may be 1 μm to 10 μm or 8 μm to 10 μm, respectively.
In each adhesive layer, the adhesive resin and the conductive powder are preferably contained in a weight ratio of 1:0.005 to 1: 0.015.
The binder resin may include one or more selected from the group consisting of: polyimide-based resins, epoxy-based resins, acrylic-based resins, phenoxy-based resins, and polyisocyanate-based resins having a weight average molecular weight of 33000g/mol to 38000 g/mol.
On the other hand, as the conductive powder for imparting conductivity to the reinforcing film or the adhesive layer, it is preferable to use a conductive powder having a particle diameter of 2.0 μm to 8.5 μm (D50), 9.5 μm or less (D90).
The conductive powder may be one or more selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), and iron (Fe). This specific conductive powder of the present invention imparts an effect of energization between the bonded portions.
Also, the reinforcing film layer may be manufactured in a thickness of 5 to 50 μm, and as a material thereof, one or more selected from polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, and polyphenylene sulfide may be used.
The conductor layer is a thin film capable of conducting electricity, and may be formed to a thickness of 7 μm to 35 μm or 10 μm to 15 μm. The material of the conductor layer may include Cu foil, SUS foil, or aluminum foil.
The continuous sheet for circuit board production of one embodiment of the present invention as described above can secure both mechanical and chemical characteristics, and can also provide an excellent thermal expansion coefficient.
The end product thus produced can be used for the manufacture of double-sided or multilayer printed circuit boards. That is, the present invention can manufacture a double-sided or multilayer printed circuit board by circuit processing a continuous sheet for circuit board production. For the circuit processing, a method performed in a manufacturing process of a general double-sided or multi-layer printed circuit board can be applied.
Advantageous effects
According to the present invention, by connecting the conventional sheet-type metal laminate through the adhesive substrate having improved plating characteristics, mechanical characteristics are enhanced and chemical resistance of chemical substances during the PCB process is also excellent, and a continuous sheet for circuit board production as a roll-type metal laminate can be provided by an economical method.
Drawings
Fig. 1 schematically shows the structure of a continuous sheet for circuit board production to which an adhesive substrate according to embodiment 1 of the present invention is applied.
Fig. 2 schematically shows the structure of a continuous sheet for circuit board production to which the adhesive substrate according to embodiment 3 of the present invention is applied.
Fig. 3 schematically shows the form of a continuous sheet for circuit board production in which the embodiment is collected in a reel type.
Detailed Description
Hereinafter, the present invention will be described in further detail with reference to examples. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
[ preparation examples ]
Preparation example 1: first adhesive substrate (Cu foil substrate)
1) Preparation of conductive adhesive varnish
The conductive varnish was prepared by mixing 100 wt% of the general polyimide-based resin and 1 wt% of Cu powder (4 μm to 4.5 μm based on the particle diameter D50) as a conductive metal powder with stirring.
2) Preparation of adhesive substrates
The conductive varnish prepared in 1) was coated on a copper foil, which is a conductor layer having a thickness of 12 μm, using a comma coater, and then coated to a thickness of 10 μm to form an adhesive layer, and then cut into a predetermined width (10mm) to make a tape form.
Preparation example 2: second adhesive substrate (PI substrate)
1) Preparation of conductive adhesive varnish
The conductive varnish was prepared by mixing 100 wt% of the general-purpose polyimide resin and 1 wt% of Cu powder (4 μm to 4.5 μm based on the particle diameter D50) as a conductive metal powder with stirring.
2) Preparation of adhesive substrates
The conductive varnish prepared in 1) was coated on a polyimide film (SK Kolon PI, 1/2 mil) as a reinforcing film layer having a thickness of 12 μm using a comma coater, and then coated to a thickness of 10 μm to form an adhesive layer, and then cut into a predetermined width (10mm) to make a tape form.
[ example 1]
The first adhesive substrate obtained in preparation example 1 was vertically placed on the temporary adhesion heating line, and then the CCL cut to 340mm x 1030mm (or 1250mm) with an insulating layer thickness of 100 μm was moved parallel to the temporary adhesion heating line to a width of 5mm so that the adhesive surface between the CCLs was placed on the adhesive layer of the first adhesive substrate and then fixed. Then, an opening portion of one end of the first adhesive substrate is cut parallel to the CCL surface.
At a temperature of 110 ℃ and 2kgf/cm2Temporarily bonding the lower surface of the CCL and the first bonding substrate for 2.5 seconds to 5 seconds under the pressure of (1). Then, along all the bonding surfaces between the CCLs (with the lower part of the CCL bonding surface->Side surface->Upper part->Order of sides) wraps the unbonded remaining first adhesive substrate around one turn and temporarily bonds the CCL upper surface and the first adhesive substrate in the same manner.
Subsequently, the first adhesive base is temporarily bonded at the lower surface of the CCL in the same manner and even at the upper surface of the CCL in the same manner, while the first adhesive base is further wound one turn along the periphery of all the adhesive surfaces between the CCLs (in the order of the lower- > side- > upper- > side of the CCL adhesive surfaces). Then, the opening portion of the first adhesive substrate was cut parallel to the CCL surface.
Then, using a vacuum hot press at a temperature of 180 ℃ to 220 ℃ and 6.5kgf/cm2To 12.5kgf/cm2Is pressed for 1 to 5 minutes under pressure. The end of the bonded CCL was fixed using a nip bar and then wound on a take-up roll (tension 150N to 500N) by feeding a unit length using a linear servo.
A continuous sheet for circuit board production is manufactured through the above process.
[ example 2]
A continuous sheet for circuit board production was produced in the same manner as in example 1, except that the second adhesive substrate of production example 2 was used instead of the first adhesive substrate of production example 1.
[ example 3]
The first adhesive substrate obtained in preparation example 1 was vertically placed on the temporary adhesion heating line, and then the CCL cut to 340mm x 1030mm (or 1250mm) with an insulating layer thickness of 100 μm was moved parallel to the temporary adhesion heating line to a width of 5mm so that the adhesive surface between the CCLs was placed on the adhesive layer of the first adhesive substrate and then fixed. Then, an opening portion of one end of the first adhesive substrate is cut parallel to the CCL surface.
At a temperature of 110 ℃ and 2kgf/cm2Temporarily bonding the lower surface of the CCL and the first bonding substrate for 2.5 seconds to 5 seconds under the pressure of (1). Then, along all the bonding surfaces between the CCLs (with the lower part of the CCL bonding surface->Side surface->Upper part->Order of sides) wraps the unbonded remaining first adhesive substrate 0.9 turns and temporarily bonds the CCL upper surface and the first adhesive substrate in the same manner. The first adhesive substrate is then cut from the open side of the CCL.
Subsequently, the second adhesive substrate obtained in production example 2 was temporarily bonded at the lower surface of the CCL in the same manner and even at the upper surface of the CCL in the same manner while the second adhesive substrate was wound on the first adhesive substrate 1.1 turns from the cut surface along the entire periphery of the adhesive surface between the CCLs (in the order of lower- > side- > upper- > side of the CCL adhesive surface). Then, the opening portion of the second adhesive substrate was cut parallel to the CCL surface.
Then, using a vacuum hot press at a temperature of 180 ℃ to 220 ℃ and 3.5kgf/cm2To 12.5kgf/cm2Is pressed for 1 to 5 minutes under pressure. The end of the bonded CCL was fixed using a nip bar and then wound on a take-up roll (tension 150N to 500N) by feeding a unit length using a linear servo.
A continuous sheet for circuit board production is manufactured through the above process.
[ example 4]
A continuous sheet for circuit board production was produced in the same manner as in example 3, except that the second adhesive substrate of production example 2 was used in place of the first adhesive substrate of production example 1, and the first adhesive substrate of production example 1 was used in place of the second adhesive substrate of production example 2.
[ Experimental example ]
In examples 1 to 4, the alkali resistance and the acid resistance of the adhesive base portion were tested, and the results are shown in table 1 below.
[ Table 1]
It was confirmed that the adhesive portion of the continuous sheet according to the embodiment of the present invention has excellent alkali resistance and acid resistance, and thus can be usefully used in a process without breakage in manufacturing a circuit board.
[ description of symbols ]
10: adhesive layer
20: conductive layer
30: cross section of CCL disc
40: reinforced film layer
100: adhesive substrate
200: sheet-type metal laminate
300: continuous sheet for circuit board production
500: winding device
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