阅读说明：本技术 一种实现半导体激光器芯片锁波中无跳模的方法 (Method for realizing no mode jump in semiconductor laser chip lock wave ) 是由 任占强 李青民 王宝超 孙翔 李喜荣 仇伯仓 于 2020-07-10 设计创作，主要内容包括：本发明提供一种实现半导体激光器芯片锁波中无跳模的方法,解决现有单管芯片的光谱出现跳膜现象,而该现象会在VBG锁波过程引起无法锁波的问题。本发明的方法包括以下步骤：步骤一、在辅助热沉的上表面设置多个沟槽,且多个沟槽等距设置；步骤二、将贴有单管芯片的陶瓷热沉贴装到辅助热沉的上表面；步骤三、将辅助热沉安装到光纤的组件上。同时,本发明无跳模半导体激光器包括依次叠加设置的单管芯片、陶瓷热沉和辅助热沉,辅助热沉与陶瓷热沉贴合的表面设置有多个沟槽,且多个沟槽等距设置。本发明方法在辅助热沉上进行沟槽设计,沟槽可以在COS贴装到辅助热沉上时进行应力的释放,以获得较好的光谱,然后可以进行VBG锁波。(The invention provides a method for realizing no mode hopping in the wave locking of a semiconductor laser chip, which solves the problem that the spectrum of the existing single-tube chip has the phenomenon of film hopping, and the phenomenon can cause no wave locking in the VBG wave locking process. The method of the invention comprises the following steps: step one, arranging a plurality of grooves on the upper surface of the auxiliary heat sink, wherein the grooves are arranged at equal intervals; step two, the ceramic heat sink attached with the single tube chip is attached to the upper surface of the auxiliary heat sink; and step three, mounting the auxiliary heat sink on the optical fiber assembly. Meanwhile, the mode-hopping-free semiconductor laser comprises a single-tube chip, a ceramic heat sink and an auxiliary heat sink which are sequentially stacked, wherein a plurality of grooves are formed in the surface, attached to the ceramic heat sink, of the auxiliary heat sink, and the grooves are arranged at equal intervals. The method of the invention designs the groove on the auxiliary heat sink, and the groove can release stress when the COS is pasted on the auxiliary heat sink so as to obtain better spectrum, and then can carry out VBG wave locking.)

1. A method for realizing no mode jump in the chip lock wave of a semiconductor laser is characterized by comprising the following steps:

step one, arranging a plurality of grooves on the upper surface of the auxiliary heat sink, wherein the grooves are arranged at equal intervals;

step two, the ceramic heat sink attached with the single tube chip is attached to the upper surface of the auxiliary heat sink;

and step three, mounting the auxiliary heat sink on the optical fiber assembly.

2. The method of claim 1 for achieving mode hopping free in the mode locking of a semiconductor laser chip, wherein: in the first step, the groove is a linear groove or a curved groove.

3. The method of claim 2 for achieving mode hopping free in the mode locking of a semiconductor laser chip, wherein: in the first step, the cross section of the groove is rectangular, V-shaped, trapezoidal or semicircular.

4. A method for realizing mode hopping-free in semiconductor laser chip lock wave according to claim 1, 2 or 3, wherein: in the first step, the plurality of grooves are arranged along the same direction, or the plurality of grooves are arranged in a staggered manner in different directions.

5. The method of claim 4 for achieving mode hopping free in the mode locking of a semiconductor laser chip, wherein: in the first step, the duty ratio range of the groove is 20% -60%, and the groove width is 2% -10% of the width of the auxiliary heat sink.

6. The utility model provides a no mode hopping semiconductor laser, includes that the stack sets up single tube chip, pottery in proper order are heat sink and supplementary heat sink, its characterized in that: the surface of the auxiliary heat sink and the ceramic heat sink is provided with a plurality of grooves which are arranged at equal intervals.

7. The mode-hopping-free semiconductor laser according to claim 6, wherein: the grooves are linear grooves or curved grooves.

8. The mode-hopping-free semiconductor laser according to claim 7, wherein: the cross section of the groove is rectangular, V-shaped, trapezoidal or semicircular.

9. The mode-hopping-free semiconductor laser according to claim 6, 7 or 8, wherein: the grooves are arranged along the same direction, or the grooves are arranged in a staggered manner in different directions.

10. The mode-hopping-free semiconductor laser according to claim 9, wherein: the duty ratio range of the groove is 20% -60%, and the groove width is 2% -10% of the width of the auxiliary heat sink.

Technical Field

The invention belongs to the field of semiconductors and optical fiber lasers, and particularly relates to a method for realizing no mode hopping in the wave locking of a semiconductor laser chip.

Background

The fiber laser is widely applied to the fields of laser fiber communication, industrial shipbuilding, automobile manufacturing, laser engraving, laser marking, laser cutting, printing roller making, metal nonmetal drilling/cutting/welding and the like, and with the development of intellectualization and miniaturization, the semiconductor laser gradually becomes a main pump source of the fiber laser. The chip of the semiconductor laser has two types of bars and single tube, and the high-power single tube chip gradually becomes the main pump source of the optical fiber laser under the development of the technologies of space beam combination, wavelength beam combination, polarization beam combination and the like.

The packaging of the high-power semiconductor laser single chip mainly comprises three steps: firstly, packaging a single Chip on a heat sink of AlN Ceramic (COS); secondly, mounting the AlN ceramic heat sink with the single-tube chip on a copper auxiliary heat sink; and thirdly, mounting the copper auxiliary heat sink on a component of the optical fiber, and debugging an optical path, such as a Volume Bragg Grating (VBG) for wave locking to obtain high power, high efficiency and higher temperature stability.

However, the above structure has the following problems: as shown in fig. 1, the package or structure of the single chip of the high-power semiconductor laser may cause a mode hopping phenomenon in the spectrum of the single chip, and the phenomenon may cause a problem of unable wave locking in the VBG wave locking process. At present, a better solution for the die jump phenomenon of a packaged chip is not provided, the die jump phenomenon is mainly reduced by adjusting a packaging process, but the packaging processes corresponding to chips of different manufacturers and different batches are different, and a large number of experiments are required to find out a packaging process suitable for a certain batch.

Disclosure of Invention

The invention aims to solve the problem that the phenomenon of film jumping occurs in the spectrum of the existing single-tube chip, and the phenomenon can cause wave locking failure in the VBG wave locking process, and provides a method for realizing no mode jumping in the wave locking of a semiconductor laser chip.

In order to achieve the above purpose, the technical scheme of the invention is as follows:

a method for realizing no mode jump in the chip lock wave of a semiconductor laser comprises the following steps:

step one, arranging a plurality of grooves on the upper surface of the auxiliary heat sink, wherein the grooves are arranged at equal intervals;

step two, the ceramic heat sink attached with the single tube chip is attached to the upper surface of the auxiliary heat sink;

and step three, mounting the auxiliary heat sink on the optical fiber assembly.

Meanwhile, the invention also provides a mode-hopping-free semiconductor laser, which comprises a single-tube chip, a ceramic heat sink and an auxiliary heat sink which are sequentially overlapped, wherein a plurality of grooves are formed in the surface, which is attached to the ceramic heat sink, of the auxiliary heat sink, and the grooves are arranged at equal intervals.

Further, the groove is a straight groove or a curved groove.

Further, the cross section of the groove is rectangular, V-shaped, trapezoidal or semicircular.

Further, the plurality of grooves may be arranged in the same direction, or the plurality of grooves may be arranged in different directions in a staggered manner.

Further, the duty cycle range of the groove is 20% -60%, and the groove width is 2% -10% of the width of the auxiliary heat sink.

Compared with the prior art, the technical scheme of the invention has the following technical effects:

1. the method for realizing no mode jump in the chip locking of the semiconductor laser carries out groove design on the auxiliary heat sink, and the groove can release stress when the COS is pasted on the auxiliary heat sink so as to obtain a better spectrum and then carry out VBG locking.

2. The method for realizing no mode hopping in the chip locking wave of the semiconductor laser carries out groove design on the auxiliary heat sink, and the technical means is simple and easy to realize. Because there will be the intensification and cooling stage in the chip packaging process, in the temperature variation, the coefficient of thermal expansion of different materials is different, so can produce certain stress, and stress will arouse semiconductor laser chip wavelength to beat, if carry out the slot design with the supplementary heat sink of encapsulation, can greatly reduced or even eliminate stress to reach the effect of locking the ripples. Compared with the method for adjusting the packaging process parameters to deal with different batches of chips, the groove type heat sink can fundamentally solve the phenomenon of mode hopping in the wave locking process.

3. The method of the invention not only solves the phenomenon of film jump in the wave locking process, but also increases the heat dissipation area of the chip due to the groove design of the heat sink, improves the heat dissipation performance and further can improve the reliability of the chip.

Drawings

FIG. 1 is a schematic diagram of a conventional COS package post-test spectrum;

FIG. 2 is a schematic cross-sectional view of an auxiliary heat sink with a channel according to the present invention;

fig. 3 is a schematic structural diagram of the auxiliary heat sink of the present invention;

FIG. 4 is a schematic structural diagram according to a first embodiment of the present invention;

FIG. 5 is a schematic structural diagram according to a second embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a third embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a fourth embodiment of the present invention;

fig. 8 is a schematic structural diagram of a fifth embodiment of the present invention.

Reference numerals: 1-auxiliary heat sink, 2-groove.

Detailed Description

The invention is described in further detail below with reference to the following figures and specific examples:

the mode hopping phenomenon occurs in the spectrum of the single chip of the high-power semiconductor laser, and the phenomenon can cause the problem of wave locking failure in the VBG wave locking process. Based on the problem, the applicant finds that when the auxiliary heat sink is a whole copper block or a flat plate of a copper plate, a large stress is generated when the COS is attached to the auxiliary heat sink, the stress can cause the spectrum of a single-tube chip to jump, namely, a mode jump phenomenon, and the phenomenon can cause the problem of wave locking failure in the VBG wave locking process. Based on the discovery, the auxiliary heat sink is subjected to groove design, the groove design can release stress when the COS is attached to the auxiliary heat sink, so that a better spectrum can be obtained, and then VBG (visual basic group) wave locking can be carried out.

Based on the principle, the invention provides a method for realizing no mode hopping in the chip locking wave of a semiconductor laser, which comprises the following steps:

step one, arranging a plurality of grooves on the upper surface of the auxiliary heat sink, wherein the grooves are arranged at equal intervals;

step two, the ceramic heat sink attached with the single tube chip is attached to the upper surface of the auxiliary heat sink;

and step three, mounting the auxiliary heat sink on the optical fiber assembly.

Meanwhile, as shown in fig. 2, the invention also provides a mode-hopping-free semiconductor laser, which comprises a single-tube chip, a ceramic heat sink and an auxiliary heat sink 1, which are sequentially stacked, wherein a plurality of grooves 2 are formed in the surface of the auxiliary heat sink, which is attached to the AlN ceramic, and the grooves 2 are arranged at equal intervals, the ceramic heat sink can be specifically an AlN ceramic heat sink, and the auxiliary heat sink 1 can be specifically a copper auxiliary heat sink.

Because there will be the intensification and cooling stage in the chip packaging process, in the temperature variation, the coefficient of thermal expansion of different materials is different, so can produce certain stress, and stress will arouse semiconductor laser chip wavelength to beat, if carry out the slot design with the heat sink of encapsulation, stress that can the encapsulation process introduction channel structure carries out stress release to greatly reduced or eliminate the stress that the encapsulation introduced, reach the wavelength of stabilizing the semiconductor laser chip, the wavelength is corresponding with the mode, thereby the stable effect that reaches the lock ripples of spectral mode.

The groove can be a straight line groove or a curve groove, the straight line groove can be in V-shaped, rhombic, trapezoidal and other patterns, and the curve groove can be in wave shape, concentric circle, semicircular and other patterns.

The cross section of the groove is not limited, and the groove can be rectangular, V-shaped, trapezoidal or semicircular, and the like.

The duty ratio range of the groove is 20% -60%, the groove width is 2% -10% of the width of the auxiliary heat sink, in the embodiment of the rectangular groove, the duty ratio of the groove is 30%, the groove width is 5% of the width of the auxiliary heat sink, a good effect is obtained, and when the duty ratio of the groove is 30% and the groove width is 5% of the auxiliary heat sink, the packaging stress is well released.

When the auxiliary heat sink is provided with the grooves, the grooves are specifically arranged as follows: the plurality of grooves may be arranged in the same direction, or the plurality of grooves may be arranged in a staggered manner in different directions. For example, if the groove is a straight groove, the direction of the groove is parallel to the length direction of the auxiliary heat sink, or parallel to the width direction of the auxiliary heat sink; or, the grooves in one direction are parallel to the length direction of the auxiliary heat sink, and the grooves in the other direction are parallel to the width direction of the auxiliary heat sink; of course, the direction of the groove may be arranged at an angle with the length direction or the width direction of the auxiliary heat sink.