阅读说明：本技术 一种双波长单片集成面发射半导体激光器 (Dual-wavelength monolithic integrated surface emitting semiconductor laser ) 是由 曾丽娜 李林 李再金 李功捷 乔忠良 赵志斌 刘国军 曲轶 彭鸿雁 于 2020-06-28 设计创作，主要内容包括：本发明公开了一种双波长单片集成面发射半导体激光器,包括蓝宝石衬底,所述蓝宝石衬底顶端自下而上依次生长有缓冲层,第一底部DBR层,第一下势垒层,第一有源层,隧道结层,电流注入层,第一上势垒层,第一顶部DBR层,欧姆接触层,第二底部DBR层,第二下势垒层,第二有源层,第二上势垒层,第二顶部DBR层,盖层,第三底部DBR层,第三下势垒层,第三有源层,第三上势垒层,第三顶部DBR层,窗口层。本发明不仅能够获得高质量的高反射率腔镜,还能有效减小谐振腔的腔长,有利于芯片集成。(The invention discloses a dual-wavelength monolithic integrated surface emitting semiconductor laser, which comprises a sapphire substrate, wherein a buffer layer, a first bottom DBR layer, a first lower barrier layer, a first active layer, a tunnel junction layer, a current injection layer, a first upper barrier layer, a first top DBR layer, an ohmic contact layer, a second bottom DBR layer, a second lower barrier layer, a second active layer, a second upper barrier layer, a second top DBR layer, a cover layer, a third bottom DBR layer, a third lower barrier layer, a third active layer, a third upper barrier layer, a third top DBR layer and a window layer are sequentially grown at the top end of the sapphire substrate from bottom to top. The invention can obtain a high-quality high-reflectivity cavity mirror, can effectively reduce the cavity length of the resonant cavity and is beneficial to chip integration.)

1. A dual wavelength monolithically integrated surface emitting semiconductor laser comprising: the sapphire substrate, the sapphire substrate top grows gradually from bottom to top has the buffer layer, first bottom DBR layer, the first barrier layer that descends, the first active layer, the tunnel junction layer, the current injection layer, the first barrier layer that goes up, first top DBR layer, ohmic contact layer, the second bottom DBR layer, the barrier layer under the second, the second active layer, the barrier layer is gone up to the second, second top DBR layer, the cap layer, third bottom DBR layer, the third barrier layer down, the third active layer, the barrier layer is gone up to the third, third top DBR layer, the window layer.

2. The dual-wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the semiconductor laser is subjected to a first ICP etching to form a first lithography ICP etching channel, said first lithography ICP etching channel extending from said tunnel junction layer to said window layer.

3. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 2 wherein semiconductor laser is subjected to a second ICP etch to form a second lithographic, ICP etched channel extending from the first bottom DBR layer to the window layer.

4. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein said first bottom DBR layer is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺20 pairs of GaN with the thickness of 35nm and 50nm respectively and the doping concentration of n-GaN of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

5. According to claim 1The double-wavelength monolithic integrated surface-emitting semiconductor laser is characterized in that the tunnel junction layer is heavily doped n⁺-GaN/p⁺-GaN，n⁺-GaN and p⁺Doping concentration of GaN was 5E19/cm³The thicknesses were 15nm and 10nm, respectively.

6. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the first top DBR layer is epitaxially grown n-GaN/n of n-type with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-15 total pairs of GaN dbr with thicknesses of 35nm and 50nm, respectively, and n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

7. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the second bottom DBR layer is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-20 total pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

8. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the second top DBR layer is epitaxially grown n-GaN/n of n-type with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

9. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the third bottom DBR layer is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-20 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

10. A dual wavelength monolithically integrated surface emitting semiconductor laser as claimed in claim 1 wherein the third top DBR layer is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

Technical Field

The invention belongs to the technical field of semiconductor photoelectron, and particularly relates to a dual-wavelength monolithic integrated surface emitting semiconductor laser.

Background

In recent years, GaN-based semiconductor materials have made great technological breakthrough in epitaxial growth and optoelectronic device fabrication, in which Light Emitting Diodes (LEDs) and Edge Emitting Lasers (EELs) have been industrialized. The blue-green light dual-wavelength monolithic integrated surface-emitting semiconductor laser has wide application prospect in the fields of high-density optical storage, laser display, laser printing, laser illumination, laser television, underwater communication, ocean resource detection, laser biomedicine and the like.

A surface-emitting semiconductor laser resonator is generally composed of a high-reflectivity Distributed Bragg Reflector (DBR). However, for GaN-based semiconductor lasers, it is very difficult to epitaxially grow a DBR, and a high-reflectivity resonant cavity is generally obtained from a multilayer dielectric film DBR. Because the dielectric film is not conductive, the conventional ITO film inner cavity electrode is adopted by the front-emitting semiconductor laser, and the loss caused by absorption of the ITO film inner cavity electrode and the loss caused by an ITO/GaN interface result in higher threshold current and lower light output. The dual-wavelength monolithic integrated surface emitting semiconductor laser utilizes the bonding technology to bond two laser chips with different emitting wavelengths together, and the integration level is lower. The output characteristics of the dual-wavelength laser are affected by bonding temperature, pressure, bonding agent and other factors, so that stable laser output characteristics are not easy to obtain, and chip integration is not facilitated.

Therefore, how to provide a dual-wavelength monolithically integrated surface emitting semiconductor laser is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the invention provides a dual-wavelength monolithic integrated surface emitting semiconductor laser, which not only can obtain a high-quality high-reflectivity cavity mirror, but also can effectively reduce the cavity length of a resonant cavity, and is beneficial to chip integration.

In order to achieve the purpose, the invention adopts the following technical scheme:

a dual wavelength monolithically integrated surface emitting semiconductor laser comprising: the sapphire substrate, the sapphire substrate top grows gradually from bottom to top has the buffer layer, first bottom DBR layer, the first barrier layer that descends, the first active layer, the tunnel junction layer, the current injection layer, the first barrier layer that goes up, first top DBR layer, ohmic contact layer, the second bottom DBR layer, the barrier layer under the second, the second active layer, the barrier layer is gone up to the second, second top DBR layer, the cap layer, third bottom DBR layer, the third barrier layer down, the third active layer, the barrier layer is gone up to the third, third top DBR layer, the window layer.

Preferably, the semiconductor laser forms a first photoetching and ICP etching channel through first ICP etching, and the first photoetching and ICP etching channel extends from the tunnel junction layer to the window layer.

Preferably, the semiconductor laser forms a second lithography and ICP etching channel by a second ICP etching, the second lithography and ICP etching channel extending from the first bottom DBR layer to the window layer.

Preferably, the first bottom DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n ⁺20 pairs of GaN with the thickness of 35nm and 50nm respectively and the doping concentration of n-GaN of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

Preferably, the tunnel junction layer is heavily doped n⁺-GaN/p⁺-GaN，n⁺-GaN and p⁺Doping concentration of GaN was 5E19/cm³The thicknesses were 15nm and 10nm, respectively.

Preferably, the first top DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaNDBR homojunction material, n-GaN and n ⁺15 pairs of-GaN DBRs each having a thickness of 35nm and 50nm, and a n-GaN doping concentration of n-1E 18/cm³，n⁺-GaNThe doping concentration is n-1E 19/cm³。

Preferably, the second bottom DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaNDBR homojunction material, n-GaN and n⁺-20 total pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

Preferably, the second top DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaNDBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

Preferably, the third bottom DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaNDBR homojunction material, n-GaN and n⁺-20 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

Preferably, the third top DBR layer is formed by epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaNDBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³。

The invention has the beneficial effects that:

the invention has compact structure, is a surface emitting semiconductor laser structure for epitaxial growth of near ultraviolet to blue-green light wavelength, forms a near ultraviolet laser pumping blue-green dual-wavelength monolithic integrated surface emitting semiconductor laser, and all semiconductor laser structures are directly obtained by epitaxial growth, thereby solving the difficulty of epitaxial growth of DBR and realizing that three active layers with different light emitting wavelengths and a plurality of pairs of DBR layers can be completed by one-time epitaxial growth. The dual-wavelength monolithic integrated surface emitting semiconductor laser can obtain a high-quality high-reflectivity cavity mirror, effectively reduce the cavity length of a resonant cavity and is beneficial to chip integration.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic diagram of the present invention.

FIG. 2 is a schematic structural diagram of a dual-wavelength monolithic integrated surface emitting semiconductor laser after two times of ICP etching.

Wherein, in the figure,

1 is a sapphire substrate, 2 is a buffer layer, 3 is a first bottom DBR layer, 4 is a first lower barrier layer, 5 is a first active layer, 6 is a tunnel junction layer, 7 is a current injection layer, 8 is a first upper barrier layer, 9 is a first top DBR layer, 10 is an ohmic contact layer, 11 is a second bottom DBR layer, 12 is a second lower barrier layer, 13 is a second active layer, 14 is a second upper barrier layer, 15 is a second top DBR layer, 16 is a cap layer, 17 is a third bottom DBR layer, 18 is a third lower barrier layer, 19 is a third active layer, 20 is a third upper barrier layer, 21 is a third top DBR layer, 22 is a window layer, 30 is a first bottom etched region, 31 is a tunnel junction etched region, 32 is a current injection aperture region, 33 is a first top DBR etched region, 34 is a second bottom DBR region, 35 is a second top etched region, 36 is a third bottom etched region, 37 is a third top DBR region, 40 is a first photoetching and ICP etching channel, and 41 is a second photoetching and ICP etching channel.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a dual-wavelength monolithic integrated surface emitting semiconductor laser, comprising: the sapphire substrate comprises a sapphire substrate 1, wherein a buffer layer 2, a first bottom DBR layer 3, a first lower barrier layer 4, a first active layer 5, a tunnel junction layer 6, a current injection layer 7, a first upper barrier layer 8, a first top DBR layer 9, an ohmic contact layer 10, a second bottom DBR layer 11, a second lower barrier layer 12, a second active layer 13, a second upper barrier layer 14, a second top DBR layer 15, a cover layer 16, a third bottom DBR layer 17, a third lower barrier layer 18, a third active layer 19, a third upper barrier layer 20, a third top DBR layer 21 and a window layer 22 are sequentially grown from bottom to top on the top of the sapphire substrate 1.

The sapphire substrate 1 is used for epitaxially growing various layers of materials of the vertical cavity surface emitting laser thereon.

The buffer layer 2 is a GaN material having a thickness of 1000nm, and the buffer layer 2 is grown on the sapphire substrate 1 to prevent the transfer of defects in the sapphire substrate 1.

A first bottom DBR layer 3 for epitaxially growing n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n ⁺20 pairs of GaN with the thickness of 35nm and 50nm respectively and the doping concentration of n-GaN of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The reflectivity of the ultraviolet light of the layer can reach more than 99.5 percent and is used as the ultraviolet light generated by the first active layer totally reflected by the bottom DBR.

The first lower barrier layer 4 is a GaN material with a thickness of 100 nm.

The first active layer 5 is a multiple quantum well layer and has a light emission wavelength of 380nm to 390 nm. Ultraviolet light of the wave band vibrates in the resonant cavity to emit light by lasing, and the emitted ultraviolet light is emitted from the first active layer to the second active layer.

The tunnel junction layer 6 being heavily doped n⁺-GaN/p⁺-GaN，n⁺-GaN and p⁺Doping concentration of GaN was 5E19/cm³The thicknesses were 15nm and 10nm, respectively. If the doping concentration of the tunnel junction layer is increased or the thickness of the tunnel junction layer is reduced, the threshold current density of the device can be reduced; if the tunnel junction layer thickness is too large, tunneling of electrons is reducedEfficiency.

The current injection layer 7 is n with a thickness of 50nm⁺-GaN material with a doping concentration n-5E 19/cm³. The thickness and doping concentration of the current injection layer affect the current injection efficiency, and increasing the doping concentration increases the current injection efficiency.

The first upper barrier layer 8 is a GaN material with a thickness of 100 nm.

The first top DBR layer 9 is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n ⁺15 pairs of-GaN DBRs each having a thickness of 35nm and 50nm, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The thickness of the first top DBR layer material is such that the uv reflectance of the layer can be above 99%. If the ratio of the doping concentrations of the DBRs of the layers is greater than 10, the difference in refractive index of the resulting DBR layers is about 0.5, which is advantageous for reducing the total logarithm of the DBR layers.

The ohmic contact layer 10 is n with a thickness of 300nm⁺-GaN material with a doping concentration n-5E 19/cm³. The layer is beneficial for reducing the contact resistance of the device, and for example, increasing the doping concentration of the layer can reduce the resistance of the ohmic contact.

The second bottom DBR layer 11 is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-20 total pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The reflectivity of the blue light of the layer can reach more than 99.5 percent, and the blue light is used as the blue light generated by the bottom DBR through total reflection of the second active layer.

The second lower barrier layer 12 is a GaN material with a thickness of 100 nm.

The second active layer 13 is a multiple quantum well layer and has a light emission wavelength of 420nm to 430 nm. The blue light of the wave band is oscillated and lased in the resonant cavity to emit light, and the emitted blue light is emitted from the second active layer to the third active layer.

Second upper barrier layer 14 is a GaN material with a thickness of 100 nm.

The second top DBR layer 15 is epitaxialGrowing n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 40nm and 55nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The thickness of the second top DBR layer material is such that the reflectivity of the blue light in this layer can be above 99%. If the ratio of the doping concentrations of the DBRs of the layers is greater than 10, the difference in refractive index of the resulting DBR layers is about 0.5, which is advantageous for reducing the total logarithm of the DBR layers.

The cap layer 16 is n with a thickness of 200nm⁺-GaN material with a doping concentration n-1E 18/cm³。

The third bottom DBR layer 17 is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-20 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The reflectivity of the green light of the layer can reach more than 99.5 percent, and the green light generated by the bottom DBR total reflection third active layer is used.

The third lower barrier layer 18 is a GaN material with a thickness of 100 nm.

The third active layer 19 is a multiple quantum well layer and has a light emission wavelength of 520nm to 530 nm. The green light of the wave band is oscillated and lasered in the resonant cavity, and the emitted green light is emitted from the third active layer to the direction of the window layer.

The third upper barrier layer 20 is a GaN material with a thickness of 100 nm.

The third top DBR layer 21 is epitaxially grown n-type n-GaN/n with different doping concentrations⁺-GaN DBR homojunction material, n-GaN and n⁺-15 pairs of GaN with a thickness of 50nm and 70nm, respectively, and a n-GaN doping concentration of n-1E 18/cm³，n⁺GaN doping concentration n-1E 19/cm³. The thickness of the third top DBR layer material is such that the green light reflectivity in this layer can be above 99%. If the ratio of the doping concentrations of the DBRs of the layers is greater than 10, the difference in refractive index of the resulting DBR layers is about 0.5, which is advantageous for reducing the total logarithm of the DBR layers.

The window layer 22 is a GaN material with a thickness of 100 nm.

The invention provides a method for manufacturing a DBR (distributed Bragg Reflector) and a current injection aperture of a double-wavelength monolithic integrated surface-emitting semiconductor laser, which comprises the following specific steps of: firstly, by utilizing MOCVD epitaxial growth equipment, each layer of material is epitaxially grown on a substrate layer from bottom to top, and the primary epitaxial growth is completed from the epitaxial growth buffer layer 2 to the window layer 22 without secondary epitaxial growth, so that the pollution of an epitaxial wafer in the secondary epitaxial growth process is avoided, and the epitaxial growth quality of the chip material is ensured.

And secondly, forming a first photoetching and ICP etching channel 40 by the semiconductor laser through first ICP etching, wherein the first photoetching and ICP etching channel 40 extends from the tunnel junction layer 6 to the window layer 22, a tunnel junction etching area 31 is formed on the tunnel junction layer 6 by the first ICP etching, and a current injection aperture area 32 is formed on the current injection layer 7. After the first ICP etching, adjusting the etching voltage to be 1.5V to 3V by using an electrochemical etching process, wherein the etching solution is strong acid (such as sulfuric acid or nitric acid) or strong base (such as sodium hydroxide or potassium hydroxide), obtaining the required current injection aperture size (10 micrometers to 30 micrometers) after etching for 3 to 5 hours, increasing the voltage to be 2 to 3 times of the original etching voltage, and finishing the reaction after 5 minutes to manufacture the current aperture of the near ultraviolet laser of the epitaxial wafer of the surface emitting laser. The current injection aperture can form an injection channel of current, thereby effectively reducing the transverse diffusion loss of the injected current and being beneficial to reducing the threshold current density of the device.

Then, the semiconductor laser is subjected to a second ICP etching to form a second photo-etched, ICP-etched channel 41, the second photo-etched, ICP-etched channel 41 extends from the first bottom DBR layer 3 to the window layer 22, the second ICP etching forms a first bottom DBR-etched section 30 at the first bottom DBR layer 3, a first top DBR-etched section 33 at the first top DBR layer 9, a second bottom DBR-etched section 34 at the second bottom DBR layer 11, a second top DBR-etched section 35 at the second top DBR layer 15, a third bottom DBR-etched section 36 at the third bottom DBR layer 17, and a third top DBR-etched section 37 at the third top DBR layer 21. After the second ICP etching, adjusting the etching voltage to be 1.5V to 3V by using an electrochemical etching process, wherein the etching solution is strong acid (such as sulfuric acid or nitric acid) or strong base (such as sodium hydroxide or potassium hydroxide), and after etching for 5 to 8 hours, completing the manufacturing of the DBR in the epitaxial wafer structure at one time to realize the manufacturing of all resonant cavities in the chip. The conventional chip electrode preparation process is utilized to realize the electric pumping lasing luminescence. The first bottom DBR etching area and the first top DBR etching area form an ultraviolet resonant cavity, and ultraviolet laser output is favorably obtained; the second bottom DBR etching area and the second top DBR etching area form a blue-light resonant cavity, and blue-light laser output is facilitated; the third bottom DBR etching area and the third top DBR etching area form a green light resonant cavity, and output of green light laser is facilitated. The invention is beneficial to realizing the multi-stage pump light monolithic integration electro-optic hybrid pump output laser, firstly ultraviolet light is obtained by the first-stage electric pump lasing, then blue light laser is obtained by the first-stage ultraviolet light pumping second stage, then green light laser output is obtained by the second-stage blue light pumping third stage, and so on, and finally the multi-stage pump light monolithic integration laser is realized.

Wherein the ICP etching gas is SF₆/BCl₃The mixed gas (the gas volume ratio is 2:3) has the etching rate of 10nm/min, and can obtain the controllable etching rate. Etching mask material of SiO₂Or Si₃N₄And SiO₂Mask Material Using Si₃N₄The masking material achieves a more vertical and smooth etched sidewall.

The invention realizes the current injection aperture manufacture of the near ultraviolet surface emitting laser epitaxial wafer after the first photoetching and ICP dry etching process, and completes the blue-green light dual-wavelength monolithic integration vertical cavity surface emitting laser preparation process after the second photoetching and ICP dry etching process.

The invention provides a method for manufacturing a dual-wavelength monolithic integrated surface-emitting semiconductor laser electrode, which utilizes the electrode manufacturing process of a conventional semiconductor laser chip, and chip electrodes are respectively manufactured on an ohmic contact layer and a buffer layer.

The invention provides electric pumping laser by the first active region to generate near ultraviolet laser, injects current into the first active region to generate electric injection excited near ultraviolet laser, and pumps the second active region and the third active region by taking the near ultraviolet laser as a pumping source, thereby obtaining blue-green light dual-wavelength laser on a single chip.

The invention provides a dual-wavelength monolithic integration surface emitting semiconductor laser structure, which realizes a high-reflectivity surface emitting laser resonant cavity by epitaxial growth homojunction DBR without a high-reflectivity resonant cavity coating process, thereby ensuring to obtain high-quality cavity mirror materials and solving the problems of cavity mirror complex mode system design and high-reflectivity film and anti-reflection film preparation.

The invention has compact structure, is a surface emitting semiconductor laser structure for epitaxial growth of near ultraviolet to blue-green light wavelength, forms a near ultraviolet laser pumping blue-green dual-wavelength monolithic integrated surface emitting semiconductor laser, and all semiconductor laser structures are directly obtained by epitaxial growth, thereby solving the difficulty of epitaxial growth of DBR and realizing that three active layers with different light emitting wavelengths and a plurality of pairs of DBR layers can be completed by one-time epitaxial growth. The dual-wavelength monolithic integrated surface emitting semiconductor laser can obtain a high-quality high-reflectivity cavity mirror, effectively reduce the cavity length of a resonant cavity and is beneficial to chip integration. The invention adopts a near-ultraviolet wavelength surface-emitting semiconductor laser as a pumping light source to obtain a near-ultraviolet single-chip laser integrated pumping source, thereby realizing blue-green light dual-wavelength monolithic integrated surface-emitting semiconductor laser.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.