阅读说明：本技术 一种大功率传导冷却封装结构巴条激光器烧结夹具及其烧结方法 (High-power conduction cooling packaging structure bar laser sintering fixture and sintering method thereof ) 是由 姚爽 王帅 纪兴启 开北超 夏伟 徐现刚 于 2019-02-28 设计创作，主要内容包括：本发明涉及一种大功率传导冷却封装结构巴条激光器烧结夹具及其烧结方法,属于半导体激光器制造领域,包括定位底座、CS热沉、压块和巴条激光器,定位底座包括第一面和第二面,第一面和第二面相互垂直设置,第一面上设置有第一限位槽,第二面上设置有第二限位槽；压块的宽度与巴条激光器的宽度一致,压块下表面的一端设置有用于压紧巴条激光器的压紧部,压紧部的高度低于压块的高度,压紧部的尺寸与巴条激光器的尺寸相一致。本发明充分地利用了CS热沉的结构特点,简化夹具结构,不仅可以减少甚至避免“smile”现象的发生,而且通过使用扭力改锥,能够保证烧结的一致性和均匀性,提高巴条烧结的效率和合格率。(The invention relates to a sintering clamp and a sintering method for a high-power conduction cooling packaging structure bar laser, belonging to the field of semiconductor laser manufacturing, and comprising a positioning base, a CS heat sink, a pressing block and a bar laser, wherein the positioning base comprises a first surface and a second surface which are perpendicular to each other, the first surface is provided with a first limiting groove, and the second surface is provided with a second limiting groove; the width of briquetting is unanimous with the width of bar laser instrument, and the one end of briquetting lower surface is provided with the portion of compressing tightly that is used for compressing tightly the bar laser instrument, and the height that highly is less than the briquetting of portion of compressing tightly, and the size of the portion of compressing tightly is unanimous with the size of bar laser instrument. The invention fully utilizes the structural characteristics of the CS heat sink, simplifies the structure of the clamp, not only can reduce or even avoid the occurrence of smile phenomenon, but also can ensure the consistency and uniformity of sintering by using the torque screwdriver, and improve the efficiency and the qualification rate of bar sintering.)

1. A sintering clamp for a high-power conduction cooling packaging structure bar laser is characterized by comprising a positioning base, a CS heat sink, a pressing block and a bar laser, wherein the positioning base comprises a first surface and a second surface, the first surface and the second surface are perpendicular to each other, a first limiting groove used for limiting the bottom of the CS heat sink is arranged on the first surface, and a second limiting groove used for limiting one end of the CS heat sink is arranged on the second surface;

the width of the pressing block is consistent with that of the bar laser, a pressing part for pressing the bar laser is arranged at one end of the lower surface of the pressing block, the height of the pressing part is lower than that of the pressing block, and the size of the pressing part is consistent with that of the bar laser;

the pressing block, the bar laser and the CS heat sink are connected together through fastening bolts.

2. The sintering fixture for the high-power conduction cooling packaging structure bar laser as claimed in claim 1, wherein one side of the upper part of the second limiting groove is provided with a limiting side edge for limiting the bar laser and the pressing block.

3. The high-power conduction cooling packaging structure bar laser sintering clamp as claimed in claim 1, wherein the CS heat sink is provided with a positioning hole, the pressing block is provided with a fastening hole, and the positioning hole and the fastening hole are fastened by a fastening bolt;

the pressing block is also provided with a clamping hole.

4. The high-power conduction cooling packaging structure bar laser sintering fixture as claimed in claim 1, wherein the positioning base is L-shaped, the included angle between the first surface and the horizontal plane is 30 degrees, and the included angle between the second surface and the horizontal plane is 60 degrees.

5. The high-power conduction cooling packaging structure bar laser sintering clamp as claimed in claim 1, wherein the positioning base is made of stainless steel, aluminum or copper, the CS heat sink is made of copper, and the pressing block is made of stainless steel, aluminum or copper.

6. The high power conduction cooling packaging structure bar laser sintering fixture as claimed in claim 1, wherein the pressing portion of the pressing block and the second surface of the positioning base are polished.

7. The high power conduction cooling packaging structure bar laser sintering fixture as claimed in claim 1, wherein the height of the compressing portion is lower than the height of the pressing block by the thickness of the bar laser.

8. The high power conduction cooling packaging structure bar laser sintering fixture as claimed in claim 1, wherein a groove is provided between the pressing block and the pressing portion.

9. The sintering method of the high-power conduction cooling packaging structure bar laser sintering clamp as claimed in claim 1, characterized by comprising the following steps:

step 1: firstly, placing a CS heat sink in a first limiting groove on a first surface of a positioning base, and then tightly attaching one end of the CS heat sink to a second limiting groove on a second surface of the positioning base;

step 2: placing the bar laser at the CS heat sink sintering position, adjusting the bar laser under a microscope to enable the bar laser to be located at the middle position of the CS heat sink sintering position, wherein the light emergent cavity surface of the bar laser is tightly attached to the surface of the second limiting groove of the positioning base, and the bar laser is ensured to be flush with the front surface of the CS heat sink;

and step 3: placing the pressing block on the upper surface of the CS heat sink, enabling the pressing part to be tightly attached to the N surface of the bar laser, enabling the pressing part to be equal to the bar laser in size, ensuring coincidence, enabling the lower surface of the pressing block to be tightly attached to the upper surface of the CS heat sink, aligning the fastening hole of the pressing block to the positioning hole of the CS heat sink, and fixing the pressing block, the bar laser and the CS heat sink through a fastening bolt;

and 4, step 4: and removing the pressing block, the bar laser and the CS heat sink which are fixed into a whole from the positioning base, further fastening by using a torsion change cone with set torsion, wherein the torsion value is 0.5-3.5 kgf, then placing the positioning base into vacuum reflow soldering equipment, and loading a set sintering curve for sintering.

10. The sintering method of the sintering fixture of the bar laser with the high-power conduction cooling packaging structure as claimed in claim 9, wherein in the step 3, the pressing block pressing part is tightly attached to the N surface of the bar laser, and the pressing block pressing part and the bar laser have the same size to ensure superposition;

in the step 4, before the pressing block, the bar laser and the CS heat sink which are fixed into a whole are moved away from the positioning base, an initial force is applied to fix the pressing block, the bar laser and the CS heat sink, then the pressing block, the bar laser and the CS heat sink are moved away from the base, and then the pressing block, the bar laser and the CS heat sink are further fastened by a torsion force changing cone with a set torsion force, so that the bar laser cannot slide out in the process.

Technical Field

The invention relates to a sintering clamp and a sintering method for a high-power conduction cooling packaging structure bar laser, and belongs to the field of semiconductor laser manufacturing.

Background

With the rapid development of semiconductor material technology and laser packaging technology, high-power laser diode single-tube devices and array devices are rapidly developed at home and abroad, and become the main direction for the application and expansion of the current laser industry. The semiconductor laser has the advantages of small volume, high efficiency, low cost and the like, so the semiconductor laser is widely applied to the technical fields of laser medical treatment, laser display, industrial processing, military weapons, solid lasers, fiber laser pumping and the like. Three main parameters of a semiconductor laser include output optical power, photoelectric conversion efficiency and reliability, and heat is one of the most important factors limiting further improvement of the three. Besides the influence of the properties of semiconductor laser materials on heat, the packaging quality of the laser is also a key factor influencing heat dissipation, and the welding between the laser and a heat sink is required to have the characteristics of firmness, no cavity, good heat conductivity, small stress, fatigue resistance, low thermal resistance and the like. Therefore, the process and method for packaging the semiconductor laser on the heat sink is one of the prerequisites and key technologies for high power semiconductor laser applications.

At present, the packaging form of the high-power semiconductor laser mainly comprises micro-channel and macro-channel water cooling, G-Stack and CS conduction cooling and the like, and an automatic sintering device and a reflow soldering sintering device are generally adopted, wherein the latter is more, so that a sintering clamp plays a key role in bar packaging.

In the bar-shaped chip sintering clamp for the high-power laser disclosed in the Chinese patent document CN205282874U, five spring probes are used for applying pressure to a bar, and threads and adjustable bolts are arranged for adjusting the pressure, but no reference standard exists in the process of adjusting balance to improve the smile effect, the adjustable bolts of the five probes need to be adjusted continuously, and the operation process is complicated; secondly, the consistency of bar sintering is difficult to guarantee, and the sintering yield may be influenced; in addition, the contact area of the spring probe is small, the whole bar cannot be completely covered, and sintering cavities are easily generated due to uneven pressure.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a sintering clamp of a high-power conduction cooling packaging structure bar laser and a sintering method thereof, which fully utilize the structural characteristics of a CS heat sink, simplify the structure of the clamp, reduce or even avoid the occurrence of smile phenomenon, ensure the consistency and uniformity of sintering by using a torque screwdriver, and improve the efficiency and the qualification rate of bar sintering.

The invention adopts the following technical scheme:

on one hand, the invention provides a sintering clamp of a high-power conduction cooling packaging structure bar laser, which comprises a positioning base, a CS heat sink, a pressing block and a bar laser, wherein the positioning base comprises a first surface and a second surface, the first surface and the second surface are arranged in a mutually perpendicular mode, a first limiting groove used for limiting the bottom of the CS heat sink is arranged on the first surface, and a second limiting groove used for limiting one end of the CS heat sink is arranged on the second surface;

the width of the pressing block is consistent with that of the bar laser, so that the whole surface of the bar laser is uniformly stressed, and the placing position is convenient to observe and adjust through a microscope in the placing process;

the pressing block, the bar laser and the CS heat sink are connected together through fastening bolts.

Preferably, one side of the upper part of the second limiting groove is provided with a limiting side edge for limiting the bar laser and the pressing block, and the bottom of the limiting side edge is preferably higher than the upper surface of the CS heat sink by about 50 μm, so that the light-emitting surfaces of the CS heat sink and the bar laser are flush, and the bar laser is positioned in the middle of the CS heat sink.

Preferably, the CS heat sink is provided with a positioning hole, the pressing block is provided with a fastening hole, and the positioning hole and the fastening hole are fastened by a fastening bolt;

the pressing block is also provided with a clamping hole, so that the pressing block can be conveniently clamped after sintering.

Preferably, the positioning base is L-shaped, the included angle between the first surface and the horizontal plane is 30 degrees, and the included angle between the second surface and the horizontal plane is 60 degrees. The 30-degree angle of the first surface provides a force parallel to the first surface, downward and vertical to the second surface for the CS heat sink to ensure that the CS heat sink is in close contact with the second surface; the 60 angle of the second facet enables the compact to provide a uniform force to the rowbar laser down its surface to ensure adequate compression.

Preferably, the positioning base is made of stainless steel, aluminum or copper, the CS heat sink is made of copper, and the pressing block is made of stainless steel, aluminum or copper.

Preferably, the pressing part of the pressing block and the second surface of the positioning base are polished, so that the light-emitting cavity surface of the bar laser can be protected from being damaged, and the light-emitting cavity surface of the bar laser can be flush with the surface of the second surface of the CS heat sink.

Preferably, the height of the compressing part is lower than that of the pressing block by the thickness of a bar laser, and the thickness is about 100 mu m, so that the stress balance can be ensured.

Preferably, a groove is formed between the pressing block and the pressing portion, so that the pressing portion and the laser batten are convenient to achieve the size consistency.

On the other hand, the invention also provides a sintering method of the bar laser sintering clamp of the high-power conduction cooling packaging structure, which comprises the following steps:

step 1: firstly, placing a CS heat sink in a first limiting groove on a first surface of a positioning base, and then tightly attaching one end of the CS heat sink to a second limiting groove on a second surface of the positioning base;

step 2: placing the bar laser at the CS heat sink sintering position, adjusting the bar laser under a microscope to enable the bar laser to be located at the middle position of the CS heat sink sintering position, wherein the light emergent cavity surface of the bar laser is tightly attached to the surface of the second limiting groove of the positioning base, and the bar laser is ensured to be flush with the front surface of the CS heat sink;

and step 3: placing the pressing block on the upper surface of the CS heat sink, enabling the pressing part to be tightly attached to the N surface of the bar laser, enabling the pressing part to be equal to the bar laser in size, ensuring coincidence, enabling the lower surface of the pressing block to be tightly attached to the upper surface of the CS heat sink, aligning the fastening hole of the pressing block to the positioning hole of the CS heat sink, and fixing the pressing block, the bar laser and the CS heat sink by using a fastening bolt;

and 4, step 4: and removing the pressing block, the batten laser and the CS heat sink which are fixed into a whole from the positioning base, further fastening by using a torsion screwdriver with set torsion, wherein the preferred torsion value is 0.5-3.5 kgf.cm, the size of the torsion value can be flexibly adjusted according to different processes, and in the twisting process, when the torsion value reaches the set value, the torsion screwdriver cannot rotate any further, so that the force applied each time can be kept consistent, then placing the torsion screwdriver in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.

Preferably, in the step 3, the pressing block pressing part is tightly attached to the N surface of the bar laser, and the sizes of the pressing block pressing part and the N surface are equivalent to ensure superposition;

in step 4, before the pressing block, the bar laser and the CS heat sink which are fixed into a whole are moved away from the positioning base, an initial force is applied to fix the pressing block, the bar laser and the CS heat sink, then the pressing block, the bar laser and the CS heat sink are moved away from the base, and then the pressing block, the bar laser and the CS heat sink are further fastened by a torsion force changing cone with a set torsion force, so that the bar laser cannot slide out in the process.

The invention has the beneficial effects that:

1) in the sintering clamp for the high-power conduction cooling packaging structure bar laser, the first surface and the second surface of the positioning base are mutually vertical, so that the protruding amount of the light-emitting surface of the bar relative to the front end of the heat sink can be strictly controlled.

2) The sintering clamp for the high-power conduction cooling packaging structure bar laser has the advantages of simple structure, practical function, low cost, simplicity and convenience in operation and good stability and repeatability, the CS heat sink and the bar laser are limited by the first surface and the second surface of the positioning base and the limiting grooves/limiting side edges, the bar laser and the CS heat sink which are limited can be accurately positioned, and consistency, uniformity and stability are guaranteed.

3) The pressing part at the front end of the pressing block, which is in contact with the N surface of the batten laser, has the same size as the batten laser, and the pressing is performed by the torque screwdriver, so that the pressing is uniform and consistent, the smile phenomenon is reduced or even avoided, and the pressing device is suitable for batch production.

4) The fixture makes full use of the characteristics of the CS heat sink, the CS heat sink can be used as the base, and the pressing block, the bar laser and the CS heat sink are fastened together, so that the structure of the fixture is simplified, the sintering time is shortened, and the production efficiency is improved.

5) The sintering clamp of the bar laser with the high-power conduction cooling packaging structure has the advantages that the packaging overall qualification rate is more than 98%, and the packaging stability and consistency are greatly improved by matching with a reflow furnace packaging process.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a bar laser sintering fixture of a high-power conduction cooling packaging structure of the present invention;

FIG. 2 is a schematic structural view of the positioning base in FIG. 1;

FIG. 3 is a schematic structural view of the compact of FIG. 1;

FIG. 4 is a side view of FIG. 1;

FIG. 5 is a schematic diagram of the matching relationship of the CS heat sink, the bar laser and the pressing block;

wherein: 1-positioning base, 2-CS heat sink, 3-bar laser, 4-pressing block, 5-fastening bolt, 101-first surface, 102-second surface, 103-first limiting groove, 104-second limiting groove, 105-limiting side edge, 401-pressing part, 402-fastening hole, 403-clamping hole and 404-groove.

The specific implementation mode is as follows:

in order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific examples, but not limited thereto, and the present invention is not described in detail and is in accordance with the conventional techniques in the art.