阅读说明：本技术 一种基于盲钻和元器件内压的多层板生产方法 (Multi-layer board production method based on blind drilling and component internal pressure ) 是由 刘胜贤 周国云 蹇锡高 方蕾 于 2019-11-15 设计创作，主要内容包括：本发明公开了一种基于盲钻和元器件内压的多层板生产方法，包括如下步骤：（1）在第一PBC板上设置电子元器件；（2）在半固化片上对应第一PCB板上的电子元器件进行开设出供电子元器件穿过的开窗；（3）在第二PCB板边缘四角钻设出第一定位孔，然后对应第一PCB板上的电子元器件进行钻设出供电子元器件容置的盲孔；（4）将半固化片置于第一PCB板设有电子元器件的端面上，且令第一PCB板上的电子元器件穿过半固化片上的开窗；再将第二PCB板对应设有盲孔的端面与半固化片贴合并令第一PCB板上的电子元器件对应套入第二PCB板上的盲孔内；（5）压合处理，将第一PCB板、半固化片和第二PCB板结合为一体，该方案实施可靠，操作简单且能够提高多层板使用可靠性。(The invention discloses a multilayer board production method based on blind drilling and internal pressure of components, which comprises the following steps: (1) arranging electronic components on the first PBC board; (2) opening a window for the electronic component to pass through on the prepreg corresponding to the electronic component on the first PCB; (3) drilling a first positioning hole at the four corners of the edge of the second PCB, and drilling a blind hole for accommodating an electronic component corresponding to the electronic component on the first PCB; (4) placing a prepreg on the end face of the first PCB provided with the electronic component, and enabling the electronic component on the first PCB to penetrate through a window on the prepreg; then, the end face of the second PCB, which is correspondingly provided with the blind hole, is attached to the prepreg, and the electronic component on the first PCB is correspondingly sleeved in the blind hole on the second PCB; (5) and the first PCB, the prepreg and the second PCB are combined into a whole through press-fitting treatment, the scheme is reliable to implement, the operation is simple, and the use reliability of the multilayer board can be improved.)

1. The utility model provides a multiply wood production method based on blind brill and components and parts internal pressure, the multiply wood include first PCB board, prepreg and the second PCB board of superpose in proper order at least, first PCB board on be equipped with electronic components, the second PCB board on be equipped with the blind hole that is used for holding electronic components, its characterized in that: the production method at least comprises the following steps:

(1) arranging electronic components on the first PBC board according to a preset circuit design layout;

(2) opening a window for the electronic component to pass through on the prepreg corresponding to the electronic component on the first PCB;

(3) drilling a first positioning hole at the four corners of the edge of the second PCB, and drilling a blind hole for accommodating an electronic component corresponding to the electronic component on the first PCB;

(4) placing a prepreg on the end face of the first PCB provided with the electronic component, and enabling the electronic component on the first PCB to penetrate through a window on the prepreg; then, the end face of the second PCB, which is correspondingly provided with the blind hole, is attached to the prepreg, and the electronic component on the first PCB is correspondingly sleeved in the blind hole on the second PCB;

(5) and (4) performing press-fit treatment, namely combining the first PCB, the prepreg and the second PCB into a whole.

2. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: and (2) after the windowing is finished, cleaning the burrs at the edge of the windowing by using a hot air gun.

3. The method for producing a multilayer board based on blind drilling and internal pressure of components according to claim 2Characterized in that: in the step (2), two prepregs are laminated, and the prepregs pass after the flock is cleaned; the cold press is used for cleaning pressed bubbles, and the pressure of the cold press is 1.0Kg/cm²The cold pressing speed was 1.5 m/min.

4. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: in the step (3), the angle of the drill point for drilling the blind hole is 85 +/-5 degrees.

5. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: the aperture of the first positioning hole is 3.175 mm.

6. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: and a second positioning hole is also formed in the edge of one side of the second PCB.

7. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: and after the first positioning hole is drilled in the second PCB, the second PCB is etched into a light plate, and then a blind hole is drilled.

8. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: the thickness of the first PCB is 1.5mm, and the thickness of the second PCB is 2 mm; the depth of the blind hole is 0.8 +/-0.1 mm, and the protruding height of the electronic component is not larger than the depth of the blind hole.

9. The multilayer board production method based on the blind drill and the internal pressure of the component as claimed in claim 1, is characterized in that: the model of the prepreg is 1080, and the glue content RC value of the prepreg is 68%.

10. A circuit board, characterized by: which is produced by the production process according to one of claims 1 to 9.

Technical Field

The invention relates to the technical field of circuit board production, in particular to a multilayer board production method based on blind drilling and component internal pressure.

Background

With the innovation of the production technology of the PCB, the electronic components designed by the product are packaged in the PCB at present, so as to prevent the electronic components (which are fragile) from being influenced by electromagnetic induction and natural influences such as external weathering and the like.

The prior production method generally has the following technical problems and defects:

1. when the electronic components are pressed, PP (polypropylene) is spun to the electronic components, so that the electronic components are polluted and cannot be normally scrapped in communication;

2. PP around the electronic component needs to be milled out, the electronic component is sleeved in the PP, and filiform substances are left in the board after the PP is milled out;

3. when the plate is pressed, air bubbles are generated between the PP and the lower cover plate.

Disclosure of Invention

In view of the situation of the prior art, the invention aims to provide a multilayer board production method based on blind drilling and component internal pressure, which improves the yield, the component stability and the production protection.

In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:

a multilayer board production method based on blind drilling and component internal pressure is provided, the multilayer board at least comprises a first PCB, a prepreg and a second PCB which are sequentially overlapped, an electronic component is arranged on the first PCB, a blind hole for containing the electronic component is arranged on the second PCB, and the production method at least comprises the following steps:

(1) arranging electronic components on the first PBC board according to a preset circuit design layout;

(2) opening a window for the electronic component to pass through on the prepreg corresponding to the electronic component on the first PCB;

(3) drilling a first positioning hole at the four corners of the edge of the second PCB, and drilling a blind hole for accommodating an electronic component corresponding to the electronic component on the first PCB;

(4) placing a prepreg on the end face of the first PCB provided with the electronic component, and enabling the electronic component on the first PCB to penetrate through a window on the prepreg; then, the end face of the second PCB, which is correspondingly provided with the blind hole, is attached to the prepreg, and the electronic component on the first PCB is correspondingly sleeved in the blind hole on the second PCB;

(5) and (4) performing press-fit treatment, namely combining the first PCB, the prepreg and the second PCB into a whole.

Further, in the step (2), after the windowing is finished, the method also comprises the step of cleaning the burrs at the edge of the windowing by using a hot air gun.

Preferably, in the step (2), two prepregs are attached to each other, and the prepregs pass after the flock is cleaned; the cold press is used for cleaning pressed bubbles, and the pressure of the cold press is 1.0Kg/cm²The cold pressing speed was 1.5 m/min.

Further, in the step (3), the angle of the drill point for drilling the blind hole is 85 +/-5 degrees.

Further, the aperture of the first positioning hole is 3.175 mm.

Furthermore, a second positioning hole is formed in the edge of one side of the second PCB.

Furthermore, after the first positioning hole is drilled in the second PCB, the second PCB is etched into a light plate, and then a blind hole is drilled.

Further, the thickness of the first PCB is 1.5mm, and the thickness of the second PCB is 2 mm; the depth of the blind hole is 0.8 +/-0.1 mm, and the protruding height of the electronic component is not larger than the depth of the blind hole.

Further, the type of the prepreg is 1080, and the glue content RC value of the prepreg is 68%.

A circuit board is prepared by the production method.

By adopting the technical scheme, compared with the prior art, the invention has the beneficial effects that: in the scheme of the invention, the prepreg is skillfully provided with the windowing for the electronic components to pass through, then the second PCB is provided with the blind holes for accommodating the components on the first PCB, and the processing process is supplemented with detailed processing steps, such as: the reliability and the stability of the front matching of each part are better by the operations of removing the burrs, removing the pressing bubbles and the like, so that the electronic components can be effectively protected, and the yield and the use reliability of the multilayer board are improved.

Drawings

The invention will be further explained with reference to the drawings and the detailed description below:

FIG. 1 is a schematic three-dimensional view illustration of a circuit board according to aspects of the present invention;

FIG. 2 is a schematic illustration of a first PCB board embodying aspects of the present invention with electronic components;

FIG. 3 is a schematic illustration of a window being opened in a prepreg according to an embodiment of the present invention;

FIG. 4 is a schematic illustration of a second PCB board with blind vias according to aspects of the present invention;

fig. 5 is a schematic diagram of positioning holes formed in the second PCB according to the embodiment of the present invention.

Detailed Description

As shown in one of fig. 1 to 5, the method for producing a multilayer board based on blind drilling and internal pressure of components in the present invention includes at least a first PCB 1, a prepreg 2 and a second PCB 3 stacked in sequence, where the first PCB 1 is provided with an electronic component 11, and the second PC3B is provided with a blind hole 33 for accommodating the electronic component, and the method at least includes the following steps:

(1) arranging an electronic component 11 on the first PBC board 1 according to a preset circuit design layout;

(2) a window 21 for the electronic component 11 to pass through is formed on the prepreg 2 corresponding to the electronic component 11 on the first PCB 1;

(3) drilling a first positioning hole 31 at the four corners of the edge of the second PCB 3, and then drilling a blind hole 33 for accommodating the electronic component 11 corresponding to the electronic component 11 on the first PCB 1;

(4) placing a prepreg 2 on the end face of the first PCB 1 provided with the electronic component 11, and enabling the electronic component 11 on the first PCB 1 to penetrate through the window 21 on the prepreg 2; then, the end face of the second PCB 3 correspondingly provided with the blind hole 33 is attached to the prepreg 2, and the electronic component 11 on the first PCB 1 is correspondingly sleeved into the blind hole 33 on the second PCB 3;

(5) and (3) performing press-fit treatment, namely combining the first PCB (printed circuit board) 1, the prepreg 2 and the second PCB 3 into a whole.

Wherein, in the step (2), after the windowing 21 is finished, the burrs at the edge of the windowing 21 are cleaned by a hot air gun; preferably, in the step (2), two prepregs 2 are attached to each other, and the two prepregs pass through after the flock is cleaned; the cold press is used for cleaning pressed bubbles, and the pressure of the cold press is 1.0Kg/cm²The cold pressing speed was 1.5 m/min.

In addition, as one of the methods for opening the blind hole 33 of the second PCB 3, in the step (3), the angle of the drill point for drilling the blind hole 33 is 85 ± 5 °, and the aperture of the first positioning hole 31 is 3.175 mm; further, a second positioning hole 32 is further formed in one side edge of the second PCB 3.

Further, after the first positioning hole 31 is drilled, the second PCB 3 is etched into a light plate, and then a blind hole 33 is drilled.

As an implementation example, the thickness of the first PCB 1 is 1.5mm, and the thickness of the second PCB 3 is 2 mm; the depth of the blind hole 33 is 0.8 +/-0.1 mm, and the protruding height of the electronic component 11 is not larger than the depth of the blind hole 33.

Further, the type of prepreg 2 is 1080, and the glue content RC value is 68%.

For the platen operation, it may be performed to integrate the first PCB board 1, the prepreg 2, and the second PCB board 3 with reference to the following parameters.

Wherein, the temperature unit is centigrade, the time unit is minute, and the pressure unit is PSI.

The above-mentioned embodiments are only one embodiment of the present invention, not all embodiments, and the accompanying drawings show the preferred embodiments of the present invention, but do not limit the scope of the present invention, and the present invention can be implemented in many different forms, and all equivalent designs made by using the contents of the description and the drawings of the present invention can be directly or indirectly applied to other related fields, and all the embodiments are within the scope of the present invention.