阅读说明：本技术 一种5g基站耦合器印制电路板制备方法 (Preparation method of printed circuit board of 5G base station coupler ) 是由 周刚 曾祥福 王欣 于 2020-01-13 设计创作，主要内容包括：本发明涉及一种5G基站耦合器印制电路板制备方法，所述制备方法用于制备用于5G基站的毫米波功率放大器的N层高频HDI板，其中N为大于6的偶数，所述制备方法包括如下步骤，第一步：L1、L2层的制作：选用TG170材质芯板制作，只做第L2层线路，L1层保留铜面；第二步：L3至L（N?2)层的制作：选用ROGERS材质芯板制作，包括前工序处理、第一次层压处理和锣边处理；第三步：L(N?1)、LN层的制作：选用TG170材质芯板制作，只做L（N?1）层线路，LN层保留铜面；第四步：组合层压处理：将第一步至第三步制作完成的层板依次叠放在一起，采用层压机进行第二次层压处理，使L1至LN层整体压合在一起；第五步：后流程处理：包括锣边、烤板、一钻、金属包边处理及后工序处理。本发明具有层压结合力强、信号传输损耗少、线路精细等优点。(The invention relates to a preparation method of a 5G base station coupler printed circuit board, which is used for preparing an N-layer high-frequency HDI board of a millimeter wave power amplifier for a 5G base station, wherein N is an even number greater than 6, and the preparation method comprises the following steps: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer; the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment; the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer; the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminator to integrally laminate the L1 to the LN layers; the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment. The invention has the advantages of strong lamination bonding force, less signal transmission loss, fine circuit and the like.)

1. A preparation method of a printed circuit board of a 5G base station coupler is characterized by comprising the following steps: the preparation method is used for preparing an N-layer high-frequency HDI board of a millimeter wave power amplifier for a 5G base station, wherein N is an even number greater than 6, and comprises the following steps,

the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;

the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;

the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer;

the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminator to integrally laminate the L1 to the LN layers;

the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.

2. The method for manufacturing a printed circuit board of a 5G base station coupler as claimed in claim 1, wherein the core boards of the L1 and L2 layers and the L (N-1) and LN layers are manufactured by using thin boards as core boards, and the core boards of the L1 and L2 layers and the L (N-1) and LN layers are designed with blind holes.

3. The method for preparing a printed circuit board of a 5G base station coupler as claimed in claim 2, wherein the core boards of the L1 and L2 layers and the L (N-1) and LN layers are prepared by the following steps: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI.

4. The method for preparing a printed circuit board of a 5G base station coupler as claimed in claim 3, wherein the core board of the L1 and L2 layers and the copper plate deposition process in the manufacturing process of the L (N-1) and LN layers are carried out by mechanical blind hole electroplating, and the mechanical blind hole electroplating is carried out by adopting a thin plate frame and VCP electroplating mode.

5. The method of manufacturing a 5G base station coupler printed circuit board of claim 1, wherein the pre-process treatment: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.

6. The method of claim 1, wherein the metal edge covering process in the fifth step comprises a metal edge covering process, and the metal edge covering position is a metal edge covering design except for a product, a process edge joint and a stamp hole area.

7. The method for manufacturing a 5G base station coupler printed circuit board according to claim 6, wherein after the metal edge covering process is completed, the copper pre-plating routing inner groove → copper plating board electric → outer dry film → graphic electric → routing half groove → film stripping → etching process is performed in sequence.

8. The method of claim 7, wherein the metal cladding process in the fifth step further comprises a secondary drilling step, which is performed before the etching step, for cutting off a portion where the metal cladding portion meets the non-metal cladding portion.

9. The method of claim 8, wherein the etching step is performed to remove copper flakes generated during the second drilling and cutting process, thereby ensuring that the metal edge is completely covered without copper flakes.

10. The method as claimed in claim 8, wherein the etching process is performed with a radio frequency line width control, and the compensation of the radio frequency line is determined according to the etching capability.

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a printed circuit board of a 5G base station coupler.

Background

With the advent of the 5G high-speed communication age, various types of high-frequency circuits, including high-frequency high-speed power amplifiers, have been developed. Appropriate printed circuit board materials are required as a foundation, and thus the demand for new high-speed printed circuit boards is increasing in the 5G era. Under 5G application of various frequencies, the material manufacturing process and the product yield of the circuit board face new challenges. Such as 6G products, and millimeter wave frequencies. At present, a multilayer high-frequency HDI board for a millimeter wave power amplifier of a 5G base station is not available for a while, and therefore, a preparation method of a 5G base station coupler printed circuit board is needed to be developed.

Disclosure of Invention

The invention provides a preparation method of a printed circuit board of a 5G base station coupler, wherein the circuit board prepared by the preparation method is a multilayer high-frequency HDI board suitable for a millimeter wave power amplifier of a 5G base station, and has the advantages of strong lamination bonding force and less signal transmission loss.

In order to achieve the above purpose, the following technical solutions are provided.

A manufacturing method of a 5G base station coupler printed circuit board for manufacturing an N-layer high frequency HDI board for a millimeter wave power amplifier of a 5G base station, wherein N is an even number greater than 6, the manufacturing method comprising the steps of,

the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;

the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;

the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer;

the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminating machine to integrally press the L1 to the LN layers together, wherein the second lamination treatment is mixed lamination treatment, namely pressing the TG170 core plates in the first step and the third step and the ROGERS core plates in the second step together;

the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.

The invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L (N-1), LN layers and L3 to L (N-2) layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L (N-2) layers, then respectively stacking L1 and L2 layers and the L (N-1) and LN layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the core board mixed pressing treatment of the ROGERS core boards, the TG170 core boards on the top and the TG170 core boards on the bottom, wherein the copper foils used by the ROGERS high-frequency materials need radio-frequency lines on the high-frequency boards and also need to consider the binding force between the high-frequency boards and PP, therefore, an L2 layer circuit is prepared on one side of a substrate, and the rough surface of the side surface of a circuit, the glue flowing gap between the glue flowing channel and the circuit can improve the bonding force between the glue flowing channel and the L3-L (N-2) layer, and the bonding force between the glue flowing channel and the circuit and other layers is ensured by combining and pressing, so that the thickness of the dielectric layer is uniform, and the signal transmission loss is reduced.

Further, according to the method for manufacturing a 5G base station coupler printed circuit board of claim 1, the core boards of the L1 and L2 layers and the L (N-1) and LN layers are manufactured by using thin boards as core boards, and the core boards of the L1 and L2 layers and the L (N-1) and LN layers are designed with blind holes.

Furthermore, the core boards of the L1 and L2 layers and the manufacturing processes of the L (N-1) and LN layers are as follows: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI.

Furthermore, mechanical blind hole electroplating is adopted in the copper plate electroplating process in the manufacturing process of the core plates of the L1 and L2 layers and the L (N-1) and LN layers, and the mechanical blind hole electroplating is electroplating in a thin plate frame and VCP electroplating mode.

Further, the pre-process treatment: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.

Further, the metal edge covering treatment in the fifth step comprises a metal edge covering process, wherein the metal edge covering position is a metal edge covering design except for the product, the process edge connecting part and the stamp hole area. As is well known, a printed circuit board includes a plurality of unit circuit boards for shipment to a user, and in the process of manufacturing the printed circuit board, a technical edge joint is provided between the unit circuit boards for connecting adjacent unit circuit boards and facilitating cutting and removal of a finished unit circuit board, which is used for shipment to the user, and thus, the unit circuit board is called a product. The metal edge covering positions are except for the product, the technical edge connecting position and the stamp hole area, namely except for the technical edge connecting position and the stamp area between the unit circuit board and the adjacent unit circuit board.

Further, after the metal edge covering process is completed, the inner groove before copper plating → the copper plating plate electric → the outer dry film → the pattern electric → the half groove → the film removing → the etching process is sequentially performed.

Further, the metal-covered edge treatment in the fifth step may further include a secondary drilling step of cutting a position where the metal-covered edge position meets the non-metal-covered edge position, before the etching step.

Furthermore, the etching process enables the copper sheet generated in the secondary drilling and cutting process to disappear after etching, and the metal edge wrapping is ensured to be complete without copper sheet tilting.

Further, during the etching process, the radio frequency line width is controlled, and the compensation size of the radio frequency line is determined according to the etching capacity.

Compared with the prior art, the preparation method of the printed circuit board of the 5G base station coupler has the following beneficial effects:

the invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L (N-1), LN layers and L3 to L (N-2) layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L (N-2) layers, then respectively stacking L1 and L2 layers and the L (N-1) and LN layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the core board mixed pressing treatment of the ROGERS core boards, the TG170 core boards on the top and the TG170 core boards on the bottom, wherein the copper foils used by the ROGERS high-frequency materials need radio-frequency lines on the high-frequency boards and also need to consider the binding force between the high-frequency boards and PP, therefore, an L2 layer circuit is prepared on one side of a substrate, and the rough surface of the side surface of a circuit, the glue flowing gap between the glue flowing channel and the circuit can improve the bonding force between the glue flowing channel and the L3-L (N-2) layer, and the bonding force between the glue flowing channel and the circuit and other layers is ensured by combining and pressing, so that the thickness of the dielectric layer is uniform, and the signal transmission loss is reduced.

Detailed Description

The method for manufacturing the printed circuit board of the 5G base station coupler according to the present invention will be described in further detail with reference to the following embodiments.