阅读说明：本技术 一种半导体激光器模条快速倒条装置及倒条方法 (Semiconductor laser module strip rapid strip-reversing device and strip-reversing method ) 是由 张广明 赵克宁 汤庆敏 贾旭涛 于 2018-07-27 设计创作，主要内容包括：一种半导体激光器模条快速倒条装置及倒条方法,包括：底座、模条、料盘、料盘定位机构、以及模条驱动机构。模条驱动机构驱动各个模条沿水平方向滑移至另一个料盘中并使模条的尾端另一个料盘上的定位块Ⅱ相接触后,将另一个料盘从底座上取下,之后将该料盘水平旋转180°即使其内部各个模条在尾端通过定位块Ⅱ定位下旋转180°,实现了模条的快速倒条操作,结构简单,成本低廉,操作方便,满足一次实现多个模条的倒条工作,效率较以前手动倒条提高了几十倍,同时使用倒条装置倒条过程中,手不直接与模条接触,避免了人为因素造成的产品污染,模条在整个倒条过程中,没有脱离料盘,避免了产品从模条洒落现象,大大的提高了产品的合格率。(A semiconductor laser module strip fast strip-reversing device and a strip-reversing method comprise: the device comprises a base, a die strip, a material tray positioning mechanism and a die strip driving mechanism. Mould strip actuating mechanism drive each mould strip slide to another charging tray along the horizontal direction and make the back of the II locating pieces on another charging tray of tail end of mould strip contact, take off another charging tray from the base, later with 180 even it is rotatory 180 of its inside each mould strip through II locating pieces location down at the tail end, the quick strip operation of falling of mould strip has been realized, moreover, the steam generator is simple in structure, therefore, the carrier wave prepaid electric energy meter is low in cost, and convenient for operation, satisfy the strip work of falling of once realizing a plurality of mould strips, efficiency has improved tens times than before manually, use simultaneously and fall the strip in-process of strip device, the hand is direct and the contact of mould strip, the product pollution that the human factor caused has been avoided, the mould strip is at whole strip in-process that falls, do not break away from the charging tray, the phenomenon of spilling from the mould strip has been avoided, great improvement the qualification rate.)

1. The utility model provides a semiconductor laser mould strip device of falling strip fast which characterized in that includes:

a base (1) disposed horizontally;

the die strip (12) is of a cuboid structure, a plurality of large round holes (121) are formed at intervals along the length direction, small round holes (122) are coaxially formed in the lower ends of the large round holes (121), positioning protrusions II (123) are formed in the inner walls of the large round holes (121), the inner diameter of each large round hole (121) is matched with the outer diameter of the outer circle of a tube seat (15) of the semiconductor laser, the inner diameter of each small round hole (122) is smaller than the outer diameter of the outer circle of the tube seat (15), the tube seat (15) is inserted into the large round holes (121), and the positioning protrusions II (123) are clamped in tube seat grooves (151) in the tube seat (15;

the upper end of the charging tray (11) is provided with a plurality of mutually parallel grooves I (111) at intervals, the grooves I (111) are horizontally arranged along the left-right direction, the upper end of each groove I (111) is provided with a die strip positioning mechanism for enabling the die strip (12) to slide along the left-right direction, and the left side end or the right side end of the die strip positioning mechanism is provided with a positioning block II (113);

the tray positioning mechanism is arranged on the base (1), the two trays (11) are arranged on the base (1) in an end-to-end mode along the left-right direction through the tray positioning mechanism, the positioning blocks II (113) of the trays (11) on the left side of the base (1) are positioned at the left side end of the trays (11), the positioning blocks II (113) of the trays (11) on the right side of the base (1) are positioned at the right side end of the trays (11), the corresponding grooves I (11) on the two trays (11) are mutually positioned on the same horizontal line, a mold strip (12) is fixed on each groove I (111) on one tray (11) through the mold strip positioning mechanism, pins at the lower ends of tube seats (15) in the mold strips (12) are positioned in the grooves I (111), and the head end of each mold strip (12) is in contact with the positioning blocks II (113) on the trays (11); and

and the die strip driving mechanism is arranged on the base (1), drives each die strip (12) in the material tray (11) provided with the die strips (12) to slide to a corresponding die strip positioning mechanism in the other material tray (11) along the horizontal direction, and enables the tail end of each die strip (12) to be in contact with a positioning block II (113) on the other material tray (11).

2. The semiconductor laser module strip fast strip pouring device according to claim 1, characterized in that: mould strip positioning mechanism is including being fixed in the protruding I (112) of location that the length direction of both sides just following recess I (111) respectively sets up around every recess I (111), and mould strip (12) are located between two adjacent protruding I (112) of location, and the protruding I (112) sliding friction contact in the location of homonymy respectively in the front and back both sides of mould strip (12).

3. The semiconductor laser module strip fast strip pouring device according to claim 1, characterized in that: charging tray positioning mechanism includes and sets up location strip (5) on base (1) along base (1) left and right sides direction, and the preceding terminal surface perpendicular to base (1) of location strip (5), the rear end face of two charging trays (11) contacts with the preceding terminal surface of location strip (5), and the tail end of location strip (5) is fixed with locating piece I (7), and the medial extremity face of locating piece I (7) contacts with the side end face of charging tray (11).

4. The semiconductor laser module strip fast strip pouring device according to claim 1, characterized in that: mould strip actuating mechanism includes vertical locating plate (3), the push rod group of horizontal cartridge on locating plate (3) of installing on base (1), and push rod group comprises a plurality of push rods (4) that are parallel to each other that the interval set up, and push rod group rear end is fixed on slide (8), direction level is provided with guide rail (14) about following on base (1), slider (13) are installed to slide (8) lower extreme, slider (13) slidable mounting is on guide rail (14), and each recess I (111) on each push rod (14) and charging tray (11) are corresponding, and the length of push rod (14) is greater than the length of charging tray (11), and push rod (11) promote when stretching out mould strip (12) and slide about along the direction.

5. The semiconductor laser module strip fast strip pouring device according to claim 1, characterized in that: four corners of the lower end of the base (1) are respectively provided with feet (2).

6. The semiconductor laser module strip fast strip pouring device according to claim 3, wherein: a plurality of long holes (6) arranged in the front-back direction are formed in the positioning strip (5), and the positioning strip (5) is fixed on the base (1) after the screw penetrates through the long holes (6).

7. The semiconductor laser module strip fast strip pouring device according to claim 4, wherein: and a handle (9) is arranged on the sliding seat (8).

8. The semiconductor laser module strip fast strip pouring device according to claim 4, wherein: an elastic buffer (10) is arranged on the base (1), and when the sliding seat (8) slides to the head end of the push rod (4) and is not exposed out of the side end of the positioning plate (3), the sliding seat (8) is contacted with the elastic buffer (10).

9. The semiconductor laser module strip fast strip pouring device according to claim 4, wherein: four edges of charging tray (11) upper end are provided with locating pin (114) respectively, and four edges of charging tray (11) lower extreme are provided with respectively with locating pin (114) coaxial locating hole, and charging tray (11) bottom is provided with recess II (115) along left right direction, the degree of depth of recess II (115) is greater than the height of protruding I (112) in location, and setting is piled up from bottom to top in N charging tray (11), and the locating hole cartridge that is located charging tray (11) of upper end is in locating pin (114) of charging tray (11) that are located the lower extreme, and protruding I (112) cartridge in each location on charging tray (11) that are located the lower extreme is in recess II (115) of charging tray (11) that are located the upper end, and N is more than or equal to 2 positive integer, corresponds from bottom to top on locating plate (3.

10. A bar guiding method using the semiconductor laser module bar fast bar-reversing device of claim 1, characterized by comprising the steps of:

a) two material trays (11) are arranged on the base (1) in an end-to-end manner along the left and right directions through a material tray positioning mechanism;

b) placing the die strips (12) provided with the tube seats (15) on a material tray (11), and enabling the head ends of the die strips (12) to be in contact with a positioning block II (113) on the material tray (11);

c) each mould strip (12) is driven by the mould strip driving mechanism to slide to the other material tray (11) along the horizontal direction, and a positioning block II (113) on the other material tray (11) at the tail end of the mould strip (12) is contacted;

d) and taking the other material tray (11) off the base (1) and horizontally rotating the material tray (11) by 180 degrees.

Technical Field

The invention relates to the technical field of semiconductor laser packaging, in particular to a device for quickly inverting a semiconductor laser module bar.

Background

After decades of development, semiconductor lasers are more and more well known to the society and have been applied in multiple fields, the photoelectric conversion efficiency of semiconductor lasers is more than 60%, which is far higher than that of other similar products, the energy consumption is low, the heat accumulation in devices is less, the service life is long, the collimation is good, the illumination distance is long, and the like, and the semiconductor lasers are more and more widely applied as a new technology in the similar industries of the society. Semiconductor lasers have various advantages, which make them increasingly receive wide attention from all the world.

The semiconductor laser needs to be packaged through a plurality of processes in the production process, but the semiconductor laser cannot be isolated in the packaging process due to the fact that the semiconductor laser has the characteristics determined by the appearance characteristics and the operating characteristics of the semiconductor laser

The semiconductor laser device has certain precision characteristics, so that the whole packaging process is realized by a special carrier in the production process, and the semiconductor laser device is suitable for different packaging processes.

In the packaging process of the semiconductor laser, a tube seat of the semiconductor laser is firstly fixed on a carrier die strip, and the die strip plays a role in fixing and protecting the semiconductor laser in the production process. Meanwhile, the laser can be kept in the same direction on the same mould strip through the positioning action of the mould strip. In order to meet the requirement of automatic production, the die strips are arranged in the material tray in order by the material tray matched with the die strips, and a plurality of die strips can be placed on each material tray, so that lasers in the material trays can keep consistent directions.

Because the requirements on the direction of a product are different in the production processes of different working procedures, the product needs to be rotated 180 degrees for strip inversion before being transferred from one working procedure to another working procedure, and the conventional method for rotating the strip inversion is to manually take out the mould strip from a charging tray, rotate the mould strip 180 degrees left and right and then place the mould strip in the charging tray. Only one can be turned at each time, the operation is not only low in efficiency, but also easy to cause product pollution and product scattering, and the requirement of batch production cannot be met. Therefore, there is a need for a device that is easy to operate and that can be used to perform strip flipping efficiently and quickly during the packaging of semiconductor devices.

Disclosure of Invention

In order to overcome the defects of the technology, the invention provides the semiconductor laser module bar rapid bar-reversing device which is simple and convenient to operate and improves the module bar rotating bar-reversing efficiency.

The technical scheme adopted by the invention for overcoming the technical problems is as follows:

a semiconductor laser module strip fast strip-reversing device comprises:

a base disposed horizontally;

the die strip is of a cuboid structure, a plurality of large round holes are formed at intervals along the length direction, small round holes are coaxially formed at the lower ends of the large round holes, positioning protrusions II are arranged on the inner walls of the large round holes, the inner diameter of each large round hole is matched with the outer diameter of the outer circle of a tube seat of the semiconductor laser, the inner diameter of each small round hole is smaller than the outer diameter of the outer circle of the tube seat, the tube seat is inserted into the large round hole, and the positioning protrusions II are clamped in tube seat grooves in the;

the upper end of the charging tray is provided with a plurality of mutually parallel grooves I at intervals, the grooves I are horizontally arranged along the left-right direction, the upper end of each groove I is provided with a die strip positioning mechanism for enabling a die strip to slide along the left-right direction, and the left side end or the right side end of the die strip positioning mechanism is provided with a positioning block II;

the material tray positioning mechanism is arranged on the base, the two material trays are arranged on the base in an end-to-end mode along the left-right direction through the material tray positioning mechanism, the positioning block II of the material tray positioned on the left side of the base is positioned at the left side end of the material tray, the positioning block II of the material tray positioned on the right side of the base is positioned at the right side end of the material tray, the corresponding grooves I on the two material trays are mutually positioned on the same horizontal line, a mould strip is fixed on each groove I on one material tray through the mould strip positioning mechanism, pins at the lower end of each tube seat in the mould strip are positioned in the grooves I, and the head end of each mould strip; and

and the die strip driving mechanism is arranged on the base and drives each die strip in the material tray provided with the die strips to slide to a corresponding die strip positioning mechanism in another material tray along the horizontal direction, and the tail ends of the die strips are contacted with the positioning blocks II on the other material tray.

Furthermore, above-mentioned mould strip positioning mechanism is including being fixed in the protruding I of location that the length direction of every recess I set up around every recess I both sides and respectively, and the mould strip is located between two adjacent protruding I of location, and the both sides are in protruding I sliding friction contact of location of homonymy respectively around the mould strip.

Furthermore, the material tray positioning mechanism comprises positioning strips arranged on the base in the left-right direction of the base, the front end faces of the positioning strips are perpendicular to the base, the rear end faces of the two material trays are in contact with the front end faces of the positioning strips, positioning blocks I are fixed at the tail ends of the positioning strips, and the inner side end faces of the positioning blocks I are in contact with the side end faces of the material trays.

Furthermore, above-mentioned mould strip actuating mechanism includes vertical locating plate, the horizontal cartridge push rod group on the locating plate of installing on the base, and push rod group comprises a plurality of push rods that are parallel to each other that the interval set up, and push rod group rear end is fixed in on the slide, direction level is provided with the guide rail about following on the base, the slider is installed to the slide lower extreme, slider slidable mounting is on the guide rail, and each I corresponding of each recess on each push rod and the charging tray, the length of push rod is greater than the length of charging tray, and the push rod promotes the mould strip when stretching out and slides along controlling the direction.

Preferably, four corners of the lower end of the base are respectively provided with feet.

Preferably, the positioning bar is provided with a plurality of long holes arranged along the front-back direction, and the screw penetrates through the long holes to fix the positioning bar on the base.

Preferably, the slider is provided with a handle.

Preferably, the base is provided with an elastic buffer, and when the sliding seat slides to the position that the head end of the push rod is not exposed from the side end of the positioning plate, the sliding seat is contacted with the elastic buffer.

Preferably, four edges on the upper end of the charging tray are respectively provided with a positioning pin, four edges on the lower end of the charging tray are respectively provided with a positioning hole which is coaxial with the positioning pin, the bottom of the charging tray is provided with a groove II along the left-right direction, the depth of the groove II is greater than the height of the positioning bulge I, the N charging trays are stacked from bottom to top, the positioning hole of the charging tray on the upper end is inserted in the positioning pin of the charging tray on the lower end, the positioning bulges I on the charging tray on the lower end are inserted in the grooves II of the charging tray on the upper end, N is a positive integer greater than or equal to 2, and N push.

The invention also relates to a bar guiding method using the semiconductor laser module bar fast bar-reversing device, which comprises the following steps:

a) two material trays are arranged on the base in an end-to-end manner along the left and right directions through a material tray positioning mechanism;

b) placing the die strips provided with the tube seats on a material tray, and enabling the head ends of the die strips to be in contact with a positioning block II on the material tray;

c) each die strip is driven by the die strip driving mechanism to slide to the other material tray along the horizontal direction, and a positioning block II on the other material tray at the tail end of each die strip is in contact with the positioning block II;

d) and taking the other tray off the base and horizontally rotating the tray by 180 degrees.

The invention has the beneficial effects that: mould strip actuating mechanism drive each mould strip slide to another charging tray along the horizontal direction and make the back of the II locating pieces on another charging tray of tail end of mould strip contact, take off another charging tray from the base, later with 180 even it is rotatory 180 of its inside each mould strip through II locating pieces location down at the tail end, the quick strip operation of falling of mould strip has been realized, moreover, the steam generator is simple in structure, therefore, the carrier wave prepaid electric energy meter is low in cost, and convenient for operation, satisfy the strip work of falling of once realizing a plurality of mould strips, efficiency has improved tens times than before manually, use simultaneously and fall the strip in-process of strip device, the hand is direct and the contact of mould strip, the product pollution that the human factor caused has been avoided, the mould strip is at whole strip in-process that falls, do not break away from the charging tray, the phenomenon of spilling from the mould strip has been avoided, great improvement the qualification rate.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic perspective view of a base according to the present invention;

FIG. 3 is a schematic perspective view of the guide rail of the present invention;

FIG. 4 is a schematic perspective view of a tray according to the present invention;

FIG. 5 is a schematic perspective view of a mold strip of the present invention;

FIG. 6 is an enlarged schematic view of a die strip of the present invention;

FIG. 7 is a schematic view of the mounting of the mold strip of the present invention to a tray;

FIG. 8 is a schematic perspective view of a laser stem of the present invention;

FIG. 9 is a schematic perspective view of a push rod-pushing mold strip according to the present invention;

in the drawing, 1, a base 2, a ground pin 3, a positioning plate 4, a push rod 5, a positioning strip 6, a long hole 7, a positioning block I8, a sliding seat 9, a handle 10, an elastic buffer 11, a material disc 12, a die strip 13, a sliding block 14, a guide rail 15, a pipe seat 111, a groove I112, a positioning protrusion I113, a positioning block II 114, a positioning pin 115, a groove II 121, a large circular hole 122, a small circular hole 123, a positioning protrusion II 151 and a pipe seat groove are arranged.

Detailed Description

The present invention will be further described with reference to fig. 1 to 9.

A semiconductor laser module strip fast strip-reversing device comprises: a base 1 horizontally disposed; the die strip 12 is of a cuboid structure, a plurality of large round holes 121 are formed at intervals along the length direction, small round holes 122 are coaxially formed at the lower ends of the large round holes 121, positioning protrusions II 123 are arranged on the inner walls of the large round holes 121, the inner diameter of each large round hole 121 is matched with the outer diameter of the outer circle of a tube seat 15 of the semiconductor laser, the inner diameter of each small round hole 122 is smaller than the outer diameter of the outer circle of the tube seat 15, the tube seat 15 is inserted into the large round holes 121, and the positioning protrusions II 123 are clamped in tube seat grooves 151 in the tube seat 15; the upper end of the charging tray 11 is provided with a plurality of mutually parallel grooves I111 at intervals, the grooves I111 are horizontally arranged along the left-right direction, the upper end of each groove I111 is provided with a die strip positioning mechanism for enabling the die strips 12 to slide along the left-right direction, and the left side end or the right side end of the die strip positioning mechanism is provided with a positioning block II 113; the tray positioning mechanism is arranged on the base 1, the two trays 11 are arranged on the base 1 in an end-to-end mode along the left-right direction through the tray positioning mechanism, the positioning block II 113 of the tray 11 positioned on the left side of the base 1 is positioned at the left side end of the tray 11, the positioning block II 113 of the tray 11 positioned on the right side of the base 1 is positioned at the right side end of the tray 11, the corresponding grooves I11 on the two trays 11 are mutually positioned on the same horizontal line, a mold strip 12 is fixed on each groove I111 on one tray 11 through the mold strip positioning mechanism, pins at the lower end of each tube seat 15 in each mold strip 12 are positioned in the grooves I111, and the head end of each mold strip 12 is contacted with the positioning block II 113 on the tray; and the die strip driving mechanism is arranged on the base 1 and drives each die strip 12 in the material tray 11 provided with the die strips 12 to slide to a corresponding die strip positioning mechanism in the other material tray 11 along the horizontal direction, and the tail end of each die strip 12 is in contact with a positioning block II 113 on the other material tray 11. The lower end of the large circular hole 121 is coaxially provided with a small circular hole 122, so that the interface surface is a circular table top, and the lower end surface of the tube seat 15 is in contact with the table top to prevent the tube seat 15 from falling off. After the die strip driving mechanism drives each die strip 12 to slide to the other tray 11 along the horizontal direction and enables the positioning block II 113 on the other tray 11 at the tail end of the die strip 12 to be contacted, the other material tray 11 is taken down from the base 1, then the material tray 11 is horizontally rotated for 180 degrees, even though each die strip 12 in the material tray is positioned at the tail end by the positioning block II 113 for 180 degrees, the rapid strip pouring operation of the die strips 12 is realized, the structure is simple, the cost is low, the operation is convenient, the requirement of realizing the strip pouring operation of a plurality of die strips 12 at one time is met, the efficiency is improved by dozens of times compared with the prior manual strip pouring, meanwhile, in the process of pouring the strips by using the strip pouring device, hands are not directly contacted with the mould strips 12, so that the product pollution caused by human factors is avoided, the mould strips 12 are not separated from the charging tray 11 in the whole strip pouring process, the phenomenon that the products are scattered from the mould strips 12 is avoided, and the qualified rate of the products is greatly improved.