Straight array type semiconductor laser light source heat dissipation device
阅读说明:本技术 一种直阵列式半导体激光光源散热装置 (Straight array type semiconductor laser light source heat dissipation device ) 是由 陶红 龙绮婷 于 2019-11-01 设计创作,主要内容包括:本发明属于激光散热技术领域,尤其为一种直阵列式半导体激光光源散热装置,包括基板,所述基板前端面设有激光组件,所述基板上设有散热机构,所述散热机构包括第一风管和风机,所述风机与外部电源电性连接,所述风机固定在所述基板后侧端面,所述风机输出端固定连接有连接管,所述连接管另一端密封连接有第三风管;通过将第二风管设置在每个激光组件中的发光体之间,通过风机产生的风能够进入到第三风管,并进入到第一风管内循环,风能够从第二风管上的聚风管排出,并吹到每个发光体上进行散热,这种设置结构简单,能够针对每个发光体进行散热,使发光的每个区域散热均匀,提高激光光源散热的效果。(The invention belongs to the technical field of laser heat dissipation, and particularly relates to a straight array type semiconductor laser light source heat dissipation device which comprises a substrate, wherein a laser assembly is arranged on the front end face of the substrate, a heat dissipation mechanism is arranged on the substrate and comprises a first air pipe and a fan, the fan is electrically connected with an external power supply, the fan is fixed on the end face of the rear side of the substrate, the output end of the fan is fixedly connected with a connecting pipe, and the other end of the connecting pipe is hermetically connected with a third air pipe; through setting up the second tuber pipe between the luminous body of every laser unit, the wind that produces through the fan can enter into the third tuber pipe to enter into first tuber pipe inner loop, wind can follow the tuber pipe of gathering on the second tuber pipe and discharge, and blow and dispel the heat on every luminous body, this kind of setting simple structure, can dispel the heat to every luminous body, make luminous every regional heat dissipation even, improve the radiating effect of laser light source.)
1. The utility model provides a straight array semiconductor laser light source heat abstractor, includes base plate (1), the terminal surface is equipped with laser subassembly (11) before base plate (1), its characterized in that: the heat dissipation device is characterized in that a heat dissipation mechanism (2) is arranged on the substrate (1), the heat dissipation mechanism (2) comprises a first air pipe (21) and a fan (25), the fan (25) is electrically connected with an external power supply, the fan (25) is fixed on the rear end face of the substrate (1), the output end of the fan (25) is fixedly connected with a connecting pipe (24), the other end of the connecting pipe (24) is hermetically connected with a third air pipe (23), the other end of the third air pipe (23) penetrates through the substrate (1) and is hermetically connected with the first air pipe (21), the inner side of the first air pipe (21) is hermetically connected with a plurality of second air pipes (22), the plurality of second air pipes (22) correspond to the laser assembly (11), the outer walls of the second air pipes (22) are fixedly connected with air gathering pipes (221), and air holes (2211) are formed in the air gathering pipes (221) in a, the air hole (2211) is communicated with a cavity inside the second air pipe (22), the front end face of the substrate (1) is fixedly connected with a refrigerating sheet (3), and the refrigerating sheet (3) is electrically connected with an external power supply;
terminal surface fixedly connected with fixed plate (4) before base plate (1), fixed plate (4) top can be dismantled and be connected with backup pad (5), fixed plate (4) with backup pad (5) are hollow rectangle form, just laser subassembly (11) are located fixed plate (4) with backup pad (5) are inboard, backup pad (5) top fixedly connected with a plurality of fore-set (51), a plurality of fore-set (51) other end with first tuber pipe (21) fixed connection, fixed plate (4) both sides fixedly connected with connecting plate (41), two adjusting hole (411) have all been run through to connecting plate (41), backup pad (5) both sides all seted up with adjusting corresponding screw hole (501) of hole (411).
2. The heat dissipation device of claim 1, wherein: the first air duct (21) is rectangular.
3. The heat dissipation device of claim 1, wherein: the number of the opening ends of the third air pipes (23) is two, and the opening ends of the third air pipes are respectively positioned at two sides of the first air pipe (21).
4. The heat dissipation device of claim 1, wherein: the third air pipe (23) is a hose.
5. The heat dissipation device of claim 1, wherein: the air gathering pipe (221) is obliquely arranged on the second air pipe (22).
6. The heat dissipation device of claim 1, wherein: the front end surface of the air gathering pipe (221) is provided with a conical surface (2212).
7. The heat dissipation device of claim 1, wherein: the height of the connecting plate (41) is three times the height of the support plate (5).
8. The heat dissipation device of claim 1, wherein: the adjusting hole (411) is a waist-shaped hole.
9. The heat dissipation device of claim 1, wherein: the positioning plate is characterized in that positioning pins (53) are fixedly connected to two sides of the bottom of the supporting plate (5), positioning holes (401) are formed in two sides of the top of the fixing plate (4), and the positioning pins (53) are inserted into the positioning holes (401).
10. The heat dissipation device of claim 1, wherein: the inner side of the threaded hole (501) is in threaded connection with a fixing bolt (52), and the fixing bolt (52) is located in the adjusting hole (411).
Technical Field
The invention belongs to the technical field of laser heat dissipation, and particularly relates to a straight array type semiconductor laser light source heat dissipation device.
Background
The laser array, also known as an integral laser semiconductor array, is composed of a plurality of luminous bodies which are arranged in parallel on a crystal material, and a laser light source is used as an excellent coherent light source and has the characteristics of good monochromaticity, strong directivity, high luminous flux and the like.
Chinese patent discloses a laser light source heat abstractor, (No. CN203787762U), this patent technique can pass through the semiconductor refrigeration piece with the heat that laser diode produced and absorb, the heat that semiconductor refrigeration piece absorbed loops through the heat pipe simultaneously, the conduction of fin, finally take away the heat by radiator fan, make a plurality of laser diode work under normal temperature always, but when a plurality of luminous bodies work, because the regional heat density of connection between the luminous body is big, thermal interference is strong, can't effectual fully dispel the heat with the region between every luminous body through the refrigeration piece, easily lead to the heat dissipation inhomogeneous or the heat dissipation is slow, the radiating effect that causes some laser diode is not good, influence the use.
Disclosure of Invention
To solve the problems set forth in the background art described above. The invention provides a straight array type semiconductor laser light source heat dissipation device which has the characteristic of dissipating heat for each heat source.
In order to achieve the purpose, the invention provides the following technical scheme: a straight array type semiconductor laser light source heat dissipation device comprises a substrate, wherein a laser assembly is arranged on the front end face of the substrate, a heat dissipation mechanism is arranged on the substrate and comprises a first air pipe and a fan, the fan is electrically connected with an external power supply, the fan is fixed on the rear end face of the substrate, a connecting pipe is fixedly connected with the output end of the fan, the other end of the connecting pipe is hermetically connected with a third air pipe, the other end of the third air pipe penetrates through the substrate and is hermetically connected with the first air pipe, a plurality of second air pipes are hermetically connected to the inner side of the first air pipe, the second air pipes correspond to the laser assembly, a plurality of air gathering pipes are fixedly connected to the outer walls of the second air pipes, air holes are formed in the air gathering pipes in a penetrating mode and are communicated with inner cavities of the second air pipes, and a refrigerating sheet is fixedly connected to the front end, the utility model discloses a refrigeration piece, including base plate, refrigeration piece, laser subassembly, backup pad, first tuber pipe fixed connection, regulation hole, the refrigeration piece and external power source electric connection, terminal surface fixedly connected with fixed plate before the base plate, the fixed plate top can be dismantled and be connected with the backup pad, the fixed plate with the backup pad is hollow rectangle form, just laser subassembly is located the fixed plate with the backup pad is inboard, a plurality of fore-set, a plurality of fore-set top the fore-set other end with first tuber pipe fixed connection, fixed plate both sides fixedly connected with connecting plate, two the connecting plate all runs through and has seted up the regulation hole, the.
Preferably, the first air duct has a rectangular shape.
Preferably, the number of the opening ends of the third air duct is two, and the opening ends are respectively located at two sides of the first air duct.
Preferably, the third air pipe is a hose.
Preferably, the air collecting pipe is obliquely arranged on the second air pipe.
Preferably, the front end surface of the air gathering pipe is provided with a conical surface.
Preferably, the height of the connecting plate is three times the height of the supporting plate.
Preferably, the adjusting hole is a waist-shaped hole.
Preferably, both sides of the bottom of the supporting plate are fixedly connected with positioning pins, both sides of the top of the fixing plate are provided with positioning holes, and the positioning pins are inserted into the positioning holes.
Preferably, the inner side of the threaded hole is in threaded connection with a fixing bolt, and the fixing bolt is located in the adjusting hole.
Compared with the prior art, the invention has the beneficial effects that:
1. this straight array semiconductor laser light source heat abstractor, through setting up the second tuber pipe between the luminous body in every laser unit, the wind that produces through the fan can enter into the third tuber pipe, and enter into first tuber pipe inner loop, wind can be followed the tuber pipe of gathering on the second tuber pipe and discharged, and blow and dispel the heat on every luminous body, this kind sets up simple structure, can dispel the heat to every luminous body, and the radiating efficiency is high, make the regional heat dissipation of every luminous body even, improve the radiating effect of laser light source.
2. This straight array semiconductor laser light source heat abstractor can prop first tuber pipe through the backup pad that sets up, makes on wind can effectually blow the luminous body, and the backup pad can slide on the fixed plate, through unscrewing fixing bolt, and the backup pad can upwards or adjust downwards under the effect of the regulation hole on the connecting plate, is convenient for make gather the laser light source that tuber pipe reply different patterns, makes to gather the tuber pipe and aims at the luminous body and dispel the heat, improves the practicality of device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a left side view of the present invention;
FIG. 3 is a schematic structural diagram of a heat dissipation mechanism according to the present invention;
FIG. 4 is a schematic structural view of a wind collecting pipe according to the present invention;
fig. 5 is a schematic structural view of the support plate of the present invention.
In the figure: 1. a substrate; 11. a laser assembly; 2. a heat dissipation mechanism; 21. a first air duct; 22. a second air duct; 221. a wind gathering pipe; 2211. a wind hole; 2212. a conical surface; 23. a third air duct; 24. a connecting pipe; 25. a fan; 3. a refrigeration plate; 4. a fixing plate; 401. positioning holes; 41. a connecting plate; 411. an adjustment hole; 5. a support plate; 501. a threaded hole; 51. a top pillar; 52. fixing the bolt; 53. and a positioning pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: a straight array type semiconductor laser light source heat dissipation device comprises a substrate 1, a
In this embodiment: the
FIGS. 1 to 4: the
FIG. 5: the height of the connecting
The working principle and the using process of the invention are as follows: when the laser light source needs to be radiated, the
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
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