阅读说明：本技术 一种刚挠结合板的制作方法 (Manufacturing method of rigid-flex printed circuit board ) 是由 孙启双 孙文兵 于 2019-09-23 设计创作，主要内容包括：本发明涉及一种刚挠结合板的制作方法,包括下列步骤：S1：在内层软板上制作线路,并在内层软板中间两侧贴覆盖膜；S2：在所述内层软板两侧进一步设置半固化片,并对所述半固化片进行开槽处理,所述开槽处理形成的缺口延伸至内层软板漏出区域；S3：在所述半固化片两侧设置开料处理后的外层硬板；S4：对所述内层软板及所述外层硬板进行层叠,获得软硬结合板,S5：对软硬结合板5进行压合；本发明通过在现有的压合的工艺步骤的上增加烤制和等离子清洗的步骤,并调整等离子清洗步骤和压合步骤中的具体参数,避免压合后刚性材料和挠性材料完全结合在一起,强行分开导致刚挠结合板损坏进而报废的情况。(The invention relates to a method for manufacturing a rigid-flex printed circuit board, which comprises the following steps: s1: manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides in the middle of the inner-layer soft board; s2: further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein a gap formed by the slotting treatment extends to a leakage area of the inner-layer soft board; s3: arranging outer-layer hard boards after cutting treatment on two sides of the prepreg; s4: stacking the inner-layer soft board and the outer-layer hard board to obtain a soft and hard combined board, and S5: pressing the rigid-flexible board 5; according to the invention, the steps of baking and plasma cleaning are added to the existing pressing process step, and the specific parameters in the steps of plasma cleaning and pressing are adjusted, so that the situation that the rigid-flex combination plate is damaged and scrapped due to forced separation of the rigid material and the flexible material which are completely combined together after pressing is avoided.)

1. A manufacturing method of a rigid-flex printed circuit board is characterized by comprising the following steps:

manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides of the middle of the inner-layer soft board;

further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein gaps formed by the slotting treatment extend to the leakage area of the inner-layer soft board;

arranging outer-layer hard boards after cutting treatment on two sides of the prepreg;

stacking the inner-layer soft board and the outer-layer hard board to obtain a rigid-flexible board;

and pressing the rigid-flexible board.

2. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the notch extends to the soft board leakage area and is increased by 0.45mm-0.55mm on the reference surface of the inner layer soft board leakage area.

3. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the inner layer soft board is an H/H oz soft board with the copper thickness of 20-30 mu m, and the thickness of the covering film is 40-60 mu m.

4. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the outer-layer hard board is a single-side hard board with the thickness of 0.025-0.75 mm.

5. The method of manufacturing a rigid-flex printed circuit board according to any one of claims 1 to 4, wherein: the step of pressing the rigid-flex board specifically comprises the following steps:

baking the rigid-flexible board;

carrying out plasma cleaning on the baked rigid-flexible printed circuit board;

the three-in-one release film, the release film and the steel plate are sequentially arranged on two sides of the soft and hard combined plate;

and pressing by using a movable full-pressing machine.

6. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: the baking temperature of the soft and hard combination board is 120-180 ℃, and the baking time is 0.5-2 h.

7. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: the plasma cleaning process is divided into three sections, and the cleaning gas comprises one or more of oxygen, nitrogen, argon and carbon tetrafluoride.

8. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: and in the pressing step, the hot pressing process and the cold pressing process are divided, the cold pressing process is carried out after the hot pressing process, and the hot pressing process is carried out under the vacuum condition.

9. The method for manufacturing a rigid-flex printed circuit board according to claim 8, wherein: the hot-pressing process time is 30-50min, and the cold-pressing process time is 30-50 min.

10. The method for manufacturing a rigid-flex printed circuit board according to claim 8 or 9, wherein: the pressing temperature is 100-.

Technical Field

The invention relates to the technical field of manufacturing of circuit boards, in particular to a method for manufacturing a rigid-flex printed circuit board.

Background

In recent years, communication technologies (such as automation control, computers, communicators, instruments, medical instruments, military and aerospace) are rapidly developed. The micro-electronic technology which is rapidly developed along with the micro-electronic technology, miniaturization and multi-functionalization of electronic equipment, reduction of the assembly size and weight of electronic products, avoidance of connection errors, increase of assembly flexibility, improvement of reliability, realization of three-dimensional assembly under different assembly conditions, and the inevitable requirement for increasingly developing electronic products. The rigid-flex printed circuit board is used as a circuit board with the superior characteristics of thinness, lightness, flexibility and the like, can meet the interconnection technology of three-dimensional assembly, and is widely applied and valued in the electronic and communication industries.

Compared with the common rigid-flex board, the thickness of the ultrathin rigid-flex board is thinner, generally not more than 0.4mm, and under the aforementioned market trend, the demand for the ultrathin rigid-flex board is more and more increased.

At present, a lamination pressing technology is adopted in the manufacturing process of the ultrathin rigid-flexible combined plate, but problems exist in the aspects of selection and manufacturing method of an adhesive, use amount control of the adhesive, selection of pressing parameters, lamination design and the like, the quality of a final product is influenced, the rejection rate is high in the using process, and the efficiency and the cost are influenced, so that the further development of the ultrathin rigid-flexible combined plate is restricted.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of an embodiment of the present invention is to provide a method for manufacturing a flex-rigid board, which can manufacture an ultra-thin flex-rigid board and facilitate layering of a rigid material and a flexible material.

The technical scheme adopted by the embodiment of the invention is as follows:

in a first aspect, a method for manufacturing an ultra-thin rigid-flex printed circuit board includes:

manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides of the middle of the inner-layer soft board;

further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein gaps formed by the slotting treatment extend to the leakage area of the inner-layer soft board;

arranging outer-layer hard boards after cutting treatment on two sides of the prepreg;

stacking the inner-layer soft board and the outer-layer hard board to obtain a rigid-flexible board;

and pressing the rigid-flexible board.

Further, the notch extends to the soft board leakage area and is increased by 0.45mm-0.55mm on the reference surface of the board leakage area.

Further, the inner layer soft board is an H/H oz soft board with copper thickness of 20-30 μm, and the thickness of the covering film is 40-60 μm.

Further, the outer-layer hard board is a single-face hard board with the thickness of 0.025-0.75 mm.

Further, the pressing of the rigid-flex board specifically comprises:

baking the rigid-flexible board;

carrying out plasma cleaning on the baked rigid-flexible printed circuit board;

the three-in-one release film, the release film and the steel plate are sequentially arranged on two sides of the soft and hard combined plate;

and pressing by using a movable full-pressing machine.

Further, the temperature for baking the rigid-flexible printed circuit board is 120-180 ℃, and the baking time is 0.5-2 h. The plasma cleaning process is divided into three sections, and the cleaning gas comprises one or more of oxygen, nitrogen, argon and carbon tetrafluoride.

Further, the pressing step comprises a hot pressing process and a cold pressing process, the cold pressing process is performed after the hot pressing process, and the hot pressing process is performed under a vacuum condition.

Further, the hot-pressing process time is 30-50min, and the cold-pressing process time is 30-50 min.

Furthermore, the pressing temperature is 100-.

The invention has the beneficial effects that:

the invention can manufacture the ultrathin rigid-flex printed circuit board by adopting a lamination manufacturing process method, and can avoid the situation that the rigid-flex printed circuit board is damaged and scrapped due to the fact that rigid materials and flexible materials are completely combined together after lamination and are separated forcibly by controlling the cutting size of the prepreg, adding steps of baking and plasma cleaning on the existing lamination process steps and adjusting parameters (such as participation in gas, temperature, power and processing time) of the plasma cleaning step and specific parameters (such as temperature, material pressure, time and the like) in the lamination step.

Drawings

FIG. 1 is a schematic structural view of a rigid-flex printed circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic view showing an increased size of a leakage area of a flexible board according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of pressing a rigid-flex printed circuit board according to an embodiment of the invention.

Reference numerals

1. An inner layer soft board; 2. covering the film; 3. a prepreg; 4. an outer hard board; 5. a rigid-flex board; 6. a three-in-one release film; 7. a release film; 8. and (3) a steel plate.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

For better understanding of the technical solution of the present invention, the technical terms referred to in the present application are defined as follows:

FR-4 is a code of a flame-resistant material grade, which means a material specification that a resin material must be self-extinguished after being burned, and it is not a material name but a material grade, so that there are very many kinds of FR-4 grade materials currently used for general circuit boards, but most of them are composite materials made of so-called tetra-functional (terra-Function) epoxy resin plus Filler (Filler) and glass fiber;

prepreg, pp sheet (Prepreg is the english abbreviation of Pre-pregant), is a sheet-like bonding material synthesized by resin and carrier; it will dissolve during the pressing process to serve as a bonding function.

Trinity from type tectorial membrane, trinity from type tectorial membrane three-layer structure design, the intermediate level is 150 mu m has the packing to hinder the flexible macromolecular material that glues and cushion, and upper and lower two-layer high temperature is from type macromolecular material, has both possessed traditional material buffering advantage before, has possessed higher gluey efficiency of hindering again, can provide great pressfitting pressure buffering and better filler effect.