阅读说明：本技术 激光二极管封装模块及发射装置、测距装置、电子设备 (Laser diode packaging module, transmitting device, distance measuring device and electronic equipment ) 是由 郑国光 刘祥 陈江波 洪小平 于 2018-04-28 设计创作，主要内容包括：一种激光二极管封装模块,包括基板(301),具有彼此相对的第一表面(30)和第二表面(31)；罩体设置在基板(301)的第一表面(30)上,包括具有窗口的罩体本体(302)和设置于窗口透光板(303),基板(301)和罩体之间形成容纳空间；以及设置于容纳空间内的激光二极管芯片(305)。该激光二极管封装模块可以减小目前直插封装方式中存在的分布电感,提高激光发射的强度。还提供了采用激光二极管封装模块的发射装置、测距装置以及电子设备。(A laser diode package module comprising a substrate (301) having a first surface (30) and a second surface (31) opposite to each other; the cover body is arranged on the first surface (30) of the substrate (301), and comprises a cover body (302) with a window and a light-transmitting plate (303) arranged on the window, and an accommodating space is formed between the substrate (301) and the cover body; and a laser diode chip (305) disposed within the receiving space. The laser diode packaging module can reduce distributed inductance existing in the existing direct-insertion packaging mode and improve the intensity of laser emission. Also provided are a transmitting device, a ranging device and an electronic device using the laser diode encapsulation module.)

A laser diode package module, the package module comprising:

a substrate having a first surface and a second surface opposite to each other;

the cover body is arranged on the first surface of the substrate, and an accommodating space is formed between the substrate and the cover body;

and the laser diode chip is arranged in the accommodating space.

The package module according to claim 1, further comprising a driving chip for controlling emission of the laser diode chip, wherein the driving chip is disposed in the accommodating space.

The packaged module of claim 2, wherein the laser diode chip and the driver chip are mounted to the first surface of the substrate.

The packaged module of claim 1, wherein the enclosure at least partially defines a light-transmissive region, and wherein the light emitted from the laser diode chip is emitted through the light-transmissive region.

The packaged module of claim 4, wherein the light-transmissive region is disposed on a top surface or a side surface of the casing, the top surface being disposed opposite to the first surface, and the light-transmissive region emits the emitted light of the laser diode chip.

The packaged module of claim 5, wherein the light emitted from the laser diode chip is emitted through the light-transmissive region in a direction perpendicular or parallel to the first surface.

The packaged module according to claim 4, wherein the light emitted from the laser diode chip is directly emitted through the light-transmitting region; or the emergent light of the laser diode chip is reflected by the reflector and then emitted out through the light-transmitting area.

The packaged module of claim 4, wherein the enclosure comprises a U-shaped enclosure body having a window, and a light-transmissive plate disposed at the window to form the light-transmissive region, the light emitted from the laser diode chip being emitted through the light-transmissive plate; or the cover body is of a plate-shaped structure with all light transmission.

The encapsulation module according to one of claims 1 to 8, further comprising:

the first heat sink and the second heat sink are respectively arranged on a first surface and a second surface of the laser diode chip, wherein the first surface and the second surface of the laser diode chip are surfaces except the emergent surface of the laser diode chip.

The packaged module of claim 9, wherein the laser diode chip, the first heat sink, and the second heat sink are each of a cylindrical structure;

the first heat sink and the second heat sink are respectively arranged on the first surface and the second surface of the laser diode chip, which are perpendicular to the emergent surface.

The packaged module of claim 9, wherein the first and second heat sinks each comprise first and second ends opposite to each other, and an end surface of at least one of the first end of the first heat sink and the first end of the second heat sink is lower than an end surface of the exit surface.

The package module of claim 11, wherein the heights of the end surface of the first end of the first heat sink, the exit surface and the end surface of the first end of the second heat sink relative to the first surface of the substrate are sequentially reduced and have a step-shaped structure.

The packaged module of claim 11, wherein the second end of the first heat sink and the second end of the second heat sink are attached to the first surface of the substrate by a solder material.

The packaged module of claim 11, wherein the second end of the first heat sink and the second end of the second heat sink are flush and vertically attached to the first surface of the substrate.

The packaged module of claim 9, wherein a bottom surface of the laser diode chip opposite to the exit surface is suspended between the first heat sink and the second heat sink with a predetermined distance from the first surface of the substrate.

The packaged module of claim 9, wherein a plurality of dummy chips are disposed between the first heat sink and the second heat sink outside three sides of the laser diode chip other than the exit surface.

The packaged module of claim 9, wherein the laser diode chip further comprises:

the first heat sink is arranged on the first surface of the laser diode chip where the first electrode is located;

and the second heat sink is arranged on the second surface of the laser diode chip where the second electrode is positioned.

The packaged module of claim 17, wherein the first heat sink and the first electrode are affixed by a conductive adhesive;

the second heat sink and the second electrode are pasted through a conductive paste.

The packaged module of claim 9, wherein the material of the first and second heat sinks comprises a metal or a metallization material.

The packaged module of claim 19, wherein the metallization material comprises a surface-metallization semiconductor material.

The packaged module of claim 19, wherein the material of the first and second heat sinks comprises copper or aluminum-clad silicon.

The packaged module of claim 1, further comprising:

and the support plate is vertically attached to the first surface of the substrate, wherein the laser diode chip and the driving chip are attached to the support plate.

The package module of claim 22, further comprising a driver chip for controlling emission of the laser diode chip, wherein the driver chip is attached to the carrier.

The packaged module of claim 22, wherein the carrier comprises a metalized ceramic board or a metalized silicon chip.

The packaged module of claim 22, further comprising:

the third heat sink is attached to the carrier plate;

and the laser diode chip is attached to the third heat sink.

The packaged module of claim 25, wherein the laser diode chip comprises a first electrode and a second electrode disposed opposite to each other, the first surface of the first electrode and the second surface of the second electrode are surfaces other than the exit surface of the laser diode chip, and the first electrode is attached to the third heat sink;

the second electrode is electrically connected to the carrier plate through an electric connection wire.

The packaged module of claim 25, wherein the material of the third heat sink comprises a metallic material or a metalized material, the metallic material comprising copper; the metallized material comprises a metallized ceramic plate or a metallized silicon wafer.

The packaged module of claim 1, wherein the second surface of the substrate is mounted to a circuit board.

The packaged module of claim 2, wherein the laser diode chip and the driver chip are mounted on the first surface of the substrate;

the second surface of the substrate is attached to the circuit board; or the first surface of the substrate is of a groove structure, and the substrate is attached to the circuit board through one end of the opening in the groove structure.

The package module of claim 1, further comprising a driver chip for controlling emission of the laser diode chip, wherein the laser diode chip is attached to the first surface of the substrate, and at least a portion of the driver chip is disposed on the second surface of the substrate.

The packaged module according to claim 30, wherein a light-transmitting adhesive covering the driving chip is disposed on the second surface of the substrate.

The package module of claim 30, wherein the second surface of the substrate is a recessed structure, at least a portion of the driver chip is disposed in the recessed structure of the second surface, and the substrate is attached to a circuit board through an end of the opening in the recessed structure.

The package module according to claim 29 or 32, wherein the circuit board is a circuit board having holes, the holes at least partially exposing areas of the substrate where functional devices are formed.

The package module of claim 7, wherein the material of the cage body comprises a metal, a resin, or a ceramic.

The packaged module of claim 1, wherein the substrate comprises a PCB substrate or a ceramic substrate.

A laser transmitter comprising the laser diode package module of any one of claims 1 to 35.

A ranging apparatus comprising the laser transmitter of claim 36.

An electronic device comprising the laser diode package module of any of claims 1-35, wherein the electronic device comprises a drone, an autonomous automobile, or a robot.