阅读说明：本技术 激光二极管封装模块及发射装置、测距装置、电子设备 (Laser diode packaging module, transmitting device, distance measuring device and electronic equipment ) 是由 郑国光 刘祥 陈江波 洪小平 于 2018-04-28 设计创作，主要内容包括：一种激光二极管封装模块,包括基板(301),具有彼此相对的第一表面(30)和第二表面(31)；罩体设置在基板(301)的第一表面(30)上,包括具有窗口的罩体本体(302)和设置于窗口透光板(303),基板(301)和罩体之间形成容纳空间；以及设置于容纳空间内的激光二极管芯片(305)。该激光二极管封装模块可以减小目前直插封装方式中存在的分布电感,提高激光发射的强度。还提供了采用激光二极管封装模块的发射装置、测距装置以及电子设备。(A laser diode package module comprising a substrate (301) having a first surface (30) and a second surface (31) opposite to each other; the cover body is arranged on the first surface (30) of the substrate (301), and comprises a cover body (302) with a window and a light-transmitting plate (303) arranged on the window, and an accommodating space is formed between the substrate (301) and the cover body; and a laser diode chip (305) disposed within the receiving space. The laser diode packaging module can reduce distributed inductance existing in the existing direct-insertion packaging mode and improve the intensity of laser emission. Also provided are a transmitting device, a ranging device and an electronic device using the laser diode encapsulation module.)