阅读说明：本技术 一种ic封装基板阻焊压平的方法 (Method for flattening solder resist of IC packaging substrate ) 是由 岳嘉成 于 2019-10-21 设计创作，主要内容包括：本发明涉及一种IC封装基板阻焊压平的方法,其包括如下步骤：第一步、将覆铜层叠板放置在烤板炉中进行烤板,第二步、对第一步中经过烤板后的覆铜层叠板依次进行减铜作业、钻孔作业、镀铜作业和线路制作作业后,得到阻焊工序所需要的半成品板体,第三步、对第二步中所得到的半成品板体进行超粗化作业以及涂布作业,其具体步骤为：步骤1、进行AOI光学检查,步骤2、进行超粗化作业前的整平作业,步骤3、进行超粗化作业,步骤4、除尘处理,步骤5、进行涂布作业,步骤6、进行阻焊压平作业,步骤7、进行光学处理,步骤8、对经过曝光后的半成品板体进行显影作业,从而剥离半成品板体上不需要的油墨。(The invention relates to a method for flattening a solder resist of an IC packaging substrate, which comprises the following steps: the method comprises the following steps of firstly, placing a copper-clad laminated board in a board baking furnace for board baking, secondly, sequentially carrying out copper reduction operation, drilling operation, copper plating operation and circuit manufacturing operation on the copper-clad laminated board subjected to board baking in the first step, obtaining a semi-finished board body required by a resistance welding process, thirdly, carrying out super-roughening operation and coating operation on the semi-finished board body obtained in the second step, wherein the specific steps are as follows: step 1, performing AOI optical inspection, step 2, performing leveling operation before super-roughening operation, step 3, performing super-roughening operation, step 4, performing dust removal treatment, step 5, performing coating operation, step 6, performing solder mask flattening operation, step 7, performing optical treatment, and step 8, performing developing operation on the exposed semi-finished plate body, thereby stripping unnecessary ink on the semi-finished plate body.)

1. A method for solder resist flattening of an IC package substrate is characterized by comprising the following steps:

firstly, placing the copper-clad laminated board in a board baking furnace for board baking,

secondly, sequentially carrying out copper reduction operation, drilling operation, copper plating operation and circuit manufacturing operation on the copper-clad laminated plate subjected to plate baking in the first step to obtain a semi-finished plate body required by a resistance welding process,

thirdly, performing super-roughening operation and coating operation on the semi-finished plate obtained in the second step, wherein the specific steps are as follows:

step 1, performing AOI optical inspection on the semi-finished plate after the circuit manufacturing is finished,

step 2, carrying out leveling operation before super-roughening operation on the semi-finished plate body subjected to AOI optical inspection,

step 3, cleaning the semi-finished plate body after leveling operation by using clear water to complete super-roughening operation, wherein the biting erosion amount of the super-roughening operation on the surface copper layer of the semi-finished plate body is 0.6-0.8 um,

step 4, cleaning the semi-finished plate body subjected to the super-roughening operation by using clear water, then performing dust removal treatment on the surface of the semi-finished plate body by using an automatic dust adhering machine in a dust-free workshop,

step 5, coating the semi-finished plate body after the dust removal operation in a dust-free workshop,

step 6, performing solder mask flattening operation on the semi-finished plate body subjected to the coating operation in a dust-free workshop,

step 7, performing optical treatment on the semi-finished plate subjected to the solder mask flattening operation in a dust-free workshop,

step 8, developing the exposed semi-finished plate body to strip off the unnecessary ink on the semi-finished plate body,

the solder resist flattening machine is used for performing the solder resist flattening work in the step 6 of the third step,

the resistance welding flattening machine comprises an upper film pressing unit and a lower film pressing unit which are arranged in a machine body at the same time, a flattening working area is formed between the upper film pressing unit and the lower film pressing unit, the flattening working area is provided with a feeding port and a discharging port,

the upper film pressing unit comprises an upper film feeding roller, an upper film collecting roller, an upper film pressing roller and an upper heater, wherein the upper film feeding roller is arranged above the material inlet, the upper film collecting roller is arranged above the material outlet, a plurality of upper film pressing rollers are arranged between the material inlet and the material outlet, and a plurality of upper heaters are also arranged between the material inlet and the material outlet,

the lower film pressing unit corresponds to the upper film pressing unit and comprises a lower film feeding roller, a lower film collecting roller, a lower film pressing roller and a lower heater, wherein the lower film feeding roller is arranged below the material inlet, the lower film collecting roller is arranged below the material outlet, a plurality of lower film pressing rollers are arranged between the material inlet and the material outlet, and a plurality of lower heaters are also arranged between the material inlet and the material outlet,

two ends of the flattened film are respectively wound between the upper film feeding roller and the upper film receiving roller and between the lower film feeding roller and the lower film receiving roller, wherein the upper film feeding roller and the lower film feeding roller gradually discharge materials, and the upper film receiving roller and the lower film receiving roller gradually receive materials,

when the solder resist flattening machine works, the upper film pressing roller and the lower film pressing roller are preheated firstly, and solder resist flattening operation is carried out after the temperature of the upper film pressing roller and the lower film pressing roller is raised to be between 100 and 110 ℃, wherein the flattening speed is between 0.6 and 0.8m/min and the flattening pressure is 6kg/cm during the solder resist flattening operation²To 8kg/cm²。

2. The method of IC package substrate solder resist leveling of claim 1, wherein: in the first step, the copper-clad laminate is placed in a dedicated baking oven at a temperature of 170 ℃ to 190 ℃ for baking for 2 hours.

3. The method of IC package substrate solder resist leveling of claim 1, wherein: in the step 2, leveling operation is carried out by using leveling agent, the concentration of the leveling agent in a leveling tank is controlled to be 44g/L-76g/L, the leveling temperature is controlled to be 23 +/-2 ℃,

the leveling agent consists of sodium persulfate, sulfuric acid, cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers,

the weight ratio of sodium persulfate, sulfuric acid, cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether is as follows: 10-18:3-5:0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2.

4. The method of IC package substrate solder resist leveling as recited in claim 1The method is characterized in that: in step 3, the specific operation of the super-roughening operation is that firstly, super-roughening micro-etching liquid with the tank volume of 30-40% is added into the treatment tank, then the plate passing speed of the super-roughening section is set to be 2.2 m/min-2.4 m/min, and the pressure of the super-roughening micro-etching liquid on the plate surface is set to be 0.6kg/cm²To 1.5kg/cm²And heating to make the temperature of the liquid medicine in the treatment tank reach 37-39 ℃ so as to finish the super-roughening operation, wherein the super-roughening micro-etching liquid is formic acid solution with the concentration of 5-10%.

5. The method of IC package substrate solder resist leveling of claim 1, wherein: in step 5, the specific steps are as follows: firstly, carrying out dust removal treatment on the surface of a semi-finished product plate body needing coating operation, then carrying out primary surface coating operation and primary surface coating and baking plate operation on the surface of the semi-finished product plate body after dust removal, and then carrying out secondary surface coating operation and secondary surface coating and baking plate operation, wherein during the surface coating operation, the viscosity of ink is controlled to be 5000-6000mpa.s, the coating speed is controlled to be 0.85m/min-2.0m/min, and the coating pressure is controlled to be 1.2kg/cm²-2.7kg/cm²The coating temperature is controlled at 80 +/-5 ℃.

6. The method of IC package substrate solder resist leveling of claim 1, wherein: in step 8, firstly, developing the semi-finished plate, and then cleaning and drying the semi-finished plate, wherein the concentration of the practical sodium carbonate solution is 0.9-1.1% and the drying temperature is 70-80 ℃.

7. The method of IC package substrate solder resist leveling of claim 1, wherein: in the second step, the specific operation steps are as follows: firstly, carrying out copper reduction operation on a copper-clad laminated plate after plate baking is finished by using an acidic solution, then carrying out drilling operation on the copper-clad laminated plate after copper reduction, plating a layer of copper on the hole wall of the copper-clad laminated plate by adopting a chemical electroless copper plating mode after the drilling operation is finished to form a first plating layer, enabling copper foils on two sides of the copper-clad laminated plate to be mutually conducted to finish the hole drilling operation, then forming a second plating layer on the first plating layer by adopting an electrolytic copper plating mode, thereby enabling a circuit to be manufactured on the second plating layer of the copper-clad laminated plate, finally, pressing a photosensitive dry film on the second plating layer of the copper-clad laminated plate, carrying out exposure through an optical treatment process, and removing the dry film through a stripping process to finish the manufacturing of a circuit layer.

8. The method of IC package substrate solder resist leveling of claim 1, wherein: this go up press mold roller and this press mold roller down all include rigid interior axle and flexible overcoat, and this flexible overcoat cover is established on this rigid interior axle surface, and this rigid interior axle both ends are protruding respectively to be equipped with the projection, and this projection is inserted and is established in the bearing, and this bearing setting is in the sleeve pipe, and this sleeve pipe setting is worn to be equipped with adjusting screw in this mount, and this adjusting screw top is established on this sheathed tube surface, and this mount fixed connection is in this organism.

Technical Field

The invention relates to a method for flattening a resistance welding surface of a substrate, in particular to a method for improving the smoothness of an ink surface of a semi-finished plate body by using a resistance welding flattening machine.

Background

As is well known, IC packaging refers to a package for mounting a semiconductor integrated circuit chip, which not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the package by wires through the contacts on the chip, which are connected to other devices by wires on a printed circuit board, thereby realizing the connection of an internal chip to an external circuit.

In order to realize the functions of the printed circuit board, the surface of the printed circuit board is provided with the ink layer, but the surface flatness of the ink layer manufactured by the traditional process cannot reach the optimum degree, and the flatness of the ink layer inevitably affects the product quality of a finished product, which is a main defect of the traditional technology.

Disclosure of Invention

The technical scheme adopted by the invention is as follows: a method for solder resist flattening of an IC package substrate is characterized by comprising the following steps.

Firstly, placing the copper-clad laminated board in a board baking furnace for baking the board.

And step two, sequentially carrying out copper reduction operation, drilling operation, copper plating operation and line manufacturing operation on the copper-clad laminated plate subjected to plate baking in the step one to obtain a semi-finished plate body required by a resistance welding process.

And thirdly, performing super-roughening operation and coating operation on the semi-finished plate obtained in the second step, wherein the specific steps are as follows.

Step 1, performing AOI optical inspection on the semi-finished plate after the circuit manufacturing is finished.

And 2, carrying out leveling operation before super-roughening operation on the semi-finished plate subjected to AOI optical inspection.

And 3, cleaning the semi-finished plate body subjected to leveling operation by using clear water, and then finishing super-roughening operation, wherein the biting amount of the super-roughening operation on the surface copper layer of the semi-finished plate body is 0.6-0.8 um.

And 4, cleaning the semi-finished plate subjected to the super-roughening operation by using clean water, and then performing dust removal treatment on the surface of the semi-finished plate by using an automatic dust adhering machine in a dust-free workshop.

And 5, coating the semi-finished plate subjected to the dust removal operation in a dust-free workshop.

And 6, performing solder mask flattening operation on the semi-finished plate body subjected to the coating operation in a dust-free workshop.

And 7, carrying out optical treatment on the semi-finished plate subjected to the solder mask flattening operation in a dust-free workshop.

And 8, developing the exposed semi-finished plate body, thereby stripping the unnecessary ink on the semi-finished plate body.

And 6, performing resistance welding flattening by using a resistance welding flattening machine.

Should hinder and weld flatting mill and include last press mold unit and the press mold unit that pushes down, should go up press mold unit and should push down the press mold unit and set up in the organism simultaneously, form one between this last press mold unit and this press mold unit and flatten the workspace, should flatten the workspace and have pan feeding mouth and discharge gate.

This go up press mold unit is including sending the membrane roller on, receiving the membrane roller on, pressing the membrane roller and going up the heater, wherein, should send the membrane roller setting in this pan feeding mouth top on, should receive the membrane roller setting in this discharge gate top on, a plurality of these press mold rollers on arrange and set up between this pan feeding mouth and this discharge gate, simultaneously, a plurality of these upper heaters also set up between this pan feeding mouth and this discharge gate.

The lower film pressing unit corresponds to the upper film pressing unit and comprises a lower film feeding roller, a lower film receiving roller, a lower film pressing roller and a lower heater, wherein the lower film feeding roller is arranged below the feeding port, the lower film receiving roller is arranged below the discharging port, the lower film pressing rollers are arranged between the feeding port and the discharging port, and meanwhile, the lower heaters are also arranged between the feeding port and the discharging port.

The two ends of the flattened film are respectively wound between the upper film feeding roller and the upper film receiving roller as well as between the lower film feeding roller and the lower film receiving roller, wherein the upper film feeding roller and the lower film feeding roller gradually discharge materials, and the upper film receiving roller and the lower film receiving roller gradually receive materials.

The solder resistWhen the flattening machine works, the upper film pressing roller and the lower film pressing roller are preheated, the solder resistance flattening operation is carried out after the temperature of the upper film pressing roller and the lower film pressing roller is raised to be between 100 and 110 ℃, the flattening speed is between 0.6 and 0.8m/min and the flattening pressure is 6kg/cm when the solder resistance flattening operation is carried out²To 8kg/cm²。

The invention has the beneficial effects that: the invention respectively flattens the ink on the upper surface and the lower surface of the semi-finished plate body by means of the upper film pressing unit and the lower film pressing unit, so that the ink surface on the surface of the semi-finished plate body is smoother. Through this hinder and weld the flatting mill and can improve this last press mold unit and this press mold unit down and wait to press the contact nature that the semi-manufactured plate body is good and improve the homogeneity of semi-manufactured plate body atress when carrying out to hinder and flatten the operation to improve the planarization of semi-manufactured plate body printing ink face on the whole.

Drawings

FIG. 1 is a schematic view of the solder resist leveler of the present invention.

FIG. 2 is a schematic structural diagram of an upper lamination film roller and a lower lamination film roller of the solder resist leveler of the invention.

Detailed Description

A method for solder resist flattening of an IC package substrate comprises the following steps.

Firstly, placing the copper-clad laminated board in a board baking furnace for baking the board.

Specifically, the copper-clad laminate is placed in a special board baking furnace at a temperature of 170 ℃ to 190 ℃ and continuously baked for 2 hours.

And step two, sequentially carrying out copper reduction operation, drilling operation, copper plating operation and line manufacturing operation on the copper-clad laminated plate subjected to plate baking in the step one to obtain a semi-finished plate body required by a resistance welding process.

And thirdly, in order to provide a good semi-finished plate body for the solder resist flattening operation, performing super-roughening operation and coating operation on the semi-finished plate body obtained in the second step, wherein the specific steps are as follows.

Step 1, performing AOI optical inspection on the semi-finished plate after the circuit manufacturing is finished. The step has the function of ensuring the integrity of the circuit layer in the semi-finished board body before the solder mask process is carried out on the semi-finished board body.

The specific operation flow is that the semi-finished plate body is scanned by using AOI optical inspection equipment so as to inspect the problems of short circuit and open circuit of the circuit layer in the semi-finished plate body, and the inspected problems are processed so as to ensure the integrity of the circuit layer in the subsequent production process.

And 2, carrying out leveling operation before super-roughening operation on the semi-finished plate subjected to AOI optical inspection.

The step has the function of removing slight oxides and dirt on the copper surface of the semi-finished plate body, and providing a clean copper surface for subsequent super-roughening operation, so that the quality of the super-roughening operation is ensured.

Leveling operation is carried out by using a leveling agent, the concentration of the leveling agent in a leveling tank is controlled to be 44g/L-76g/L, the leveling temperature is controlled to be 23 +/-2 ℃, the leveling agent consists of sodium persulfate, sulfuric acid, cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether, and the weight ratio of the sodium persulfate, the sulfuric acid, the cadmium, the lead, the mercury, the hexavalent chromium, the polybrominated biphenyl and the polybrominated diphenyl ether is as follows: 10-18:3-5:0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2: 0.5-1.2.

And 3, cleaning the semi-finished plate subjected to leveling operation by using clean water, and then finishing the super-roughening operation.

The biting amount of the super-roughening operation on the surface copper layer of the semi-finished plate is 0.6um to 0.8 um.

The specific operation of the super-roughening operation is that firstly super-roughening micro-etching liquid with the tank volume of 30-40% is added into a treatment tank, then the plate passing speed of a super-roughening section is set to be 2.2 m/min-2.4 m/min, and the pressure of the super-roughening micro-etching liquid on the plate surface is set to be 0.6kg/cm²To 1.5kg/cm²And heating to make the temperature of the liquid medicine in the treatment tank reach 37-39 ℃ so as to finish the super-roughening operation.

In the specific implementation, the super-roughening micro-etching solution is a formic acid solution with the concentration of 5% -10%.

And 4, cleaning the semi-finished plate subjected to the super-roughening operation by using clean water, and then performing dust removal treatment on the surface of the semi-finished plate by using an automatic dust adhering machine in a dust-free workshop.

The step has the effect of removing dust on the surface layer of the semi-finished product plate, so that the surface layer of the semi-finished product plate is clean enough, and the problem that printing ink covers dust to influence the operation quality of solder mask flattening during subsequent coating operation is avoided.

And 5, coating the semi-finished plate subjected to the dust removal operation in a dust-free workshop.

The main function of this step is to cover the photosensitive ink on the both sides of semi-manufactured plate body circuit layer to play the effect of protection both sides circuit layer and be convenient for follow-up electroplating process go on.

The method comprises the following specific steps: firstly, carrying out dust removal treatment on the surface of a semi-finished product plate to be coated, then carrying out primary surface coating operation and primary surface coating and baking operation on the surface of the semi-finished product plate subjected to dust removal, and then carrying out secondary surface coating operation and secondary surface coating and baking operation.

During the top coating operation, the viscosity of the ink is controlled at 5000-6000mpa.s, the coating speed is controlled at 0.85-2.0 m/min, and the coating pressure is controlled at 1.2kg/cm²-2.7kg/cm²The coating temperature is controlled at 80 +/-5 ℃.

And 6, performing solder mask flattening operation on the semi-finished plate body subjected to the coating operation in a dust-free workshop.

The step has the effect of enabling the ink surface of the semi-finished plate body after coating operation to be smoother.

And 7, carrying out optical treatment on the semi-finished plate subjected to the solder mask flattening operation in a dust-free workshop.

The function of this step is to make the ink to be retained tightly cover the circuit layer.

And 8, developing the exposed semi-finished plate body, thereby stripping the unnecessary ink on the semi-finished plate body.

The specific operation is that firstly, the semi-finished plate body is developed, and then the semi-finished plate body is cleaned and dried. The sodium carbonate solution is used as a developer, the concentration of the sodium carbonate solution is 0.9 to 1.1 percent, and the drying temperature is between 70 and 80 ℃.

In the second step, the specific operation steps are as follows: firstly, carrying out copper reduction operation on a copper-clad laminated plate after plate baking is finished by using an acidic solution, then carrying out drilling operation on the copper-clad laminated plate after copper reduction, plating a layer of copper on the hole wall of the copper-clad laminated plate by adopting a chemical electroless copper plating mode after the drilling operation is finished to form a first plating layer, enabling copper foils on two sides of the copper-clad laminated plate to be mutually conducted to finish the hole drilling operation, then forming a second plating layer on the first plating layer by adopting an electrolytic copper plating mode, thereby enabling a circuit to be manufactured on the second plating layer of the copper-clad laminated plate, finally, pressing a photosensitive dry film on the second plating layer of the copper-clad laminated plate, carrying out exposure through an optical treatment process, and removing the dry film through a stripping process to finish the manufacturing of a circuit layer.

The solder resist flattening work is performed in step 6 of the above-described third step using a solder resist flattening machine including an upper film pressing unit 100 and a lower film pressing unit 200 as shown in fig. 1 to 2.

The upper film pressing unit 100 and the lower film pressing unit 200 are simultaneously disposed in the machine body 300, and a flattening working area is formed between the upper film pressing unit 100 and the lower film pressing unit 200, and the flattening working area has a feeding port 310 and a discharging port 320.

During operation, the semi-finished plate enters the flattening area from the feeding port 310 and then is discharged from the discharging port 320.

In the above process, the upper film pressing unit 100 and the lower film pressing unit 200 are respectively used to flatten the ink on the upper and lower surfaces of the semi-finished plate, so that the ink on the surface of the semi-finished plate is smoother.

Through this hinder and weld the flatting mill and can improve this upper pressure membrane unit 100 and this press down membrane unit 200 and wait to press the good contact nature of semi-manufactured goods plate body and improve the homogeneity of semi-manufactured goods plate body atress when carrying out to hinder and flatten the operation to improve the planarization of semi-manufactured goods plate body printing ink face on the whole.

The upper film pressing unit 100 includes an upper film feeding roller 10, an upper film receiving roller 20, an upper film pressing roller 30 and an upper heater 40, wherein the upper film feeding roller 10 is disposed above the feeding port 310, and the upper film receiving roller 20 is disposed above the discharging port 320.

The upper squeeze film rollers 30 are arranged between the material inlet 310 and the material outlet 320, and the upper heaters 40 are also arranged between the material inlet 310 and the material outlet 320.

This membrane unit 200 is pressed down and this membrane unit 100 is pressed on correspondingly, and this membrane unit 200 is pressed down includes send membrane roller 50, receive membrane roller 60, press membrane roller 70 and lower heater 80 down, and wherein, should send membrane roller 50 to set up in this pan feeding mouth 310 below down, should receive membrane roller 60 and set up in this discharge gate 320 below down.

The lower film-pressing rollers 70 are arranged between the material inlet 310 and the material outlet 320, and the lower heaters 80 are also arranged between the material inlet 310 and the material outlet 320.

The lower squeeze film rollers 70 are disposed directly below the upper squeeze film roller 30 in a one-to-one correspondence.

In practice, the upper heater 40 is disposed between any adjacent two of the upper nip rollers 30.

The lower heater 80 is disposed between any adjacent two of the lower pressure film rollers 70.

The upper heater 40 and the lower heater 80 are both heating fans including a fan and a heating wire, and heat generated by the heating wire is blown out by the fan.

Two ends of the flattened film 400 are respectively wound between the upper film feeding roller 10 and the upper film receiving roller 20, and between the lower film feeding roller 50 and the lower film receiving roller 60, wherein the upper film feeding roller 10 and the lower film feeding roller 50 gradually discharge materials, and the upper film receiving roller 20 and the lower film receiving roller 60 gradually receive materials.

In practical implementation, auxiliary rollers 91 are respectively disposed below the upper film feeding roller 10 and the upper film collecting roller 20.

Auxiliary rollers 92 are provided above the lower film feeding roller 50 and the lower film collecting roller 60, respectively.

The auxiliary rollers 91 and 92 can keep the flat and tight film 400.

In specific implementation, the upper film pressing roller 30 and the lower film pressing roller 70 both include a rigid inner shaft 510 and a flexible outer sleeve 520, the flexible outer sleeve 520 is sleeved on the outer surface of the rigid inner shaft 510, protruding columns 511 are respectively disposed at two ends of the rigid inner shaft 510, the protruding columns 511 are inserted into the bearings 530, the bearings 530 are disposed in the sleeves 540, the sleeves 540 are disposed in the fixing frame 550, the adjusting screws 560 are disposed on the outer surface of the sleeves 540, and the fixing frame 550 is fixedly connected in the machine body 300.

In use, the gap between the upper lamination roller 30 and the lower lamination roller 70 is adjusted by adjusting the adjusting screw 560.

In practice, the diameter of the upper film roll 30 and the lower film roll 70 may be set to 78mm, the length thereof may be set to 760mm, and the thickness of the flexible outer cover 520 may be set to 3 mm.

When the solder resist flattening machine works, the upper film pressing roller 30 and the lower film pressing roller 70 are preheated firstly, and the solder resist flattening operation is carried out after the temperature of the upper film pressing roller and the lower film pressing roller is raised to be between 100 ℃ and 110 ℃. When the solder mask flattening operation is carried out, the flattening speed is 0.6m/min to 0.8m/min, and the flattening pressure is 6kg/cm²To 8kg/cm²。

In practice, the hardness of the surfaces of the upper film pressing roller 30 and the lower film pressing roller 70 is 70 degrees, the flexible outer sleeve 520 is made of silica gel, the rotating speed of the upper film pressing roller 30 and the lower film pressing roller 70 is controlled to be 0.6-0.8m/min, and the flattening film 400 is a PET release film with the thickness of 25 um.