阅读说明：本技术 多层夹芯金属基电路板生产方法 (Multilayer sandwich metal-base circuit plate producing process ) 是由 陈荣贤 梁少逸 程有和 陈启涛 徐伟 舒波宗 朱光辉 张伟勋 于 2019-09-26 设计创作，主要内容包括：本发明提供了一种多层夹芯金属基电路板生产方法,包括：工程设计：根据客户资料及制程能力对图纸进行优化设计,包括菲林的预拉长、线路的补偿、钻孔补偿等；还包括开料、内层线路制作、内外层检测、棕化、金属基芯板钻孔、金属基芯板化学处理、压合、钻孔、化学镀铜、电镀铜、图形转移、外层蚀刻、防焊、网印字符、表面处理。本发明可以生产4层或以上的夹芯金属基板,芯板之间对位精度<50um,金钻孔粗糙度<25um,金属基与芯板不会有爆板及毛刺等问题,可满足客户的各项性能指标。(The present invention provides a kind of multilayer sandwich metal-base circuit plate producing process, comprising: engineering design: optimizing drawing according to customer data and process capability, compensation, the bore hole compensated etc. of pre- elongation, route including the film；It further include sawing sheet, internal layer circuit production, ectonexine detection, brownification, the drilling of Metal Substrate core plate, the chemical treatment of Metal Substrate core plate, pressing, drilling, electroless copper, electro-coppering, pattern transfer, outer layer etching, anti-welding, wire mark character, surface treatment.The problems such as present invention can produce 4 layers or more of sandwich metal substrate, aligning accuracy < 50um between core plate, golden borehole rugosity < 25um, and Metal Substrate and core plate do not have plate bursting and burr, can meet the performance indexes of client.)

1. a kind of multilayer sandwich metal-base circuit plate producing process characterized by comprising

Step 1, engineering design: optimizing drawing according to customer data and process capability, pre- elongation including the film, Compensation, bore hole compensated of route etc.；

Step 2, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, plate is then split into phase The size answered；

Step 3, internal layer circuit makes: according to the data of client, figure being transferred to inner operative plate up from egative film；

Step 4, ectonexine detects: using automatically scanning detecting instrument, checks the quality of route after etching；

Step 5, brownification: using chemical mode, and coarse surface increases the binding force between material；

Step 6, Metal Substrate core plate drills: is drilled out in plate face in pressing contraposition tooling hole and unit using drilling machine and needs gold The hole of categoryization；

Step 9, Metal Substrate core plate is chemically treated: scabrid structure is formed in metal primary surface using chemical method, so that golden Belonging to base and prepreg has better binding force；

Step 9, it presses: by the fast press of vacuum, using corresponding pressing plate parameter, different line layer and Metal Substrate being pressed in one It rises；

Step 9, drill: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize upper and lower level copper Electric performance conducting；

Step 10, electroless copper: it is exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate；

Step 11, electro-coppering: the copper of copper and surface in device to hole is thickeied, to reach the requirement of client, to ensure terminal visitor The requirement on electric performance at family；

Step 12, according to the data of client, figure pattern transfer: is transferred to working plate up from egative film；

Step 13, outer layer etches: using the corrosion liquid medicine of alkalinity, the figure that client needs all being corroded out；

Step 14, anti-welding: according to the requirement of client, one layer of dielectric ink to be pressed in circuit plate face, but want the weldering of plug-in unit and patch Disk all exposes；

Step 15, wire mark character: some marks letter, figure and the company Logo of client are printed using halftone or character ink jet printer Up, convenient for the identification of terminal client；

Step 16, it is surface-treated: being surface-treated according to the requirement of client, such as: chemical silvering, chemical gilding, organic guarantor weld film Etc. techniques.

2. the method according to claim 1, wherein the pre- elongation of the film refers to: the film of internal layer circuit according to X, Y-direction is elongated in advance, it may be assumed that in the size of plate 1:1, X, Y-direction add 30000 to ten thousand/10000ths/point length, simultaneously The alignment target of the film is corresponding with the contraposition tooling hole of Metal Substrate core plate.

3. the method according to claim 1, wherein bore hole compensated refers to: aluminium base core plate, contraposition tooling hole are not required to Reaming is wanted, the size as the tool pore size of epoxy resin core plate is needed, other holes all need reaming；Copper-based core plate, it is right Position tooling hole does not need reaming, needs then to need reaming with the hole of metal based insulation, other holes do not need temporarily then to bore.

4. the method according to claim 1, wherein in Metal Substrate core plate drill process, aluminium base and copper-based core plate It all bores nozzle using diamond coating to drill out, which mainly drills out contraposition tooling hole, convenient for the contraposition of pressing working procedure；Metal Substrate core Twist drill wants deburring to handle behind hole, and the burr in aperture is all removed.

5. the method according to claim 1, wherein in Metal Substrate core plate chemical treatment step:

Aluminium base core plate is handled about 30-60 seconds using alkali electroless degreaser, then uses nylon bruss polish-brush surface, to reach micro- thick Change aluminium base surface, increases binding force；

Copper-based core plate forms the oxide layer of one layer of brown using brown oxidation chemistry treatment process, on copper surface, with promoted it is copper-based with Binding force between prepreg；Lamination is completed after the chemical treatment of Metal Substrate core plate in 4 hours and starts to press.

6. the method according to claim 1, wherein in core material and Metal Substrate core plate pressing step:

Core material and Metal Substrate align lamination: using dedicated steel plate, have corresponding pilot pin, pilot pin and internal layer on steel plate Core plate and the location hole of Metal Substrate are corresponding, put core material, prepreg and Metal Substrate respectively according to laminate structure；

Working plate uses special auxiliary material up and down, which is a kind of fractal film, is resistant to 350 DEG C of maximum temperature, uses the auxiliary material It can ensure that pressing effect, plate face do not have residue glue；

Use special pressing parameter: into 160 DEG C of furnace temperature, heating rate: 1.5-2.5 DEG C/min, pressing-in temp 190-210 DEG C, pressure 1.5-3.5MPa, wherein 210 DEG C, the condition of 3.5MPa will keep 60-90min, total pressing time 180-240min.

7. the method according to claim 1, wherein in drill process:

Because there is metal substrate in centre, hardness is larger, and it is big that conventional brill nozzle is easy to appear roughness in hole, aperture protrusion, breaking of rod nozzle The problems such as, it needs to bore nozzle using diamond coating；

Revolving speed 30000-60000 turns/min, cuts fast 0.3-0.7m/min, withdrawing speed 8-10m/min, the service life 100-200 hole/ Branch.

8. the method according to claim 1, wherein in electroless copper step:

Aluminium base core plate: after upper process gong frame, edges of boards expose metallic aluminium, but aluminium is rotten in the alkaline cylinder of chemical plating copper wire Erosion, therefore first elder generation copper facing 10-15 minutes on electro-coppering production line before electroless copper, the copper of 5-10um is plated, then again Do chemical-copper-plating process；

Copper-based core plate: the brill dirt that generates is easy to be stained on copper when because of drilling high temperature, therefore when electroless copper, de-smear twice Technique, avoid because bore it is dirty caused by electro-coppering and it is copper-based between electrical property open a way.

9. the method according to claim 1, wherein in forming step:

Use four blade milling cutter gong plate of titanizing, gong knife service life 15-20m/ branch；

Gong plate cutting output 0.05-0.15cm/sec, gong plate in the process will be to milling cutter spraying cooling liquid；

The product that gong comes out crosses horizontal cleaning machine, is cleaned using faintly acid degreaser, cell wall is avoided to black.

Technical field

The present invention relates to circuit board manufacturing area, in particular to a kind of multilayer sandwich metal-base circuit plate producing process.

Background technique

For market upper core metal substrate generally based on dual platen, major metal core has copper-based or aluminium base, because without interior Sandwich circuit, therefore there is no internal layer circuit production process, pressing working procedure does not need to carry out particularly to align .4 layers or above of folder yet Core metal substrate, part run and points for attention and dual platen it is different, need especially to control.4 layers or more Sandwich metal substrate, because having multiple core plates and one or several sheets metal core board, the aligning accuracy control between them is less than 0.05mm is being pressed simultaneously as may have several metal core boards, drilling, electroless copper, and the processes such as molding need especially control System, is otherwise easy that binding force is poor between Metal Substrate core plate and prepreg, and roughness is bigger than normal in hole, and when gong plate is easy to appear plate bursting Or the problems such as burr.

Summary of the invention

The present invention provides a kind of multilayer sandwich metal-base circuit plate producing process, are asked with solving at least one above-mentioned technology Topic.

To solve the above problems, it is raw to provide a kind of multilayer sandwich metal-based circuit board as one aspect of the present invention Production method, comprising:

Step 1, engineering design: drawing is optimized according to customer data and process capability, including the pre- of the film Elongation, the compensation of route, bore hole compensated etc.；

Step 2, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, then opens plate At corresponding size；

Step 3, internal layer circuit makes: according to the data of client, figure being transferred to inner operative plate up from egative film；

Step 4, ectonexine detects: using automatically scanning detecting instrument, checks the quality of route after etching；

Step 5, brownification: using chemical mode, and coarse surface increases the binding force between material；

Step 6, Metal Substrate core plate drills: drilling out pressing contraposition tooling hole and unit domestic demand in plate face using drilling machine The hole to be metallized；

Step 7, Metal Substrate core plate is chemically treated: being formed scabrid structure in metal primary surface using chemical method, is made Obtaining Metal Substrate and prepreg has better binding force；

Step 8, it presses: by the fast press of vacuum, using corresponding pressing plate parameter, by different line layers and Metal Substrate pressure Together；

Step 9, drill: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize upper and lower level The electric performance conducting of copper；

Step 10, electroless copper: it is exactly to plate one layer of thin copper in the hole of drilling, realizes that the upper and lower level electrical property of plate is led It is logical；

Step 11, electro-coppering: the copper of copper and surface in device to hole is thickeied, to reach the requirement of client, to ensure end Hold the requirement on electric performance of client；

Step 12, according to the data of client, figure pattern transfer: is transferred to working plate up from egative film；

Step 13, outer layer etches: using the corrosion liquid medicine of alkalinity, the figure that client needs all being corroded out；

Step 14, anti-welding: according to the requirement of client, one layer of dielectric ink to be pressed in circuit plate face, but want plug-in unit and patch Pad all expose；

Step 15, wire mark character: using halftone or character ink jet printer by some marks letter, figure and the company of client Logo is stamped, convenient for the identification of terminal client；

Step 16, it is surface-treated: being surface-treated according to the requirement of client, such as: chemical silvering, chemical gilding, You Jibao Weld the techniques such as film.

Preferably, the pre- elongation of the film refers to: the film of internal layer circuit is elongated in advance according to X, Y-direction, it may be assumed that in plate 1: In 1 size, X, Y-direction add 30000 to ten thousand/10000ths/point length, while the alignment target of the film and Metal Substrate core plate Contraposition tooling hole it is corresponding.

Preferably, bore hole compensated refers to: aluminium base core plate, and contraposition tooling hole does not need reaming, needs and epoxy resin core plate The same size of tool pore size, other holes all need reaming；Copper-based core plate, contraposition tooling hole do not need reaming, need with The hole of metal based insulation then needs reaming, and other holes do not need temporarily then to bore.

Preferably, in Metal Substrate core plate drill process, aluminium base and copper-based core plate all bore nozzle using diamond coating and drill out, should Tool mainly drills out contraposition tooling hole, convenient for the contraposition of pressing working procedure；Deburring is wanted to handle after the drilling of Metal Substrate core plate, by aperture Burr all remove.

Preferably, in Metal Substrate core plate chemical treatment step: aluminium base core plate handles about 30-60 using alkali electroless degreaser Second, nylon bruss polish-brush surface is then used, to reach micro- roughening aluminium base surface, increases binding force；Copper-based core plate is using palm fibre oxidation Chemical treatment technology forms the oxide layer of one layer of brown on copper surface, to promote the copper-based binding force between prepreg；Gold Lamination is completed in 4 hours after belonging to the chemical treatment of base core plate and starts to press.

Preferably, in core material and Metal Substrate core plate pressing step: core material and Metal Substrate align lamination: using special Steel plate has corresponding pilot pin on steel plate, and pilot pin is corresponding with the location hole of core material and Metal Substrate, according to lamination Structure puts core material, prepreg and Metal Substrate respectively；Working plate uses special auxiliary material up and down, which is a kind of from shape Film is resistant to 350 DEG C of maximum temperature, can ensure that pressing effect, plate face do not have residue glue using the auxiliary material；Use special pressing ginseng Number: into 160 DEG C of furnace temperature, heating rate: 1.5-2.5 DEG C/min, 190-210 DEG C of pressing-in temp, pressure 1.5-3.5MPa, wherein 210 DEG C, the condition of 3.5MPa will keep 60-90min, total pressing time 180-240min.

Preferably, in drill process: because there is metal substrate in centre, hardness is larger, and conventional brill nozzle is easy to appear in hole slightly The problems such as rugosity is big, aperture protrusion, breaking of rod nozzle needs to bore nozzle using diamond coating；Revolving speed 30000-60000 turns/min, under Knife speed 0.3-0.7m/min, withdrawing speed 8-10m/min, the service life 100-200 hole/.

Preferably, in electroless copper step: aluminium base core plate: after upper process gong frame, edges of boards expose metallic aluminium, but aluminium exists It is corroded in the alkaline cylinder of chemical plating copper wire, therefore the first first copper facing 10-15 on electro-coppering production line before electroless copper Minute, the copper of 5-10um is plated, then does chemical-copper-plating process again；Copper-based core plate: because the brill dirt generated when drilling high temperature is easy Be stained on copper, therefore when electroless copper, de-smear technique twice, avoid because bore it is dirty caused by electro-coppering and it is copper-based between electricity Performance open circuit.

Preferably, in forming step: using four blade milling cutter gong plate of titanizing, gong knife service life 15-20m/ branch；Gong plate cutting output 0.05-0.15cm/sec, gong plate in the process will be to milling cutter spraying cooling liquid；The product that gong comes out crosses horizontal cleaning machine, and use is weak Acid deoiling agent cleaning, avoids cell wall from blacking.

The present invention can produce 4 layers or more of sandwich metal substrate, and aligning accuracy < 50um between core plate, gold drilling is slightly The problems such as rugosity < 25um, Metal Substrate and core plate do not have plate bursting and burr, can meet the performance indexes of client.

Detailed description of the invention

Fig. 1 schematically shows process flow chart of the invention.

Specific embodiment

The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims Implement with the multitude of different ways of covering.