阅读说明：本技术 一种麻酱烧饼及其制备工艺 (Sesame paste sesame seed cake and preparation process thereof ) 是由 彭飞 于 2021-09-26 设计创作，主要内容包括：本发明公开了一种麻酱烧饼,包括以下具体原料：面团原料、调味芝麻酱和白芝麻,所述面团原料包括小麦面粉5000克、纯净水3000克、发酵粉3克、白砂糖5克,所述调味芝麻酱包括芝麻酱3000克、五香粉50克、孜然50克、花椒10克、食用盐200克、白砂糖150克,所述白芝麻为1500克。本发明与现有技术相比的优点在于：口味独特,烤制两面金黄,香酥可口,且制作方法简单,制作周期较短。(The invention discloses sesame paste sesame seed cake which comprises the following specific raw materials: the seasoning sesame paste comprises 3000 g of sesame paste, 50 g of five spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar, and the white sesame is 1500 g. Compared with the prior art, the invention has the advantages that: unique taste, golden baked two sides, crisp and delicious taste, simple preparation method and short preparation period.)

1. The sesame paste sesame seed cake is characterized by comprising the following specific raw materials: the seasoning sesame paste comprises 3000 g of sesame paste, 50 g of five spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar, and the white sesame is 1500 g.

2. The preparation method of sesame paste sesame seed cake as claimed in claim 1, which is characterized by comprising the following specific steps:

(1) 5000 g of wheat flour, 3000 g of purified water, 3 g of baking powder and 5 g of white granulated sugar are selected and added into a dough mixer to be kneaded into dough;

(2) rolling the dough obtained in the step (1) into a dough sheet with the thickness of 1 cm by using a rolling pin;

(3) 3000 g of sesame paste, 50 g of five-spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar are selected to be prepared into seasoning sesame paste;

(4) uniformly coating the seasoned sesame paste in the step (3) on the wrapper in the step (2); rolling the dough sheet coated with the seasoned sesame paste into a strip shape;

(5) preparing the mixed dough rolled into long strips in the step (4) into a dough base with the volume of 50 g-80 g/piece;

(6) pressing the dough obtained in the step (5) into a cake shape in a spherical manner;

(7) uniformly dipping 1500 g of white sesame seeds on the plurality of the flour cakes in the step (6);

(8) and (5) sequentially placing the flour cakes obtained in the step (7) in an electric baking pan, baking for 5 minutes and shaping.

(9) And (4) putting the flour cake shaped in the step (8) into an oven for baking, and taking the flour cake out of the oven for eating after baking for 10 minutes.

3. The method for preparing sesame paste sesame seed cake according to claim 2, wherein: the diameter of the cake-shaped dough ball in the step (6) is 6-7 cm.

4. The method for preparing sesame paste sesame seed cake according to claim 2, wherein: and (4) adjusting the temperature of the electric baking pan to 180 ℃ in the step (8).

5. The method for preparing sesame paste sesame seed cake according to claim 2, wherein: the temperature of the oven in the step (9) is set to 200 ℃.

Technical Field

The invention relates to the technical field of sesame paste sesame cake preparation, in particular to a sesame paste sesame cake and a preparation process thereof.

Background

The traditional sesame seed cake uses wheat flour as main material and salt or sugar as seasoning and is baked into salty or sweet sesame seed cake. With the improvement of living standard of people, the requirements on nutrition and taste of food are higher and higher, and the traditional sesame seed cake has single component, low nutrition value and monotonous taste.

Disclosure of Invention

The invention aims to solve the technical problem of overcoming the technical defects and provides a sesame paste sesame seed cake and a preparation process thereof.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: a sesame paste sesame seed cake comprises the following specific raw materials: the seasoning sesame paste comprises 3000 g of sesame paste, 50 g of five spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar, and the white sesame is 1500 g.

A preparation method of sesame paste sesame seed cake comprises the following steps:

(1) 5000 g of wheat flour, 3000 g of purified water, 3 g of baking powder and 5 g of white granulated sugar are selected and added into a dough mixer to be kneaded into dough;

(2) rolling the dough obtained in the step (1) into a dough sheet with the thickness of 1 cm by using a rolling pin;

(3) 3000 g of sesame paste, 50 g of five-spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar are selected to be prepared into seasoning sesame paste;

(4) uniformly coating the seasoned sesame paste in the step (3) on the wrapper in the step (2); rolling the dough sheet coated with the seasoned sesame paste into a strip shape;

(5) preparing the mixed dough rolled into long strips in the step (4) into a dough base with the volume of 50 g-80 g/piece;

(6) pressing the dough obtained in the step (5) into a cake shape in a spherical manner;

(7) uniformly dipping 1500 g of white sesame seeds on the plurality of the flour cakes in the step (6);

(8) and (5) sequentially placing the flour cakes obtained in the step (7) in an electric baking pan, baking for 5 minutes and shaping.

(9) And (4) putting the flour cake shaped in the step (8) into an oven for baking, and taking the flour cake out of the oven for eating after baking for 10 minutes.

As a modification, the diameter of the cake-shaped dough ball in the step (6) is 6-7 cm.

As an improvement, the temperature of the electric baking pan in the step (8) is adjusted to 180 ℃.

As a modification, the temperature of the oven in the step (9) is set to 200 degrees.

Compared with the prior art, the invention has the advantages that: the sesame paste sesame cake provided by the invention is rich in layers, is seasoned by using various seasonings, is unique in taste, is golden on the baked two sides, is crispy and delicious, and is simple in preparation method and short in preparation period.

Detailed Description

Example 1

A sesame paste sesame seed cake comprises the following specific raw materials: the seasoning sesame paste comprises 3000 g of sesame paste, 50 g of five spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar, and the white sesame is 1500 g.

A preparation method of sesame paste sesame seed cake comprises the following steps:

(1) 5000 g of wheat flour, 3000 g of purified water, 3 g of baking powder and 5 g of white granulated sugar are selected and added into a dough mixer to be kneaded into dough;

(2) rolling the dough obtained in the step (1) into a dough sheet with the thickness of 1 cm by using a rolling pin;

(3) 3000 g of sesame paste, 50 g of five-spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar are selected to be prepared into seasoning sesame paste;

(4) uniformly coating the seasoned sesame paste in the step (3) on the wrapper in the step (2); rolling the dough sheet coated with the seasoned sesame paste into a strip shape;

(5) preparing the mixed dough rolled into long strips in the step (4) into a dough base with the volume of 50 g-80 g/piece;

(6) pressing the dough obtained in the step (5) into a cake shape in a spherical manner;

(7) uniformly dipping 1500 g of white sesame seeds on the plurality of the flour cakes in the step (6);

(8) and (5) sequentially placing the flour cakes obtained in the step (7) in an electric baking pan, baking for 5 minutes and shaping.

(9) And (4) putting the flour cake shaped in the step (8) into an oven for baking, and taking the flour cake out of the oven for eating after baking for 10 minutes.

The diameter of the cake-shaped dough ball in the step (6) is 6 cm.

And (4) adjusting the temperature of the electric baking pan to 180 ℃ in the step (8).

The temperature of the oven in the step (9) is set to 200 ℃.

Example 2

A sesame paste sesame seed cake comprises the following specific raw materials: the seasoning sesame paste comprises 3000 g of sesame paste, 50 g of five spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar, and the white sesame is 1500 g.

A preparation method of sesame paste sesame seed cake comprises the following steps:

(1) 5000 g of wheat flour, 3000 g of purified water, 3 g of baking powder and 5 g of white granulated sugar are selected and added into a dough mixer to be kneaded into dough;

(2) rolling the dough obtained in the step (1) into a dough sheet with the thickness of 1 cm by using a rolling pin;

(3) 3000 g of sesame paste, 50 g of five-spice powder, 50 g of cumin, 10 g of pepper, 200 g of edible salt and 150 g of white granulated sugar are selected to be prepared into seasoning sesame paste;

(4) uniformly coating the seasoned sesame paste in the step (3) on the wrapper in the step (2); rolling the dough sheet coated with the seasoned sesame paste into a strip shape;

(5) preparing the mixed dough rolled into long strips in the step (4) into a dough base with the volume of 50 g-80 g/piece;

(6) pressing the dough obtained in the step (5) into a cake shape in a spherical manner;

(7) uniformly dipping 1500 g of white sesame seeds on the plurality of the flour cakes in the step (6);

(8) and (5) sequentially placing the flour cakes obtained in the step (7) in an electric baking pan, baking for 5 minutes and shaping.

(9) And (4) putting the flour cake shaped in the step (8) into an oven for baking, and taking the flour cake out of the oven for eating after baking for 10 minutes.

The diameter of the cake-shaped dough ball in the step (6) is 7 cm.

And (4) adjusting the temperature of the electric baking pan to 180 ℃ in the step (8).

The temperature of the oven in the step (9) is set to 200 ℃.

The present invention and its embodiments have been described above, but the description is not limitative, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.