阅读说明：本技术 印刷线路板的制作方法及印刷线路板 (Printed circuit board manufacturing method and printed circuit board ) 是由 胡新星 张佳 胡绪兵 钟国华 于 2021-09-08 设计创作，主要内容包括：本发明适用于印刷线路板制造技术领域,提出一种印刷线路板的制作方法,包括：提供至少两张芯板,芯板包括基材层和设于基材层相对两侧的厚铜层与薄铜层,厚铜层的厚度大于薄铜层的厚度；自薄铜层的一侧,在芯板上开设盲孔；将两张芯板的厚铜层相粘合,形成临时板；对临时板进行沉铜、电镀,使两张芯板的薄铜层上分别沉积一层镀铜层,以及使盲孔内填充电镀铜；对粘合后的两张芯板进行分离,并在芯板的表面制作线路；将芯板进行后制程,以制作印刷线路板。上述制作方法能够解决因芯板较薄引起的制程受限、电镀异常和铜厚不均的问题。本发明同时提出一种印刷线路板。(The invention is suitable for the technical field of printed circuit board manufacturing, and provides a manufacturing method of a printed circuit board, which comprises the following steps: providing at least two core plates, wherein each core plate comprises a base material layer, a thick copper layer and a thin copper layer, the thick copper layer and the thin copper layer are arranged on two opposite sides of the base material layer, and the thickness of the thick copper layer is larger than that of the thin copper layer; forming a blind hole on the core plate from one side of the thin copper layer; bonding the thick copper layers of the two core plates to form a temporary plate; carrying out copper deposition and electroplating on the temporary plate to enable a copper plating layer to be respectively deposited on the thin copper layers of the two core plates and enable the blind holes to be filled with the copper plating; separating the two bonded core plates, and manufacturing a circuit on the surfaces of the core plates; and carrying out post-processing on the core board to manufacture the printed circuit board. The manufacturing method can solve the problems of limited manufacturing process, abnormal electroplating and uneven copper thickness caused by thinner core plates. The invention also provides a printed circuit board.)

1. A method of making a printed wiring board, comprising:

providing at least two core plates, wherein each core plate comprises a base material layer, a thick copper layer and a thin copper layer, the thick copper layer and the thin copper layer are arranged on two opposite sides of the base material layer, and the thickness of the thick copper layer is larger than that of the thin copper layer;

forming a blind hole in the core plate from one side of the thin copper layer;

bonding the thick copper layers of the two core plates to form a temporary plate;

carrying out copper deposition and electroplating on the temporary board to enable a copper plating layer to be respectively deposited on the thin copper layers of the two core boards and enable the blind holes to be filled with electroplated copper;

separating the two bonded core plates, and manufacturing a circuit on the surface of each core plate;

and carrying out post-processing on the core board to manufacture the printed circuit board.

2. The method of manufacturing a printed wiring board according to claim 1, wherein: the sum of the thicknesses of the thin copper layer and the copper plating layer is equal to the thickness of the thick copper layer.

3. The method of manufacturing a printed wiring board according to claim 1, wherein: two of the core plates in the temporary plate have the same number of blind holes.

4. The method of manufacturing a printed wiring board according to claim 1, wherein:

in the step of bonding the thick copper layers of the two core plates, the thick copper layers of the two core plates are bonded through a peelable glue;

the step of separating the two bonded core plates comprises the following steps: and under the preset condition, the peelable glue is invalid, and the two bonded core plates are split and recovered into two independent core plates.

5. The method of manufacturing a printed wiring board according to claim 4, wherein: the peelable glue is blue glue, and the preset condition is baking at 100-120 ℃ for 10-15 min.

6. The method of manufacturing a printed wiring board according to claim 5, wherein:

bonding the thick copper layers of the two core plates by using a peelable glue, comprising the following steps:

providing a blue glue tape, wherein the blue glue tape comprises blue glue and protective films arranged on two sides of the blue glue;

cutting the blue glue tape to a size matched with the core plates, and respectively stripping the two layers of protective films to ensure that two sides of the blue glue are respectively aligned and bonded with the thick copper layers of the two core plates;

and pressing and heating the two core plates and the blue glue by a quick pressing machine or a film pressing machine to enable the blue glue to generate a crosslinking reaction so as to enhance the viscosity of the blue glue.

7. The method of manufacturing a printed wiring board according to claim 1, wherein: carrying out post-processing on the core board, wherein the post-processing comprises the following steps:

respectively overlapping prepregs and copper foils on two sides of the core board and laminating to form a composite board;

and drilling, electroplating and filling holes, manufacturing a circuit and performing post-treatment on the composite board to form the printed circuit board.

8. The method of manufacturing a printed wiring board according to claim 1, wherein: from one side of thin copper layer, set up the blind hole on the core board, include:

brown the thin copper layer of the core plate;

and forming a blind hole in the core plate from one side of the thin copper layer by adopting a laser drilling mode, wherein the blind hole penetrates through the thin copper layer and the substrate layer.

9. The method of manufacturing a printed wiring board according to claim 1, wherein: and when the circuit is manufactured on the surface of the core board, selecting the thick copper layer to manufacture the dense fine circuit.

10. A printed wiring board characterized by: the printed wiring board according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a printed circuit board and the printed circuit board.

Background

An HDI (High Density interconnection) board is a circuit board with High line distribution Density, and is divided into first-order, second-order, multi-order and any-order interconnections according to structural stacking layers. Any-order interconnection is also called any-layer interconnection, from an inner core plate to an outer layer, all layers are interconnected by blind holes, any-order interconnection HDI plates can provide higher wiring density and more fine circuit design, and the demand on the market of high-end electronic products is increasing.

In order to meet the requirements of lightness, thinness and precision, thinner core plates such as core plates with the plate thickness of less than 75 micrometers (3 mils) are generally adopted for manufacturing any current layer of interconnecting HDI, and such thin core plates generally need to be processed by using auxiliary fixtures during electroplating, so that the manufacturing process is limited, otherwise, the core plates are easy to warp, wrinkle and even break and other abnormalities. In addition, when the conventional inner core plate is used for blind hole electroplating filling, the rigidity is insufficient due to the fact that the thickness of the core plate is too thin, the core plate is influenced by jet flow in the conduction process of an electroplating bath, the current distribution of the core plate in electroplating is extremely uneven, the copper thickness of the surface of the core plate after electroplating is uneven, and the processing of a fine circuit is not facilitated. Accordingly, there is a need in the art for improvements.

Disclosure of Invention

In view of the above, the present invention provides a method for manufacturing a printed circuit board and a printed circuit board, so as to solve the problems of limited manufacturing process, abnormal electroplating and uneven copper thickness caused by the thinner core board.

The first aspect of the present invention provides a method for manufacturing a printed circuit board, including:

providing at least two core plates, wherein each core plate comprises a base material layer, a thick copper layer and a thin copper layer, the thick copper layer and the thin copper layer are arranged on two opposite sides of the base material layer, and the thickness of the thick copper layer is larger than that of the thin copper layer;

forming a blind hole in the core plate from one side of the thin copper layer;

bonding the thick copper layers of the two core plates to form a temporary plate;

carrying out copper deposition and electroplating on the temporary board to enable a copper plating layer to be respectively deposited on the thin copper layers of the two core boards and enable the blind holes to be filled with electroplated copper;

separating the two bonded core plates, and manufacturing a circuit on the surface of each core plate;

and carrying out post-processing on the core board to manufacture the printed circuit board.

In an embodiment, the sum of the thicknesses of the thin copper layer and the copper plating layer is equal to the thickness of the thick copper layer.

In one embodiment, two of the core plates in the temporary plate have the same number of blind holes.

In one embodiment, in the step of bonding the thick copper layers of the two core plates, the thick copper layers of the two core plates are bonded by a peelable glue;

the step of separating the two bonded core plates comprises the following steps: and under the preset condition, the peelable glue is invalid, and the two bonded core plates are split and recovered into two independent core plates.

In one embodiment, the peelable glue is a blue glue, and the preset condition is baking at 100-120 ℃ for 10-15 min.

In one embodiment, bonding the thick copper layers of two core plates by a peelable glue comprises:

providing a blue glue tape, wherein the blue glue tape comprises blue glue and protective films arranged on two sides of the blue glue;

cutting the blue glue tape to a size matched with the core plates, and respectively stripping the two layers of protective films to ensure that two sides of the blue glue are respectively aligned and bonded with the thick copper layers of the two core plates;

and pressing and heating the two core plates and the blue glue by a quick pressing machine or a film pressing machine to enable the blue glue to generate a crosslinking reaction so as to enhance the viscosity of the blue glue.

In one embodiment, the post-processing of the core board includes:

respectively overlapping prepregs and copper foils on two sides of the core board and laminating to form a composite board;

and drilling, electroplating and filling holes, manufacturing a circuit and performing post-treatment on the composite board to form the printed circuit board.

In one embodiment, the forming of the blind via in the core from one side of the thin copper layer comprises:

brown the thin copper layer of the core plate;

and forming a blind hole in the core plate from one side of the thin copper layer by adopting a laser drilling mode, wherein the blind hole penetrates through the thin copper layer and the substrate layer.

In one embodiment, when the circuit is manufactured on the surface of the core board, the thick copper layer is selected to manufacture dense fine circuits.

A second aspect of the present invention provides a printed wiring board manufactured by the method for manufacturing a printed wiring board according to the first aspect.

According to the manufacturing method of the printed circuit board, the core boards with asymmetric thicknesses at two sides are provided, the blind holes are formed in the core boards, then the thick copper layers of the two core boards are bonded to form the temporary board, the temporary layer-adding thickening of the core boards is realized, and electroplating abnormity such as core board warping, folding and even breaking caused by the thinner core boards can be avoided without using an electroplating jig during subsequent electroplating hole filling, so that the problem of limited manufacturing process is solved, and the manufacturing efficiency is improved; and the thickness of the temporary plate is thicker and the rigidity is enhanced, when in electroplating, the core plate is not easy to be influenced by jet flow to cause uneven current distribution, so that the problem of uneven copper thickness after electroplating is solved, the processing of fine circuits is facilitated, and the copper layer on the surface of the core plate can meet the manufacturing requirement of high-precision circuits.

The printed circuit board manufactured by the manufacturing method has the advantages that the copper surfaces of the core board are uniform in copper thickness, fine circuits can be manufactured on the core board, and the manufacturing requirements of high-end electronic products can be met.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a flowchart of a method for manufacturing a printed wiring board according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a core board provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a core board provided in an embodiment of the present invention after blind holes are formed;

FIG. 4 is a schematic structural diagram of a temporary plate provided in an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of the temporary plate shown in FIG. 4 after copper deposition and electroplating;

FIG. 6 is a schematic structural view of a core plate separated from the temporary plate shown in FIG. 5;

FIG. 7 is a schematic structural view of another core panel separated from the temporary panel shown in FIG. 5;

fig. 8 is a schematic structural view of a blue adhesive tape according to an embodiment of the present invention.

The designations in the figures mean:

10. a core board; 11. a thick copper layer; 12. a thin copper layer; 13. a substrate layer; 14. plating a copper layer; 15. electroplating copper; 101. blind holes; 20. blue glue tape; 21. blue glue; 22. a protective film; 30. a temporary plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

It should be noted that, in the embodiments of the present invention, the same reference numerals are used to denote the same components or parts, and for the same components or parts in the embodiments of the present invention, only one of the components or parts may be labeled with the reference numeral, and it should be understood that the reference numerals are also applicable to other similar components or parts.

To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.

Referring to fig. 1, an embodiment of the first aspect of the present invention provides a method for manufacturing a printed circuit board, including the following steps.

Step S1: providing at least two core plates, wherein each core plate comprises a base material layer, and a thick copper layer and a thin copper layer which are arranged on two opposite sides of the base material layer.

Referring to fig. 2, a thick copper layer 11 and a thin copper layer 12 are respectively disposed on two sides of the core board 10, and the thickness of the thick copper layer 11 is greater than that of the thin copper layer 12, that is, the core board 10 is a cathode-anode copper board with asymmetric copper thickness on two sides.

For example, the core board 10 has a thickness of 50 μm (2mil), the thin copper layer 12 and the thick copper layer 11 have thicknesses of 1/2oz and 1oz, respectively, or the thin copper layer 12 and the thick copper layer 11 have thicknesses of 1/3oz and 1/2oz, respectively.

The substrate layer 13 may be an insulating medium layer composed of epoxy resin and fiberglass cloth, but is not limited thereto.

Step S2: blind holes are made in the core 10 from one side of the thin copper layer 12.

Referring to fig. 3, blind holes 101 are formed in the core board 10 from one side of the thin copper layer 12 according to predetermined drilling data, and one or more blind holes 101 are formed in each core board 10.

In one embodiment, the step S2 of forming the blind via 101 in the core board 10 from one side of the thin copper layer 12 specifically includes: brown the thin copper layer 12 of the core plate 10; a blind hole 101 is formed in the core board 10 from one side of the thin copper layer 12 in a laser drilling mode, the blind hole 101 penetrates through the thin copper layer 12 and the base material layer 13, and the bottom of the blind hole 101 is located at the thick copper layer 11. Thus, the copper surface can be roughened by browning, which is beneficial to absorbing laser energy.

Step S3: the thick copper layers 11 of the two core sheets 10 are bonded to form a temporary sheet.

Referring to fig. 4, the two core boards 10 with the blind holes 101 formed therein are stacked, so that the thick copper layers 11 of the two core boards 10 are disposed back to back and bonded by the adhesive, thereby forming the temporary board 30, and realizing temporary layer-adding and thickening of the core boards 10.

If the number of the core boards 10 for manufacturing the printed circuit board is more than two, the plurality of core boards 10 can be paired and bonded.

Step S4: the temporary plate 30 is subjected to copper deposition and electroplating.

Referring to fig. 5, by performing copper deposition and electroplating on the temporary board 30, a copper-plated layer is deposited on the thin copper layers 12 of the two core boards 10, and the blind holes 101 are filled with the electroplated copper.

Specifically, the temporary plate 30 is first subjected to copper deposition, and a layer of dense thin copper is deposited in both the thin copper layer 12 and the blind holes 101 of the core plate 10, so that the whole plate can be conveniently plated in the subsequent process. Next, the temporary board 30 is electroplated to fill the blind holes 101 with copper by chemical reaction, which simultaneously thickens the copper layer on the surface of the core board 10, so that a copper plating layer 14 can be deposited on the thin copper layer 12 of the core board 10 by copper deposition and electroplating, and the blind holes 101 can be filled with electroplated copper 15. The electroplated copper 15 can conduct the thin copper layer 12 and the thick copper layer 11, and is beneficial to realizing interconnection of core boards 10 of any layers.

Because the temporary plate 30 is equivalent to a false 4-layer plate, the temporary layer-adding thickening of the core plate 10 is realized, the rigidity of the thinner core plate 10 during electroplating is increased, an electroplating auxiliary jig is not required to be additionally arranged during electroplating, and the manufacturing process is simple, flexible and efficient. In addition, the temporary board 30 can be used for copper deposition and hole filling by electroplating according to a normal process, one surface of the thin copper layer 12 is an electroplating surface, and one side of the thick copper layer 11 is a non-electroplating surface, so that the copper thickness of one side of the thin copper layer 12 is consistent with that of one side of the thick copper layer 11, special process control according to a cathode-anode copper plate is not needed, and the problem of process limitation is solved.

In one embodiment, after copper deposition and electroplating, the sum of the thicknesses of the thin copper layer 12 and the copper-plated layer 14 is equal to the thickness of the thick copper layer 11, so that the copper thicknesses on the two sides of the core board 10 are consistent, and subsequent processing can be normally performed; it will be appreciated that the sum of the thicknesses of the thin copper layer 12 and the copper plating layer 14 may also be 0.8 to 1.2 times the thickness of the thick copper layer 11, so that the copper thickness is similar on both sides of the core 10.

Step S5: the two core sheets 10 after bonding are separated, and a wiring is formed on the surface of the core sheet 10.

Referring to fig. 5 to 7, after electroplating, two core plates 10 in the temporary plate 30 are separated into two independent core plates 10, and fig. 6 and 7 show two core plates 10 separated from the temporary plate 30; then, a circuit is formed on the surface of each core board 10 according to the process data.

In one embodiment, when the circuit is formed on the surface of the core board 10, the thick copper layer 11 is selected to form a dense fine circuit. Because the thick copper layer 11 is unchanged, the uniformity is relatively better, and the etching processing of high-precision circuits is facilitated. Thus, the pattern with finer lines and denser pattern is preferentially designed on the thick copper layer 11. It will be appreciated that it is also possible to choose to make fine lines on one side of the thin copper layer 12, or on both side surfaces of the core 10.

Optionally, after the circuit is manufactured, AOI detection is performed on the core board 10 to detect whether the circuit is abnormal.

Step S6: the core board 10 is post-processed to manufacture a printed circuit board.

If the printed circuit board to be manufactured is an HDI board, the core board 10 is subjected to post-processing, which includes: respectively overlapping prepregs and copper foils on two sides of the core plate 10 and laminating to form a composite plate; and drilling, electroplating and filling holes, manufacturing a circuit and performing post-treatment on the composite board to form the printed circuit board. The holes drilled in the composite board can simultaneously penetrate through the two layers of copper foils and the core board 10, and can also penetrate through the copper foils and the core board 10 of the layers only, so that the multilayer circuits can be interconnected conveniently.

The post-treatment process may be a conventional process for a printed wiring board, for example, the post-treatment process includes solder resist, characters, surface treatment, testing, appearance inspection, or includes at least one of the above processes.

It will be appreciated that after the composite board is formed, the prepreg and copper foil may be further laminated on the composite board to form a multilayer HDI board. For example, if the printed circuit board to be manufactured is a 4-layer HDI board, after the composite board is formed, a post-treatment process can be directly performed until the printed circuit board is manufactured; if the printed circuit board needing to be manufactured is an 8-layer HDI board, after a composite board is formed, prepregs and copper foils are respectively pressed on two sides of the composite board to form a 6-layer working board, drilling, electroplating and hole filling are carried out, circuit manufacturing is carried out, then the prepregs and the copper foils are respectively pressed on two sides of the 6-layer working board to form an 8-layer working board, and at the moment, a post-processing procedure is carried out, so that the 8-layer HDI board can be manufactured. It will be appreciated that the number of layers of HDI boards may be set as desired.

If the printed circuit board to be manufactured is a conventional multilayer circuit board, step S6 performs a post-processing on the core board 10, including directly laminating at least two core boards 10, and then performing a post-processing procedure.

According to the manufacturing method of the printed circuit board, the core plates 10 with asymmetric thicknesses on two sides are provided, the blind holes 101 are formed in the core plates 10, then the thick copper layers 11 of the two core plates 10 are bonded to form the temporary plate 30, temporary layer adding and thickening of the core plates 10 are realized, and electroplating abnormity such as warping, folding and even breakage of the core plates 10 caused by the fact that the core plates 10 are thin can be avoided without using an electroplating jig when electroplating hole filling is carried out subsequently, so that the problem of limited manufacturing process is solved, and the manufacturing efficiency is improved; moreover, the thickness and rigidity of the temporary plate 30 are increased, and the core plate 10 is not easily affected by jet flow to cause uneven current distribution during electroplating, so that the problem of uneven copper thickness after electroplating is solved, processing of fine circuits is facilitated, and the copper layer on the surface of the core plate 10 can meet the manufacturing requirement of high-precision circuits.

In the manufacturing method of the printed circuit board, the cathode and anode copper plates are selected to replace the conventional symmetrical core plate 10, and one side of the thick copper layer 11 of the core plate 10 is pasted back to back, so that the electroplating processing of the thin core plate 10 can be realized, the uniformity of the copper thickness at two sides of the core plate 10 can be controlled, and particularly, the uniformity of the base copper is kept to the maximum extent because the thick copper layer 11 is not electroplated. Moreover, the copper thicknesses of the two sides of the core plate 10 after electroplating are basically consistent, and the core plate 10 can be processed according to the conventional core plate subsequently without special management and control according to a cathode copper plate and an anode copper plate, so that the processing bottleneck of dense fine lines is broken through by the method provided by the embodiment.

In an embodiment, the two core plates 10 in the temporary plate 30 have the same number of blind holes 101, and the positions of the blind holes 101 may be different without limitation. Because the areas of the thin copper layers 12 of the two core plates 10 are consistent and the number of the blind holes 101 to be electroplated is consistent, compared with the conventional processing method, the power distribution during electroplating is more uniform, and the copper thickness formed by electroplating is more uniform.

In the step of bonding the thick copper layers 11 of the two core sheets 10, the thick copper layers 11 of the two core sheets 10 are bonded by a peelable glue.

Separating the two bonded core sheets 10 comprises: and (3) under the preset condition, the peelable glue is invalid, and the two bonded core plates 10 are split and recovered into two independent core plates 10.

Referring to fig. 1 and 4, in an embodiment, in the step of bonding the thick copper layers 11 of the two core boards 10 (step S3), the thick copper layers 11 of the two core boards 10 are bonded by a peelable glue; separating the two bonded core sheets 10 (step S5), including: and (3) under a preset condition, the peelable glue is invalid, and the two bonded core plates 10 are separated and recovered into two independent core plates 10.

By adopting the technical scheme, the thick copper layers 11 of the two core plates 10 are bonded by the peelable glue, so that the core plates 10 are convenient to separate, and the core plates 10 are not easy to damage and residual glue is not easy to leave.

In one embodiment, the peelable glue is blue glue, and the predetermined condition is baking at 100-120 ℃ for 10-15 min.

The blue glue is a glue synthesized by acrylic resin, has basic viscosity and can be adhered to a board surface; after the blue gel is heated to 100-120 ℃, chemical bonds formed by crosslinking reaction are easy to embrittle to cause chain breakage, and the viscosity of the blue gel can lose efficacy, so that the blue gel can lose efficacy by baking the temporary plate 30, two core plates 10 are easily separated, and the manufacturing process difficulty is reduced. Alternatively, the temporary plate 30 may be baked through a tunnel oven or a vertical oven.

It will be appreciated that the peelable glue may also be a thermal release glue, the viscosity of which is reduced after heating to a predetermined temperature, which facilitates separation of the core 10.

Referring to fig. 1, fig. 5 and fig. 8, in an embodiment, the bonding of the thick copper layers 11 of the two core boards 10 by the peelable glue includes: providing a blue adhesive tape 20, wherein the blue adhesive tape 20 comprises blue adhesive 21 and protective films 22 arranged on two sides of the blue adhesive 21; and cutting the blue glue tape 20 to a size matched with the core plates 10, and respectively stripping off the two protective films 22 to ensure that two surfaces of the blue glue 21 are respectively aligned and bonded with the thick copper layers 11 of the two core plates 10. In this way, the two core plates 10 can be bonded by the blue glue 21.

It is understood that the core 10 may be bonded in a variety of ways, and the present application is not limited thereto.

For example, the protective film 22 on one side of the blue adhesive tape 20 is removed, the adhesive surface of the blue adhesive 21 is aligned and bonded to the thick copper layer 11 of one core board 10, and then the protective film 22 on the other side is removed, and the other adhesive surface of the blue adhesive 21 is aligned and bonded to the thick copper layer 11 of the second core board 10, so as to form the temporary board 30.

For another example, the core board 10, the blue glue 21 and the core board 10 are aligned and bonded together by the bonding jig.

For another example, the blue glue 21 is not required to be cut before bonding, and the blue glue 21 of the coil stock is directly bonded on the thick copper layer 11 of the core plate 10 by using an automatic film bonding machine.

In an embodiment, after the thick copper layers 11 of the two core boards 10 are bonded by the peelable glue, the two core boards 10 and the blue glue 21 are pressed and heated by a fast pressing machine or a film pressing machine, so that the blue glue 21 undergoes a cross-linking reaction to enhance the viscosity of the blue glue 21. The blue gel 21 has general viscosity at normal temperature, and can generate crosslinking reaction at 60-70 ℃, so that the blue gel 21 and the copper surface form a bonding force, and the viscosity is enhanced. Therefore, the core plate 10 after being pasted can be pressed and heated by a quick pressing machine or a temperature-controllable film pressing machine, so that the bonding strength is enhanced.

A second aspect of the present invention provides a printed wiring board fabricated by the method of fabricating a printed wiring board as in the first aspect.

The printed wiring board may be any interconnecting HDI board, but is not limited thereto, and may also be a general multilayer printed wiring board. The copper surface of the core board 10 of the printed circuit board manufactured by the manufacturing method has uniform copper thickness, so that fine circuits can be manufactured on the core board 10, and the manufacturing requirements of high-end electronic products can be met.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.