Speckle dot matrix projector with furnace temperature of 260 DEG C

文档序号:451701 发布日期:2021-12-28 浏览:19次 中文

阅读说明:本技术 一种过炉温260度的散斑点阵投射器 (Speckle dot matrix projector with furnace temperature of 260 DEG C ) 是由 王槐 潘婷婷 于 2021-09-23 设计创作,主要内容包括:本发明公开了一种过炉温260度的散斑点阵投射器,包括基板,所述基板上设置芯片,支架设置在基板上,所述支架在基板上围成腔室,所述芯片位于腔室内,且所述支架上还设置激光衍射光学元件和准直镜,同时所述激光衍射光学元件和准直镜位于芯片的上方,所述基板采用陶瓷材质,所述支架采用LCP、PA、NTB中的至少一种,所述激光衍射光学元件和准直镜均采用玻璃或耐热树脂材质。与现有产品相比,本申请可以满足过炉温260℃,实现产品可以多制程生产、多结构变化以及进行标准化的加工。(The invention discloses a speckle dot matrix projector with a furnace-passing temperature of 260 ℃, which comprises a substrate, wherein a chip is arranged on the substrate, a support is arranged on the substrate, the support surrounds a cavity on the substrate, the chip is positioned in the cavity, a laser diffraction optical element and a collimating mirror are also arranged on the support, the laser diffraction optical element and the collimating mirror are positioned above the chip, the substrate is made of ceramic, the support is made of at least one of LCP (liquid crystal Polymer), PA (polyamide) and NTB (non-thermal) and both the laser diffraction optical element and the collimating mirror are made of glass or heat-resistant resin. Compared with the existing product, the method can meet the condition that the temperature of the furnace is 260 ℃, and realize the processing that the product can be produced in multiple processes, changed in multiple structures and standardized.)

1. The utility model provides a speckle dot matrix projector of 260 degrees of over furnace temperature which characterized in that: the laser diffraction optical element and the collimating mirror are arranged above the chip, the substrate is made of ceramic materials, the support is made of at least one of LCP (liquid Crystal display), PA (polyamide) and NTB (non-leaded glass), and the laser diffraction optical element and the collimating mirror are made of glass or heat-resistant resin.

2. The speckle dot matrix projector of claim 1, wherein the oven-temperature of 260 degrees is: the chip is arranged on the substrate through glue, the support is fixed on the substrate through the glue, the laser diffraction optical element and the collimating lens are fixed on the support through the glue after being combined, and the glue is high-temperature-resistant glue.

3. The speckle dot matrix projector of claim 1, wherein the oven-temperature of 260 degrees is: the support encloses into rectangular cavity, and the lower extreme and the base plate of cavity are connected, and the upper end of cavity sets up the compound lens of laser diffraction optical element and collimating mirror.

4. The speckle dot matrix projector of claim 1, wherein the oven-temperature of 260 degrees is: the base plate is of a long strip structure, and semicircular holes are formed in two ends of the base plate.

5. The speckle dot matrix projector of claim 1, wherein the oven-temperature of 260 degrees is: two bonding pads are arranged below the substrate and divided into a positive electrode and a negative electrode.

6. The speckle dot matrix projector of claim 4, wherein the oven-temperature of 260 degrees is: and arranging a copper layer at the position of the semicircular hole.

Technical Field

The invention relates to the field of speckle dot matrix projectors, in particular to a speckle dot matrix projector with a furnace temperature of 260 ℃.

Background

Using a speckle projector to project speckle into a scene, a camera can acquire a speckle pattern. Speckle adds characteristic information to the scene graph, and the anti-interference is stronger. And the subsequent speckle pattern is used for depth estimation, a scene depth pattern is obtained, the face recognition can be two-dimensional recognition or three-dimensional recognition, and the depth pattern is used for the three-dimensional recognition.

However, in the production process of the existing speckle dot matrix projector, due to the structural and material factors, the existing speckle dot matrix projector can only bear 85 ℃ when entering an oven for baking, and when the temperature is too high, the projector can generate parameter variation, so that the test requirement cannot be met. Moreover, the existing emitter has a single structure, can only be manufactured by a conventional manufacturing process, and cannot meet various structural changes.

Therefore, the inventor of the present invention aims to invent a speckle dot matrix projector with a temperature of 260 ℃ in the overheating process, aiming at the technical problems.

Disclosure of Invention

In order to overcome the defects, the invention aims to provide a speckle dot matrix projector with the over-furnace temperature of 260 ℃.

In order to achieve the above purposes, the invention adopts the technical scheme that: the utility model provides a speckle dot matrix projector of 260 degrees of temperature of overburning, includes the base plate, set up the chip on the base plate, the support sets up on the base plate, the support encloses into the cavity on the base plate, the chip is located the cavity, just still set up the compound lens of laser diffraction optical element and collimating mirror on the support, simultaneously laser diffraction optical element and collimating mirror are located the top of chip, the base plate adopts ceramic material, the support adopts at least one of LCP, PA, NTB, laser diffraction optical element and collimating mirror all adopt glass or heat-resisting resin material. Wherein LCP is an industrialized liquid crystal polymer material, PA is a nylon material, and NTB is a special plastic material.

Preferably, the chip is arranged on the substrate through glue, the support is fixed on the substrate through the glue, the composite lens of the laser diffraction optical element and the collimating lens is also fixed on the support through the glue, and the glue is high-temperature-resistant glue.

Preferably, the support encloses a rectangular cavity, the lower end of the cavity is connected with the substrate, and the upper end of the cavity is provided with a composite lens of the laser diffraction optical element and the collimating lens. By composite lens is meant that the lens at the upper end of the chamber has the properties of both the laser diffraction optical element and the collimating lens.

Preferably, the substrate is of a long strip structure, and semicircular holes are formed at two ends of the substrate.

Preferably, two pads are disposed under the substrate, and the two pads are divided into a positive electrode and a negative electrode. The welding pads of the anode and the cathode can realize SMT welding and can also be connected by point conductive silver adhesive.

Preferably, a copper layer is provided at the location of the semicircular hole. Set up the copper layer through electroplating, can with the pad intercommunication of positive pole and negative pole, when utilizing the semicircle orifice to carry out the reinforcement, also can guarantee the stability of switching on.

PC lenses, chemically known as polycarbonate, are a thermoplastic material. The environment of general 85 ℃ can be borne, when the furnace temperature reaches 260 ℃, the environment is hard to bear, generally, the PC lens is used as a collimating mirror material before improvement, and the DOE, namely the raw material before the improvement of the laser diffraction optical element, is PC; the bracket is a resin shell.

The liquid crystal high molecular polymer, LCP for short, is a novel high-performance special engineering plastic.

By changing the structural arrangement of the DOE, the collimating mirror and the substrate and selecting high-temperature-resistant materials, the furnace temperature of 260 ℃ borne by a product can be met.

The speckle dot matrix projector with the over-furnace temperature of 260 ℃ has the advantages that compared with the existing products, the speckle dot matrix projector can meet the over-furnace temperature of 260 ℃, and the products can be produced in multiple processes, changed in multiple structures and processed in a standardized mode.

Drawings

Fig. 1 is a schematic sectional structure diagram of a speckle dot matrix projector at a furnace temperature of 260 ℃.

FIG. 2 is a top view of a speckle dot matrix projector.

Fig. 3 is a schematic view of the lower end face of the substrate.

In the figure:

1. the device comprises a substrate, 2, a chip, 3, a support, 4, a composite lens of a laser diffraction optical element and a collimating mirror, 5, a bonding pad, 6, a copper layer, 11 and a semicircular hole.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.

Referring to fig. 1-3, the speckle dot matrix projector with an oven-passing temperature of 260 degrees in this embodiment includes a substrate 1, a chip 2 is disposed on the substrate 1, a support 3 is disposed on the substrate 1, the support 3 surrounds a cavity on the substrate 1, the chip 2 is located in the cavity, a composite lens 4 of a laser diffraction optical element and a collimating mirror is further disposed on the support 3, the composite lens 4 of the laser diffraction optical element and the collimating mirror is located above the chip 2, the substrate 1 is made of ceramic, the support is made of at least one of LCP, PA, and NTB, and both the laser diffraction optical element and the collimating mirror are made of glass or heat-resistant resin. Wherein LCP is an industrialized liquid crystal polymer material, PA is a nylon material, and NTB is a special plastic material.

The chip 2 is arranged on the substrate 1 through glue, the support 3 is fixed on the substrate 1 through glue, the laser diffraction optical element and the composite lens 4 of the collimating lens are also fixed on the support 3 through glue, and the glue is high-temperature-resistant glue.

The support 3 encloses into rectangular cavity, and the lower extreme of cavity is connected with base plate 1, and the upper end of cavity sets up the compound lens 4 of laser diffraction optical element and collimating mirror.

The substrate 1 has a long structure, and semicircular holes 11 are formed at both ends of the substrate 1.

Referring to fig. 3, two pads 5 are provided under the substrate 1, and the two pads 5 are divided into a positive electrode and a negative electrode. The welding pads 5 of the anode and the cathode can realize SMT welding and can also be connected by point conductive silver adhesive.

The copper layer 6 is provided at the position of the semicircular hole 11. The copper layer 6 is arranged through electroplating, and can be communicated with the bonding pads 5 of the anode and the cathode, and the stability of conduction can be ensured while the semicircular hole 11 is used for reinforcement.

PC lenses, chemically known as polycarbonate, are a thermoplastic material. The environment of general 85 degrees can be born, when the furnace temperature reaches 260 degrees, the environment is hard to bear, generally, the collimator lens material before the improvement is a PC lens, the DOE, namely the raw material before the improvement of the laser diffraction optical element 4 is PC, and the bracket adopts a vertical shell.

The liquid crystal high molecular polymer, LCP for short, is a novel high-performance special engineering plastic.

By changing the structural arrangement of the DOE, the bracket and the substrate 1 and selecting high-temperature-resistant materials, the furnace temperature of 260 ℃ borne by a product can be met.

Compared with the existing product, the method can meet the condition that the temperature of the furnace is 260 ℃, and realize the processing that the product can be produced in multiple processes, changed in multiple structures and standardized.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

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